ARRAYRDM-0112A20 ONSEMI | Alldatasheet
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© Semiconductor Components Industries, LLC, 2019 September, 2020 − Rev. P7
1 Publication Order Number:
ARRAYRDM−0112A20/D Silicon Photomultipliers (SiPM), RDM-Series 1 x 12 Monolithic Array Advance Information ArrayRDM-0112A20-QFN The ArrayRDM−0112A20−QFN is a monolithic 1 × 12 array of Silicon Photomultiplier (SiPM) pixels based on the market −leading RDM process. The RDM process has been specifically developed to create products that give high PDE at the NIR wavelengths used for LiDAR and 3D ranging applications. In order to meet the requirements for automotive LiDAR applications, this product is qualified to AEC−Q102 and developed in accordance with IATF 16949. An evaluation board (ArrayRDM −0112A20 −GEVB) is also available for this product. KEY SENSOR AND PACKAGE SPECIFICATIONS Parameter Value Comments Silicon Process RDM Number of Pixels 12 Array Configuration 1 × 12 Monolithic silicon array Pixel Size 1.12 × 0.47 mm Pixel Pitch 0.49 mm Microcell Size 20 /C0109m Number of Microcells per Pixel 806 Package Size 5.2 × 10.0 × 1.85 mm W × L × H (see case outline on page 5 for more details) Output Type Analog Standard output per pixel PERFORMANCE SPECIFICATIONS Typical values are measured at 21°C. Minimum and Maximum values take into account operation over the full temperature range of −40°C to 105°C. All measurements made at Vbr + 7.9 V. Parameter Min Typ Max Unit Comment PDE at 905 nm 8 14 23 % Total Noise Rate < 0.05 0.1 40 Mcps Total noise rate is the count of all noise events arising from thermal noise, crosstalk and afterpulsing. It is measured by counting distinct event peaks per unit time with no incident light and minimum threshold set just above the electronic noise floor. Per pixel Optical Crosstalk 23 28 33 % Gain 1.1 × 106 1.2 × 106 1.4 × 106 Microcell Recovery Time Constant 24 34 45 ns RC time constant Microcell Rise Time − 200 − ps Terminal Capacitance 19 20 22 pF Per pixel Peak Pulsed Saturation Current 3.2 − 7.5 mA Per pixel Continuous Saturation Current 1.4 − 3.4 mA Per pixel This document contains information on a new product. Specifications and information herein are subject to change without notice. www.onsemi.com See detailed ordering and shipping information in the ordering information section on page 4 of this data sheet.
ORDERING INFORMATION
The ArrayRDM−0112A20−QFN Product
should not be assumed, damage may occur and reliability may be affected. Figure 1. Breakdown Voltage vs Temperature
1 Cathode 1 SiPM 1 standard output
28 Cathode 2 SiPM 2 standard output
27 Cathode 3 SiPM 3 standard output
26 Cathode 4 SiPM 4 standard output
25 Cathode 5 SiPM 5 standard output
24 Cathode 6 SiPM 6 standard output
23 Cathode 7 SiPM 7 standard output
22 Cathode 8 SiPM 8 standard output
21 Cathode 9 SiPM 9 standard output
20 Cathode 10 SiPM 10 standard output
19 Cathode 11 SiPM 11 standard output
18 Cathode 12 SiPM 12 standard output
Figure 2. Array Schematic Showing Pixel
ArrayRDM−0112A20−QFN www.onsemi.com EVALUATION BOARD The ArrayRDM −0112A20−GEVB evaluation board consists of:
- ArrayRDM−0112A20−DFN SiPM array
- 12 U.FL connectors for access to each pixel cathode for signal readout
- An SMA connector for applying the bias to the common anode
- Bias filtering circuit
- Decoupling capacitors (12 x 10 nF and 4 x 100 nF decoupling capacitors from anode to ground − not shown) This product allows users to quickly and easily set up an evaluation of the array product. Note that a negative bias supply should be suppled via the SMA connector (J13) and the U.FL connectors (J1 to J12) should be 50 /C0087 terminated.
Figure 3. ArrayRDM−0112A20−GEVB Top Side View Figure 4. ArrayRDM−0112A20−GEVB Board
0 VJ13
Part Number Product Description Shipping Format ArrayRDM−0112A20−QFN−TR Monolithic 1 × 12 array of NiR sensitive SiPM pixels formed using the RDM process. Individual cathode connection per pixel and a common anode available via the 28−pin QFN package. Tape and Reel ArrayRDM−0112A20−QFN−TR1 Cut Tape ArrayRDM−0112A20−QFN−TR−E Unqualified prototype part of the ArrayRDM−0112A20−QFN−TR Depends on Quantity Ordered ArrayRDM−0112A20−GEVB Evaluation board consisting of an ArrayRDM−0112A20−QFN mounted onto PCB. A U.FL connector gives access to each pixel output (cathode). The bias is supplied via an SMA connector to the common anode.
ArrayRDM−0112A20−QFN www.onsemi.com PACKAGE DIMENSIONS QFN28 10x5.2, 0.65P CASE 485FZ ISSUE B A B
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