ASA-SMD RALTRON | Alldatasheet

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SURFACE MOUNT MICROPROCESSOR CRYSTAL Page 1 of 4 TCXO Page 1 of 4 SERIES ASA-SMD Telephone: +1-305-593-6033  Fax: +1-305-594-3973  e-mail: sales@raltron.com  web site: http://www.raltron.com  FEATURES  ISO/TS 16949 CERTIFIED FACILITY  RELIABILITY TESTING PER AEC-Q200  PPAP DOCUMENTATION AVAILABLE  EXCELLENT TOLERANCE AND STABILITY  CUSTOM SPECIFICATIONS AVAILABLE  SPECIFICATIONS ‡ Not all combinations of temperature and frequency stability available, consult factory. PARAMETER VALUE FREQUENCY RANGE 3.000 MHz to 80.000 MHz MODE OF OSCILLATION FUNDAMENTAL 3.000 MHz to 48.000 MHz THIRD OVERTONE 30.000 MHz to 80.000 MHz FREQUENCY TOLERANCE AT 25° C ±50 ppm max (± 10 ppm, ± 15 ppm, ± 20 ppm and ± 30 ppm available) FREQUENCY STABILITY OVER TEMPERATURE ‡ ±50 ppm max (± 10 ppm, ± 15 ppm, ± 20 ppm and ± 30 ppm available, see Table 2) OPERATING TEMPERATURE RANGE ‡ -20° C to +70° C Standard -40° C to +85° C Extended -40° C to +105° C Extended6 STORAGE TEMPERATURE RANGE -55° C to +125°C AGING ±3 ppm per year max LOAD CAPACITANCE 8 pF to 32 pF or Series EQUIVALENT SERIES RESISTANCE See Table 1 SHUNT CAPACITANCE 7.0 pF max DRIVE LEVEL 100 µW typ, 500 µ W max INSULATION RESISTANCE 500 MΩ min SHOCK RESISTANCE ± 5 ppm max 75 cm drop test in 3 axes onto a hard wood surface REFLOW CONDITIONS 260° C for 10 s max TABLE 1 FREQUENCY (MHz) MODE ESR MAX (Ω) 3≤F0<4 FUND 150 4≤F0<6 FUND 100 6≤F0<10 FUND 70 10≤F0<12 FUND 60 12≤F0<16 FUND 50 16≤F0<24 FUND 40 24≤F0<30 FUND 30 30≤F0≤48 FUND 20 30≤F0<36 3OT 80 36≤F0≤80 3OT 60 TABLE 2 TEMP RANGE (° C) STABILITY (ppm) -20 to +70 O O O O O -40 to +85 × △ △ O O Note: O: Available, △: Conditional, ×: Not available

SURFACE MOUNT MICROPROCESSOR CRYSTAL Page 2 of 4 TCXO Page 2 of 4 SERIES ASA-SMD Telephone: +1-305-593-6033  Fax: +1-305-594-3973  e-mail: sales@raltron.com  web site: http://www.raltron.com  PART NUMBERING SYSTEM TYPE - FREQUENCY - LOAD CAPACITANCE - MODE - TOLERANCE/STABLITY (PPM/PPM) ASA - in MHz - 8 to 32 pF for Parallel S for Series - Blank for < 24.576 MHz F for ≥ 24.576 MHz - Blank for max ppmppm Example: 1020, 2050 - EXTENDED TEMPERATURE - CONFIGURATION - TAPE & REEL Blank for Standard EXT for Extended EXT6 for Extended6 - SMD - TR EXAMPLE: ASA-24.000-18-3050-EXT-SMD-TR AUTOMOTIVE GRADE Surface Mount Microprocessor Crystal, HC-49S SMD package, 24.000 MHz, Fundamental mode, 18 pF Load, ±30 ppm Tolerance, ±50 ppm Stability from -40° C to +85°C, Tape and Reel packaging  MECHANICAL SPECIFICATION  CARRIER TAPE DIMENSIONS NOTE: REFER TO EIA-481 FOR NON-SPECIFIED DIMENSIONS  PACKAGING 330 mm REEL DIAMETER 24 mm TAPE WIDTH, 12 mm PITCH QUANTITY: 1000 PIECES PER REEL

SURFACE MOUNT MICROPROCESSOR CRYSTAL Page 3 of 4 TCXO Page 3 of 4 SERIES ASA-SMD Telephone: +1-305-593-6033  Fax: +1-305-594-3973  e-mail: sales@raltron.com  web site: http://www.raltron.com  REFLOW PROFILE Reflow profile (Reference IPC/JEDEC J-STD-020) Temperature Min Preheat TSMIN 150° C Temperature Max Preheat TSMAX 200° C Time (TSMIN to TSMAX) tS 60-180 sec. Temperature TL 217° C Peak Temperature TP 260° C Ramp-up rate RUP 3° C/sec max. Ramp-down rate RDOWN 6° C/sec max. Time within 5° C of Peak Temperature tP 10 sec. Time t[25° C] to Peak Temperature t[25° C] to Peak 480 sec. Time tL 60-150 sec.  ENVIRONMENTAL PARAMETER VALUE MOISTURE SENSITIVITY LEVEL 1 RoHS Compliant REACH SVHC Compliant HALOGEN-FREE Compliant ESD CLASSIFICATION LEVEL N/A TERMINATION FINISH Au UNIT WEIGHT 0.585 g Temp. [° C] Time [sec] TP TL TSMAX TSMIN Ramp-up Ramp-down Critical Zone TL to TP t[25° C] to Peak tS Preheat tL tP

SURFACE MOUNT MICROPROCESSOR CRYSTAL Page 4 of 4 TCXO Page 4 of 4 SERIES ASA-SMD Telephone: +1-305-593-6033  Fax: +1-305-594-3973  e-mail: sales@raltron.com  web site: http://www.raltron.com The process of manufacturing ASA-SMD series of Automotive Grade Surface Mount Microprocessor Crystals is performed by using Advanced Product Quality Planning (APQP). This technique defines and establishes the following actions:  Product design activities communicating special characteristics to the process design activity, prior to design release, linking the DFMEA to PFMEA.  Plan, acquire and install appropriate process equipment and tooling based on design tolerances provided by the customer. – CPPD (Collaborative Product Process Design)  Assembly personnel communicating suggestions on better ways to assemble a product prior to the completion of the design of the product. – DFA/M (Design for Assembly and Manufacturing)  Manufacturing or Process Engineering establishing adequate Quality Controls for features of a product or parameters of a process, which still risk potential failure. – Control Plan Methodology  Performing Stability and Capability studies on special characteristics to understand the variation pr esent and predict future performance. – SPC (Statistical Process Control and Process Capability) Request for Production Part Approval Process (PPAP) documentation must be requested at time of order placement. Requests for part approval will be supported in official PPAP format and with documented results as requested at time of order placement. Actual measurements are taken of the parts produced and are used to complete the various test sheets of PPAP.  NOTICE If you intend to use our product referenced above in an automotive application that may result in loss of life or assets, please do not fail to advise us of your intention beforehand. The use of the listed part in those applications is not covered by warra nty, and we will not be held accountable for any liability claims. We reserve the right to not supply parts in those circumstances. NOVEMBER 2016