AQXX-02HTG LITTELFUSE | Alldatasheet

Document overview

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Technical content

Features

  • ESD, IEC 61000-4-2, ±30kV contact, ±30kV air
  • EFT , IEC 61000-4-4, 50A (5/50ns)
  • Lightning, 33A (8/20μs as defined in IEC 61000-4-5 2nd edition) for the AQ05
  • Working voltages: 5V , 12V , 15V , 24V and 36V ESD, ISO 10605, 330pF 330Ω, ±30kV contact, ±30kV air
  • Low clamping voltage
  • Low leakage current
  • AEC-Q101 qualified
  • Moisture Sensitivity Level (MSL -1)
  • Halogen free, lead free and RoHS compliant
  • PPAP capable
  • Industrial Equipment
  • Test and Medical Equipment
  • Point-of-Sale Terminals
  • Motor Controls
  • Legacy Ports (RS-232, RS-485)
  • Security and Alarm Systems Pinout and Functional Block Diagram Life Support Note: Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. RoHS Pb GREENAQxx-02HTG Series 500W TVS Diode Array IC RD TD RTS CTS DSR DTR RS-232 Port Transceiver AQ15 (x6) (bidirectional implementation) Case GND

TVS Diode Array (SPA ® Diodes) General Purpose ESD Protection - AQxx-02HTG Series © 2019 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 09/17/19 CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the component. This is a stress only rating and operation of the component at these or any other conditions above those indicated in the operational sections of this specification is not implied. Absolute Maximum Ratings Symbol Parameter Value Units PPk Peak Pulse Power (tp=8/20μs) 500 W TOP Operating Temperature -40 to 150 °C TSTOR Storage Temperature -55 to 150 °C Parameter Symbol T est Conditions Min Ty p Max Units Reverse Standoff Voltage VRWM IR=1μA 5.0 V Breakdown Voltage VBR IR=1mA 6.0 7. 0 V Reverse Leakage Current ILEAK VR=5V 1. 0 μA Clamp Voltage1 VC IPP=1A, tp=8/20µs, Pin 1 or Pin 2 to Pin 3 8.0 9.8 V IPP=10A, tp=8/20µs, Pin 1 or Pin 2 to Pin 3 10.5 13.0 V Dynamic Resistance2 RDYN TLP , tp=100ns, Pin 1 or Pin 2 to Pin 3 0.19 Ω Peak Pulse Current IPP tp=8/20µs 33 A ESD Withstand Voltage1 VESD IEC 61000-4-2 (Contact Discharge) ±30 kV IEC 61000-4-2 (Air Discharge) ±30 kV Diode Capacitance1 CI/O-GND Reverse Bias=0V , f=1MHz 290 350 pF CI/O-I/O Reverse Bias=0V , f=1MHz 145 180 pF Parameter Symbol T est Conditions Min Ty p Max Units Reverse Standoff Voltage VRWM IR=1μA 12.0 V Breakdown Voltage VBR IR=1mA 13.3 14.2 V Reverse Leakage Current ILEAK VR=12V 1. 0 μA Clamp Voltage1 VC IPP=1A, tp=8/20µs, Pin 1 or Pin 2 to Pin 3 16.0 18.5 V IPP=10A, tp=8/20µs, Pin 1 or Pin 2 to Pin 3 20.0 22.5 V Dynamic Resistance2 RDYN TLP , tp=100ns, Pin 1 or Pin 2 to Pin 3 0.25 Ω Peak Pulse Current IPP tp=8/20µs 20 A ESD Withstand Voltage1 VESD IEC 61000-4-2 (Contact Discharge) ±30 kV IEC 61000-4-2 (Air Discharge) ±30 kV Diode Capacitance1 CI/O-GND Reverse Bias=0V , f=1MHz 110 135 pF CI/O-I/O Reverse Bias=0V , f=1MHz 55 85 pF AQxx-02HTG Series

TVS Diode Array (SPA ® Diodes) General Purpose ESD Protection - AQxx-02HTG Series © 2019 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 09/17/19 Parameter Symbol T est Conditions Min Ty p Max Units Reverse Standoff Voltage VRWM IR=1μA 15.0 V Breakdown Voltage VBR IR=1mA 16.7 18.5 V Reverse Leakage Current ILEAK VR=15V 1. 0 μA Clamp Voltage1 VC IPP=1A, tp=8/20µs, Pin 1 or Pin 2 to Pin 3 20.5 24.0 V IPP=10A, tp=8/20µs, Pin 1 or Pin 2 to Pin 3 26.6 30.0 V Dynamic Resistance2 RDYN TLP , tp=100ns, Pin 1 or Pin 2 to Pin 3 0.30 Ω Peak Pulse Current IPP tp=8/20µs 15 A ESD Withstand Voltage1 VESD IEC 61000-4-2 (Contact Discharge) ±30 kV IEC 61000-4-2 (Air Discharge) ±30 kV Diode Capacitance1 CI/O-GND Reverse Bias=0V , f=1MHz 85 100 pF CI/O-I/O Reverse Bias=0V , f=1MHz 45 75 pF Parameter Symbol T est Conditions Min Ty p Max Units Reverse Standoff Voltage VRWM IR=1μA 24.0 V Breakdown Voltage VBR IR=1mA 26.7 28 V Reverse Leakage Current ILEAK VR=24V 1. 0 μA Clamp Voltage1 VC IPP=1A, tp=8/20µs, Pin 1 or Pin 2 to Pin 3 30.0 36.0 V IPP=5A, tp=8/20µs, Pin 1 or Pin 2 to Pin 3 36.0 42.0 V Dynamic Resistance2 RDYN TLP , tp=100ns, Pin 1 or Pin 2 to Pin 3 0.50 Ω Peak Pulse Current IPP tp=8/20µs 9 A ESD Withstand Voltage1 VESD IEC 61000-4-2 (Contact Discharge) ±30 kV IEC 61000-4-2 (Air Discharge) ±30 kV Diode Capacitance1 CI/O-GND Reverse Bias=0V , f=1MHz 60 65 pF CI/O-I/O Reverse Bias=0V , f=1MHz 30 50 pF Parameter Symbol T est Conditions Min Ty p Max Units Reverse Standoff Voltage VRWM IR=1μA 36.0 V Breakdown Voltage VBR IR=1mA 40.0 41 .8 V Reverse Leakage Current ILEAK VR=36V 1. 0 μA Clamp Voltage1 VC IPP=1A, tp=8/20µs, Pin 1 or Pin 2 to Pin 3 45.0 52.0 V IPP=5A, tp=8/20µs, Pin 1 or Pin 2 to Pin 3 58.5 62.0 V Dynamic Resistance2 RDYN TLP , tp=100ns, Pin 1 or Pin 2 to Pin 3 0.65 Ω Peak Pulse Current IPP tp=8/20µs 7 A ESD Withstand Voltage1 VESD IEC 61000-4-2 (Contact Discharge) ±30 kV IEC 61000-4-2 (Air Discharge) ±30 kV Diode Capacitance1 CI/O-GND Reverse Bias=0V , f=1MHz 45 50 pF CI/O-I/O Reverse Bias=0V , f=1MHz 25 40 pF Note: 1 Parameter is guaranteed by design and/or component characterization.

2 Transmission Line Pulse (TLP) with 100ns width, 2ns rise time, and average window t1=70ns to t2= 90ns

TVS Diode Array (SPA ® Diodes) General Purpose ESD Protection - AQxx-02HTG Series © 2019 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 09/17/19 8/20μs Pulse Waveform 10% 20% 30% 40% 50% 60% 70% 80% 90% 100% 110% Time (/uni03BCs) Percent of IPP Capacitance vs. Reverse Bias (Pin1 or Pin2 to Pin3) SD36CSD24C AQ36 100 150 200 250 300 Capacitance (pF) Reverse Bias (V) AQ05 AQ12 AQ15 AQ24 02468 10 12 TLP Voltage (V) TLP Current (A) AQ05 T ransmission Line Pulsing(TLP) Plot 05 10 15 20 25 TLP Voltage (V) TLP Current (A) AQ12 T ransmission Line Pulsing(TLP) Plot 05 10 15 20 25 30 TLP Voltage (V) TLP Current (A) AQ15 T ransmission Line Pulsing(TLP) Plot AQxx-02HTG Series 05 10 15 20 25 30 35 40 TLP Voltage (V) TLP Current (A) AQ24 T ransmission Line Pulsing(TLP) Plot

TVS Diode Array (SPA ® Diodes) General Purpose ESD Protection - AQxx-02HTG Series © 2019 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 09/17/19 05 10 15 20 25 30 35 40 45 50 55 TLP Voltage (V) TLP Current (A) AQ36 T ransmission Line Pulsing(TLP) Plot AQxx-02HTG Series Power Derating Curve 100 110 02 55 07 51 00 1251 50 Ambient Temperature - TA (oC) % of Rated Power I PP ISO10605 (C:330pF , R:330Ω) contact discharge plot at +8KV ISO10605 (C:330pF , R:330Ω) contact discharge plot at -8KV ISO10605 (C:330pF , R:330Ω) contact discharge plot at +8KV ISO10605 (C:330pF , R:330Ω) contact discharge plot at -8KV

TVS Diode Array (SPA ® Diodes) General Purpose ESD Protection - AQxx-02HTG Series © 2019 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 09/17/19 ISO10605 (C:330pF , R:330Ω) contact discharge plot at +8KV ISO10605 (C:330pF , R:330Ω) contact discharge plot at -8KV ISO10605 (C:330pF , R:330Ω) contact discharge plot at +8KV ISO10605 (C:330pF , R:330Ω) contact discharge plot at -8KV ISO10605 (C:330pF , R:330Ω) contact discharge plot at +8KV ISO10605 (C:330pF , R:330Ω) contact discharge plot at -8KV

TVS Diode Array (SPA ® Diodes) General Purpose ESD Protection - AQxx-02HTG Series © 2019 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 09/17/19 Time Temperature TP TL TS(max) TS(min) tP tL tS time to peak temperature PreheatPreheat Ramp-upRamp-up Ramp-downRamp-dow Critical Zone TL to TP Critical Zone TL to TP Soldering Parameters Product Characteristics Lead Plating Matte Tin Lead Material Copper Alloy Lead Coplanarity 0.004 inches(0.102mm) Substrate Material Silicon Body Material Molded Compound Flammability UL Recognized compound meeting flammability rating V-0

Ordering Information

Part Number Package Min. Order Qty. AQ05-02HTG SOT23-3 3000 AQ12-02HTG SOT23-3 3000 AQ15-02HTG SOT23-3 3000 AQ24-02HTG SOT23-3 3000 AQ36-02HTG SOT23-3 3000 Reflow Condition Pb – Free assembly Pre Heat - T emperature Min (Ts(min)) 150°C - T emperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs Average ramp up rate (Liquidus) T emp (TL) to peak 3°C/second max TS(max) to TL - Ramp-up Rate 3°C/second max Reflow - T emperature (TL) (Liquidus) 217°C - T emperature (tL) 60 – 150 seconds Peak T emperature (TP) 260+0/-5 °C Time within 5°C of actual peak T emperature (tp) 20 – 40 seconds Ramp-down Rate 6°C/second max Time 25°C to peak T emperature (TP) 8 minutes Max. Do not exceed 260°C

TVS Diode Array (SPA ® Diodes) General Purpose ESD Protection - AQxx-02HTG Series © 2019 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 09/17/19 GENERAL INFORMA TION 1. 3000 PIECES PER REEL. 2. ORDER IN MUL TIPLES OF FULL REELS ONLY. 3. MEETS EIA-481 REVISION "A" SPECIFICATIONS. CO VER TAPE USER DIRECTION OF FEED PIN 1 SO T23-3 (8mm POCKET PITCH) 8.4mm 180mm 14.4mm 13mm 60mm ACCESS HOLE 8mm TAPE AND REEL Embossed Carrier T ape & Reel Specification — SOT23-3 Symbol Millimeters Inches Min Max Min Max E 1 .65 1 .85 0.065 0.073 F 3.40 3.60 0.134 0.142 P2 1 .90 2.10 0.075 0.083 D 1 .40 1 .60 0.055 0.063 P0 3.90 4.10 0.154 0.161 W 7 .70 8.30 0.303 0.327 P 3.90 4.10 0.154 0.161 A0 3.05 3.25 0.120 0.128 B0 2.67 2.87 0.105 0.113 K0 1. 12 1 .32 0.044 0.052 t 0.22 0.24 0.009 0.009 Symbol Millimeters Inches Min Max Min Max A 0.90 1. 10 0.035 0.043 A1 0.03 0.09 0.001 0.004 b 0.37 0.51 0.015 0.020 D 2.80 3.04 0.110 0.120 E 2.10 2.64 0.083 0.104 E1 1 .20 1 .40 0.047 0.055 e 0.95 BSC 0.037 BSC e1 1 .90 BSC 0.075 BSC L 0.30 0.55 0.012 0.022 L1 0.25 BSC 0.010 BSC Ɵ 0° 8° 0° 8° Ɵ1 7° TYP 7° TYP Part Numbering SystemPart Marking System AQ 02 T G Series Number of Channels Package T= Tape & Reel G= Green TVS Diode Arrays (SPA Automotive Grade Diodes) H: SOT23-3 Hxx Working Voltage Mxx D E e b x 3 A Pin1 Top View Bottom View Side View 0.60 1.300.80 Recommended soldering pad layout (unit :mm) Detail A Detail A L L L1 (gauge plane) θ Drawing# : H01-B 1.30 2.50 2.90 8mm TAPE AND REEL AQxx-02HTG Series xx is the number of working voltage D E e b x 3 A Pin1 Top View Bottom View Side View 0.60 1.300.80 Recommended soldering pad layout (unit :mm) Detail A Detail A L L L1 (gauge plane) θ Drawing# : H01-B 1.30 2.50 2.90 Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at http://www.littelfuse.com/disclaimer-electronics.