ARF1510 MICROSEMI | Alldatasheet

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MAXIMUM RATINGS All Ratings: T C = 25°C unless otherwise specifi ed. STATIC ELECTRICAL CHARACTERISTICS Symbol BVDSS VDS(ON) IDSS IGSS gfs Visolation VGS(TH) Characteristic / Test Conditions Drain-Source Breakdown Voltage (VGS = 0V, ID = 250 μA) On State Drain Voltage 1 (ID(ON) = 3.25A, VGS = 10V) Zero Gate Voltage Drain Current (VDS = 1000V, VGS = 0V) Zero Gate Voltage Drain Current (VDS = 800V, VGS = 0V, TC = 125°C) Gate-Source Leakage Current (VGS = ±30V, VDS = 0V) Forward Transconductance (VDS = 25V, ID = 3.25A) RMS Voltage (60Hz Sinewave from terminals to mounting surface for 1 minute) Gate Threshold Voltage (VDS = VGS, ID = 50mA) MIN TYP MAX 1000 6.8 7.5 250 ±100 3 4 TBD 3 5 UNIT Volts μA nA mhos Volts Symbol VDSS ID VGS PD TJ,TSTG TL Parameter Drain-Source Voltage Continuous Drain Current @ TC = 25°C Gate-Source Voltage Total Device Dissipation @ TC = 25°C Operating and Storage Junction Temperature Range Lead Temperature: 0.063" from Case for 10 Sec. ARF 1510 1000 ±30 1500 -55 to 175 300 UNIT Volts Amps Volts Watts RF POWER MOSFET FULL-BRIDGE 400V 750W 40MHz The ARF1510 is four RF power transistor arranged in an H-Bridge con fi guration. It is intended for off-line 300V operation in high power scienti fi c, medical and, industrial RF power generator and ampli fi er applications up to 40 MHz.

  • Specifi ed 300 Volt, 27.12 MHz Characteristics:
  • Output Power = 750 Watts.
  • Gain = 17dB (Class D)
  • High Performance Power RF Package.
  • Very High Breakdown for Improved Ruggedness.
  • Low Thermal Resistance.
  • Nitride Passivated Die for Improved Reliability.
  • RoHS Compliant ARF1510 THERMAL CHARACTERISTICS Symbol RθJC RθJHS Characteristic (per package unless otherwise noted) Junction to Case Junction to Sink (Use High Effi ciency Thermal Joint Compound and Planar Heat Sink Surface.) MIN TYP MAX 0.10 0.16 UNIT °C/W Volts ARF1510 S1D2 S3D4 Microsemi Website - http://www.microsemi.com CAUTION: These Devices are Sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed.

DYNAMIC CHARACTERISTICS ARF1510 Symbol Ciss Coss Crss td(on) tr td(off) tf Characteristic Input Capacitance Output Capacitance Reverse Transfer Capacitance Turn-on Delay Time Rise Time Turn-off Delay Time Fall Time Test Conditions V GS = 0V VDS = 200V f = 1 MHz VGS = 15V VDD = 500V ID = 6.5A @ 25°C RG = 1.6Ω MIN TYP MAX 1200 1800 100 130 20 26 UNIT pF ns FUNCTIONAL CHARACTERISTICS Symbol GPS η Ψ Test Conditions f = 40.7 MHz VGS = 0V VDD = 400V Pout = 750W No Degradation in Output Power Characteristic Common Source Amplifi er Power Gain Drain Effi ciency Electrical Ruggedness VSWR 6:1 MIN TYP MAX 13 15 UNIT dB 1 Pulse Test: Pulse width < 380 μS, Duty Cycle < 2%. HAZARDOUS MATERIAL WARNING The ceramic portion of the device between leads and mounting surface is beryllium oxide, BeO. Beryllium oxide dust is toxic when inhaled. Care must be taken during handling and mounting to avoid damage to this area. These devices must never be thrown away with general industri- al or domestic waste. S1D2 S3D4 ARF 1510 Clamp Heat Sink ARF1510 1.065" 27.05 mm 1.065" 27.05 mm .100 .100 .300 .300 .100 .175 .075 .100 .100 .175 .075 S1D2 S3D4 .005.045 .254 Microsemi reserves the right to change, without notice, the specifi cations and information contained herein. Thermal Considerations and Package Mounting: The rated 1500W power dissipation is only available when the package mounting surface is at 25°C and the junction temperature is 175°C. The thermal resis- tance between junctions and case mounting surface is 0.10°C/W. When installed, an additional thermal impedance of 0.06°C/W between the package base and the mounting surface is smooth and fl at. Thermal joint compound must be used to reduce the effects of small surface irregularities. The heatsink should incorporate a copper heat spreader to obtain best results. The package is designed to be clamped to a heatsink. A clamped joint maintains the required mounting pressure while allowing for thermal expansion of both the device and the heat sink. A simple clamp, and two 6-32 (M3.5) screws can provide the minimum 125 lb. required mounting force. T=4-6 in-lb. Please refer to App Note 1802 "Mounting Instructions for Flangeless Packages."