AQY212GH NAIS | Alldatasheet

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Technical content

GU (General Use) Type 1-Channel (Form A) High Capacity 4-Pin Type cUL pending VDE pending mm inch 4.78 .188 6.4 .252 3.2 .1261

FEATURES

  1. Greatly increased load current. 2. Reinforced insulation 5,000 V type. 3. Greatly improved specs allow you to use this in place of mercury and mechanical relays. 4. Compact 4-pin DIP size. TYPICAL APPLICATIONS
  • Security market (use in I/O for alarm and security devices, etc.)
  • Measuring instrument market TYPES *Indicate the peak AC and DC values. Note: For space reasons, the initial letters of the product number “AQY”, the SMD terminal shape indicator “A” and the package type indicator "X" and "Z" are omitted from the seal. Type I/O isolation voltage Output rating* Part No. Packing quantityThrough hole terminal Surface-mount terminal Load voltage Load current Tube packing style Tape and reel packing style Tube Tape and reelPicked from the 1/2-pin side Picked from the 3/4-pin side AC/DC type Reinforced 5,000 V 60 V 1.1 A AQY212GH AQY212GHA AQY212GHAX AQY212GHAZ 1 tube contains 100 pcs. 1 batch contains 1,000 pcs. 1,000 pcs. RATING 1. Absolute maximum ratings (Ambient temperature: 25 C 77 Item Symbol AQY212GH Remarks Input LED forward current I F 50 mA LED reverse voltage V R 5 V Peak forward current I FP 1 A f = 100 Hz, Duty factor = 0.1% Power dissipation P in 75 mW Output Load voltage (peak AC) V L 60 V Continuous load current (peak AC) I L 1.1 A Peak load current I peak

3.0 A 100ms (1 shot), V

L = DC Power dissipation P out 500 mW Total power dissipation P T 550 mW I/O isolation voltage V iso 5,000 V AC Temperature limitsOperating T opr –40 C to +85 C –40 F to +185 F Non-condensing at low temperatures Storage T stg –40 C to +100 C –40 F to +212 F AQY212GH.fm1y[WQOOQNU Sú@Îjú@ ãPQ QTª

  1. Electrical characteristics (Ambient temperature: 25 C 77 Note: Recommendable LED forward current I F = 5 to 10 mA. For type of connection, see Page 4. *Turn on/Turn off time Item Symbol AQY212GH Condition Input LED operate current Typical I Fon 1.1 mA I L = 100mAMaximum 3 mA LED turn off current Minimum I Foff 0.3 mA I L = 100mATypical 1.0 mA LED dropout voltage Typical V F 1.14 V (1.32 V at IF = 50 mA) I F = 5 mAMaximum 1.5 V Output On resistance Typical R on 0.34 W I F = 5 mA I L = Max. Within 1 s on timeMaximum 0.7 W Off state leakage current Maximum I Leak m A I F = 0 V L = Max. Transfer characteristics Turn on time* Typical T on 1.3 ms I F = 5 mA I L = 100 mA V L = 10 VMaximum 5.0 ms Turn off time* Typical T off 0.1 ms I F = 5 mA I L = 100 mA V L = 10 VMaximum 0.5 ms I/O capacitance Typical C iso 0.8 pF f = 1 MHz V B = 0Maximum 1.5 pF Initial I/O isolation resistance Minimum R iso 1,000 M W

500 V DC

Output 10% 90% Toff REFERENCE DATA 1. Load current vs. ambient temperature characteristics Allowable ambient temperature: –40 C to +85 C –40 F to +185 F 2. On resistance vs. ambient temperature characteristics Measured portion: between terminals 3 and 4; LED current: 5 mA; Load voltage: Max. (DC) Continuous load current: Max.(DC) 3. Turn on time vs. ambient temperature characteristics LED current: 5 mA; Load voltage: 10 V (DC); Continuous load current: 100 mA (DC) Ambient temperature, °C Load current, A 2.5 02 0 4 0 6 0 8085 100–40 –20 0.5 1.5 0 –40 –20 0.2 02 0 4 0 6 0 80 Ambient temperature, °C On resistance, Ω 0.6 0.8 0.4 Ambient temperature, °C Turn on time, ms –40 –20 02 0 4 0 6 0 80 AQY212GH.fm2y[WQOOQNU Sú@Îjú@ ãPQ QTª

  1. Turn off time vs. ambient temperature characteristics LED current: 5 mA; Load voltage: 10 V (DC); Continuous load current: 100 mA (DC) 5. LED operate current vs. ambient temperature characteristics Load voltage: 10 V (DC); Continuous load current: 100mA (DC) 6. LED turn off current vs. ambient temperature characteristics Load voltage: 10 V (DC); Continuous load current: 100mA (DC) 0.4 0.8 0.6 Ambient temperature, °C Turn off time, ms –40 –20 02 0 4 0 6 0 80 0.2 85 0 Ambient temperature, °C LED operate current, mA –40 –20 02 0 4 0 6 0 80 85 Ambient temperature, °C LED turn off current, mA –40 –20 02 0 4 0 6 0 80 7. LED dropout voltage vs. ambient temperature characteristics LED current: 5 to 50 mA 8. Voltage vs. current characteristics of output at MOS portion Measured portion: between terminals 3 and 4; Ambient temperature: 25 C 77 F 9. Off state leakage current Measured portion: between terminals 3 and 4; Ambient temperature: 25 C 77 F 1.1 1.2 1.3 1.4 Ambient temperature, °C LED dropout voltage, V –40 –20 02 0 4 06 0 80 85 1.5 50mA 30mA 20mA 10mA 5mA Voltage, V Current, mA1 10.5 –1 –0.5 0 30 40 60 Load voltage, V Off state leakage current, A 10-12 10-10 10 20 10-6 10-8 10. LED forward current vs. turn on time characteristics Measured portion: between terminals 3 and 4; Load voltage: 10 V (DC); Continuous load current: 100 mA (DC); Ambient temperature: 25 C 77 F 11. LED forward current vs. turn off time characteristics Measured portion: between terminals 3 and 4; Load voltage: 10 V (DC); Continuous load current: 100 mA (DC); Ambient temperature: 25 C 77 F 12. Applied voltage vs. output capacitance characteristics Measured portion: between terminals 3 and 4; Frequency: 1 MHz; Ambient temperature: 25 C 77 F LED forward current, mA Turn on time, ms 10 20 30 40 50 LED forward current, mA Turn off time, ms 0.1 0.3 0.2 10 20 30 40 0.5 500 0.4 100 200 800 Applied voltage, V Output capacitance, pF 10 20 30 40 50 500 400 300 600 700 AQY212GH.fm3y[WQOOQNU Sú@Îjú@ ãPQ QTª

Through hole terminal type Terminal thickness = 0.2 .008 General tolerance: 0.1 .004 Surface mount terminal type Terminal thickness = 0.2 .008 General tolerance: 0.1 .004 4.78 .188 6.4 .252 2.7 .106 7.62–0.05 .300–.002 Max. 10° Max. 10° 1.0 .039 0.33 .013 0.2 .0083.0 .118 0.47 .019 3.2–0.1 .126–.004 0.47 .019 2.54 .100 4.78 .188 6.4 .252 1.0 .039 2.7 .106 7.62–0.05 .300–.002 Max. 10° 1.0 .039 1.0 .039 2.7 .106 0.47 .019 0.47 .019 2.54 .100 0.2 .008 –0.2 0–.008 PC board pattern (BOTTOM VIEW) Tolerance: 0.1 .004 Mounting pad (TOP VIEW) Tolerance: 0.1 .004 4-0.8 dia. 4-.031 dia. 7.62 .3006.4 .252 2.54 .100 2.54 .100 8.3 .327 1.9 .075 1.5 .0592.54 .100 SCHEMATIC AND WIRING DIAGRAMS Notes: E : Power source at input side; I F : LED forward current; V L : Load voltage; I L : Load current; Schematic Output configura- tion Load Connec- tion Wiring diagram 1a AC/DC — IF IL 2 3 VL (AC,DC) Load Load IL VL (AC,DC) AQY212GH.fm4y[WQOOQNU Sú@Îjú@ ãPQ QTª

  • Do not use the product under conditions that exceed the range of its specifications. It may cause overheating, smoke, or fire.
  • Do not touch the recharging unit while the power is on. There is a danger of electrical shock. Be sure to turn off the power when performing mounting, maintenance, or repair operations on the relay (including connecting parts such as the terminal board and socket).
  • Check the connection diagrams in the catalog and be sure to connect the terminals correctly. Erroneous connections could lead to unexpected operating errors, overheating, or fire. NOTES 1. Short across terminals Do not short circuit between terminals when relay is energized. There is possibility of breaking the internal IC. 2. Surge voltages at the input If reverse surge voltages are present at the input terminals, connect a diode in reverse parallel across the input terminals and keep the reverse voltages below the reverse breakdown voltage. 3. Recommended LED forward current F It is recommended that the LED forward current (I F ) be kept at 5mA. 4. Ripple in the input power supply If ripple is present in the input power supply, observe the following: 1) For LED operate current at E min maintain the value mentioned in the table of “Note 3. Recommended LED forward current (I F ).” 2) Keep the LED operate current at 50 mA or less at E max 5. Output spike voltages 1) If an inductive load generates spike voltages which exceed the absolute maximum rating, the spike voltage must be limited. Typical circuits are shown below. 2) If spike voltages generated at the load are limited with a clamp diode and the circuit wires are long, spike voltages will occur by inductance. Keep wires as short as possible to minimize inductance. 6. Cleaning solvents compatibility Dip cleaning with an organic solvent is recommended for removal of solder flux, dust, etc. Select a cleaning solvent from the following table. If ultrasonic cleaning is used, the severity of factors such as frequency, output power and cleaning solvent selected may cause loose wires and other defects. Make sure these conditions are correct before use. For details, please consult us. Emin. Emax. Load Add a clamp diode to the load Add a CR snubber circuit to the load Load Cleaning solvent Compatibility m : Y es : No) Chlorine- base
  • Trichlene
  • Chloroethlene m Adueous
  • Indusco
  • Hollis
  • Lonco Terg m Alcohol- base
  • IPA
  • Ethanol m Others • Thinner
  • Gasoline 7. Soldering 1) When soldering PC board terminals, keep soldering time to within 10 s at 260 C 500 2) When soldering surface-mount terminals, the following conditions are recommended. (1) IR (Infrared reflow) soldering method (2) Vapor phase soldering method (3) Double wave soldering method T1 = 155 to 165°C 311 to 329°F T2 = 180°C 200°C 356 to 392°F T3 = 245°C 473°F or less t1 = 120 s or less t2 = 30 s or less t1 t2 t1 t2 T1 = 180 to 200°C 366 to 392°F T2 = 215°C 419°F or less t1 = 40 s t2 = 90 s or less t1 t2 t3 T1 = 155 to 165°C 311 to 329°F T2 = 260°C 500°F or less t1 = 60 s or less t2+t3 = 5 s or less (4) Soldering iron method Tip temperature: 280 to 300 C 536 to 572 F Wattage: 30 to 60 W Soldering time: within 5 s (5) Others Check mounting conditions before using other soldering methods (hot-air, hot plate, pulse heater, etc.)
  • The temperature profile indicates the temperature of the soldered terminal on the surface of the PC board. The ambient temperature may increase excessively. Check the temperature under mounting conditions.
  • The conditions for the infrared reflow soldering apply when preheating using the VPS method. AQY212GH.fm5y[WQOOQNU Sú@Îjú@ ãPQ QTª
  1. The following shows the packaging format mm inch 1) Tape and reel Type Tape dimensions Dimensions of paper tape reel 4-pin SMD type (1) When picked from 1/2-pin side: Part No. AQYmmm GHAX (Shown above) (2) When picked from 3/4-pin side: Part No. AQYmmm GHAZ Device mounted on tape Direction of picking Tractor feed holes 1.5 dia. .059 dia. 1.55–0.1 dia. .061–.004 dia. –0.1 – 0 –.004 4–0.1 .157–.004 2–0.1 .079–.004 10.2–0.1 .402–.004 12–0.1 .472–.004 0.3–0.05 .012–.002 4.2–0.3 .165–.012 12–0.3 .472–.012 5.5–0.1 .217–.004 1.75–0.1 .069–.004 5.25–0.1 .207–.004 80–1 dia. 3.150–.039 dia. 13–0.5 dia. .512–.020 dia. 21–0.8 .827–.031 13.5–2.0 .531–.079 2–0.5 .079–.020 2–0.5 .079–.020 300–2 dia. 11.811–.079 dia. 80–1 dia. 3.150–.039 dia. 2) Tube Devices are packaged in a tube so pin No. 1 is on the stopper B side. Observe correct orientation when mounting them on PC boards. 9. Transportation and storage 1) Extreme vibration during transport will warp the lead or damage the relay. Handle the outer and inner boxes with care. 2) Storage under extreme conditions will cause soldering degradation, external appearance defects, and deterioration of the characteristics. The following storage conditions are recommended:
  • Temperature: 0 to 45 C 32 to 113 F
  • Humidity: Less than 70% R.H.
  • Atomosphere: No harmful gasses such as sulfurous acid gas, minimal dust. Stopper B Stopper A AQY212GH.fm6y[WQOOQNU Sú@Îjú@ ãPQ QTª