AQ3041 LITTELFUSE | Alldatasheet

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Technical content

Features

Applications

The AQ3041 includes low capacitance rail to rail diodes with an additional Zener diode to provide protection for electronic equipment that may experience destructive electrostatic discharges (ESD). These robust diodes can safely absorb repetitive ESD strikes above the maximum level specified in IEC 61000-4-2 international standard (±20kV contact discharge) without performance degradation. The low loading capacitance makes it ideal for protecting high speed data lines such as HDMI, DVI, USB2.0, USB3.0 and eSATA.

  • ESD protection of ±20kV contact discharge, ±30kV air discharge, (IEC 61000-4-2)
  • EFT protection, IEC 61000-4-4, 40A p=5/50ns)
  • Lightning Protection, IEC 61000-4-5 2 nd edition, 3A (tp=8/20µs)
  • Low capacitance of 0.5pF @ VR=0V
  • Low leakage current of 0.1μA at 5V
  • Small SOD882 packaging helps save board space
  • AEC-Q101 qualified
  • Halogen free, lead free and RoHS compliant
  • Moisture Sensitivity Level(MSL -1)
  • Tablets
  • Ultrabook
  • eReader
  • Smart Phones
  • Digital Cameras
  • MP3/ PMP
  • Set Top Boxes
  • Portable Medical
  • Automotive Applications Functional Block Diagram Life Support Note: Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. USB3.0 Application Example AQ3041 Series 0.5pF 20kV Unidirectional Discrete TVS USB Port USB Controller Signal Ground IC *Packages are shown as transparent AQ1003 AQ3041 (x6) SSTX+ SSTX- SSRX+ SSRX- VBUS HDMI Port HDMI Chipset D2+ D2- *Packages are shown as transparent CEC SCL IC AQ3041 (x8) SP3002 D1+ D1- D0+ D0- CLK+ CLK- HPD PWR SDA Pinout 1 2 SOD882 (AEC-Q101 qualified) RoHS Pb GREEN

©2017 Littelfuse, Inc. Specifications are subject to change without notice. TVS Diode Arrays (SPA ® Diodes) Revision: 11/09/17 Low Capacitance ESD Protection - AQ3041 Series CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the component. This is a stress only rating and operation of the component at these or any other conditions above those indicated in the operational sections of this specification is not implied. Absolute Maximum Ratings Symbol Parameter Value Units IPP Peak Current (tp=8/20μs) 3.0 A TOP Operating Temperature -40 to 150 °C TSTOR Storage Temperature -55 to 150 °C Electrical Characteristics (TOP=25ºC) Parameter Symbol Test Conditions Min Typ Max Units Reverse Standoff Voltage VRWM 5 V Reverse Leakage Current ILEAK VR=5V with 1pin at GND 0.1 0.5 µA Clamp Voltage1 VC IPP=1A, tp=8/20µs, Fwd 9.2 V IPP=2A, tp=8/20µs, Fwd 10.0 V ESD Withstand Voltage1 VESD IEC 61000-4-2 (Contact) ±20 kV IEC 61000-4-2 (Air) ±30 kV Dynamic Resistance2 RDYN TLP , tP=100ns, I/O to GND 0.3 Ω Diode Capacitance1 CI/O-I/O Reverse Bias=0V , f=1 MHz 0.5 pF Normalized Capacitance vs. Reverse Voltage 0.3 0.6 0.9 1.2 1.5 Capacitance (pF) Bias Voltage (V) 8/20μs Pulse Waveform 10% 20% 30% 40% 50% 60% 70% 80% 90% 100% 110% Time (/uni03BCs) Pe rcen t of IPP Note: 1 Parameter is guaranteed by design and/or component characterization.

2 Transmission Line Pulse (TLP) with 100ns width, 2ns rise time, and average window t1=70ns to t2= 90ns

Maximum Junction Temperature 150 °C Maximum Lead Temperature (Soldering 30s) 260 °C

©2017 Littelfuse, Inc. Specifications are subject to change without notice. TVS Diode Arrays (SPA ® Diodes) Revision: 11/09/17 Low Capacitance ESD Protection - AQ3041 Series Soldering Parameters Time Temperature TP TL TS(max) TS(min) tP tL tS time to peak temperature PreheatPreheat Ramp-upRamp-up Ramp-downRamp-do Critical Zone TL to TP Critical Zone TL to TP Reflow Condition Pb – Free assembly Pre Heat - Temperature Min (Ts(min)) 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs Average ramp up rate (Liquidus) Temp (TL) to peak 3°C/second max TS(max) to TL - Ramp-up Rate 3°C/second max Reflow - Temperature (TL) (Liquidus) 217°C - Temperature (tL) 60 – 150 seconds Peak Temperature (TP) 260+0/-5 °C Time within 5°C of actual peak Temperature (tp) 20 – 40 seconds Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes Max. Do not exceed 260°C Product Characteristics Lead Plating Pre-Plated Frame Lead Material Copper Alloy Substrate material Silicon Body Material Molded Epoxy Flammability UL Recognized epoxy meeting flammability rating V-0. Notes : 1 . All dimensions are in millimeters 2. Dimensions include solder plating. 3. Dimensions are exclusive of mold flash & metal burr. 4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 5. Package surface matte finish VDI 11-13. Part Numbering System AQ 3041 01 E T G Series Number of Channels Package T= Tape & Reel G= Green E: SOD882 Automotive Grade TVS Diode Arrays (SPA Diodes) T ransmission Line Pulsing(TLP) Plot 05 10 15 20 25 TLP Voltage (V) TLP Current (A) Part Marking System T PIN 1 PIN 2

©2017 Littelfuse, Inc. Specifications are subject to change without notice. TVS Diode Arrays (SPA ® Diodes) Revision: 11/09/17 Low Capacitance ESD Protection - AQ3041 Series Part Number Package Marking Min. Order Qty. Packaging Option P0/P1 Packaging Specification AQ3041-01ETG SOD882 T 10000 Tape & Reel – 8mm tape/7” reel 4mm/2mm EIA RS-481

Ordering Information

D EA L b e Recommended Soldering Pad Layout 0.325 0.325 0.650 0.975 0.650 Symbol JEDEC MO-236 Millimeters Inches Min Max Min Max A 0.36 0.42 0.014 0.017 b 0.45 0.55 0.018 0.022 L 0.20 0.30 0.008 0.012 e 0.65 0.026 D 0.93 1 .07 0.037 0.042 E 0.53 0.67 0.021 0.026 Embossed Carrier T ape & Reel Specification — SOD882 Symbol Millimetres Inches Min Max Min Max A 0.65 0.70 0.026 0.028 B 1. 10 1 .20 0.043 0.047 C 0.50 0.60 0.020 0.024 dØ 1 .40 1 .60 0.055 0.063 E 1 .65 1 .85 0.065 0.073 F 3.40 3.60 0.134 0.142 P0 3.90 4.10 0.154 0.161 P 1 .90 2.10 0.075 0.083 P1 1 .90 2.10 0.075 0.083 W 7 .90 8.10 0.311 0.319 User Feeding Direction Pin 1 Location Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at http://www.littelfuse.com/disclaimer-electronics. 8mm TAPE AND REEL W P0 P2 Φ2: 1.55±0.05 E FA0 T Top Cover Tape 3° RE F Φ: 0.40±0.05 Pin1 ComponentOrientationi nT ape R W MN S H K