ATA6561-GBQW-N

ATA6560 MICROCHIP | Alldatasheet

Document overview

• Manufacturer or author: Provided By alldatasheet.com(free datasheet download site)
• PDF pages: 28

Technical content

Features

• Fully ISO 11898-2, ISO 11898-5, and SAE J2284 Compliant
• CAN FD Ready
• Communication Speed up to 5 Mbps
• Low Electromagnetic Emission (EME) and High Electromagnetic Immunity (EMI)
• Differential Receiver with Wide Common-Mode Range
• ATA6560: Silent Mode (Receive Only)
• Remote Wake-Up Capability via CAN Bus
• Functional Behavior Predictable under All Supply Conditions
• Transceiver Disengages from the Bus when Not Powered Up
• RXD Recessive Clamping Detection
• High Electrostatic Discharge (ESD) Handling Capability on the Bus Pins
• Bus Pins Protected Against Transients in Automotive Environments
• Transmit Data (TXD) Dominant Time-Out Function
• Undervoltage Detection on VCC and VIO Pins
• CANH/CANL Short-Circuit and Overtemperature Protected
• Qualified According to AEC-Q100: Only ATA6560-GAQW, ATA6560-GBQW, ATA6561-GAQW, and ATA6561-GBQW
• Packages: SOIC8, VDFN8 with Wettable Flanks (Moisture Sensitivity Level 1)

Applications

Classical CAN and CAN FD networks in the following applications:

• Automotive
• Industrial
• Aerospace
• Medical
• C o n s u m e r General Description The ATA6560/1 is a high-speed CAN transceiver that provides an interface between a Controller Area Net- w o r k ( C A N ) p r o t o c o l c o n t r o l l e r a n d t h e p h y s i c a l two-wire CAN bus. The transceiver is designed for high-speed (up to 5 Mbps) CAN applications in the automotive industry, providing differential transmit and receive capability to (a microcontroller with) a CAN protocol controller. It offers improved Electromagnetic Compatibility (EMC) and ESD performance, as well as features such as:
• Ideal passive behavior to the CAN bus when the supply voltage is off
• Direct interfacing to microcontrollers with supply voltages from 3V to 5V (ATA6561) Three operating modes, together with the dedicated fail-safe features, make the ATA6560/1 an excellent choice for all types of high-speed CAN networks, especially in nodes requiring a Low-Power mode with wake-up capability via the CAN bus. Package Types ATA6561 3 x 3 VDFN* with wettable flanks ATA6560 SOIC VCC GND RXD CANH CANL

5 NSIL

5 VIO

3 x 3 VDFN* with wettable flanks VCC GND RXD CANH CANL NSIL STBYTXD 1 *Includes Exposed Thermal Pad (EP); see Table 1-2. VCC GND RXD CANH CANL VIO STBYTXD 1 High-Speed CAN Transceiver with Standby Mode CAN FD Ready

DS20005991A-page 2  2018 Microchip Technology Inc. ATA6560/1 FAMILY MEMBERS Device VIO Pin NSIL Pin VDFN8 SOIC8 AEC-Q100 Qualified Description ATA6560-GAQW X X X Standby mode and Silent mode ATA6560-GBQW X X X Standby mode and Silent mode ATA6561-GAQW X X X Standby mode, VIO - pin for compatibility with 3.3V and 5V microcontroller ATA6561-GBQW X X X Standby mode, VIO - pin for compatibility with 3.3V and 5V microcontroller ATA6560-GAQW-N X X Standby mode and Silent mode ATA6560-GBQW-N X X Standby mode and Silent mode ATA6561-GAQW-N X X Standby mode, VIO - pin for compatibility with 3.3V and 5V microcontroller ATA6561-GBQW-N X X Standby mode, VIO - pin for compatibility with 3.3V and 5V microcontroller Note: For ordering information, see the Product Identification System section.

 2018 Microchip Technology Inc. DS20005991A-page 3 ATA6560/1 Functional Block Diagram Temperature Protection Control Unit Wake-Up Filter Slope Control and Driver TXD Time-Out Timer VIO VIO(1) VIO(1) VIO(1) VCC 9&& MUX TXD STBY CANH ATA6560/1 RXD NSIL 5(1) 3 CANL GND 5(1) VIO(1) WUC(3) HSC(2) Note 1:Pin 5: ATA6561: VIO ATA6560: NSIL (the VIO line and the VCC line are internally connected) 2: HSC: High-Speed Comparator 3: Wake-Up Comparator

DS20005991A-page 4  2018 Microchip Technology Inc.

1.0 FUNCTIONAL DESCRIPTION

The ATA6560/1 is a stand-alone, high-speed CAN transceiver, compliant with the ISO 11898-2 and ISO 11898-5 standards. It provides a very low current consumption in Standby mode and wake-up capability via the CAN bus. There are two versions available, only differing in the function of pin 5:

• ATA6560: Pin 5 is the control input for Silent mode NSIL, allowing the ATA6560 to only receive data and not send data via the bus. The output driver stage is disabled. The VIO line and the VCC line are internally connected; this sets the signal levels of the TXD, RXD, STBY, and NSIL pins to levels compatible with 5V microcontrollers.
• ATA6561: Pin 5 is the VIO pin and should be connected to the microcontroller supply voltage. This allows direct interfacing to microcontrollers with supply voltages down to 3V and adjusts the signal levels of the TXD, RXD, and STBY pins to the I/O levels of the microcontroller. The I/O ports are supplied by the VIO pin.

1.1 Operating Modes

The ATA6561 supports three operating modes: Unpow- ered, Standby, and Normal. The ATA6560 has an addi- tional Silent mode. These modes can be selected via the STBY and NSIL pin. See Figure 1-1 and Table 1-1 for a description of the operating modes. FIGURE 1-1: Operating Modes. TABLE 1-1: OPERATING MODES Mode Inputs Outputs STBY NSIL TXD CAN Driver RXD Unpowered X (3) X(3) X(3) Recessive Recessive Standby HIGH X (3) X(3) Recessive Active (4) Silent (only for ATA6560) LOW LOW X (3) Recessive Active (1) Normal LOW HIGH (2) LOW Dominant LOW LOW HIGH (2) HIGH Recessive HIGH Note 1: LOW if the CAN bus is dominant, and HIGH if the CAN bus is recessive. 2: Internally pulled up if not bonded out. 3: Irrelevant. 4: Reflects the bus only for wake-up. VCC < Vuvd(VCC) VCC < Vuvd(VCC) STBY = 1 STBY = 1 STBY = 0 and NSIL = 1 and STBY = 0 and (NSIL = 0 or TXD = 0) STBY = 0 and TXD = 0 NSIL = 1 and TXD = 1 and Error = 0 NSIL = 0 or Error = 1 TXD = 1 and Error = 0 VCC > Vuvd(VCC) VCC < Vuvd(VCC)Unpowered Mode Standby Mode Silent Mode Normal Mode VCC < Vuvd(VCC) or STBY = 1 STBY = 0 and TXD = 1 and Error = 0 and TXD = 1 Error = 1 Error = 0 VCC < Vuvd(VCC) or VIO < Vuvd(VIO) VIO < Vuvd(VIO) VCC < Vuvd(VCC) or VCC > V uvd(VCC) and VIO < Vuvd(VIO) VIO > Vuvd(VIO) Unpowered Mode Standby Mode Silent Mode Normal Mode ATA6560 ATA6561 STBY = 1 Note 1:The Silent mode is externally not accessible. 2: For the ATA6561, NSIL is internally set to “1”.

 2018 Microchip Technology Inc. DS20005991A-page 5 ATA6560/1

1.1.1 NORMAL MODE

A low level on the STBY pin, together with a high level on pins TXD and NSIL, selects the Normal mode. In this mode, the transceiver can transmit and receive data via the CANH and CANL bus lines (see the “Functional Block Diagram”). The output driver stage is active and drives data from the TXD input to the CAN bus. The High-Speed Comparator (HSC) converts the analog data on the bus lines into digital data, which is output to pin RXD. The bus biasing is set to V VCC/2, and the undervoltage monitoring of VCC is active. The slope of the output signals on the bus lines is controlled and optimized to ensure the lowest possible EME. To switch the device to a normal operating mode, set the STBY pin to low and the TXD and NSIL pins (if applicable) to high (see Table 1-1, Figure 1-2, and Figure 1-3). Both the STBY and the NSIL pins provide a pull-up resistor to VIO, thus ensuring defined levels if the pins are open. The device cannot enter the Normal mode as long as the TXD is at ground level. ATA6560 only switches to the Normal mode when all inputs are set accordingly. FIGURE 1-2: Switching from Standby Mode to Normal Mode (NSIL = High). FIGURE 1-3: Switching from Silent Mode to Normal Mode. STBY TXD Standby Pode tdel(stby-norm) = 47μs max Normal Pode t t t Operation Pode STBY NSIL TXD Silent Pode tdel(sil-norm) = 10μs max Normal Pode t t t t Operation Pode

DS20005991A-page 6  2018 Microchip Technology Inc.

1.1.2 SILENT MODE (ONLY FOR THE

ATA6560) A low level on the NSIL pin (available on pin 5) and on the STBY pin selects the Silent mode. This receive-only mode can be used to test the connection of the bus medium. In the Silent mode, the ATA6560 can still receive data from the bus, but the transmitter is disabled and therefore no data can be sent to the CAN bus. The bus pins are released to recessive state. All other IC functions, including the HSC, continue to oper- ate as they do in the Normal mode. The Silent mode can be used to prevent a faulty CAN controller from disrupting all network communications.

1.1.3 STANDBY MODE

A high level on the STBY pin selects the Standby mode. In this mode, the transceiver cannot transmit or correctly receive data via the bus lines. The transmitter and the HSC are switched off to reduce current con- sumption, and only the low-power Wake-Up Compara- tor (WUC) monitors the bus lines for a valid wake-up signal. A signal change on the bus from “Recessive” to “Dominant,” followed by a dominant state longer than t wake, switches the RXD pin to low to signal a wake-up request to the microcontroller. In the Standby mode, the bus lines are biased to ground to reduce current consumption to a minimum. The WUC monitors the bus lines for a valid wake-up signal. When the RXD pin switches to low to signal a wake-up request, a transition to the Normal mode is not triggered until the microcontroller forces back the STBY pin to low. A bus dominant time-out timer prevents the device from generating a permanent wake-up request by switching the RXD pin to high. For ATA6560 only: If the NSIL input pin is set to low in the Standby mode, the internal pull-up resistor causes an additional quiescent current from VIO to GND. Microchip recommends setting the NSIL pin to high in the Standby mode.

1.2 Fail-Safe Features

1.2.1 TXD DOMINANT TIME-OUT

A TXD dominant time-out ti mer is started when the TXD pin is set to low. If the low state on the TXD pin persists for longer than t to(dom)TXD, the transmitter is disabled, releasing the bus lines to a recessive state. This function prevents a hardware failure, software application failure, or both from driving the bus lines to a permanent dominant state (blocking all network communications). The TXD dominant time-out timer is reset when the TXD pin is set to high (≥ 4 µs).

1.2.2 INTERNAL PULL-UP STRUCTURE

AT TXD, NSIL, AND STBY INPUT PINS The TXD, STBY, and NSIL pins have an internal pull-up to VIO. This ensures a safe, defined state in case one or all of these pins are left floating. Pull-up currents flow in these pins in all states, meaning all pins should be in a high state during the Standby mode to minimize the current consumption.

1.2.3 UNDERVOLTAGE DETECTION ON

If VVCC or VVIO drops below their respective undervoltage detection levels (Vuvd(VCC) and Vuvd(VIO), see Section 2.0 “Electrical Characteristics”), the transceiver switches off and disengages from the bus until VVCC and VVIO have recovered. The low-power WUC is only switched off during a VCC or VIO undervoltage. The logic state of the STBY pin is ignored until the VCC voltage or the VIO voltage has recovered.

1.2.4 BUS WAKE-UP TIME-OUT

In the Standby mode, a bus wake-up time-out timer is started when the CAN bus changes from recessive to dominant state. If the dominant state on the bus persists for longer than t to_bus, the RXD pin is switched to high. This function prevents a clamped dominant bus (due to a bus short circuit or a failure in one of the other nodes on the network) from generating a permanent wake-up request. The bus wake-up time-out timer is reset when the CAN bus changes from dominant to recessive state.

1.2.5 OVERTEMPERATURE PROTECTION

The output drivers are protected against overtemperature conditions. If the junction temperature exceeds the shutdown junction temperature, TJsd, the output drivers are disabled until the junction temperature drops below TJsd a n d p i n T X D i s a t a h i g h l e v e l a g a i n . T h e T X D condition ensures that output driver oscillations due to temperature drift are avoided.

 2018 Microchip Technology Inc. DS20005991A-page 7 ATA6560/1 FIGURE 1-4: Release of Transmission After Overtemperature Condition.

1.2.6 SHORT-CIRCUIT PROTECTION OF

The CANH and CANL bus outputs are short-circuit protected, either against GND or a positive supply voltage. A current-limiting circuit protects the trans- ceiver against damage. If the device heats up due to a continuous short on CANH or CANL, the internal overtemperature protecti on switches the bus trans- mitter off.

1.2.7 RXD RECESSIVE CLAMPING

This fail-safe feature prevents the controller from sending data on the bus if its RXD line is clamped to high (for example, recessive). That is, if the RXD pin cannot signal a dominant bus condition (for example, because it is shorted to VCC), the transmitter within the ATA6560/1 is disabled to avoid possible data collisions on the bus. In Normal and Silent modes (only for the ATA6560), the device permanently compares the state of the HSC to the state of the RXD pin. If the HSC indicates a dominant bus state for more than t RC_det, without the RXD pin doing the same, a recessive clamping situation is detected and the device is forced into the Silent mode. This Fail-Safe mode is released by entering either the Standby or the Unpow- ered mode or if the RXD pin is showing a dominant (for example, low) level again. Failure Overtemp GND TXD Overtemperature RD R t t t OT BUS V DIFF (CANH-CANL) V9,O RDD t t RXD V9,O GND

DS20005991A-page 8  2018 Microchip Technology Inc. FIGURE 1-5: RXD Recessive Clamping Detection.

1.3 Pin Description

The descriptions of the pins are listed in Table 1-2. CAN TXD RXD Operation Pode Normal Normal Silent If the clamping condition is removed and a dominant bus is detected, the transceiver goes back to 1ormal mode. TABLE 1-2: PIN FUNCTION TABLE ATA6560 ATA6561 Symbol Description SOIC8 VDFN8 SOIC8 VDFN8

1111 T X D Transmit Data Input

2222 G N D G r o u n d S u p p l y

3333 V C C S u p p l y V o l t a g e

4444 R X D R e c e i v e D a t a O u t p u t ; r eads out data from the bus lines

— — 5 5 VIO Supply Voltage for the I/ O Level Adapter; the VIO and VCC lines are internally connected 5 5 — — NSIL Silent Mode Control Input (low active) 6666C A N L L o w - L e v e l C A N B u s L i n e

7777 C A N H H i g h - L e v e l C A N B u s L i n e

8888S T B Y S t a n d b y M o d e C o n t r o l I nput — 9 — 9 EP Exposed Thermal Pad; heat slug, internally connected to t he GND pin

 2018 Microchip Technology Inc. DS20005991A-page 9 ATA6560/1

1.4 Typical Application

ATA6560 Typical Application ATA6561 Typical Application Note 1:The size of this capacitor depends on the external voltage regulator used. 2: For the VDFN package, the heat slug must always be connected to GND. 4 2

3 CANH

6 CANL

22μF(1) + CANH 100nF 22μF(1) VIO VCC VDD Microcontroller GND ATA6561 CANHSTBY TXD RXD CANL BAT 12V 3.3V 12V 100nF Note 1:The size of this capacitor depends on the external voltage regulator used. 2: For the VDFN package, the heat slug must always be connected to GND.

DS20005991A-page 10  2018 Microchip Technology Inc.

2.0 ELECTRICAL CHARACTERISTICS

Absolute Maximum Ratings † † Notice: Stresses above those listed under “Absolute Maximum Ratings” m ay cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operation listings of this specification is no t implied. Exposure to maximum rating conditions for extended periods may affect device reliability. ATA6560/1 ELECTRICAL CHARACTERISTICS Electrical Specifications: TvJ = –40°C to +150°C; VVCC = 4.5V to 5.5V; VVIO = 2.8V to 5.5V; RL =6 0, CL = 100 pF, unless otherwise; all voltages are defined in relation to ground; positive currents flow into the IC. Parameters Sym. Min. Typ. Max. Units Conditions Supply, Pin VCC Supply Voltage V VCC 4.5 — 5.5 V Supply Current in Silent Mode I VCC_sil 1.9 2.5 3.0 mA Silent mode, VTXD =V VIO Supply Current in Normal Mode I VCC_rec 2 — 5 mA Recessive, VTXD =V VIO IVCC_dom 20 50 70 mA Dominant, V TXD =0 V Supply Current in Standby Mode IVCC_STBY — — 12 µA V VCC =V VIO, VTXD =V NSIL =V VIO IVCC_STBY —7— µ A T a =+ 2 5 ° C (Note 3) Undervoltage Detection Threshold on Pin VCC Vuvd(VCC) 2.75 — 4.5 V I/O Level Adapter Supply, Pin VIO (only for the ATA6561) Supply Voltage on Pin VIO V VIO 2.8 — 5.5 V Supply Current on Pin VIO I IO_rec 10 80 250 µA Normal and Silent modes Recessive, VTXD =V VIO IIO_rdom 50 350 500 µA Normal and Silent modes Dominant, VTXD =0 V IIO_STBY — — 1 µA Standby mode Undervoltage Detection Threshold on Pin VIO Vuvd(VIO) 1.3 — 2.7 V Note 1: This parameter is 100% correlation tested. 2: This parameter is ensured by characterization on samples. 3: This parameter is ensured by design.

 2018 Microchip Technology Inc. DS20005991A-page 11 ATA6560/1 Mode Control Input, Pin NSIL and STBY High-Level Input Voltage V IH 0.7 x VVIO —V VIO +0 . 3 V Low-Level Input Voltage V IL –0.3 — 0.3 x V VIO V Pull-Up Resistor to VIO R pu 75 125 175 kΩ V STBY =0 V , VNSIL =0 V High-Level Leakage Current I L –2 — +2 µA V STBY =V VIO, VNSIL =V VIO CAN Transmit Data Input, Pin TXD High-Level Input Voltage V IH 0.7 x VVIO —V VIO +0 . 3 V Low-Level Input Voltage V IL –0.3 — 0.3 x V VIO V Pull-Up Resistor to VIO R TXD 20 35 50 kΩ V TXD =0 V High-Level Leakage Current I TXD –2 — +2 µA Normal mode, VTXD =V VIO Input Capacitance C TXD — 5 10 pF Note 3 CAN Receive Data Output, Pin RXD High-Level Output Current I OH –8 — –1 mA Normal mode, VRXD =V VIO –0 . 4 V , VVIO =V VCC Low-Level Output Current I OL 2 — 12 mA Normal mode, VRXD =0 . 4 V , bus dominant Bus Lines, Pins CANH and CANL Dominant Output Voltage I IO 2.75 3.5 4.5 V V TXD =0 V , t<t to(dom)TXD pin CANH 0.5 1.5 2.25 V V TXD =0 V , t<t to(dom)TXD pin CANL Transmitter Dominant Voltage Symmetry Vdom(TX)sym 0.9 x VVCC — 1.1 x VVCC VV dom(TX)sym =V CANH + VCANL (Note 1) Bus Differential Output Voltage V O(diff)bus 1.5 — 3 V V TXD =0 V , t<t to(dom)TXD RL = 45Ω to 65Ω –50 — +50 mV V VCC = 4.75V to 5.25V VTXD =V VIO, receive, no load Recessive Output Voltage V O(rec) 20 . 5 x VVCC 3 V Normal and Silent modes, V TXD =V VIO, no load –0.1 — +0.1 V Standby mode, VTXD =V VIO, no load ATA6560/1 ELECTRICAL CHARACTERISTICS (CONTINUED) Electrical Specifications: TvJ = –40°C to +150°C; VVCC = 4.5V to 5.5V; VVIO = 2.8V to 5.5V; RL =6 0, CL = 100 pF, unless otherwise; all voltages are defined in relation to ground; positive currents flow into the IC. Parameters Sym. Min. Typ. Max. Units Conditions Note 1: This parameter is 100% correlation tested. 2: This parameter is ensured by characterization on samples. 3: This parameter is ensured by design.

DS20005991A-page 12  2018 Microchip Technology Inc. Differential Receiver Threshold Voltage Vth(RX)dif 0.5 0.7 0.9 V Normal and Silent modes (HSC), Vcm(CAN) =– 2 7 V t o +27V 0.4 0.7 1 V Standby mode (WUC), Vcm(CAN) =– 2 7 V t o +27V (Note 1) Differential Receiver Hystere- sis Voltage (HSC) Vhys(RX)dif 50 120 200 mV Normal and Silent modes (HSC), Vcm(CAN) =– 2 7 V t o +27V (Note 1) Dominant Output Current I IO(dom) –100 — –35 mA V TXD =0 V , t<t to(dom)TXD, VVCC =5 V pin CANH, VCANH =0 V 35 — 100 mA V TXD =0 V , t<t to(dom)TXD, VVCC =5 V pin CANL, V CANL =5 V / 4 0 V Recessive Output Current I IO(rec) –5 — +5 mA Normal and Silent modes, V TXD =V VIO, no load, VCANH =V CANL = –27V to +32V Leakage Current I IO(rec) –5 0 +5 µA V VCC =V VIO =0 V , VCANH =V CANL =5 V Input Resistance R i 91 5 2 8 k Ω Input Resistance Deviation ΔR i –1 0 +1 % Between V CANH and VCANL Differential Input Resistance R i(dif) 19 30 56 kΩ Ri(dif) 20 30 56 kΩ T vJ < +125°C Common-Mode Input Capacitance Ci(cm) — — 20 pF Note 3 Differential Input Capacitance C i(dif) — — 10 pF Note 3 Transceiver Timing, Pins CANH, CANL, TXD, and RXD, see Figure 2-1 and Figure 2-2 Delay Time from TXD to Bus Dominant td(TXD-busdom) 40 — 130 ns Normal mode ( Note 2) Delay Time from TXD to Bus Recessive td(TXD-busrec) 40 — 130 ns Normal mode ( Note 2) Delay Time from Bus Dominant to RXD td(busdom-RXD) 20 — 100 ns Normal and Silent modes (Note 2) Delay Time from Bus Reces- sive to RXD td(busrec-RXD) 20 — 100 ns Normal and Silent modes (Note 2) ATA6560/1 ELECTRICAL CHARACTERISTICS (CONTINUED) Electrical Specifications: TvJ = –40°C to +150°C; VVCC = 4.5V to 5.5V; VVIO = 2.8V to 5.5V; RL =6 0, CL = 100 pF, unless otherwise; all voltages are defined in relation to ground; positive currents flow into the IC. Parameters Sym. Min. Typ. Max. Units Conditions Note 1: This parameter is 100% correlation tested. 2: This parameter is ensured by characterization on samples. 3: This parameter is ensured by design.

 2018 Microchip Technology Inc. DS20005991A-page 13 ATA6560/1 Propagation Delay from TXD to RXD tPD(TXD-RXD) 40 — 210 ns Normal mode, Rising edge at pin TXD 40 — 200 ns Normal mode, Falling edge at pin TXD tPD(TXD-RXD) — — 300 ns Normal mode, Rising edge at pin TXD RL = 120Ω, CL = 200 pF (Note 3) — — 300 ns Normal mode, Falling edge at pin TXD R L = 120Ω, CL = 200pF (Note 3) TXD Dominant Time-Out Time t to(dom)TXD 0.8 — 3 ms V TXD = 0V, Normal mode Bus Wake-Up Time-Out Time t to_bus 0.8 — 3 ms Standby mode Minimum Dominant/Recessive Bus Wake-Up Time twake 0.75 3 5 µs Standby mode Delay Time for Standby Mode to Normal Mode Transition tdel(stby-norm) — — 47 µs Falling edge at pin STBY NSIL = HIGH Delay Time for Normal Mode to Standby Mode Transition t del(norm-stby) — — 5 µs Rising edge at pin STBY NSIL = HIGH (Note 3) Delay Time for Normal Mode to Silent Mode Transition t del(norm-sil) — — 10 µs Falling edge at pin NSIL STBY = LOW (Note 3) Delay Time for Silent Mode to Normal Mode Transition t del(sil-norm) — — 10 µs Rising edge at pin NSIL STBY = LOW (Note 3) Delay Time for Silent Mode to Standby Mode Transition tdel(sil-stby) — — 5 µs Rising edge at pin STBY NSIL = LOW (Note 3) Delay Time for Standby Mode to Silent Mode Transition tdel(stby-sil) — — 47 µs Rising edge at pin STBY NSIL = LOW (Note 3) Debouncing Time for Reces- sive Clamping State Detection tRC_det —9 0— n s V (CANH-CANL) > 900 mV RXD = HIGH (Note 3) Transceiver Timing for higher Bit Rates, Pins CANH, CANL, TXD, and RXD, see Figure 2-1 and Figure 2-3 Recessive Bit Time on Pin RXD tBit(RXD) 400 — 550 ns Normal mode, tBit(TXD) = 500 ns (Note 3) 120 — 220 ns Normal mode, tBit(TXD) = 200 ns ATA6560/1 ELECTRICAL CHARACTERISTICS (CONTINUED) Electrical Specifications: TvJ = –40°C to +150°C; VVCC = 4.5V to 5.5V; VVIO = 2.8V to 5.5V; RL =6 0, CL = 100 pF, unless otherwise; all voltages are defined in relation to ground; positive currents flow into the IC. Parameters Sym. Min. Typ. Max. Units Conditions Note 1: This parameter is 100% correlation tested. 2: This parameter is ensured by characterization on samples. 3: This parameter is ensured by design.

DS20005991A-page 14  2018 Microchip Technology Inc. FIGURE 2-1: Timing Test Circuit for the ATA6560/1 CAN Transceiver. Temperature Specifications Parameters Sym. Min. Typ. Max. Units Conditions 8-Lead SOIC Thermal Resistance Virtual Junction to Ambient R thvJA —1 4 5 —K / W Thermal Shutdown of Bus Drivers T Jsd 150 175 195 °C 8-Lead VDFN Thermal Resistance Virtual Junction to Heat Slug R thvJC —1 0 — K / W Thermal Resistance Virtual Junction to Ambient, where Heat Slug is Soldered to PCB According to JEDEC RthvJA —5 0 — K / W Thermal Shutdown of Bus Drivers T Jsd 150 175 195 °C TXD1 +5V 22μF 100nF 15pF RXD CANH GND STBY CANL VIO/NSIL VCC RL CL

DS20005991A-page 16  2018 Microchip Technology Inc.

3.0 PACKAGING INFORMATION

3.1 Package Marking Information

Legend: XX...X Customer-specific information Y Year code (last digit of calendar year) YY Year code (last 2 digits of calendar year) WW Week code (week of January 1 is week ‘01’) NNN Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) * This package is Pb-free. The Pb-free JEDEC designator ( ) Note: In the event the full Microchip part number cannot be marked o n one line, it will be carried over to the next line, thus limiting the number of a vailable characters for customer-specific information. 6566 ZZZ 8-Lead SOIC 8-Lead 3 x 3 mm VDFN Example ATA6560 Example ATA6561 Example ATA6561 6561 256 6566 ZZZ 6560 256 Example ATA6560 Industrial type Example ATA6561 Industrial type Example ATA6561 Industrial type 6566 ZZZ 6561-N 256 6566 ZZZ 6560-N 256 Example ATA6560 Industrial type Example ATA6560

 2018 Microchip Technology Inc. DS20005991A-page 17 ATA6560/1 8-Lead Plastic Small Outline (OA) - Narrow, 3.90 mm (.150 In.) Body [SOIC] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging.

0.25 C A–B D

C SEATING PLANE TOP VIEW SIDE VIEW VIEW A–A 0.10 C 0.10 C Microchip Technology Drawing No. C04-057-OA Rev D Sheet 1 of 2 1 2 N h h A2A A B e D E E 2E1 NOTE 5 NOTE 5 NX b

0.10 C A–B

H 0.23 (L1) L R0.13 R0.13 VIEW C SEE VIEW C NOTE 1 D

DS20005991A-page 18  2018 Microchip Technology Inc. 8-Lead Plastic Small Outline (OA) - Narrow, 3.90 mm (.150 In.) Body [SOIC] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging. Microchip Technology Drawing No. C04-057-OA Rev D Sheet 2 of 2 Foot Angle 0° - 8° 15°-5°Mold Draft Angle Bottom 15°-5°Mold Draft Angle Top 0.51-0.31bLead Width 0.25-0.17cLead Thickness 1.27-0.40LFoot Length 0.50-0.25hChamfer (Optional)

4.90 BSCDOverall Length

3.90 BSCE1Molded Package Width

6.00 BSCEOverall Width

0.25-0.10A1Standoff --1.25A2Molded Package Thickness 1.75--AOverall Height

1.27 BSCePitch

REF: Reference Dimension, usually without tolerance, for information purposes only. BSC: Basic Dimension. Theoretically exact value shown without tolerances. Pin 1 visual index feature may vary, but must be located within the hatched area. Significant Characteristic Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15mm per side. Dimensioning and tolerancing per ASME Y14.5M Notes: Footprint L1 1.04 REF 5. Datums A & B to be determined at Datum H.

 2018 Microchip Technology Inc. DS20005991A-page 19 ATA6560/1 8-Lead Plastic Small Outline (OA) - Narrow, 3.90 mm Body [SOIC] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging. RECOMMENDED LAND PATTERN Microchip Technology Drawing C04-2057-OA Rev B BSC: Basic Dimension. Theoretically exact value shown without tolerances. Notes: Dimensioning and tolerancing per ASME Y14.5M1. Dimension Limits Units CContact Pad Spacing Contact Pitch MILLIMETERS

1.27 BSC

E MAX 5.40 Contact Pad Length (X8) Contact Pad Width (X8) 1.55 0.60 NOM E C SILK SCREEN

DS20005991A-page 20  2018 Microchip Technology Inc. 8-Lead Very Thin Plastic Dual Flat, No Lead Package (Q8B) - 3x3 mm Body [VDFN] With 2.40x1.60 mm Exposed Pad and Stepped Wettable Flanks Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging. BA 0.10 C 0.10 C

0.10 C A B

0.05 C (DATUM B) (DATUM A) C SEATING PLANE N TOP VIEW SIDE VIEW BOTTOM VIEW 0.10 C 0.08 C Microchip Technology Drawing C04-21358 Rev B Sheet 1 of 2 D E NOTE 1 (A3) A N NOTE 1 L K e 8X b A A

 2018 Microchip Technology Inc. DS20005991A-page 21 ATA6560/1 8-Lead Very Thin Plastic Dual Flat, No Lead Package (Q8B) - 3x3 mm Body [VDFN] With 2.40x1.60 mm Exposed Pad and Stepped Wettable Flanks Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging. Microchip Technology Drawing C04-21358 Rev B Sheet 2 of 2 Number of Terminals Overall Height Terminal Width Overall Width Terminal Length Exposed Pad Width Terminal Thickness Pitch Standoff Units Dimension Limits A b e L E N

0.65 BSC

0.203 REF

1.50 0.35 0.25 0.80 0.00 0.30 0.40 1.60 0.85 0.03

3.00 BSC

1.70 0.45 0.35 0.90 0.05 MAX K- 0.20 - REF: Reference Dimension, usually without tolerance, for information purposes only. BSC: Basic Dimension. Theoretically exact value shown without tolerances. Notes: Pin 1 visual index feature may vary, but must be located within the hatched area. Package is saw singulated Dimensioning and tolerancing per ASME Y14.5M Terminal-to-Exposed-Pad Overall Length Exposed Pad Length D D2 2.30 2.40 2.50 SECTION A–A PARTIALLY PLATED Wettable Flank Step Cut Depth A4 0.10 0.1 3 0.15 E3 --0 . 0 4Wettable Flank Step Cut Width

DS20005991A-page 22  2018 Microchip Technology Inc. 8-Lead Very Thin Plastic Dual Flat, No Lead Package (Q8B) - 3x3 mm Body [VDFN] With 2.40x1.60 mm Exposed Pad and Stepped Wettable Flanks Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging. RECOMMENDED LAND PATTERN Dimension Limits Units Optional Center Pad Width Optional Center Pad Length Contact Pitch 2.50 1.70 MILLIMETERS E MAX Contact Pad Length (X8) Contact Pad Width (X8) 0.80 0.35 Microchip Technology Drawing C04-23358 Rev B NOM CContact Pad Spacing 3.00 Contact Pad to Center Pad (X8) G1 0.20 Thermal Via Diameter V Thermal Via Pitch EV 0.33 1.20 BSC: Basic Dimension. Theoretically exact value shown without tolerances. Notes: Dimensioning and tolerancing per ASME Y14.5M For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during reflow process C E EV ØV SILK SCREEN EVX2 Pin 1 Index Chamfer CH 0.20 Contact Pad to Contact Pad (X6) G2 0.20 CH

 2018 Microchip Technology Inc. DS20005991A-page 23 ATA6560/1 APPENDIX A: REVISION HISTORY Revision A (April 2018)

• Original release of this document.
• This document replaces Atmel - 9288J-AUTO-04/15.
• Added Industrial types.
• Added table ATA6560/1 Family Members.

DS20005991A-page 24  2018 Microchip Technology Inc. NOTES:

 2018 Microchip Technology Inc. DS20005991A-page 25 ATA6560/1 THE MICROCHIP WEB SITE Microchip provides online support via our WWW site at www.microchip.com. This web site is used as a means to make files and information easily available to customers. Accessible by usi ng your favorite Internet browser, the web site contains the following information:

• Product Support – Data sheets and errata, application notes and sample programs, design resources, user’s guides and hardware support documents, latest software releases and archived software
• General Technical Support – Frequently Asked Questions (FAQ), technical support requests, online discussion groups, Microchip consultant program member listing
• Business of Microchip – Product selector and ordering guides, latest Microchip press releases, listing of seminars and events, listings of Microchip sales offices, distributors and factory representatives CUSTOMER CHANGE NOTIFICATION SERVICE Microchip’s customer notif ication service helps keep customers current on Microchip products. Subscribers will receive e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or development tool of interest. To register, access the Microchip web site at www.microchip.com. Under “Support”, click on “Customer Change Notification” and follow the registration instructions. CUSTOMER SUPPORT Users of Microchip products can receive assistance through several channels:
• Distributor or Representative
• Local Sales Office
• Field Application Engineer (FAE)
• Technical Support Customers should contac t their distributor, representative or Field Application Engineer (FAE) for support. Local sales offices are also available to help customers. A listing of sales offices and locations is included in the back of this document. Technical support is available through the web site at: http://microchip.com/support

DS20005991A-page 26  2018 Microchip Technology Inc. PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office. Examples: a) ATA6560-GAQW: ATA6560, 8-Lead SOIC, Qualified according to AEC-Q100, Tape and Reel, Package according to RoHS b) ATA6560-GBQW: ATA6560, 8-Lead VDFN, Qualified according to AEC-Q100, Tape and Reel, Package according to RoHS c) ATA6561-GAQW: ATA6561, 8-Lead SOIC, Qualified according to AEC-Q100, Tape and Reel, Package according to RoHS d) ATA6561-GBQW: ATA6561, 8-Lead VDFN, Qualified according to AEC-Q100, Tape and Reel, Package according to RoHS e) ATA6560-GAQW-N: ATA6560, 8-Lead SOIC, Tape and Reel, Package according to RoHS, Industrial type f) ATA6560-GBQW-N: ATA6560, 8-Lead VDFN, Tape and Reel, Package according to RoHS, Industrial type g) ATA6561-GAQW-N: ATA6561, 8-Lead SOIC, Tape and Reel, Package according to RoHS, Industrial type h) ATA6561-GBQW-N: ATA6561, 8-Lead VDFN, Tape and Reel, Package according to RoHS, Industrial type PART NO. X Package DirectivesDevice Device: ATA6560/1: High-Speed CAN Transceiver with Standby Mode – CAN FD Ready Package: GA = 8-Lead SOIC GB = 8-Lead VDFN Tape and Reel Option: Q = 330 mm diameter Tape and Reel Package Directives Classification: W = Package according to RoHS (2) Device Variant N = Device Variant N (Industrial type) XX Package X Tape and Reel Option Classification Note 1: Tape and Reel identifier only appears in the catalog part number description. This identifier is used for ordering purposes and is not printed on the device package. Check with your Microchip Sales Office for package availability with the Tape and Reel option. 2: RoHS compliant; maximum concentration value of 0.09% (900 ppm) for Bromine (Br) and Chlorine (Cl) and less than 0.15% (1500 ppm) total Bromine (Br) and Chlorine (Cl) in any homogeneous material. Maximum concentration value of 0.09% (900 ppm) for Antimony (Sb) in any homogeneous material. X Device Variant – –

 2018 Microchip Technology Inc. DS20005991A-page 27 Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE . Microchip disclai m s a l l l i a b i l i t y arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights unless otherwise stated. Trademarks The Microchip name and logo, the Microchip logo, AnyRate, AVR, AVR logo, AVR Freaks, BeaconThings, BitCloud, chipKIT, chipKIT logo, CryptoMemory, CryptoRF, dsPIC, FlashFlex, flexPWR, Heldo, JukeBlox, K EELOQ, KEELOQ logo, Kleer, LANCheck, LINK MD, maXStylus, maXTouch, MediaLB, megaAVR, MOST, MOST logo, MPLAB, OptoLyzer, PIC, picoPower, PICSTART, PIC32 logo, Prochip Designer, QTouch, RightTouch, SAM-BA, SpyNIC, SST, SST Logo, SuperFlash, tinyAVR, UNI/O, and XMEGA are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. ClockWorks, The Embedded Control Solutions Company, EtherSynch, Hyper Speed Control, HyperLight Load, IntelliMOS, mTouch, Precision Edge, and Quiet-Wire are registered trademarks of Microchip Technology Incorporated in the U.S.A. Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut, BodyCom, CodeGuard, CryptoAuthentication, CryptoCompanion, CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial Programming, ICSP , Inter- Chip Connectivity, JitterBlocker, KleerNet, KleerNet logo, Mindi, MiWi, motorBench, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, PureSilicon, QMatrix, RightTouch logo, REAL ICE, Ripple Blocker, SAM-ICE, Serial Quad I/O, SMART-I.S., SQI, SuperSwitcher, SuperSwitcher II, Total Endurance, TSHARC, USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries. GestIC is a registered trademark of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. © 2018, Microchip Technology Incorporated, All Rights Reserved. ISBN: 978-1-5224-2875-6 Note the following details of the code protection feature on Microchip devices:

• Microchip products meet the spec ification contained in their particular Microchip Data Sheet.
• Microchip believes that its family of products is one of the m ost secure families of its kind on the market today, when used in the intended manner and under normal conditions.
• There are dishonest and possibly illegal methods used to breac h the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
• Microchip is willing to work with the customer who is concerne d about the integrity of their code.
• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are com mitted to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC ® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. QUALITY MANAGEMENT SYSTEM CERTIFIED BY DNV == ISO/TS 16949 ==

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