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Technical content

Features

 Available in peak wavelengths: 850 nm and 940 nm  High radiant intensity  High radiant power  Low forward voltage  Typical viewing angles: 90° and 150°  Compatible with industrial reflow soldering process  MSL 3

Applications

 Infrared illumination for cameras  Surveillance systems ARE1-xxx0-00000 High Power Infrared Emitting Diodes

ARE1-xxx0-00000 Data Sheet High Power Infrared Emitting Diodes Figure 1: Package Drawing NOTE: 1. All dimensions in millimeters (mm). 2. Tolerance is ± 0.1 mm unless otherwise specified. Viewing Angle 90° (ARE1-89x0, ARE1-99x0) Viewing Angle 150° (ARE1-8Fx0, ARE1-9Fx0) Cathode ESD protection device Anode Anode Cathode ESD protection device

ARE1-xxx0-00000 Data Sheet High Power Infrared Emitting Diodes Device Selection Guide (TJ = 25°C, IF = 1A) Absolute Maximum Ratings Part Number Peak Wavelength, peak (nm) Radiant Intensity, Ie (mW/sr)a,b a. The radiant intensity, Ie is measured at the mechanical axis of the package and it is tested with a single current pulse condition (tp = 10 ms). The actual peak of the spatial radiation pattern may not be aligned with the axis. b. Tolerance is ±15%. Radiant Flux, Φe (mW)c c. The radiant flux,Φ e is the total flux output as measured with an integrating sphere at a single current pulse condition (tp = 10 ms). Viewing Angle, 2θ½ (°) d d. θ½ is the off-axis angle where the luminous intensity is half of the peak intensity. Min. Max. Typ. Typ. ARE1-89C0-00000 850 160 450 685 90 ARE1-89D0-00000 850 250 600 800 90 ARE1-8930-00000 850 630 1000 1340 90 ARE1-8FC0-00000 850 100 350 630 150 ARE1-8FD0-00000 850 150 400 800 150 ARE1-8F30-00000 850 200 500 1270 150 ARE1-99D0-00000 940 160 450 590 90 ARE1-9930-00000 940 320 850 935 90 ARE1-9F30-00000 940 160 400 970 150 Parameters ARE1-8xC0 ARE1-8xD0 ARE1-8x30 ARE1-9xD0 ARE1-9x30 Units DC Forward Currenta a. Derate linearly as shown in Figure 8, Figure 9, Figure 10, and Figure 11. 1000 1000 1000 1000 1000 mA Peak Forward Currentb b. Duty factor = 10%, frequency = 1kHz. 3000 3000 3000 3000 3000 mA Power Dissipation 2500 2500 3600 2500 3400 mW Reverse Voltage Not designed for reverse bias operation LED Junction Temperature 115 145 115 115 115 °C Operating Temperature Range –40 t o +85 –40 to +100 –40 to +85 –40 t o +85 –40 to +85 °C Storage Temperature Range –40 to +100 –40 to +100 –40 to +100 –40 t o +100 –40 to +100 °C

ARE1-xxx0-00000 Data Sheet High Power Infrared Emitting Diodes Optical and Electrical Characteristics (TJ = 25°C) Part Numbering System Part Number Example ARE1-89D0-00000 Parameters Min. Typ. Max. Units Test Condition Forward Voltage, VF a ARE1-8xC0 ARE1-8xD0 ARE1-8x30 ARE1-9xD0 ARE1-9x30 a. Forward voltage tolerance is ±0.1V. 1.4 1.4 2.7 1.4 2.5 1.8 1.8 3.2 1.8 3.0 2.5 2.5 3.6 2.5 3.4 VI F = 1A Reverse Voltage, VR Not designed for reverse bias Thermal Resistance, RθJ-S b b. Thermal resistance from the LED junction to the solder point. — 10 — °C/W LED junction to solder point ARE1 -x 1 x2 x3 0-00000 Code Description Option x1 Peak Wavelength 8 850 nm 9 940 nm x2 Viewing Angle 9 90° F 150° x3 Brightness Option C Single junction normal brightness D Single junction high brightness

3 Double junction high brightness

x1: 8 — Peak wavelength 850nm x2: 9 — Viewing angle typical 90° x3: D — Single junction high brightness

ARE1-xxx0-00000 Data Sheet High Power Infrared Emitting Diodes Broadcom ARE1-xxx0-DS100 Precautionary Notes Reflow Soldering  Do not perform reflow soldering more than twice. Observe necessary precautions of handling moisture-sensitive devices as stated in Handling of Moisture-Sensitive Devices.  Do not apply any pressure or force on the LED during reflow and after reflow when the LED is still hot. Figure 16: Recommended Lead-Free Reflow Soldering Profile Handling Precautions The encapsulation material of the LED is made of silicone for better product reliability. Compared to epoxy encapsulant, which is hard and brittle, silicone is softer and flexible. Observe special handling precautions during assembly of silicone encapsulated LED products. Failure to comply might lead to damage and premature failure of the LED. Refer to Broadcom® Application Note AN5288, Silicone Encapsulation for LED: Advantages and Handling Precautions, for additional information.  Do not poke sharp objects into the silicone encapsulant. Sharp objects, such as tweezers or syringes, might apply excessive force or even pierce through the silicone and induce failures to the LED die or wire bond.  Do not touch the silicone encapsulant. Uncontrolled force acting on the silicone encapsulant might result in excessive stress on the wire bond. Hold the LED only by the body.  Do not stack assembled PCBs together. Use an appropriate rack to hold the PCBs.  The surface of silicone material attracts dust and dirt easier than epoxy due to its surface tackiness. To remove foreign particles on the surface of silicone, use a cotton bud with isopropyl alcohol (IPA). During cleaning, rub the surface gently without putting too much pressure on the silicone. Ultrasonic cleaning is not recommended. Handling of Moisture-Sensitive Devices This product has a Moisture Sensitive Level 3 rating per JEDEC J-STD-020. Refer to Broadcom Application Note AN5305, Handling of Moisture Sensitive Surface Mount Devices, for additional details and a review of proper handling procedures. Before use:  An unopened moisture barrier bag (MBB) can be stored at <40°C/90% RH for 12 months. If the actual shelf life has exceeded 12 months and the humidity indicator card (HIC) indicates that baking is not required, it is safe to reflow the LEDs per the original MSL rating.  Do not open the MBB prior to assembly (for example, for IQC). If unavoidable, MBB must be properly resealed with fresh desiccant and HIC. The exposed duration must be taken in as floor life. Control after opening the MBB:  Read the HIC immediately upon opening of MBB.  Keep the LEDs at <30°/60% RH at all times, and complete all high temperature-related processes, including soldering, curing, or rework within 168 hours. Control for unfinished reel: Store unused LEDs in a sealed MBB with desiccant or a desiccator at <5% RH. Control of assembled boards: If the PCB soldered with the LEDs is to be subjected to other high-temperature processes, store the PCB in a sealed MBB with desiccant or desiccator at <5% RH to ensure that all LEDs have not exceeded their floor life of 168 hours. Baking is required if the following conditions exist:  The HIC indicator indicates a change in color for 10% and 5%, as stated on the HIC.  The LEDs are exposed to conditions of >30°C/60% RH at any time.  The LED's floor life exceeded 168 hours. The recommended baking condition is: 60°C ± 5ºC for 20 hours. Baking can only be done once. 10 to 30 SEC. 6°C/SEC. MAX. 255 – 260°C 3°C/SEC. MAX. 217°C 200°C 150°C 3°C/SEC. MAX. 60 – 120 SEC. 100 SEC. MAX. TIME TEMPERATURE

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