MW6IC2240N NXP | Alldatasheet

Document overview

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Technical content

Features

  • Characterized with Series Equivalent Large-Signal Impedance Parameters and Common Source Scattering Parameters
  • On-Chip Matching (50 Ohm Input, DC Blocked, >3 Ohm Output)
  • Integrated Quiescent Current Temperature Compensation with Enable/Disable Function (1)
  • Integrated ESD Protection
  • 225°C Capable Plastic Package
  • RoHS Compliant
  • In Tape and Reel. R1 Suffix = 500 Units per 44 mm, 13 inch Reel 1. Refer to AN1977, Quiescent Current Thermal Tracking Circuit in the RF Integrated Circuit Family and to AN1987, Quiescent Current Control Document Number: MW6IC2240N Rev. 6, 12/2008 Freescale Semiconductor Technical Data 2110-2170 MHz, 4.5 W AVG., 28 V 2 x W-CDMA RF LDMOS WIDEBAND INTEGRATED POWER AMPLIFIERS MW6IC2240NBR1 MW6IC2240GNBR1 CASE 1329-09 TO-272 WB-16 PLASTIC MW6IC2240NBR1 CASE 1329A-04 TO-272 WB-16 GULL PLASTIC MW6IC2240GNBR1

Figure 1. Functional Block Diagram Figure 2. Pin Connections the source terminal for the transistors. © Freescale Semiconductor, Inc., 2005-2008. All rights reserved.

Table 1. Maximum Ratings Table 2. Thermal Characteristics Table 3. ESD Protection Characteristics Table 4. Moisture Sensitivity Level Table 5. Electrical Characteristics (TC = 25°C unless otherwise noted)

  1. Continuous use at maximum temperature will affect MTTF.
  2. MTTF calculator available at http://www.freescale.com/rf . Select Software & Tools/Development Tools/Calculators to access MTTF

Select Documentation/Application Notes - AN1955.

Table 5. Electrical Characteristics (TC = 25°C unless otherwise noted) (continued)

2110 MHz<Frequency<2170 MHz

Table 6. Electrical Characteristics (TC = 25°C unless otherwise noted)

  1. Refer to AN1977, Quiescent Current Thermal Tracking Circuit in the RF Integrated Circuit Family and to AN1987, Quiescent Current Control

Figure 3. MW6IC2240NBR1(GNBR1) Test Circuit Schematic Table 7. MW6IC2240NBR1(GNBR1) Test Circuit Component Designations and Values

Figure 4. MW6IC2240NBR1(GNBR1) Test Circuit Component Layout

Figure 16. Series Equivalent Input and Load Impedance

Table 8. Common Source Scattering Parameters (VDD = 28 V, IDQ1 = 210 mA, IDQ2 = 370 mA, 50 Ohm System)

Figure 17. MW6IC2240NBR1(GNBR1) Test Circuit Schematic — TD-SCDMA Table 9. MW6IC2240NBR1(GNBR1) Test Circuit Component Designations and Values — TD-SCDMA

Figure 18. MW6IC2240NBR1(GNBR1) Test Circuit Component Layout — TD-SCDMA

Pout, OUTPUT POWER (WATTS) AVG. Figure 19. 3-Carrier TD-SCDMA ACPR, ALT and Pout, OUTPUT POWER (WATTS) AVG. Figure 20. 6-Carrier TD-SCDMA ACPR, ALT and Figure 21. 3-Carrier TD-SCDMA Spectrum

1.28 MHz

Figure 22. 6-Carrier TD-SCDMA Spectrum

1.28 MHz BW

Figure 23. Series Equivalent Input and Load Impedance — TD-SCDMA

MW6IC2240NBR1 MW6IC2240GNBR1 RF Device Data Freescale Semiconductor PACKAGE DIMENSIONS

MW6IC2240NBR1 MW6IC2240GNBR1

MW6IC2240NBR1 MW6IC2240GNBR1 RF Device Data Freescale Semiconductor

MW6IC2240NBR1 MW6IC2240GNBR1

MW6IC2240NBR1 MW6IC2240GNBR1 RF Device Data Freescale Semiconductor

MW6IC2240NBR1 MW6IC2240GNBR1

MW6IC2240NBR1 MW6IC2240GNBR1 RF Device Data Freescale Semiconductor PRODUCT DOCUMENTATION Refer to the following documents to aid your design process. Application Notes

  • AN1907: Solder Reflow Attach Method for High Power RF Devices in Plastic Packages
  • AN1955: Thermal Measurement Methodology of RF Power Amplifiers
  • AN1977: Quiescent Current Thermal Tracking Circuit in the RF Integrated Circuit Family
  • AN1987: Quiescent Current Control for the RF Integrated Circuit Device Family
  • AN3263: Bolt Down Mounting Method for High Power RF Transistors and RFICs in Over-Molded Plastic Packages Engineering Bulletins
  • EB212: Using Data Sheet Impedances for RF LDMOS Devices

REVISION HISTORY

The following table summarizes revisions to this document. Revision Date Description 3 Oct. 2006 • Added “including TD-SCDMA” to data sheet description, p. 1

  • Added Part Number and Manufacturer to Resistors in Table 7, Component Designations and Values, p. 4
  • Added TD-SCDMA test circuit schematic, component designations and values, component layout, typical characteristic curves, test signal and series impedance, p. 11-14
  • Added Product Documentation and Revision History, p. 21 4 Dec. 2006 • Updated Part Numbers in Table 7, Component Designations and Values, to RoHS compliant part numbers, p. 4 5 Feb. 2007 • Corrected VBIAS and VSUPPLY callouts, Fig. 3, Test Circuit Schematic, p. 4, Fig. 4, Test Circuit Component Layout, p. 5
  • Updated Part Numbers in Tables 7 and 9, Component Designations and Values, to latest RoHS compliant part numbers, p. 4, 11
  • Removed lower voltage tests from Fig. 14, Power Gain versus Output Power, due to fixed tuned fixture limitations, p. 8
  • Replaced Fig. 15, MTTF versus Junction Temperature with updated graph. Removed Amps2 and listed operating characteristics and location of MTTF calculator for device, p. 8
  • Changed callout ηD to PAE (Power Added Efficiency) for Figs. 19 and 20, 3-Carrier and 6-Carrier TD-SCDMA ACPR, ALT and Power Added Efficiency versus Output Power, p. 13
  • Corrected Zin data and plot in Fig. 23, Series Impedance, p. 14 6 Dec. 2008 • Modified data sheet to reflect RF Test Reduction described in Product and Process Change Notification number, PCN13232, p. 1, 2
  • Changed 220°C to 225°C in Capable Plastic Package bullet, p. 1
  • Added Footnote 1 to Quiescent Current Temperature bullet under Features section and to callout in Figure 1, Functional Block Diagram, p. 1
  • Changed Storage Temperature Range in Max Ratings table from -65 to +200 to -65 to +150 for standardization across products, p. 2
  • Added Case Operating Temperature limit to the Maximum Ratings table and set limit to 150 °C, p. 2
  • Operating Junction Temperature increased from 200°C to 225°C in Maximum Ratings table and related “Continuous use at maximum temperature will affect MTTF” footnote added, p. 2
  • Updated Part Numbers in Table 7, Component Designations and Values, to latest RoHS compliant part numbers, p. 4

MW6IC2240NBR1 MW6IC2240GNBR1 Information in this document is provided solely to enable system and software implementers to use Freescale Semiconductor products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document. Freescale Semiconductor reserves the right to make changes without further notice to any products herein. Freescale Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Freescale Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters that may be provided in Freescale Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals”, must be validated for each customer application by customer’s technical experts. Freescale Semiconductor does not convey any license under its patent rights nor the rights of others. Freescale Semiconductor products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Freescale Semiconductor product could create a situation where personal injury or death may occur. Should Buyer purchase or use Freescale Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold Freescale Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Freescale Semiconductor was negligent regarding the design or manufacture of the part. Freescale/C0116 and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2005-2008. All rights reserved. How to Reach Us: Home Page: www.freescale.com Web Support: http://www.freescale.com/support USA/Europe or Locations Not Listed: Freescale Semiconductor, Inc. Technical Information Center, EL516

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