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1 Publication Order Number:
- The ARRAYC-60035-4P does not have access to the fast output.
performance evaluation of the arrays. where multiple arrays can be evaluated with a single BOB. Figure 1 summarizes the array schematic for a portion of an ArrayC. output*, standard output and common. Biasing and Readout from the Standard Breakout Boards 24.... Figure 1. Signal connections at the pixel of the BOBs, or the user’s own boards. process until the connectors are free from each other. Note that a BGA ArrayC cannot be removed from its EVB.
www.onsemi.com ARRAYC-60035-4P-BGA (2 x 2 ARRAY OF 6 mm SMT SENSORS) Array Size Sensor Type Readout Board Size Pixel Pitch No. Connections No. Connectors 2 x 2 60035 Pixel 14.2 x 14.2 mm2 7.2 mm 9 3 x 3 BGA The ARRAYC-60035-4P is comprised of 4 individual 6mm C-Series sensors arranged in a 2 x 2 array. The performance of the individual pixels and details of the bias to apply can be found in the C-Series datasheet. Connections to each sensor are provided by a BGA (ball grid array). The BGA can be used to mount the array on the user’s board using reflow soldering. The 4 SiPM sensors have all substrate connections (cathodes) connected together to form a common I/O. The 3 x 3 BGA provides connections as follows:
- 4 x standard I/O
- 5 x common I/O
- There is NO fast output Schematics for the ARRAYC-60035-4P-BGA The complete ARRAYC-60035-4P-BGA CAD and solder footprint is available to download.
location of both pin A1 and pixel 1. room temperature before further operations. number of passes should not be more than 2. Figure 2. Solder reflow profile. Conditions must be in compliance with J-STD-20, table 5.2
www.onsemi.com ARRAYC-60035-4P-GEVB (ARRAYC-60035-4P-BGA Evaluation Board) The ARRAYC-60035-4P-GEVB is an evaluation board allowing easy access to the signals of a ARRAYC-60035- 4P-BGA via pins. The ARRAYC-60035-4P-GEVB has the array on the front and pins on the back of the PCB. The pins are compatible with a standard 8-pin DIL socket for evaluation purposes. Alternatively, the pins can be directly soldered into through-holes in the user’s readout PCB. Four of the pins are connected to the anodes of the individual pixels and the other four pins are connected to the common cathode. An example mating 8-pin DIL socket is the 110-93-308-41-001000 from Mill-Max The GEVB PCB is slightly smaller than the actual array, allowing for tiling. The GEVB does NOT provide access to the fast output. Pin. No Function
1 Anode 1
2 Common Cathode
3 Anode 3
4 Common Cathode
5 Common Cathode
6 Anode 4
7 Common Cathode
8 Anode 2
Schematics for the ARRAYC-60035-4P-GEVB The complete ARRAYC-60035-4P-GEVB CAD and solder footprint is available to download.
www.onsemi.com ARRAYC-60035-64P-PCB (8 x 8 ARRAY OF 6 mm SMT SENSORS) Array Size Sensor Type Readout Board Size Pixel Pitch No. Connections No. Connectors 8 x 8 60035 Pixel 57.4 x 57.4 mm2 7.2 mm 160 2 x 80-way The ARRAYC-60035-64P is comprised of 64 individual 6mm SMT sensors arranged in a 8 x 8 array. The performance of the individual pixels and details of the bias to apply can be found in the C-Series datasheet. The connections to each array are provided by two Samtec 80-way connectors, type QTE-040-03-F-D-A . These connectors mate with the Samtec QSE-040- 01-F-D-A board-to-board connector and the Samtec EQCD High Speed Cable Assemblies. The 64 SiPM pixels all have substrate connections (cathode) summed to form a common I/O. The 80-way connectors provide connections as follows:
- 64 x fast output
- 64 x standard I/O
- 32 x common I/O Schematics for the ARRAYC-60035-64P-PCB The complete ARRAYC-60035-64P-PCB CAD is available to download.
Figure 3. Connector schematic for the ARRAYC-60035-64P
Table 1. Connector Pin-Outs for the ARRAYC-60035-64P-PCB
1 S17 2 S1 1 S49 2 S33
3 F17 4 F1 3 F49 4 F33
5 S25 6 S9 5 S57 6 S41
7 F25 8 F9 7 F57 8 F41
9 S18 10 S2 9 S50 10 S34
11 F18 12 F2 11 F50 12 F34
13 S26 14 S10 13 S58 14 S42
15 F26 16 F10 15 F58 16 F42
17 S19 18 S3 17 S51 18 S35
19 F19 20 F3 19 F51 20 F35
21 S27 22 S11 21 S59 22 S43
23 F27 24 F11 23 F59 24 F43
25 S20 26 S4 25 S52 26 S36
27 F20 28 F4 27 F52 28 F36
29 S28 30 S12 29 S60 30 S44
31 F28 32 F12 31 F60 32 F44
33 CM 34 CM 33 CM 34 CM
35 CM 36 CM 35 CM 36 CM
37 CM 38 CM 37 CM 38 CM
39 CM 40 CM 39 CM 40 CM
41 S21 42 S5 41 S53 42 S37
43 F21 44 F5 43 F53 44 F37
45 S29 46 S13 45 S61 46 S45
47 F29 48 F13 47 F61 48 F45
49 S22 50 S6 49 S54 50 S38
51 F22 52 F6 51 F54 52 F38
53 S30 54 S14 53 S62 54 S46
55 F30 56 F14 55 F62 56 F46
57 S23 58 S7 57 S55 58 S39
59 F23 60 F7 59 F55 60 F39
61 S31 62 S15 61 S63 62 S47
63 F31 64 F15 63 F63 64 F47
65 S24 66 S8 65 S56 66 S40
67 F24 68 F8 67 F56 68 F40
69 S32 70 S16 69 S64 70 S48
71 F32 72 F16 71 F64 72 F48
73 CM 74 CM 73 CM 74 CM
75 CM 76 CM 75 CM 76 CM
77 CM 78 CM 77 CM 78 CM
79 CM 80 CM 79 CM 80 CM
orientating the array on the BOB is straightforward. the board can be seen in Figure 4. of the board on an optical breadboard. Figure 4. Layout of the ARRAYX-BOB6-64P. The dimensions of the board are 112 mm x 112 mm
Table 2. HEADER SIGNALS ON THE ARRAYX-BOB6-64P
Table 3. HEADER SIGNALS ON THE ARRAYX-BOB6-64S
www.onsemi.com ARRAYC-30035-16P-PCB (4 x 4 ARRAY OF 3 mm SMT SENSORS) Array Size Sensor Type Readout Board Size Pixel Pitch No. Connections No. Connectors 4 x 4 30035 Pixel 16.6 x 16.6 mm2 4.2 mm 40 1 x 40-way The ARRAYC-30035-16P-PCB is comprised of 16 individual 3 mm C-Series sensors arranged in a 4 x 4 array. The performance of the individual pixels and details of the bias to apply can be found in the C-Series datasheet. Connections to each sensor are provided by a 40-way Hirose plug-type board-to-board connector DF17(2.0)- 40DP-0.5V(57). These connectors mate with the Hirose DF17(3.0)-40DS-0.5V(57). The 16 SiPM pixels have all substrates (cathodes) connected together to form a common I/O. The 40-way connector provides connections as follows:
- 16 x fast output
- 16 x standard I/O
- 8 x common I/O Schematics for the ARRAYC-30035-16P-PCB The complete ARRAYC-30035-16P-PCB CAD is available to download.
Figure 6. Connector schematic for the ARRAYC-30035-16P
1 CM 40 CM
2 CM 39 CM
3 S1 38 S9
4 F1 37 F9
5 S5 36 S13
6 F5 35 F13
7 S2 34 S10
8 F2 33 F10
9 S6 32 S14
10 F6 31 F14
11 S3 30 S11
12 F3 29 F11
13 S7 28 S15
14 F7 27 F15
15 S4 26 S12
16 F4 25 F12
17 S8 24 S16
18 F8 23 F16
19 CM 22 CM
20 CM 21 CM
two 20-way (10 x 2 row) 2.54 mm pitch headers; J2 and J3. to allow mounting of the board on an optical breadboard. Figure 7. Layout of the ArrayX-BOB3-16P (left). The board dimensions are 62 mm x 62 mm. The underside of the
www.onsemi.com Header Signals for the ARRAYX-BOB3-16P PIN J2 J3 1 2 CM CM CM CM 3 4 S1 F1 S9 F9 5 6 S5 F5 S13 F13 7 8 S2 F2 S10 F10 9 10 S6 F6 S14 F14 11 12 S3 F3 S11 F11 13 14 S7 F17 S15 F15 15 16 S4 F4 S12 F12 17 18 S8 F6 S16 F16 19 20 NC NC NC NC NC Not Connected CM Common I/O Sn Standard I/O of pixel n Fn Fast output of pixel n
array are routed via the mating connectors to header pins. Figure 8. Layout of the ARRAYX-BOB3-16S. The board dimensions are 62 mm x 62 mm
www.onsemi.com Header Signals for the ARRAYX-BOB3-16S PIN J2 J3 1 2 CM NC CM NC 3 4 F1 F1 F9 F9 5 6 F5 F5 F13 F13 7 8 F2 F2 F10 F10 9 10 F6 F6 F14 F14 11 12 F3 F3 F11 F11 13 14 F7 F7 F15 F15 15 16 F4 F4 F12 F12 17 18 F8 F8 F16 F16 19 20 CM NC CM NC NC Not Connected CM Common I/O Sn Standard I/O of pixel n Fn Fast output of pixel n
www.onsemi.com ARRAYC-30035-144P-PCB (12 x 12 ARRAY OF 3 mm SMT SENSORS) Array Size Sensor Type Readout Board Size Pixel Pitch No. Connections No. Connectors 12 x 12 30035 Pixel 50.2 x 50.2 mm2 4.2 mm 320 4 x 80-way The ARRAYC-30035-144P is comprised of 144 individual 3 mm C-Series sensors arranged in a 12 x 12 array. The performance of the individual pixels and details of the bias to apply can be found in the C-Series datasheet. Connections to each sensor are provided by four Samtec 80-way connectors, type QTE-040-03-F-D-A. These connectors mate with the Samtec QSE-040-01-F-D-A board-to-board connector and the Samtec EQCD High Speed Cable Assemblies. The 144 SiPM sensors have all substrate connections (cathodes) connected together to form a common I/O. The 80-way connectors provide connections as follows:
- 144 x fast output
- 144 x standard I/O
- 32 x common I/O Schematics for the ARRAYC-30035-144P-PCB The complete ARRAYC-30035-144P-PCB CAD is available to download.
Figure 9. Connector pin-outs for the ARRAYC-30035-144P
Table 4. Connector Pin-Outs for the ARRAYC-30035-144P
1 S25 2 S1 1 S61 2 S37
3 F25 4 F1 3 F61 4 F37
5 S14 6 S13 5 S50 6 S49
7 F14 8 F13 7 F50 8 F49
9 S26 10 S2 9 S62 10 S38
11 F26 12 F2 11 F62 12 F38
13 S27 14 S3 13 S63 14 S39
15 F27 16 F3 15 F63 16 F39
17 S28 18 S15 17 S64 18 S51
19 F28 20 F15 19 F64 20 F51
21 CM 22 S4 21 CM 22 S40
23 CM 24 F4 23 CM 24 F40
25 S17 26 S5 25 S53 26 S41
27 F17 28 F5 27 F53 28 F41
29 S29 30 CM 29 S65 30 CM
31 F29 32 CM 31 F65 32 CM
33 S30 34 S16 33 S66 34 S52
35 F30 36 F16 35 F66 36 F52
37 S18 38 S6 37 S54 38 S42
39 F18 40 F6 39 F54 40 F42
41 S19 42 S7 41 S55 42 S43
43 F19 44 F7 43 F55 44 F43
45 S31 46 S21 45 S67 46 S57
47 F31 48 F21 47 F67 48 F57
49 S32 50 CM 49 S68 50 CM
51 F32 52 CM 51 F68 52 CM
53 S20 54 S8 53 S56 54 S44
55 F20 56 F8 55 F56 56 F44
57 CM 58 S9 57 CM 58 S45
59 CM 60 F9 59 CM 60 F45
61 S33 62 S22 61 S69 62 S58
63 F33 64 F22 63 F69 64 F58
65 S34 66 S10 65 S70 66 S46
67 F34 68 F10 67 F70 68 F46
69 S35 70 S11 69 S71 70 S47
71 F35 72 F11 71 F71 72 F47
73 S23 74 S24 73 S59 74 S60
75 F23 76 F24 75 F59 76 F60
77 S36 78 S12 77 S72 78 S48
79 F36 80 F12 79 F72 80 F48
www.onsemi.com J3 J4 PIN SIGNAL PIN SIGNAL PIN SIGNAL PIN SIGNAL
1 S97 2 S73 1 S133 2 S109
3 F97 4 F73 3 F133 4 F109
5 S86 6 S85 5 S122 6 S121
7 F86 8 F85 7 F122 8 F121
9 S98 10 S74 9 S134 10 S110
11 F98 12 F74 11 F134 12 F110
13 S99 14 S75 13 S135 14 S111
15 F99 16 F75 15 F135 16 F111
17 S100 18 S87 17 S136 18 S123
19 F100 20 F87 19 F136 20 F123
21 CM 22 S76 21 CM 22 S112
23 CM 24 F76 23 CM 24 F112
25 S89 26 S77 25 S125 26 S113
27 F89 28 F77 27 F125 28 F113
29 S101 30 CM 29 S137 30 CM
31 F101 32 CM 31 F137 32 CM
33 S102 34 S88 33 S138 34 S124
35 F102 36 F88 35 F138 36 F124
37 S90 38 S78 37 S126 38 S114
39 F90 40 F78 39 F126 40 F114
41 S91 42 S79 41 S127 42 S115
43 F91 44 F79 43 F127 44 F115
45 S103 46 S93 45 S139 46 S129
47 F103 48 F93 47 F139 48 F129
49 S104 50 CM 49 S140 50 CM
51 F104 52 CM 51 F140 52 CM
53 S92 54 S80 53 S128 54 S116
55 F92 56 F80 55 F128 56 F116
57 CM 58 S81 57 CM 58 S117
59 CM 60 F81 59 CM 60 F117
61 S105 62 S94 61 S141 62 S130
63 F105 64 F94 63 F141 64 F130
65 S106 66 S82 65 S142 66 S118
67 F106 68 F82 67 F142 68 F118
69 S107 70 S83 69 S143 70 S119
71 F107 72 F83 71 F143 72 F119
73 S95 74 S96 73 S131 74 S132
75 F95 76 F96 75 F131 76 F132
77 S108 78 S84 77 S144 78 S120
79 F108 80 F84 79 F144 80 F120
Sn Standard I/O of pixel n Fn Fast output of pixel n
orientating the array on the BOB is straightforward. 50-way (25 x 2 row) 2.54 mm pitch headers. to allow mounting of the board on an optical breadboard. The layout of the board is shown in Figure 10. Figure 10. Layout of the ARRAYX-BOB3-144P. The board dimensions are 112 mm x 112 mm
Table 5. HEADER SIGNALS ON THE ARRAYX-BOB3-144P
full readout of all pixels simultaneously. recommended to apply the bias to the common I/O. addition to the jumpers and crimp socket leads supplied.
- The pins are labelled; Fin, Fout, I (Inner) and O (Outer).
- Fin provides the input to the balun transformer.
- Fout is the output of the balun transformer.
- I provides direct connection to the inner part of the SMA connector.
- O provides direct connection to the outer part of the SMA connector. Balun Transformer The Balun transformer (RFMD RFXF9503) allows impedance matching of the fast output signal to the readout electronics. For a customer considering their own design, the Balun is not required if the readout amplifiers are placed in close proximity to the sensor pixels of the array. For optimized timing performance, the impedance matching and signal propagation from the SiPM sensor to the readout electronics must be carefully considered.
Figure 11. (right) photo and (left) schematic of the BOB SMA, balun transformer and
Figure 12. Schematic of the 4-pin header and balun transformer sensor should be performed in total darkness. higher gain of the SiPM sensor.
The Figure 14 shows the ARRAYX-BOB6-64P set up for readout of standard signals (anode-cathode) from pixel 49. Figure 14. Example of an ARRAYC-60035-64P connected to an ARRAYX-BOB6-64P for the readout of the standard (anode-cathode) signal from pixel 49 (left), with simplified readout schematic (right). (standard I/O) is the anode. negative polarity with respect to the common cathode. signal is then available from SMA2.
The Figure 15 shows the ARRAYX-BOB6-64S set up for readout of all of the pixels summed together. Figure 15. Example of an ARRAYC-60035-64P connected to an ARRAYX-BOB6-64S for the summed readout of all of the pixels (left), with simplified readout schematic (right). is connected via a “CM” pin to the outer (“O”) of SMA1. negative polarity with respect to the common. summed signal is then available from SMA2.
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ORDERING INFORMATION
(Total Number per Pixel) Array Size I/O Interface 6 mm Sensor Arrays ARRAYC-60035-4P-BGA 35 /C0109m (18,980 microcells) 2 x 2 BGA ARRAYC-60035-64P-PCB 8 x 8 Connector 3 mm Sensor ARRAYs ARRAYC-30035-16P-PCB 35 /C0109m (4,774 microcells) 4 x 4 Connector ARRAYC-30035-144P-PCB 12 x 12 Connector Optional Breakout Boards ARRAYX-BOB6-64P-GEVK Breakout board with connectors for use with the 8 x 8 arrays of 6 mm pixels ARRAYX-BOB3-16P-GEVK Breakout board with connectors for use with the 4 x 4 arrays of 3 mm pixels ARRAYX-BOB3-144P-GEVK Breakout board with connectors for use with the 12 x 12 arrays of 3 mm pixels Optional Summed Breakout Boards ARRAYX-BOB6-64S-GEVK Summed breakout board for use with the 8 x 8 array of 6 mm pixels ARRAYX-BOB6-16S-GEVK Summed breakout board for use with the 4 x 4 array of 3 mm pixels Evaluation Board with ARRAYC Permanently Attached ARRAYC-60035-4P-GEVB Evaluation board with a permanently attached 2 x 2 array of 6 mm pixels ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in t he United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property . A listing of ON Semiconductor’s product/patent ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, reg ulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the right s of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION N. American Technical Support: 800-282-9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 ARRAYC−SERIES/D SensL is a registered trademark of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries. LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor 19521 E. 32nd Pkwy, Aurora, Colorado
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