AR0544_V01 ONSEMI | Alldatasheet
Document overview
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Technical content
Features
5 MP CMOS Sensor with Advanced 1.4 /C0109m Pixel Stacked BSI Technology Enhanced NIR Response at 850 nm and 940 nm Wavelength LI-HDR: Supports Line Interleaved T1/T2 Readout to Enable HDR Processing in ISP Chip enhanced Dynamic Range (eDR) Super Low Power Mode Wake on Motion (WOM)/Motion Detection Subsampling Modes: Skipping, Binning, Summing Data Interfaces: 2-lane MIPI D-PHY Bit-depth Compression Available for MIPI Interface Various Trigger Modes for Multi-sensor Synchronization Electronic Rolling Shutter (ERS) and Global Reset Release (GRR) Modes Supported 2360 bytes One-Time Programmable Memory (OTPM) for Storing Shading Correction Coefficients and Module Information Programmable Controls: Gain, Horizontal and Vertical Blanking, Frame Size/Rate, Exposure, Window Size On-chip Temperature Sensor Simple Two-wire Fast-mode+ Serial Interface On-chip Lens Shading Correction See detailed ordering and shipping information on page 3 of this data sheet.
ORDERING INFORMATION
Applications
Videoconferencing Endpoints Webcams Machine Vision Cameras Video Doorbells Retail In-store Cameras, Bodycams, etc. 3D and Stereo Cameras ODCSP47 CASE 570DD Request Full Data Sheet Non−NDA Data Sheet Interested in what you see? If you would like more detailed information, please request the full version of our data sheet.
Table 1. KEY PERFORMANCE PARAMETERS
- /C0113JA is dependent on the customer module design and should not be used for calculating junction temperature.
Table 2. 10-bit MODES OF OPERATION
- Sensor resolution is actually 648 x 486. GB columns are skipped which helps reduce power consumption. The stream output of the sensor
cannot be used in this mode. Table 3. 12-bit MODES OF OPERATION Table 4. ORDERING INFORMATION
- Refer to AR0544 Die Data Sheet for Die Part Numbers & Ordering Information.
Figure 1. Block Diagram
ODCSP47 4.67x3.68x0.63, 0.50P CASE 570DD ISSUE A DATE 05 JUN 2025 MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS onsemi and are trademarks of Semiconductor Components Industries, LLC dba onsemi or its subsidiaries in the United States and/or other countries. onsemi reserves the right to make changes without further notice to any products herein. onsemi makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. onsemi does not convey any license under its patent rights nor the rights of others. 98AON60539HDOCUMENT NUMBER: DESCRIPTION: Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1ODCSP47 4.67x3.68x0.63, 0.50P © Semiconductor Components Industries, LLC, 2023 www.onsemi.com
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