ASWD-S2-0001 ABRACON | Alldatasheet
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DC-8GHz SPDT RF & Antenna Switch with Enhanced ESD Protection Revision: A 8/28/2025 Page 1 Disclaimer lign Request Samples lign Check Inventory
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Part No. Description ASWD-S2-0001 DC-8GHz SPDT RF & Antenna Switch with Enhanced ESD Protection on Cut Tape ASWD-S2-0001-T DC-8GHz SPDT RF & Antenna Switch with Enhanced ESD Protection on Tape & Reel ASWD-S2-0001-EVB DC-8GHz SPDT RF & Antenna Switch with Enhanced ESD Protection EVB The ASWD-S2-0001 is a low -loss, high-isolation Silicon-On-Insulator (SOI) SPDT Reflective RF switch, engineered for exceptional performance with ultra -low on-state resistance and ultra-high linearity. These attributes make it ideal for antenna tuning and g eneral-purpose IoT applications. It features ±1kV HBM ESD protection and comes in a compact DFN package measuring 1.1mm x 0.7mm x 0.55mm, providing a space-efficient solution for high- performance RF designs. Additionally, the ASWD -S2-0001 is RoHS compliant and has a Moisture Sensitivity Level (MSL) of 3. ▪ DFN-6L Package: 1.1 mm x 0.7 mm ▪ Frequency Range: DC to 8.0 GHz ▪ Low Insertion Loss 0.37 dB Typ. @f = 2.2 to 2.7 GHz 0.57 dB Typ. @f = 4.0 to 8.0 GHz ▪ High Isolation 25 dB Typ. @f = 2.2 to 2.7 GHz 14 dB Typ. @f = 4.0 to 8.0GHz ▪ Low Control Voltage VCTL_H = 1.8V Typ. Voltage Operation VDD = 2.8V Typ. ▪ GPIO Control for SPDT ▪ ±1kV HBM ESD Protection ▪ RoHS Compliant | MSL Level 3 ▪ Smart Phones, Tablets, PCs ▪ GSM/WCDMA/LTE band and Mode Switching ▪ Antenna Selection / Tuning Switch ▪ RF Combo Modules (Wi-Fi/BT, LTE/GNSS) ▪ AR/VR, Wi-Fi Speakers ▪ Access Point, Routers and Gateways
DC-8GHz SPDT RF & Antenna Switch with Enhanced ESD Protection Revision: A 8/28/2025 Page 2 Disclaimer lign Request Samples lign Check Inventory Absolute Maximum Ratings 1. HBM: ESDA/JEDEC JS-001-2017 2. CDM: ESDA/JEDEC JS-002-2018 Operation of this device outside the parameter ranges given above may cause permanent damage. Recommended Operating Conditions Electrical specifications are measured at specified test conditions. Specifications are not guaranteed over all recommended operating conditions. Parameter Symbol Min. Typ. Max. Unit Supply Voltage VDD 1.6 - 3.6 V Control Voltage VCTL VDD V Max Input Power PINMAX - - +35 dBm Operating Temperature TOP -40 - 85 ℃ Storage Temperature TSTG -55 - 150 ℃ Moisture Sensitivity Level - MSL3 - Electrostatic Discharge, HBM1 VESD - - ±1000 V Electrostatic Discharge, CDM2 - - ±1000 V Parameter Min. Typ. Max. Unit VDD 1.6 2.8 3.1 V Pin (RFC – X , W, 50 Ω 34.5 dBm Tj at MTTF>105 hrs. - 150 - ℃ Parameters Condition Values Unit Minimum Typical Maximum Insertion Loss IL DC-1.0 GHz - 0.35 0.50 dB 1.0-2.2 GHz - 0.35 0.55 2.7-4.0 GHz 0.57 0.75 4.0-8.0 GHz 0.57 0.75 Isolation ISL DC-1.0 GHz 30 35 - dB 1.0-2.2 GHz 28 33 - 2.2-2.7 GHz 20 25 - 2.7-4.0 GHz 15 18 4.0-8.0 GHz 12 14 Return Loss RL DC-2.7 GHz - 13.9 20.8 dB 2nd Harmonics 2f0 Pin = 26dBm - -80 - dBc 3rd Harmonics 3f0 Pin = 26dBm - -75 - dBc Turn-on switching time (50% of final VC to 10%/90& of final RF power) tSW - - 1.0 - us
DC-8GHz SPDT RF & Antenna Switch with Enhanced ESD Protection Revision: A 8/28/2025 Page 3 Disclaimer lign Request Samples lign Check Inventory Control Logic Parameter Symbol Minimum Typical Maximum Unit Supply Voltage VDD 1.6 2.8 3.1 V Supply Current IDD - 10 50 uA Control Voltage VCTL_H 1.2 1.8 2.85 V VCTL_L - - 0.4 V Control Current ICTL - 2.5 5 uA Control Pin RF1 RF2
0 ON OFF
1 OFF ON
DC-8GHz SPDT RF & Antenna Switch with Enhanced ESD Protection Revision: A 8/28/2025 Page 4 Disclaimer lign Request Samples lign Check Inventory Timing Requirements It is important that the user adheres to the correct timing sequences in order to avoid leakage power consumption. 1. VDD and VCTL cannot be powered on and off independently from one another. During power -on sequence, the user must power up VDD first, then power up VCTL. During power -off sequence, the user must power off VCTL first, then power off VDD. In the state of VDD=OFF (0 V) and VCTL=ON (1.8V), it may cause leakage power consumption as ESD protection circuit inside the switch. a: VDD ON b: VCTL ON c: VDD OFF d: VCTL OFF 2. VDD and VCTL must be on for a minimum of 15 us before applying RF power e: VDD and VCTL ON f: RF Power Up
DC-8GHz SPDT RF & Antenna Switch with Enhanced ESD Protection Revision: A 8/28/2025 Page 5 Disclaimer lign Request Samples lign Check Inventory Pin Configuration Pin Name Description
1 VCTL Switch Control
2 GND Ground
3 VDD DC Control Voltage
4 RF2 RF2 Port
5 RFC RF Common Port (Antenna Port)
6 RF1 RF1 Port
DC-8GHz SPDT RF & Antenna Switch with Enhanced ESD Protection Revision: A 8/28/2025 Page 6 Disclaimer lign Request Samples lign Check Inventory Product Dimensions Unit: mm
DC-8GHz SPDT RF & Antenna Switch with Enhanced ESD Protection Revision: A 8/28/2025 Page 7 Disclaimer lign Request Samples lign Check Inventory Performance Plots re e c ser i ss re e c ser i ss re e c e r ss re e c e r ss re e c s la i re e c s la i
DC-8GHz SPDT RF & Antenna Switch with Enhanced ESD Protection Revision: A 8/28/2025 Page 8 Disclaimer lign Request Samples lign Check Inventory Evaluation Board ASWD-S2-0001-EVB EVB Schematic Bill of Material NOTES: 1. Input and output are 50-ohm lines. Component Description Manufacturer Manufacturer Part QTY U1 DC-8GHz SPDT RF & Antenna Switch with Enhanced ESD Protection Abracon ASWD-S2-0001 1 C1, C2 Capacitor (0402) Murata GRM022R60J102KE19 2
DC-8GHz SPDT RF & Antenna Switch with Enhanced ESD Protection Revision: A 8/28/2025 Page 9 Disclaimer lign Request Samples lign Check Inventory IC Footprint & PCB Land Pattern Unit: mm t r t P tter
DC-8GHz SPDT RF & Antenna Switch with Enhanced ESD Protection Revision: A 8/28/2025 Page 10 Disclaimer lign Request Samples lign Check Inventory Reflow Profile [JEDEC J-STD-020] Solder paste: Sn/3.0Ag/0.5Cu Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly Preheat / soak Temperature minimum (Tsmin) 100℃ 150℃ Temperature maximum (Tsmax) 150℃ 200℃ Time (Tsmin to Tsmax) (ts) 60 – 120 sec. 60 – 120 sec. Average ramp-up rate (Tsmax to Tp) 3℃/sec. max 3℃/sec. max Liquidous temperature (TL) 183℃ 217℃ Time at Liquidous (TL) 60 – 90 sec. 60 – 90 sec. Peak package body temperature (Tp)* See Table 1 See Table 2 Time (Tp)** within 5℃ of the specified classification temperature (Tc) 20 sec. 10 sec. Ramp-down rate (Tp to Tsmax) 3℃/sec. max 3℃/sec. max Time 25℃ to peak temperature 6 min. max 8 min. max Reflow cycles 2 max 2 max *Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum. **Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum. Table 1 SnPb Eutectic Process Classification Temperatures (Tc) Package Thickness Volume mm3 <350 Volume mm3 ≧350 <2.5mm 235℃ 220℃ ≧2.5mm 220℃ 220℃ Table 2 Pb-Free Process Classification Temperatures (Tc) Package Thickness Volume mm3 <350 Volume mm3 350-2000 Volume mm3 >2000 <1.6mm 260℃ 260℃ 260℃ 1.6mm - 2.5mm 260℃ 250℃ 245℃ >2.5mm 250℃ 245℃ 245℃
DC-8GHz SPDT RF & Antenna Switch with Enhanced ESD Protection Revision: A 8/28/2025 Page 11 Disclaimer lign Request Samples lign Check Inventory Packaging Tape & Reel Dimension Carrier Tape Specifications (mm) E1 D0 P0 P2 F P1 W A0 B0 K0 Reel Qty Reel Specifications (mm) A W1 N B C D