AQ1005

AQ1005 LITTELFUSE | Alldatasheet

Document overview

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Technical content

Features

• ESD, IEC 61000-4-2, ±30kV contact, ±30kV air
• EFT , IEC 61000-4-4, 40A (5/50ns)
• Lightning, IEC 61000-4-5 2nd edition, 8A (tP=8/20μs)
• Low capacitance of 30pF (@ VR=0V)
• Low leakage current of 0.1μA at 5V
• SOD882 footprint compatible to 0402 footprint
• AEC-Q101 qualified
• Halogen free, Lead free and RoHS compliant
• PPAP capable
• Mobile Phones
• Smart Phones
• Camcorders
• Portable Medical
• Digital Cameras
• MP3/PMP
• Portable Navigation Components
• Tablets
• Point of Sale Terminals
• Automotive Applications Pinout Functional Block Diagram 1 2 Life Support Note: Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. RoHS Pb GREEN Application Example I/O Controller Outside World GND Keypads ICP3 SP1005 (x4) GND AQ1005 Series 30pF 30kV Bidirectional Discrete TVS AQ1005 Series (4)AQ1005

TVS Diode Arrays (SPA® Diodes) General Purpose ESD Protection - SP1005 Series ©2018 Littelfuse, Inc. Specifications are subject to change without notice. Revision: 04/09/18 Notes: 2. CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the component. This is a stress only rating and operation of the component at these or any other conditions above those indicated in the operational sections of this specification is not implied. Absolute Maximum Ratings Symbol Parameter Value Units IPP Peak Current (tp=8/20μs) 8.0 A TOP Operating Temperature -40 to 150 °C TSTOR Storage Temperature -55 to 150 °C Electrical Characteristics (TOP=25ºC) Parameter Symbol Test Conditions Min Typ Max Units Reverse Standoff Voltage VRWM IR≤1μA 6.0 V Breakdown Voltage VBR IR=1mA 8.5 9.5 V Leakage Current ILEAK VR=5V with 1 pin at GND 0.1 0.5 µA Clamp Voltage1 VC IPP=1A, tp=8/20µs, Fwd 9.3 V IPP=2A, tp=8/20µs, Fwd 10.0 V Dynamic Resistance2 RDYN TLP , tP=100ns 0.25 Ω ESD Withstand Voltage1 VESD IEC 61000-4-2 (Contact Discharge) ±30 kV IEC 61000-4-2 (Air Discharge) ±30 kV Diode Capacitance1 CD Reverse Bias=0V 30 pF Reverse Bias=2.5V 23 pF Note: 1 .Parameter is guaranteed by design and/or component characterization. 2.Transmission Line Pulse (TLP) with 100ns width, 2ns rise time, and average window t1=70ns to t2= 90ns 8/20μs Pulse WaveformCapacitance vs. Reverse Bias 0.0 5.0 10.0 15.0 20.0 25.0 30.0 35.0 40.0 Bias Voltage (V) Capacitance (pF) 10% 20% 30% 40% 50% 60% 70% 80% 90% 100% 110% Time (/uni03BCs) Percent of IPP AQ1005 Series

TVS Diode Arrays (SPA® Diodes) General Purpose ESD Protection - SP1005 Series ©2018 Littelfuse, Inc. Specifications are subject to change without notice. Revision: 04/09/18 Clamping Voltage vs. IPP 0.0 2.0 4.0 6.0 8.0 10.0 12.0 14.0 16.0 18.0 Peak Pulse Current-IPP (A) Clamp Voltage (VC) Insertion Loss (S21) I/O to GND -35 -30 -25 -20 -15 -10 11 01 00 1000 10000 Frequency (MHz) Attenuation (dB) Time Temperature TP TL TS(max) TS(min) tP tL tS time to peak temperature PreheatPreheat Ramp-upRamp-up Ramp-downRamp-do Critical Zone TL to TP Critical Zone TL to TP Reflow Condition Pb – Free assembly Pre Heat - Temperature Min (Ts(min)) 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs Average ramp up rate (Liquidus) Temp (TL) to peak 3°C/second max TS(max) to TL - Ramp-up Rate 3°C/second max Reflow - Temperature (TL) (Liquidus) 217°C - Temperature (tL) 60 – 150 seconds Peak Temperature (TP) 260+0/-5 °C Time within 5°C of actual peak Temperature (tp) 20 – 40 seconds Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes Max. Do not exceed 260°C Soldering Parameters Product Characteristics Lead Plating Pre-Plated Frame Lead Material Copper Alloy Substrate material Silicon Body Material Molded Compound Flammability UL Recognized compound meeting flammability rating V-0. Notes : 1 . All dimensions are in millimeters 2. Dimensions include solder plating. 3. Dimensions are exclusive of mold flash & metal burr. 4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 5. Package surface matte finish VDI 11-13. T ransmission Line Pulsing(TLP) Plot 0246 81 01 21 41 6 TLP Voltage (V) TLP Current (A) AQ1005 Series

TVS Diode Arrays (SPA® Diodes) General Purpose ESD Protection - SP1005 Series ©2018 Littelfuse, Inc. Specifications are subject to change without notice. Revision: 04/09/18

Ordering Information

Part Number Package Marking Min. Order Qty. AQ1005-01ETG SOD882 •a 10000 Part Numbering SystemPart Marking System a AQ1005 Series Symbol Millimetres Inches Min Max Min Max A 0.65 0.70 0.026 0.028 B 1. 10 1 .20 0.043 0.047 C 0.50 0.60 0.020 0.024 dØ 1 .40 1 .60 0.055 0.063 E 1 .65 1 .85 0.065 0.073 F 3.40 3.60 0.134 0.142 P0 3.90 4.10 0.154 0.161 P 1 .90 2.10 0.075 0.083 P1 1 .90 2.10 0.075 0.083 W 7 .90 8.10 0.311 0.319 User Feeding Direction Pin 1 Location Embossed Carrier T ape & Reel Specification — SOD882 Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at http://www.littelfuse.com/disclaimer-electronics. ,Ref. ,Ref. ,Ref. 8mm Tape and Reel AQ 1005 01 E T G G = Green T = Tape & Reel Package E: SOD882 Automotive Grade TVS Diode Arrays (SPA® Diodes) Series Number of Channels -01 = 1 Channel 0.60mm 0.30mm0.35mm 1 .00mm Recommended Soldering Pad Layout D E PIN1 Top View A Side View Symbol DIMENSIONS (mm) Min. Nor. Max. A 0.36 0.39 0.42 A1 0.127 REF L1 0.20 0.25 0.30 L2 0.45 0.50 0.55 D 0.93 1. 0 0 1 .07 E 0.53 0.60 0.67 e 0.65 BSC e Bottom View User Feeding Direction Pin 1 Location