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 High terminal impedances for optimal broadband performance  Designed for digital predistortion error correction systems  Optimized for Doherty applications Document Number: A2G22S190- -01S Rev. 0, 09/2018 NXP Semiconductors Technical Data 1800–2200 MHz, 36 W AVG., 48 V AIRFAST RF POWER GaN TRANSISTOR A2G22S190- -01SR3 Figure 1. Pin Connections

Table 1. Maximum Ratings Table 2. Thermal Characteristics Table 3. ESD Protection Characteristics Table 4. Electrical Characteristics(TA =2 5C unless otherwise noted)

  1. Reliability tests were conducted at 225C.
  2. RCHC (FEA) must be used for purposes related to reliability and limitations on maximum channel temperature. MTTF may be estimated by

the expression MTTF (hours) = 10[A + B/(T + 273)], whereT is the channel temperature in degrees Celsius,A = –10.3 andB = 8260.

Table 4. Electrical Characteristics(TA =2 5C unless otherwise noted)(continued)

  1. Part internally input matched.
  2. Turn on VDS to nominal supply voltage (48 V)
  3. Increase VGS until IDS current is attained
  4. Apply RF input power to desired level
  5. Reduce VGS d o w nt o– 5V
  6. Reduce VDS down to 0 V (Adequate time must be allowed

Table 5. Ordering Information

  1. P3dB = Pavg + 7.0 dB where Pavg is the average output power measured using an unclipped W- -CDMA single- -carrier input signal where

output PAR is compressed to 7.0 dB @ 0.01% probability on CCDF.

Figure 2. A2G22S190- -01SR3 Test Circuit Component Layout Table 6. A2G22S190- -01SR3 Test Circuit Component Designations and Values

PRODUCT DOCUMENTATION, SOFTWARE AND TOOLS Refer to the following resources to aid your design process. Application Notes  AN1908: Solder Reflow Attach Method for High Power RF Devices in Air Cavity Packages  AN1955: Thermal Measurement Methodology of RF Power Amplifiers Engineering Bulletins  EB212: Using Data Sheet Impedances for RF LDMOS Devices Software  .s2p File Development Tools  Printed Circuit Boards To Download Resources Specific to a Given Part Number: 1. Go tohttp://www.nxp.com/RF 2. Search by part number 3. Click part number link 4. Choose the desired resource from the drop down menu

REVISION HISTORY

The following table summarizes revisions to this document. Revision Date Description 0 Sept. 2018  Initial release of data sheet

Information in this document is provided solely to enablesystem and software implementers to use NXP products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits based on the information in this document. NXP reserves the right to make changes without further notice to any products herein. NXP makes no warranty, representation, or guarantee regarding the suitability of its products for any particularpurpose, nor does NXP assume any liability arising out of the application or use of any product or circuit, andspecifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters that may be provided in NXP data sheets and/or specifications can and do vary in different applications, and actual performance may vary over time. All operating parameters, including “typicals,” must be validated for each customer application by customer’s technical experts. NXP does not convey any license under its patent rights nor the rights of others. NXP sells products pursuant to standard terms and conditions of sale, which can be found at the following address:nxp.com/ SalesTermsandConditions. NXP, the NXP logo and Airfast are trademarks of NXP B.V. All other product or service names are the property of their respective owners. E 2018 NXP B.V. How to Reach Us: Home Page: nxp.com Web Support: nxp.com/support Document Number: A2G22S190- -01S Rev. 0, 09/2018