AQY221N2V NAIS | Alldatasheet

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RF (Radio Frequency) C R 10 SSOP Type UL pending CSA pending mm inch

FEATURES

  1. Reduced package size Lower surface has been reduced 60% and mounting space 40% compared to conventional 4-pin SOP type. 2. Lower output capacitance and on- resistance Output capacitance(C): 1.0pF (typ.) ON resistance(R): 9.5 W (typ.) 3. Mounting space has been reduced and output signals have been improved by using new flat lead terminals. 4. High speed switching Turn on time: 0.02ms Turn off time: 0.02ms TYPICAL APPLICATIONS Measuring and testing equipment 1. Test equipment IC tester, Liquid crystal driver tester, semiconductor performance tester 2. Board tester Bear board tester, In-circuit tester, function tester 3. Medical equipment Ultrasonic wave diagnostic machine 4. Multi-point recorder Warping, thermo couple 4.45 .175 1.80 .071 2.65 .104 Conventional SOP type SSOP Flat lead TYPES * Indicate the peak AC and DC values. Notes: (1)Tape package is the standard packing style. (2)For space reasons, the initial letters of the product number “AQY and V”, the package type indicator “Y” and “W” are omitted from the seal. Circuit arrangement Type Output rating* Tape and reel packing style Packing quantity in tape and reelLoad voltage Load current Picked from the 1/4-pin sidePicked from the 2/3-pin side 1 Form A AC/DC type 40 V 120 mA AQY221N2VY AQY221N2VW 3,500 pcs. RATING 1. Absolute maximum ratings (Ambient temperature: 25 C 77 Item Symbol AQY221N2V Remarks Input LED forward current I F 50mA LED reverse voltage V R Peak forward current I FP 1A f=100 Hz, Duty factor=0.1% Power dissipation P in 75mW Output Load voltage (peak AC) V L 40V Continuous load current (peak AC) I L 0.12A Peak AC,DC Peak load current I peak 0.3A 100 ms (1 shot), V L = DC Power dissipation P out 250mW Total power dissipation P T 300mW I/O isolation voltage V iso 1,500V AC Temperature limits Operating T opr –40 C to +85 C –40 F to +185 F Non-condensing at low temperatures Storage T stg –40 C to +100 C –40 F to +212 F PhotoMOS RELAYS (by)
  1. Electrical characteristics (Ambient temperature: 25 C 77 Note: Recommendable LED forward current I F = 5 mA. For type of connection, see Page 5. *Turn on/Turn off time Item Symbol AQY221N2V Condition Input LED operate current Typical I Fon 1.0 mA I L = 80 mA Maximum 3.0 mA LED turn off current Minimum I Foff 0.2 mA I L = 80 mA Typical 0.9 mA LED dropout voltage Typical V F 1.14 V (1.35 V at I F = 50mA) I F = 5mA Maximum 1.5 V Output On resistance Typical R on 9.5 W I F = 5mA I L = 80 mA Within 1 s on timeMaximum 12.5 W Output capacitance Typical C out 1.0 pF I F = 0 V B = 0 V f = 1 MHzMaximum 1.5 pF Off state leakage current Typical I Leak 0.01 nA I F = 0 V L = Max.Maximum 10 nA Transfer characteristics Switching speed Turn on time* Typical T on 0.02 ms I F = 5mA V L = 10V R L = 125 W Maximum 0.5ms Turn off time* Typical T off 0.02ms I F = 5mA V L = 10V R L = 125 W Maximum 0.2 ms I/O capacitance Typical C iso 0.8 pF f = 1MHz V B = 0Maximum 1.5 pF Initial I/O isolation resistanceMinimum R iso 1,000M W 500V DC Toff Input Output Ton 90% 10% REFERENCE DATA 1. Load current vs. ambient temperature characteristics Allowable ambient temperature: –40 C to +85 C –40 F to +185 F 2. Load current vs. Load voltage characteristics Ambient temperature: 25 C 77 F 3. On resistance vs. ambient temperature characteristics Measured portion: between terminals 3 and 4 LED current: 5 mA; Load voltage: Max. (DC); Load current: 80mA (DC) 140 0 2 04 06 0 8085 100-40 -20 100 120Load current, mA Ambient temperature, °C 200 10 20 30 40 500 120 160Load current, mA Load voltage, V 02 0 4 0 6 0 8 0 8 5-40 -20 On resistance, Ω Ambient temperature, °C
  1. Turn on time vs. ambient temperature characteristics Measured portion: between terminals 3 and 4 LED current: 5 mA; Load voltage: 10V (DC); Continuous load current: 80mA (DC) 5. Turn off time vs. ambient temperature characteristics LED current: 5 mA; Load voltage: 10V (DC); Continuous load current: 80mA (DC) 6. LED operate current vs. ambient temperature characteristics Load voltage: Max. (DC); Continuous load current: 80mA (DC) 0.04 0.06 -40 -20 0.1 02 0 4 0 6 0 8 0 0.02 0.08 Turn on time, ms Ambient temperature, °C 0.04 0.06 -40 -20 0.1 02 0 4 0 6 0 8085 0.02 0.08Turn off time, ms Ambient temperature, °C 0.5 -40 -20 02 0 4 0 6 0 8085 1.5LED operate current, mA Ambient temperature, °C 7. LED turn off current vs. ambient temperature characteristics Load voltage: Max. (DC); Continuous load current: 80mA (DC) 8. LED dropout voltage vs. ambient temperature characteristics LED current: 5 to 50 mA 9. Voltage vs. current characteristics of output at MOS portion Measured portion: between terminals 3 and 4 Ambient temperature: 25 C 77 F 0.5 -40 -20 02 0 4 0 6 0 8085 1.5LED turn off current, mA Ambient temperature, °C 1.0 1.1 1.2 1.3 -40 -20 02 0 4 0 6 0 80 1.4 50mA 30mA 20mA 10mA 5mA 1.5 85 100 LED dropout voltage, V Ambient temperature, °C -0.5 120 100 -20 -40 -60 -80 -100 -120 Voltage, V Current, mA 10. Off state leakage current Measured portion: between terminals 3 and 4 Ambient temperature: 25 C 77 F 11. LED forward current vs. turn on time characteristics Measured portion: between terminals 3 and 4 Load voltage: 10V (DC); Continuous load current: 80mA (DC); Ambient temperature: 25 C 77 F 12. LED forward current vs. turn off time characteristics Measured portion: between terminals 3 and 4 Load voltage: 10V (DC); Continuous load current: 80mA (DC); Ambient temperature: 25 C 77 F 40302010 -12 05 0 Off state leakage current, A Load voltage, V 0.03 0.09 0.06 1002 0 3 0 4 0 0.12 50 60 Turn on time, µs LED forward current, mA 0.02 0.08 0.04 0.06 1002 0 3 0 4 0 0.1 50 60 Turn off time, µs LED forward current, mA 13. Applied voltage vs. output capacitance characteristics Measured portion: between terminals 3 and 4 Frequency: 1 MHz, 30m Vrms; Ambient temperature: C 77 F 14. Isolation characteristics (50 W impedance) Measured portion: between terminals 3 and 4 Ambient temperature: 25 C 77 F 15. Insertion loss characteristics (50 W impedance) Measured portion: between terminals 3 and 4 Ambient temperature: 25 C 77 F 0.5 2.5 2010 30 40 50 1.5 Output capacitance, pF Applied boltage, V 0 10 10 10 68 10710 100 Isolation, dB Frequency, Hz 0 10 10 106710 1.5 0.5 Insertion loss, dB Frequency, Hz
  1. On resistance distribution Measured portion: between terminals 3 and 4 Continuous load current: 80mA (DC) Quantity, n=60; Ambient temperature: 25 C 77 F 17. Turn on time distribution Load voltage: 10V (DC) Continuous load current: 80mA (DC) Quantity, n = 60; Ambient temperature: 25 C 77 F 18. Turn off time distribution Load voltage: 10V (DC) Continuous load current: 80mA (DC) Quantity, n = 60; Ambient temperature: 25 C 77 F 8.6 9 9.4 9.8 10.2 Quantity, n On resistance, Ω Quantity, n Turn on time, ms Quantity, n Turn off time, ms 19. LED operate current distribution Load voltage: 10V (DC) Continuous load current: 80mA (DC) Quantity, n = 60; Ambient temperature: 25 C 77 F Quantity, n LED operate current, mA DIMENSIONS Terminal thickness = 0.15 .006 General tolerance: 0.1 .004 4.45 .175 0.20 .008 0.20 .008(4.85) (.191) 0.40 .016 0.40 .016 1.27 .050 2.65 .104 1.80 .071 Recommended mounting pad (TOP VIEW) Tolerance: 0.1 .004 0.90 .035 4.35 .171 1.27 .050 0.70 .028 mm inch SCHEMATIC AND WIRING DIAGRAMS Notes: 1. E : Power source at input side; V IN : Input voltage; I F : LED forward current; I IN : Input current; V L : Load voltage; I L : Load current Schematic Output configuration Load Wiring diagram 1a AC/DC IF IL 2 3 VL (AC,DC) Load Load IL VL (AC,DC)
  1. Short across terminals Do not short circuit between terminals when relay is energized. There is possibility of breaking the internal IC. 2. Surge voltages at the input If reverse surge voltages are present at the input terminals, connect a diode in reverse parallel across the input terminals and keep the reverse voltages below the reverse breakdown voltage. 3. Recommended LED forward current F It is recommended that the LED forward current (I F ) be kept at 5mA. 4. Ripple in the input power supply If ripple is present in the input power supply, observe the following: 1) For LED operate current at E min , main- tain the value mentioned in the table of "3. Recommended LED forward current (I F )." 2) Keep the LED operate current at 50 mA or less at E max 5. Output spike voltages 1) If an inductive load generates spike voltages which exceed the absolute maximum rating, the spike voltage must be limited. Typical circuits are shown below. 2) If spike voltages generated at the load are limited with a clamp diode and the circuit wires are long, spike voltages will occur by inductance. Keep wires as short as possible to minimize inductance. 6. Cleaning solvents compatibility Dip cleaning with an organic solvent is recommended for removal of solder flux, dust, etc. Select a cleaning solvent from the following table. If ultrasonic cleaning is used, the severity of factors such as frequency, output power and cleaning solvent selected may cause loose wires and other defects. Make sure these conditions are correct before use. For details, please consult us. Emin. Emax. Load Add a clamp diode to the load Add a CR snubber circuit to the load Load Cleaning solvent Compatibility m : Y es : No) Chlorine base
  • Trichlene
  • Chloroethlene m Adueous
  • Indusco
  • Hollis
  • Lonco Terg m Alcohol base
  • IPA
  • Ethanol m Others • Thinner
  • Gasoline 7. Soldering When soldering this terminals, the following conditions are recommended. (1) IR (Infrared reflow) soldering method (2) Vapor phase soldering method (3) Double wave soldering method T1 = 155 to 165°C 311 to 329°F T2 = 180°C 200°C 356 to 392°F T3 = 245°C 473°F or less t1 = 120 s or less t2 = 30 s or less t1 t2 t1 t2 T1 = 180 to 200°C 366 to 392°F T2 = 215°C 419°F or less t1 = 40 s t2 = 40 s or less t1 t2 t3 T1 = 155 to 165°C 311 to 329°F T2 = 260°C 500°F or less t1 = 60 s or less t2+t3 = 5 s or less (4) Soldering iron method Tip temperature: 280 to 300 C 536 to 572 F Wattage: 30 to 60 W Soldering time: within 5 s (5) Others Check mounting conditions before using other soldering methods (hot-air, hot plate, pulse heater, etc.)
  • The temperature profile indicates the temperature of the soldered terminal on the surface of the PC board. The ambient temperature may increase excessively. Check the temperature under mounting conditions.
  • The conditions for the infrared reflow soldering apply when preheating using the VPS method.
  1. The following shows the packaging format mm inch 1) Tape and reel Type Tape dimensions Dimensions of paper tape reel SSOP 4-pin type 0.3–0.05 .012–.002 2.7–0.3 .106–.012 4.0–0.1 .157–.004 4.0–0.1 .157–.004 3.0–0.1 .118–.004 1.50 Tractor feed holes dia. +0.5 -01.50 dia. +0.5 Direction of picking Device mounted on tape .059 dia. +.004 1.50 dia. +0.1 5.1–0.2 .201–.008 1.75–0.1 .069–.004 5.5–0.1 .217–.004 12.0–0.3 .472–.012 (1) When picked from 1/4-pin side: Part No. AQYmmm VY (Shown above) (2) When picked from 2/3-pin side: Part No. AQYmmm VW 21±0.8 3.150±.039 dia. 2±0.5 .079±.020 13±0.5 dia. .551±.059 2±0.5 .079±.020 250±2 dia. 9.843±.079 dia. 80±1 dia. 3.150±.039 dia. 2) Storage PhotoMOS relays implemented in SSOP types are sensitive to moisture and come in sealed moisture-proof packages. Obse rve the following cautions on storage.
  • After the moisture-proof package is unsealed, take the devices out of storage as soon as possible (within 1 month at the most).
  • If the devices are to be left in storage for a considerable period after the moisture- proof package has been unsealed, it is recommended to keep them in another moisture-proof bag containing silica gel (within 3 months at the most). 9. Transportation and storage 1) Extreme vibration during transport will w arp the lead or damage the relay. Handle the outer and inner boxes with care. 2) Storage under extreme conditions will cause soldering degradation, external appearance defects, and deterioration of the characteristics. The following storage conditions are recommended:
  • Temperature: 0 to 45 C 32 to 113 F
  • Humidity: Less than 70% R.H.
  • Atomosphere: No harmful gasses such as sulfurous acid gas, minimal dust. 10. Applying stress that exceeds the absolute maxim um rating If the voltage or current value for any of the terminals exceeds the absolute maximum rating, internal elements will deteriorate because of the excessive voltage or current. In extreme cases, wiring may melt, or silicon P/N junctions m ay be destroyed. As a result, the design should ensure that the absolute maximum ratings will never be exceeded, even momentarily. (Use at 15 V DC or lower and 9 V DC or lower is recommended.) 11. Deterioration and destruction caused by discharge of static electricity This phenomenon is generally called static electricity destruction. This occurs when static electricity generated by various factors is discharged while the relay terminals are in contact. The result can producing internal destruction of the element. To prevent problems from static electricity, the following precautions and measures should be taken when using your device. 1) Employees handling relays should wear anti-static clothing and should be grounded through protective resistance of 500 k W to 1 M W 2) A conductive metal sheet should be placed over the work table. Measuring instruments and jigs should be grounded. 3) When using soldering irons, either use irons with low leakage current, or ground the tip of the soldering iron. (Use of low- voltage soldering irons is also recommended.) 4) Devices and equipment used in assem bly should also be grounded. 5) When packing printed circuit boards and equipment, avoid using high-polymer materials such as foam styrene, plastic, and other materials which carry an electrostatic charge. 6) When storing or transporting relays, the environment should not be conducive to generating static electricity (for instance, the humidity should be between 45 and 60%). Relays should alw ays be protected using non-conductive packing materials. 8/1/2001 All Rights Reserved, © Copyright Matsushita Electric W orks, Ltd. G o To Online Catalog