MDE6IC9120N NXP | Alldatasheet
Document overview
- Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 18
Technical content
Features
- Production Tested in a Symmetrical Doherty Configuration
- 100% PAR Tested for Guaranteed Output Power Capability
- Characterized with Series Equivalent Large-Signal Impedance Parameters and Common Source S-Parameters
- On-Chip Matching (50 Ohm Input, DC Blocked)
- Integrated Quiescent Current Temperature Compensation with Enable/Disable Function (1)
- Integrated ESD Protection
- 225°C Capable Plastic Package
- RoHS Compliant
- In Tape and Reel. R1 Suffix = 500 Units per 44 mm, 13 inch Reel
Figure 1. Functional Block Diagram Figure 2. Pin Connections the source terminal for the transistors.
- Refer to AN1977, Quiescent Current Thermal Tracking Circuit in the RF Integrated Circuit Family and to AN1987, Quiescent Current Control
- Peaking and Carrier orientation is determined by the test fixture design.
© Freescale Semiconductor, Inc., 2009. All rights reserved.
Table 1. Maximum Ratings Table 2. Thermal Characteristics Table 3. ESD Protection Characteristics Table 4. Moisture Sensitivity Level
- Continuous use at maximum temperature will affect MTTF.
- MTTF calculator available at http://www.freescale.com/rf . Select Software & Tools/Development Tools/Calculators to access MTTF
Select Documentation/Application Notes - AN1955.
Table 5. Electrical Characteristics (TA = 25°C unless otherwise noted) CCDF. ACPR measured in 3.84 MHz Channel Bandwidth @ ±5 MHz Offset.
- Each side of device measured separately.
- Part internally matched both on input and output.
- Measurement made with device in a Symmetrical Doherty configuration.
- Measurement made with device in straight lead configuration before any lead forming operation is applied. (continued)
Table 5. Electrical Characteristics (TA = 25°C unless otherwise noted) (continued)
- Measurement made with device in a Symmetrical Doherty configuration.
- Refer to AN1977, Quiescent Current Thermal Tracking Circuit in the RF Integrated Circuit Family and to AN1987, Quiescent Current Control
Figure 3. MDE6IC9120NR1(GNR1) Test Circuit Component Layout Note: Component numbers C15, C16 and R2 are not used. Table 6. MDE6IC9120NR1(GNR1) Test Circuit Component Designations and Values
Figure 4. Possible Circuit Topologies
Pout, OUTPUT POWER (WATTS) AVG. Figure 8. Single-Carrier W-CDMA Power Gain, Power Added Figure 9. Broadband Frequency Response
960 MHz
940 MHz920 MHz
920 MHz
940 MHz
3.84 MHz Channel Bandwidth
Figure 10. CCDF W-CDMA IQ Magnitude Channel Bandwidth @ ±5 MHz Offset.
3.84 MHz
Figure 11. Single-Carrier W-CDMA Spectrum
Figure 14. Pulsed CW Output Power NOTE: Measurement made on the Class AB, carrier side of the device.
MDE6IC9120NR1 MDE6IC9120GNR1 RF Device Data Freescale Semiconductor PACKAGE DIMENSIONS
MDE6IC9120NR1 MDE6IC9120GNR1
MDE6IC9120NR1 MDE6IC9120GNR1 RF Device Data Freescale Semiconductor
MDE6IC9120NR1 MDE6IC9120GNR1
MDE6IC9120NR1 MDE6IC9120GNR1 RF Device Data Freescale Semiconductor
MDE6IC9120NR1 MDE6IC9120GNR1
MDE6IC9120NR1 MDE6IC9120GNR1 RF Device Data Freescale Semiconductor PRODUCT DOCUMENTATION Refer to the following documents to aid your design process. Application Notes
- AN1955: Thermal Measurement Methodology of RF Power Amplifiers
- AN1977: Quiescent Current Thermal Tracking Circuit in the RF Integrated Circuit Family
- AN1987: Quiescent Current Control for the RF Integrated Circuit Device Family Engineering Bulletins
- EB212: Using Data Sheet Impedances for RF LDMOS Devices Software
- Electromigration MTTF Calculator
- RF High Power Model
- .s2p File For Software and Tools, do a Part Number search at http://www.freescale.com, and select the “Part Number” link. Go to the Software & Tools tab on the part’s Product Summary page to download the respective tool.
REVISION HISTORY
The following table summarizes revisions to this document. Revision Date Description 0 Nov. 2009 • Initial Release of Data Sheet
MDE6IC9120NR1 MDE6IC9120GNR1 Information in this document is provided solely to enable system and software implementers to use Freescale Semiconductor products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document. Freescale Semiconductor reserves the right to make changes without further notice to any products herein. Freescale Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Freescale Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters that may be provided in Freescale Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals”, must be validated for each customer application by customer’s technical experts. Freescale Semiconductor does not convey any license under its patent rights nor the rights of others. Freescale Semiconductor products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Freescale Semiconductor product could create a situation where personal injury or death may occur. Should Buyer purchase or use Freescale Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold Freescale Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Freescale Semiconductor was negligent regarding the design or manufacture of the part. Freescale/C0116 and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2009. All rights reserved. How to Reach Us: Home Page: www.freescale.com Web Support: http://www.freescale.com/support USA/Europe or Locations Not Listed: Freescale Semiconductor, Inc. Technical Information Center, EL516
2100 East Elliot Road
Tempe, Arizona 85284 1-800-521-6274 or +1-480-768-2130 www.freescale.com/support Europe, Middle East, and Africa: Freescale Halbleiter Deutschland GmbH Technical Information Center Schatzbogen 7
81829 Muenchen, Germany
+44 1296 380 456 (English) +46 8 52200080 (English) +49 89 92103 559 (German) +33 1 69 35 48 48 (French) www.freescale.com/support Japan: Freescale Semiconductor Japan Ltd. Headquarters ARCO Tower 15F 1-8-1, Shimo-Meguro, Meguro-ku, Tokyo 153-0064 Japan 0120 191014 or +81 3 5437 9125 support.japan@freescale.com Asia/Pacific: Freescale Semiconductor China Ltd. Exchange Building 23F No. 118 Jianguo Road Chaoyang District Beijing 100022 China +86 10 5879 8000 support.asia@freescale.com For Literature Requests Only: Freescale Semiconductor Literature Distribution Center 1-800-441-2447 or +1-303-675-2140 Fax: +1-303-675-2150 LDCForFreescaleSemiconductor@hibbertgroup.com Document Number: MDE6IC9120N Rev. 0, 11/2009