APTC80AM75SCG MICROSEMI | Alldatasheet

Document overview

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Technical content

Features

  • Ul tra low RDSon - Low Miller capacitance - Ultra low gate charge - Avalanche energy rated
  • Parallel SiC Schottky Diode - Zero reverse recovery - Zero forward recovery - Temperature Independent switching behavior - Positive temperature coefficient on VF
  • Kelvin source for easy drive
  • Very low stray inductance - Symmetrical design - M5 power connectors
  • High level of integration Benefits
  • Outstandi ng performance at hi gh frequency operation
  • Direct mounting to heatsink (isolated package)
  • Low junction to case thermal resistance
  • Low profile
  • RoHS Compliant Phase leg Series & SiC parallel diodes Super Junction MOSFET Power Module

APTC80AM75SCG – Rev 2 July, 2006 www.microsemi.com 2 – 7 All ratings @ Tj = 25°C unless otherwise specified

Electrical Characteristics

Symbol Characteristic Test Conditions Min Typ Max Unit VGS = 0V,VDS = 800V Tj = 25°C 100 IDSS Zero Gate Voltage Drain Current VGS = 0V,VDS = 800V T j = 125°C 1000 µA RDS(on) Drain – Source on Resistance V GS = 10V, ID = 28A 75 mΩ VGS(th) Gate Threshold Voltage V GS = VDS, ID = 4mA 2.1 3 3.9 V IGS S Gate – Source Leakage Current V GS = ±20 V, VDS = 0V ±200 nA Dynamic Characteristics Symbol Characteristic Test Conditions Min Typ Max Unit Cis s Input Capacitance 9015 Coss Output Capacitance 4183 Crss Reverse Transfer Capacitance VGS = 0V VDS = 25V f = 1MHz 215 pF Qg Total gate Charge 364 Qgs Gate – Source Charge 48 Qgd Gate – Drain Charge VGS = 10V VBus = 400V ID = 56A 184 nC Td(on) Turn-on Delay Ti me 10 Tr Rise Time 13 Td(off) Turn-off Delay Time 83 Tf Fall Time Inductive switching @ 125°C VGS = 15V VBus = 533V ID = 56A RG = 1.2Ω 35 ns Eon Turn-on Switching Energy 583 Eoff Turn-off Switching Energy Inductive switching @ 25°C VGS = 15V, VBus = 533V ID = 56A, RG = 1.2Ω 556 µJ Eon Turn-on Switching Energy 1020 Eoff Turn-off Switching Energy Inductive switching @ 125°C VGS = 15V, VBus = 533V ID = 56A, RG = 1.2Ω 684 µJ Series diode ratings and characteristics Symbol Characteristic Test Conditions Min Typ Max Unit VRRM Maximum Peak Repetitive Reverse Voltage 200 V Tj = 25°C 350 IRM Maximum Reverse Leakage Current V R=200V Tj = 125°C 600 µA IF DC Forward Current T c = 85°C 60 A IF = 60A 1.1 1.15 IF = 120A 1.4 VF Diode Forward Voltage IF = 60A T j = 125°C 0.9 V Tj = 25°C 24 trr Reverse Recovery Time Tj = 125°C 48 ns Tj = 25°C 66 Qrr Reverse Recovery Charge IF = 60A VR = 133V di/dt = 400A/µs Tj = 125°C 300 nC

APTC80AM75SCG – Rev 2 July, 2006 www.microsemi.com 3 – 7 Parallel diode ratings and characteristics Symbol Characteristic Test Conditions Min Typ Max Unit VRRM Maximum Peak Repetitive Reverse Voltage 1200 V Tj = 25°C 300 1200 IRM Maximum Reverse Leakage Current V R=1200V Tj = 175°C 600 6000 µA IF DC Forward Current Tc = 125°C 30 A Tj = 25°C 1.6 1.8 VF Diode Forward Voltage I F = 30A Tj = 175°C 2.6 3.0 V QC Total Capacitive Charge IF = 30A, VR = 600V di/dt =1600A/µs 84 nC f = 1MHz, VR = 200V 270 Q Total Capacitance f = 1MHz, VR = 400V 198 pF Thermal and package characteristics Symbol Characteristic Min Typ Max Unit Transistor 0.22 Series diode 0.65 RthJC Junction to Case Thermal Resistance Parallel diode 0.45 °C/W VISOL RMS Isolation Voltage, any terminal to case t =1 min, I isol<1mA, 50/60Hz 2500 V TJ Operating junction temperature range -40 150 TSTG Storage Temperature Range -40 125 TC Operating Case Temperature -40 100 To heatsink M6 3 5 Torque Mounting torque For terminals M5 2 3.5 N.m Wt Package Weight 280 g See application note APT0601 - Mounting Instructions for SP6 Power Modules on www.microsemi.com

APTC80AM75SCG – Rev 2 July, 2006 www.microsemi.com 4 – 7 Typical CoolMOS Performance Curve 0.9 0.7 0.5 0.3 0.1 0.05 Single Pulse 0.05 0.1 0.15 0.2 0.25 rectangular Pulse Duration (Seconds) Thermal Impedance (°C/W) Maximum Effective Transient Thermal Impedance, Junction to Case vs Pulse Duration 4.5V 5.5V 6.5V 100 120 140 160 0 5 10 15 20 25 VDS, Drain to Source Voltage (V) ID, Drain Current (A) VGS=15&10V Low Voltage Output Characteristics Transfert Characteristics TJ=-55°C TJ=-55°C TJ=25°C TJ=125°C TJ=125°C 100 150 200 012345678 V GS, Gate to Source Voltage (V) ID, Drain Current (A) VDS > ID(on)xRDS(on)MAX 250µs pulse test @ < 0.5 duty cycle RDS(on) vs Drain Current VGS=10V VGS=20V 0.8 0.9 1.1 1.2 1.3 1.4 0 2 04 06 08 0 1 0 0 1 2 0 I D, Drain Current (A) RDS(on) Drain to Source ON Resistance Normalized to VGS=10V @ 28A 25 50 75 100 125 150 T C, Case Temperature (°C) ID, DC Drain Current (A) DC Drain Current vs Case Temperature

APTC80AM75SCG – Rev 2 July, 2006 www.microsemi.com 5 – 7 0.90 0.95 1.00 1.05 1.10 1.15 -50 0 50 100 150 T J, Junction Temperature (°C) BVDSS, Drain to Source Breakdown Voltage (Normalized) Breakdown Voltage vs Temperature ON resistance vs Temperature 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -50 0 50 100 150 T J, Junction Temperature (°C) RDS(on), Drain to Source ON resistance (Normalized) VGS=10V ID= 28A Threshold Voltage vs Temperature 0.7 0.8 0.9 1.0 1.1 1.2 -50 0 50 100 150 TC, Case Temperature (°C) VGS(TH), Threshold Voltage (Normalized) Maximum Safe Operating Area 100ms 1ms 100µs 100 1000 1 10 100 1000 VDS, Drain to Source Voltage (V) ID, Drain Current (A) limited by RDSon Single pulse TJ=150°C TC=25°C Ciss Crss Coss 100 1000 10000 100000 0 1 02 03 04 05 0 VDS, Drain to Source Voltage (V) C, Capacitance (pF) Capacitance vs Drain to Source Voltage VDS=160V VDS=400V VDS=640V 0 50 100 150 200 250 300 350 400 Gate Charge (nC) Gate Charge vs Gate to Source Voltage VGS, Gate to Source Voltage (V) ID=56A TJ=25°C

APTC80AM75SCG – Rev 2 July, 2006 www.microsemi.com 6 – 7 Delay Times vs Current td(on) td(off) 100 20 30 40 50 60 70 80 90 ID, Drain Current (A) td(on) and td(off) (ns) VDS=533V RG=1.2Ω TJ=125°C L=100µH Rise and Fall times vs Current tr tf 20 30 40 50 60 70 80 90 ID, Drain Current (A) tr and tf (ns) VDS=533V RG=1.2Ω TJ=125°C L=100µH Switching Energy vs Current Eon Eoff 0.4 0.8 1.2 1.6 20 30 40 50 60 70 80 90 ID, Drain Current (A) Eon and Eoff (mJ) VDS=533V RG=1.2Ω TJ=125°C L=100µH Eon Eoff Eoff 0.5 1.5 2.5 3.5 02 . 557 . 5 1 0 Gate Resistance (Ohms) Switching Energy (mJ) Switching Energy vs Gate Resistance VDS=533V ID=56A TJ=125°C L=100µH Hars Switching ZCS ZVS 100 150 200 250 300 350 400 10 15 20 25 30 35 40 45 50 55 ID, Drain Current (A) Frequency (kHz) Operating Frequency vs Drain Current VDS=533V D=50% RG=1.2Ω TJ=125°C TC=75°C TJ=25°C TJ=150°C 100 1000 0.2 0.6 1 1.4 1.8 VSD, Source to Drain Voltage (V) IDR, Reverse Drain Current (A) Source to Drain Diode Forward Voltage

APTC80AM75SCG – Rev 2 July, 2006 www.microsemi.com 7 – 7 Typical SiC Diode Performance Curve Maximum Effective Transient Thermal Impedance, Junction to Case vs Pulse Duration 0.9 0.7 0.5 0.3 0.1 0.05 Single Pulse 0.1 0.2 0.3 0.4 0.5 Rectangular Pulse Duration (Seconds) Thermal Impedance (°C/W) Forward Characteristics TJ=25°C TJ=75°C TJ=125°C TJ=175°C 00 . 511 . 522 . 533 . 5 VF Forward Voltage (V) IF Forward Current (A) Reverse Characteristics TJ=25°C TJ=75°C TJ=125°C TJ=175°C 300 600 900 1200 400 600 800 1000 1200 1400 1600 VR Reverse Voltage (V) IR Reverse Current (µA) Capacitance vs.Reverse Voltage 400 800 1200 1600 2000 2400 1 10 100 1000 VR Reverse Voltage C, Capacitance (pF) “COOLMOS™ comprise a new family of transistors developed by Infineon Technologies AG. “COOLMOS” is a trademark of Infineon Technologies AG”. Microsemi reserves the right to change, without notice, the specifications and information contained herein Microsemi's products are covered by one or more of U.S patents 4,895,810 5,045,903 5,089,434 5,182,234 5,019,522 5,262,336 6,503,786 5,256,583 4,748,103 5,283,202 5,231,474 5,434,095 5,528,058 and foreign patents. U.S and Foreign patents pending. All Rights Reserved.