ASB20A SPSEMI | Alldatasheet
Document overview
- Manufacturer or author: Stephan Huck
- PDF pages: 4
Technical content
Features
Excellent clamping capability Glass passivated chip
8000 W peak pulse power capability with a
ȝ s waveform, repetitive rate (duty cycle):0.01 % Meet AEC-Q101 requirement Low leakage Uni-directional polarity A =25 ɗ unless otherwise noted)
Electrical Characteristics
NOTE: Surge current waveform is defined at 10/1000uS waveform 01 | www.spsemi.cn Mechanical Data Epoxy: UL 94V-0 rate flame retardant Polarity: Heatsink is anode IEC Compatibility Plastic package Part Number (Uni) Working Peak Reverse Voltage VRWM (V) Breakdown Voltage VBR @I T Maximum Reverse Leakage IR @VRWM(uA) Maximum IR@VRWM TJ=175 (uA) Maximu Reverse Surge Current I PP (A) (1) Maximum Clamping Voltage VC@I PP (V)Min(V) Max(V) IT(mA) ASB20A 20 22.2 24.5 5 10 150 246.9 32.4 ASB22A 22 24.4 26.9 5 10 150 225.4 35.5 ASB24A 24 26.7 29.5 5 10 150 205.7 38.9 ASB26A 26 28.9 31.9 5 10 150 190.0 42.1 ASB28A 28 31.1 34.4 5 10 150 176.2 45.4 ASB30A 30 33.3 36.8 5 10 150 165.3 48.4 ASB33A 33 36.7 40.6 5 10 150 150.1 53.3 ASB36A 36 40.0 44.2 5 10 150 137.7 58.1 ISO 16750-2 Test A 12v System ( 100V 1 400ms 10c) 24v System (174V 4 350ms 10c) Ω Ω DO-218AB/SOD-BLOCK REV.2016.01.04
ASC ) Series 02 | www.spsemi.cn AMBIE N AVERAGE FORWARD CURRENT, (A) 0 100 25 100 175 0 0 0 0.2 ## 0.5 76 1 50 1.5 33 2 23 3 13 4 10 Fig. 3 - Steady State Power Derating Curve Fig. 2 - Pulse Waveform A =25ɗ unless otherwise noted) Fig. 1 - Pulse Derating Curve Fig. 4 - Peak Pulse Power Rating Curve 100 0 25 50 75 100 125 150 175 200 Peak Pulse Derating in Percentage of Peak Power or Current, (%) Ambient Temperature ,T A (ɗ) 100 0 1 2 3 4 Peak Pulse Current , (% ) Time , (ms) 10/1000 ȝsec. Waveform Peak Value (Ipp) td T r =10ȝs Half Value = Ipp T J = 25 ƱC Pulse Width (td) is defined as the point where the peak current decays to 50 % of Ipp Note: A =25 ɗ unless otherwise noted) Parameter Symbol Value UNIT Peak power dissipation with a 10/1000 ȝ s waveform (1) P PP 8000 W Peak pulse current wih a 10/1000 ȝ s waveform (1) I PP See above Table Power dissipation on infinite heatsink at T L = 25 °C D 5.0 W Peak forward surge current 8.3 ms single half sine- I FSM 500 A Operating junction and storage temperature range T J , T STG –55 to +175 °C (1)Non-repetitive current pulse per Fig.2 and derated above T A = 25 °C per Fig.1 P x Ma imum Ratings Ratings and Characteristics Curves A 0 5 25 5 ## 0 0.0 2.0 4.0 6.0 8.0 0 25 50 75 100 125 150 175 200 Steady State Power Dissipation, (W) Lead Temperature , T L (ɗ) 0.1 100 1000 0.000001 0.000010 .0001 0.001 P PPM -Peak Pulse Power (kW) t d -Pulse Width (Sec.) REV.2016.01.04
ASB ) Series 03 | www.spsemi.cn Fig. 6 Ri-Vs chart for ISO-16750-2 Test A : 24V System Fig. 5 Ri-Vs chart for ISO-16750-2 Test A : 12V System millimeters Recommended Mounting Pad Layout 11.0 9.5 15.8 3.5 3.0 3.3 PACKAGE OUTLINE DIMENSIONS REV.2016.01.04
ɗ 200 ɗ 60-180 sec ɗ /sec >220 ɗ 255-260 sec 60-150 sec ɗ /sec 10-30 sec ɗ /sec njo 280 ɗ Do not exceed Ramp up rate (150-200 ɗ Reflow Liquidus Temp. Peak Temp. Time(Liq. to Peak) Ramp up rate (220-200 ɗ Time within actual peak temp. Ramp down Rate Time(25 ɗ to Peak temp.) Pre Heat Temp. min Temp. max Time(min to max) IR-Reflow Condition t p t s Perheat T s(min) T s(max) T L t L T P Ramp-up Time(t) Temp from 25 °C to Peak Temperature(T) AUTO TVS/PK AUTO TVS/ASB Series ASC 04 | www.spsemi.cn Recommended Soldering Parameters B MIN. C 1.5 (0.059) 13.0 ± 0.20 (0.51 ± 0.0008) G MAX. 26.4 (1.039) T MAX. 30.4 (1.197) TAPE SIZE 24 mm (0.945) A MAX. 330 ± 2.0 (13.0 ± 0.079) 178 ± 2.0 (7.0 ± 0.079) DIMENSIONS in millimeters (inches) D MIN. 20.2 (0.795) N MIN. 50 (1.97) B D C ZONE 1 ZONE1 A N G T SURFACE MOUNT TAPE AND REEL PACKAGING REV.2016.01.04