DATASHEET SEARCH SITE | WWW.ALLDATASHEET.COM

Document overview

  • Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
  • PDF pages: 4

Technical content

Features

  • ESD, IEC61000-4-2, ±30kV contact, ±30kV air
  • EFT , IEC61000-4-4, 40A (5/50ns)
  • Lightning, IEC61000-4-5 2nd edition, 5A (8/20µs)
  • Low leakage current of 0.5µA (MAX) at 5V
  • Space efficient 0201 footprint)
  • Halogen free, Lead free and RoHS compliant
  • AEC-Q101 qualified
  • Mobile phones
  • Smart phones
  • Smart watches
  • Tablets
  • Portable navigation devices
  • Portable medical devices Pinout Pin 1 Pin 2 Functional Block Diagram Life Support Note: Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. RoHS Pb GREEN Application Example I/O Controller Outside World Case GND Keypads IC P3 SP1026 (x4) AQ1026 Series 15pF 30kV Bidirectional Discrete TVS AQ1026(X4) AQ1026 Series

©2016 Littelfuse, Inc. Specifications are subject to change without notice. TVS Diode Arrays (SPA ® Diodes) Revision: 04/07/16 TVS Diode Arrays (SPA® Diodes) SP1007 Series General Purpose ESD Protection - SP1026 Series CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Absolute Maximum Ratings Symbol Parameter Value Units IPP Peak Pulse Current (tp=8/20μs) 5 A TOP Operating Temperature -40 to 125 °C TSTOR Storage Temperature -55 to 150 °C Thermal Information Parameter Rating Units Storage Temperature Range -55 to 150 °C Maximum Junction Temperature 150 °C Maximum Lead Temperature (Soldering 30s) 260 °C Electrical Characteristics (TOP=25ºC) Parameter Symbol Test Conditions Min Typ Max Units Reverse Standoff Voltage VRWM 6.0 V Breakdown Voltage VBR IR=1mA (Pin 1 to 2) 7. 8 V Leakage Current ILEAK VR=5V 0.1 0.5 μA Clamp Voltage1 VC Ipp=1A, tp=8/20µs (Pin 1 to 2) 12.0 V Ipp=2A, tp=8/20µs (Pin 1 to 2) 13.4 V Dynamic Resistance RDYN (VC2 - VC1) / (IPP2 - IPP1) 1. 4 Ω ESD Withstand Voltage1 VESD IEC61000-4-2 (Contact Discharge) ±30 kV IEC61000-4-2 (Air Discharge) ±30 kV Diode Capacitance1 CD Reverse Bias=0V 15 pF Reverse Bias=2.5V 12 pF Note: 1 Parameter is guaranteed by design and/or device characterization. Capacitance vs. Reverse Bias Capacitance (pF) Bias Voltage (V) Insertion Loss (S21) I/O to GND -30 -25 -20 -15 Attenuation (dB) -10 10 100 1000 Frequency (MHz) AQ1026 Series

©2016 Littelfuse, Inc. Specifications are subject to change without notice. TVS Diode Arrays (SPA ® Diodes) Revision: 04/07/16 TVS Diode Arrays (SPA® Diodes) SP1007 Series General Purpose ESD Protection - SP1026 Series Clamping Voltage vs. IPP 12345 Clamp Voltage (VC) Peak Pulse Current-IPP (A) T ransmission Line Pulsing(TLP) Plot 05 10 15 20 25 TLP Voltage (V) TLP Current (A) Time Temperature TP TL TS(max) TS(min) tP tL tS time to peak temperature PreheatPreheat Ramp-upRamp-up Ramp-downRamp-do Critical Zone TL to TP Critical Zone TL to TP Reflow Condition Pb – Free assembly Pre Heat - Temperature Min (Ts(min)) 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs Average ramp up rate (Liquidus) Temp (TL) to peak 3°C/second max TS(max) to TL - Ramp-up Rate 3°C/second max Reflow - Temperature (TL) (Liquidus) 217°C - Temperature (tL) 60 – 150 seconds Peak Temperature (TP) 260+0/-5 °C Time within 5°C of actual peak Temperature (tp) 20 – 40 seconds Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes Max. Soldering Parameters Product Characteristics Lead Plating Matte Tin or Pre-Plated Frame Lead Material Copper Alloy Lead Coplanarity 0.004 inches(0.102mm) Substrate material Silicon Body Material Molded Epoxy Flammability UL 94 V-0 Notes : 1 . All dimensions are in millimeters 2. Dimensions include solder plating. 3. Dimensions are exclusive of mold flash & metal burr. 4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 5. Package surface matte finish VDI 11-13. AQ1026 Series

©2016 Littelfuse, Inc. Specifications are subject to change without notice. TVS Diode Arrays (SPA ® Diodes) Revision: 04/07/16 TVS Diode Arrays (SPA® Diodes) SP1007 Series General Purpose ESD Protection - SP1026 Series ©2015 Littelfuse, Inc. Specifications are subject to change without notice. Revision: 04/07/16 Package Dimensions — μDFN-2 (0201) TOP VIEW BOTTOM VIEW SIDE VIEW SOLDERING PATTERN 0.32 0.32 0.24 0.24 0.14 Pin1Pin2 Package μDFN-2 (0201) JEDEC MO-236 Symbol Millimeters Inches Min Max Min Max A 0.23 0.33 0.009 0.013 A1 0.00 0.05 0.000 0.002 A2 0.10 REF 0.004 REF b 0.18 0.30 0.007 0.012 D 0.55 0.65 0.022 0.026 E 0.25 0.35 0.010 0.014 L1 0.12 0.24 0.005 0.009 L2 0.12 0.23 0.005 0.009 K1 0.165 REF 0.006 REF

Ordering Information

Part Number Package Marking Min. Order Qty. AQ1026-01UTG μDFN-2 I I 15000 Part Numbering System Part Marking System U: /uni03BCDFN-2 AQ 1026 01 U T G Series Packag e T= Tape & Reel G= Green Number of Channels TVS Diode Arrays (SPA® Automotive Grade Diodes) Embossed Carrier T ape & Reel Specification — μDFN-2 Symbol Millimetres Inches Min Max Min Max A0 0.33 0.40 0.013 0.016 B0 0.63 0.70 0.025 0.028 D0 1 .40 1 .60 0.055 0.063 E 1 .65 1 .85 0.065 0.073 F 3.45 3.55 0.136 0.140 K0 0.30 0.39 0.012 0.015 P0 1 .90 2.10 0.075 0.083 P1 1 .95 2.05 0.077 0.081 P2 3.90 4.10 0.154 0.161 T 0.13 0.25 0.005 0.010 W 7 .90 8.30 0.311 0.327 0º MAX 0º MAX T W P2 P1 D0 E F 0.20 ± 0.05 AQ1026 Series