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1.6 in 2.0 in User Manual SPMU290 –April2013 BOOSTXL-SENSHUB Sensor Hub BoosterPack The Sensor Hub BoosterPack (BOOSTXL-SENSHUB ) isa low-costextensionboard forthe Tiva™ C Series TM4C LaunchPad EK-TM4C123GXL evaluationplatformfor ARM ® Cortex™ -M4F-based microcontrollers(MCUs). Thisextensionboard,or BoosterPack,isspecificallydesignedto expand the functionalityoftheTivaTM4C LaunchPad. Thisuser’s manual providesan overviewoftheSensor Hub BoosterPacksoftwareand hardware Figure1 shows a photooftheBOOST-XL-SENSHUB. Figure1.BOOSTXL-SENSHUB BoosterPack ExtensionBoard

Contents

Tiva,Code Composer StudioaretrademarksofTexas Instruments. TivaWare,StellarisareregisteredtrademarksofTexas Instruments. Cortex,KeilaretrademarksofARM Limited. ARM, RealViewareregisteredtrademarksofARM Limited. Microsoft,Windows areregisteredtrademarksofMicrosoftCorp. Allothertrademarksarethepropertyoftheirrespectiveowners. 1SPMU290 –April2013 BOOSTXL-SENSHUB SensorHub BoosterPack SubmitDocumentationFeedback Copyright© 2013,Texas InstrumentsIncorporated

Board Overview www.ti.com

1 Board Overview

The SensorHub BoosterPackisan extensionboardfortheTIMCU LaunchPad evaluationmodule eco- system.Itwas designedspecificallytoextendthefunctionalityoftheTivaTM4C1233 LaunchPad (EK- TM4C123GXL). The SensorHub enablescustomerstocreateand model innovativeprototypesolutions thatleveragetheprocessingand floating-pointcapabilitiesoftheTM4C123GH6PM MCU coupledwith motionand environmentalsensors.The SensorHub BoosterPackplugsintotheBoosterPackXL headers locatedon thetopoftheLaunchPad.The BoosterPackalsofeaturesa TI-standardextensionmodule (EM) connectortofurtherextendcustomerapplicationsthrougha varietyofwirelessextensionmodules. Thisboardand theavailablesoftwarealsohighlighttheuse ofthenew TivaWare® SensorLibsensor driverlibrary,an easy-to-use,extendablefoundationofsensorcommunicationsoftware. NOTE: The SensorHub BoosterPackisfullycompatiblewithboththeTiva™ C SeriesLaunchPad (EK-TM4C123GXL )and theStellaris® LM4F120 LaunchPad (EK-LM4F120XL).

1.1 KitFeatures

The BOOSTXL-SENSHUB BoosterPackoffersthefollowingfeatures:

  • TMP006 infraredobjecttemperaturesensor
  • 9-axisInvenSenseMPU9150 motionsensor: – 3-axisacceleration – 3-axisgyroscope – 3-axismagnetometer
  • Bosch BMP180 pressuresensor
  • IntersilISL29023ambientand infraredlightsensor
  • SensirionSHT21 humiditysensor
  • Two userpushbuttons
  • One userLED
  • One power LED
  • EM connectorforadditionalwirelessexpansion

1.2 Using theSensor Hub BoosterPack

Followtheserecommended stepstoquicklyconfigureyourSensorHub forproperoperation. Step1. Review theBOOSTXL-SENSHUB BoosterPackGettingStartedGuide (literaturenumber SPMU295 ,availablefordownloadatwww.ti.com).Thisdocument guidesyou through downloading,installing,and runningtheassociatedTivaWareexamplesthatdemonstratethe SensorHub capabilitiesand functions. Step2. Examine theadditionalexamplesthatareprovidedwiththedownloadedsoftwareto understandthecapabilitiesand limitationsofeach on-boardsensor. Step3. Createyourown applicationusingtheTivaC SeriesLaunchPad and SensorHub BoosterPack.Use theTivaWareforC SeriesSensorLibrarytoenableyourinnovativeTiva TM4C MCU applications. Step4. Customizeand integratethehardwaretosuita specificend application.Thisuser’s manual is an importantreferenceforunderstandingcircuitoperationand completinghardware modifications.

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3.3 V RF Expansion UART/SPI/ I2C1 3.3 V 1.8 V LED BoosterPack XL Connectors BMP180 MPU9150 SHT21 ISL29023 TMP006 I2C3 www.ti.com Hardware Description

1.3 Specifications

Table1 summarizesthespecificationsfortheBOOSTXL-SENSHUB BoosterPack. Table1.Sensor Hub BoosterPack Specifications Parameter Value Board supplyvoltage 2.7V to5.5V nominallysupplied as 3.3V fromtheBoosterPack interface Dimensions 2.0x 1.5x 0.625(in) 5.08x 3.81x 1.587(cm) RoHS status Compliant

2 Hardware Description

The SensorHub BoosterPackincludesfivemotionand environmentalsensors.ItalsoenablesRF expansionand accesstouserLEDs and buttons.The hardwareisdesignedtoenableinnovative applicationsthatfusesensorinformationand TivaC Seriessoftwareprocessingthroughthefunctionality oftheTivaC SeriesLaunchPad. Figure2 shows a blockdiagramoftheSensorHub BoosterPack. Figure2.BOOSTXL-SENSHUB BoosterPack Block Diagram 3SPMU290 –April2013 BOOSTXL-SENSHUB SensorHub BoosterPack SubmitDocumentationFeedback Copyright© 2013,Texas InstrumentsIncorporated

Hardware Description www.ti.com

2.1 FunctionalDescription

Thissectionprovidesa functionaldescriptionoftheSensorHub BoosterPack.

2.1.1 BoosterPack XL Connector

The BoosterPackXL connectorattachestheBoosterPacktotheTivaTM4C LaunchPad.This BoosterPackisspecificallydesignedtomatch thepinfunctionwiththeTivaTM4C LaunchPad.BasicI2C and UART communicationtothesensorsand RF expansionconnectorsarealsoavailablewhen the SensorHub isconnectedtoeithertheC2000 orMSP430 LaunchPad. Table2 describestheBoosterPackXL interfaceconnectionsand therespectiveuses on theSensorHub BoosterPack.Italsoshows whichpinsremainavailableforadditionalexpansionattheuser'sdiscretion. Table2.BoosterPack XL InterfaceConnections(1) Pin Function Pin Function Pin Function Pin Function J1.2 J2.2 Interrupt J3.2 J4.2 J1.3 UART RX J2.3 Interrupt J3.3 J4.3 RF GPIO J1.4 UART TX J2.4 J3.4 J4.4 UART RTS J1.5 J2.5 J3.5 USER LED J4.5 UART CTS J1.6 Interrupt J2.6 SensorI2C J3.6 User Button J4.6 RF Shutdown J1.7 J2.7 SensorI2C J3.7 User Button J4.7 RF Reset J1.8 SSI TX J2.8 SSI RX J3.8 RF GPIO J4.8 RF GPIO J1.9 RF I2C J2.9 SSI SS J3.9 RF GPIO J4.9 J1.10 RF I2C J2.10 SSI CLK J3.10 J4.10 (1) Shaded cellsindicateunused pinsthatareavailableforadditionalexpansion.

2.1.2 TMP006 Temperature Sensor

The TMP006 providesbothdirectand indirecttemperaturemeasurements.Itcontainsan on-chip temperaturesensortodirectlymeasure ambienttemperatureconditions.Italsoallowscontactlessinfrared objecttemperaturemeasurement.

2.1.3 InvenSense MPU9150 9-AxisMotion Sensor

The MPU9150 isa 3-axisaccelerometer,3-axisgyroscope,and 3-axismagnetometerina singlepackage. Thisdeviceistheprimarymotionsensoron theSensorHub. Itisused by thedemonstrationsoftwareas theraw motioninputs,whicharefusedby a directcosinematrixintoroll,pitch,and yaw measurements.

2.1.4 IntersilISL29023 Ambient and InfraredLightSensor

The ISL29023providessensormeasurements oflightconditionsacrossboththeambient(human-visible) spectrumand theinfraredspectrum.

2.1.5 SensirionSHT21 HumiditySensor

The SHT21 providesrelativehumiditymeasurements.

2.1.6 Bosch BMP180 BarometricPressureSensor

The BMP180 measures barometricpressureconditions.Itcan be used toenhance themotionsensorby determiningrelativechanges inaltitude.

2.1.7 Low-Power RF Expansion Connection

The RF expansionconnectionprovidesa widearrayofoptionstotheend application.

4 BOOSTXL-SENSHUB SensorHub BoosterPack SPMU290 –April2013

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www.ti.com SoftwareDevelopment

2.1.8 TPS75118 VoltageRegulator

The TPS75118 regulatesthe3.3-VsupplyfromtheLaunchPad down to1.8V fortheinputtotheRF expansionconnector.

3 SoftwareDevelopment

Thissectionprovidesgeneralinformationon softwaredevelopmentas wellas instructionsforFlash memory programming.Note:Thisinformationpresumes thattheSensorHub BoosterPackisconnectedto a TivaTM4C1233 LaunchPad.

3.1 SoftwareDescription

The TivaWaresoftwareprovidedwiththeTivaC SeriesLaunchPad includesfunctionaldriversforallof theperipheraldevicessuppliedinthedesign.The TivaWareforC SeriesPeripheralDriverLibraryisused toconfigureand operatetheon-chipperipheralsas partofTivaWare. The TivaWarepackage includesa setofexample applicationsthatuse theTivaWarePeripheralDriver Library.These applicationsdemonstratethecapabilitiesoftheTM4C1233H6 microcontroller,as wellas providea startingpointfortheusertodevelopthefinalapplicationforuse on theTivaC Series LaunchPad evaluationboardand theBOOSTXL-SENSHUB BoosterPack.

3.2 Source Code

The completesourcecode,includingthesourcecode installationinstructions,areavailableat www.ti.com/tool/boostxl-senshub.The sourcecode and binaryfilesareinstalledintheTivaWareforC SeriesPeripheralDriverLibrarytree.

3.3 Tool Options

The sourcecode installationincludesdirectoriesthatcontainprojectsand/ormakefilesforthefollowing toolchains:

  • Keil™ ARM RealView® MicrocontrollerDevelopmentSystem
  • IAR Embedded Workbench forARM
  • SourceryCodeBench
  • Texas Instruments'Code Composer Studio™ IDE Download evaluationversionsofthesetoolsfromwww.ti.com/tiva-c.As a resultofcode sizerestrictions, theevaluationtoolsmay notbuildallexample programs.A fulllicenseisnecessarytorebuildordebug all examples. Instructionson installingand usingeach oftheevaluationtoolscan be foundintheQuickstartguides(for example,Quickstart-Keil,Quickstart-IAR),whichareavailablefordownloadfromtheEvaluationKitsection ofourwebsiteatwww.ti.com/tiva-c. Fordetailedinformationon usingeach tool,see thedocumentationincludedwiththerespectivetoolchain installationorvisitthewebsiteoftherespectivetoolsupplier.

3.4 Programming theTivaTM4C LaunchPad EvaluationBoard

The TivaTM4C LaunchPad softwarepackage includespre-builtbinariesforeach oftheexample applications.Ifyou installedTivaWareforC Seriestothedefaultinstallationpathof C:\\ti\\TivaWare_C_Series_<version>,you can findtheseexample applicationsin C:\\ti\\TivaWare_C_Series_<version>/examples\\boards\\ek-tm4c123gxl.The onboardICDIisused withthe LM FlashProgrammer tooltoprogramapplicationson theTivaC SeriesLaunchPad. Followthesestepstoprogramexample applicationsintotheTivaC SeriesLaunchPad evaluationboard usingtheICDI: 1. InstalltheLM FlashProgrammer on a PC runningMicrosoft® Windows ® XP, Windows 7,orlater Windows OS. 2. SwitchthePOWER SELECT switchtotherighttouse Debug mode. 5SPMU290 –April2013 BOOSTXL-SENSHUB SensorHub BoosterPack SubmitDocumentationFeedback Copyright© 2013,Texas InstrumentsIncorporated

References,PCB Layout,and BillofMaterials www.ti.com 3. ConnecttheUSB-A cableplugtoan availableporton thePC and theMicro-BplugtotheDebug USB porton theboard. 4. VerifythatthePOWER LED D4 on theboardislit. 5. Run theLM FlashProgrammer program. 6. IntheConfigurationtab,use theQuick Set controltoselecttheTivaC SeriesLaunchPad evaluation board. 7. Move totheProgram taband clicktheBrowse button.Navigatetotheexample applicationsdirectory (thedefaultlocationisC:\\ti\\TivaWare_C_Series_<version>/examples\\boards\\ek-tm4c123gxl-senshub\\). 8. Each example applicationhas itsown directory.Navigatetotheexample directorythatyou want to load,thennavigatetothedirectorythatcontainsthebinary(*.bin)files.Selectthedesiredbinaryfile and clickOpen . 9. SettheEraseMethod toEraseNecessaryPages.Check theVerifyAfterProgram box,and check theReset MCU AfterProgram option. 10.ClicktheProgram buttontostarttheErase,Download,and Verifyprocess.Program executionstarts once theVerifyprocessiscomplete.

4 References,PCB Layout,and BillofMaterials

CompleteschematicsfortheSensorHub BoosterPackareappended tothisuser'sguide.

4.1 References

Inadditiontothisdocument,thefollowingreferencesareavailablefordownloadatwww.ti.com:

  • BOOSTXL-SENSHUB BoosterPackGettingStartedGuide (literaturenumber SPMU295 )
  • TivaC SeriesTM4C123GH6PM MicrocontrollerData Sheet(literaturenumber SPMS376 ).
  • TivaWareforC SeriesDriverLibrary.Availablefordownloadatwww.ti.com/tool/sw-tm4c-drl.
  • TivaWareforC SeriesDriverLibraryUser’s Manual (literaturenumber SPMU298 ).
  • TPS75118 FastTransientResponse,1.5-A,Low-DropoutRegulatorData Sheet(literaturenumber SLVS241 )
  • TMP006 InfraredThermopileSensorData Sheet(literaturenumber SBOS518 )
  • Texas Instruments’Code Composer StudioIDE website:www.ti.com/ccs Additionalsupport:
  • RealViewMDK (www.keil.com/arm/rvmdkkit.asp)
  • IAR Embedded Workbench (www.iar.com)
  • SourceryCodeBench developmenttools(www.codesourcery.com/gnu_toolchains/arm)
  • InvenSenseMPU9150 (www.invensense.com/mems/gyro/mpu9150.html)
  • IntersilISL29023(www.intersil.com/en/products/optoelectronics/ambient-light-sensors/light-to-digital- sensors/ISL29023.html)
  • Bosch BMP180 (www.bosch- sensortec.com/homepage/products_3/environmental_sensors_1/bmp180_1/bmp180)
  • SensirionSHT21 (www.sensirion.com/en/products/humidity-temperature/humidity-sensor-sht21)

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www.ti.com References,PCB Layout,and BillofMaterials

4.2 BillofMaterials(BOM)

Table3 shows thebillofmaterialsfortheBOOSTXL-SENSHUB BoosterPackboard. Table3.BOOSTXL-SENSHUB BillofMaterials(1)(2)(3) Item Ref Des Qty Value Description Manufacturer ManufacturerPartNo IC,digital,barometricpressure1 U2 1 BMP180 Bosch BMP180sensor C1-2,C8-9,C11, Capacitor,ceramic,NPO orC0G or2 8 100 nF Murata GRM21BR71E104KA01LC13, C15-16 X5R, 10 V orhigher,0805(4) Capacitor,ceramic,X7R, ±10%,3 C4, C6 2 100 nF Murata GRM21BR71E104KA01L10 V orhigher,0805(4) Capacitor,ceramic,X7R, ±10%,4 C5 1 10 nF Murata GRM216R71H103KA01D10 V orhigher,0805(4) Capacitor,ceramic,X7R, ±10%,5 C3 1 2.2nF Kemet C0805C222K5RACTU50 V orhigher,0805(4) C7, C10, C12, Capacitor,tantalum,10 V orhigher,6 4 1 μF AVX Corp. TAJA105M020RNJC14 Type A Capacitor,tantalum,10 V orhigher,7 C17 1 47 μF Nichicon F931A476MAAType A — Y1 0 32.768kHz Clockoscillator,2.5x 3.2mm Do notpopulate Do notpopulate Lightemittingdiode,1.7V forward8 D1 1 Red Stanley BR1112H-TRvoltageorless,0805

9 D2 1 Yellow Lightemittingdiode,0805 Knightbright APT2012YC

Header,female,10-pin,100-mil10 J1-4 4 PEC10SAAN Sullins PPTC101LFBN-RCspacing,0.100inchx 10 TFM-110-02- Header,SMT 10x2 pin,shrouded,11 RF_PART1-2 2 Samtec TFM-110-02-SM-D-A-K-TRSM-D-A-K-TR 0.225x 0.625inch IC,integrateddigitallightsensorwith12 U4 1 ISL29023 Intersil ISL29023interrupt IC,nine-axisMEMS motiontracking13 U3 1 MPU-9150 InvenSense MPU-9150device Surfacemount resistor,1/10W or14 R1, R4, R9-10 4 10 kΩ Yageo RC0805JR-0710KLhigher,0805 Surfacemount resistor,1/10W or— R2 0 10 kΩ Do notpopulate Do notpopulatehigher,0805 Surfacemount resistor,1/10W or15 R6 1 5.1Ω Yageo RC0805JR-075R1Lhigher,0805 Surfacemount resistor,1/10W or16 R7 1 100 Ω Yageo RC0805JR-07100RLhigher,0805 Surfacemount resistor,1/10W or17 R5, R8 2 0 Ω Yageo RC0805JR-070RLhigher,0805 Surfacemount resistor,1/10W or18 R3 1 499 kΩ Yageo RC0805FR-07499KLhigher,0805 Surfacemount resistor,1/10W or19 R11-12 2 3.3kΩ Yageo RC0805JR-073K3Lhigher,0805

20 U5 1 SHT21 IC,humidityand temperaturesensor SensirionAG SHT21

Switch,1P1T, PB momentary,21 S1-2 2 7914G Bourns 7914G100 mA, SM, 0.19x 0.18inch

22 U1 1 TMP006AIYZFT IC,infraredthermopilesensor Texas Instruments TMP006YZF

TPS75118Q IC,lowdropoutvoltageregulator,23 U6 1 Texas Instruments TPS75118QPWPPWP 1.8V,1.5A (1) These assembliesareESD sensitive.ESD precautionsshallbe observed. (2) These assembliesmust be cleanand freefromfluxand allcontaminants.Use ofno cleanfluxisnotacceptable. (3) These assembliesmust complywithworkmanshipstandardsIPC-A-610Class2. (4) A dielectricwitha higherthermalrangeand/orlowercapacitancevariationisalsopermitted(forexample,X7R, X9R). 7SPMU290 –April2013 BOOSTXL-SENSHUB SensorHub BoosterPack SubmitDocumentationFeedback Copyright© 2013,Texas InstrumentsIncorporated

Sensor_Hub_Booster_Pack Rev A.sch Aneesh Rai Sensor Hub Booster Pack A AR Texas Instruments 2/20/2013 Rev Filename Date Engineer D C Sheet Drawn by Number B C B A of D Size Title B A Temperature Sensor Pressure Sensor 9-Axis Motion Sensor Humidity & Temp. Sensor (Do Not Populate) Light Sensor SDA VSS NC NC VDD SCL VSS SHT21 100nF CSB VDD VDDIO SDO SCK SDA GND BMP180 100nF DGND ADR1 ADR0 AGND DRDY SCL SDA TMP006 10k CLKIN NC VDD NC NC RESV RESV VLOGIC AD0 REGOUT RESV-G INT VDD NC GND NC GND GND RESV CPOUT RESV RESV SCL SDA MPU-9150 10nF 100nF 10k 100nF 2.2nF 100nF VDD GND R-EXT INT SCL SDA GND ISL29023 10k 499k 100nF 1uF 3.3V I2C_SCL I2C_SDA 3.3V I2C_SCL I2C_SDA I2C_SDA I2C_SCL INT_TEMP 3.3V 3.3V INT_MOTION 3.3V I2C_SDA I2C_SCL 3.3V ANALOG_PWR ANALOG_GND 3.3V 3.3V I2C_SCL I2C_SDA INT_LT 3.3V 3.3V

Sensor_Hub_Booster_Pack Rev A.sch Aneesh Rai A Rev Filename Date Engineer D C Sheet Drawn by Number B C B A of D Size B A LaunchPad Headers Push Buttons RF Headers Regulator Power Indicator LED General Purpose LED General Purpose Oscillator R11 3.3k R12 3.3k RF_PART1 RF_PART2 CRYSTAL_ECS-327KE GND/HTSK NC IN IN EN PG FB/SEN OUTPUT OUTPUT GND/HTSK GND/HTSK NC NC NC NC NC GND NC NC GND/HTSK PWRPAD TPS75118 C14 1uF C17 47uF 5.1 100 C15 100nF 10k C16 100nF R10 10k C10 1uF C11 100nF C12 1uF C13 100nF I2C_SCL 3.3V U1RTS 32.768_CLK U1TX U1RX RF_GPIO0 RF_GPIO1 SSI0FSS SSI0CLK SSI0TX SSI0RX 1.8V 3.3V RF_GPIO2 RF_RST RF_SHUTDN RF_GPIO3 U1CTS 3.3V 32.768_CLK 3.3V PG_1.8V 1.8V 1.8V PG_1.8V LED_GPIO PUSH_BUT_GPIO0 3.3V 3.3V PUSH_BUT_GPIO1 RF_I2C_SDA RF_I2C_SCL 3.3V U1RX U1TX INT_LT SSI0TX INT_MOTION INT_TEMP I2C_SDA I2C_SCL SSI0RX SSI0FSS SSI0CLK LED_GPIO RF_GPIO1 RF_GPIO2 U1RTS U1CTS RF_SHUTDN RF_RST 3.3V ANALOG_GND ANALOG_PWR RF_GPIO3 RF_GPIO0 PUSH_BUT_GPIO0 PUSH_BUT_GPIO1 RF_I2C_SCL RF_I2C_SDA I2C_SDA

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FCC InterferenceStatementforClass B EVM devices Thisequipmenthas been testedand foundtocomplywiththelimitsfora ClassB digitaldevice,pursuanttopart15 oftheFCC Rules. These limitsaredesignedtoprovidereasonableprotectionagainstharmfulinterferenceina residentialinstallation.Thisequipment generates,uses and can radiateradiofrequencyenergyand,ifnotinstalledand used inaccordancewiththeinstructions,may cause harmfulinterferencetoradiocommunications.However,thereisno guaranteethatinterferencewillnotoccurina particularinstallation.If thisequipmentdoes cause harmfulinterferencetoradioortelevisionreception,whichcan be determinedby turningtheequipmentoffand on,theuserisencouragedtotrytocorrecttheinterferenceby one ormore ofthefollowingmeasures:

  • Reorientorrelocatethereceivingantenna.
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  • Connecttheequipmentintoan outleton a circuitdifferentfromthattowhichthereceiverisconnected.
  • Consultthedealeroran experiencedradio/TVtechnicianforhelp. For EVMs annotatedas IC – INDUSTRY CANADA Compliant ThisClassA orB digitalapparatuscomplieswithCanadianICES-003. Changes ormodificationsnotexpresslyapprovedby thepartyresponsibleforcompliancecouldvoidtheuser’s authoritytooperatethe equipment. Concerning EVMs includingradiotransmitters ThisdevicecomplieswithIndustryCanada licence-exemptRSS standard(s).Operationissubjecttothefollowingtwo conditions:(1)this devicemay notcause interference,and (2)thisdevicemust acceptany interference,includinginterferencethatmay cause undesired operationofthedevice. Concerning EVMs includingdetachableantennas Under IndustryCanada regulations,thisradiotransmittermay onlyoperateusingan antennaofa typeand maximum (orlesser)gain approvedforthetransmitterby IndustryCanada. To reducepotentialradiointerferencetootherusers,theantennatypeand itsgainshould Thisradiotransmitterhas been approvedby IndustryCanada tooperatewiththeantennatypeslistedintheuserguidewiththemaximum permissiblegainand requiredantennaimpedance foreach antennatypeindicated.Antennatypesnotincludedinthislist,havinga gain greaterthanthemaximum gainindicatedforthattype,arestrictlyprohibitedforuse withthisdevice. Cet appareilnum ériquede laclasseA ou B estconformeà lanorme NMB-003 du Canada. Les changements ou lesmodificationspas expressément approuvés parlapartieresponsablede laconformité ontpu viderl’autorité de l'utilisateurpouractionnerl'équipement. Concernant lesEVMs avec appareilsradio Le présentappareilestconformeaux CNR d'IndustrieCanada applicablesaux appareilsradioexempts de licence.L'exploitationest autorisée aux deux conditionssuivantes:(1)l'appareilne doitpas produirede brouillage,et(2)l'utilisateurde l'appareildoitacceptertout brouillageradioélectriquesubi,m ême silebrouillageestsusceptibled'en compromettrelefonctionnement. Concernant lesEVMs avec antennes détachables Conformément à laréglementationd'IndustrieCanada, leprésentémetteurradiopeutfonctionneravec une antenned'un typeetd'un gain maximal(ouinférieur)approuvé pourl'émetteurparIndustrieCanada. Dans lebutde réduirelesrisquesde brouillageradioélectriqueà l'intentiondes autresutilisateurs,ilfautchoisirletyped'antenneetson gainde sorteque lapuissanceisotroperayonnée équivalente Le présentémetteurradioa été approuvé parIndustrieCanada pourfonctionneravec lestypesd'antenneénum érés dans lemanuel d’usage etayantun gainadmissiblemaximaletl'impédance requisepourchaque typed'antenne.Les typesd'antennenon inclusdans cetteliste,ou dontlegainestsupérieurau gainmaximalindiqué,sontstrictementinterditspourl'exploitationde l'émetteur. SPACER SPACER SPACER SPACER SPACER SPACER SPACER SPACER

【【ImportantNoticeforUsers ofthisProduct inJapan】】 Thisdevelopment kitisNOT certifiedas ConfirmingtoTechnicalRegulationsofRadio Law ofJapan Ifyou use thisproductinJapan,you arerequiredby RadioLaw ofJapan tofollowtheinstructionsbelowwithrespecttothisproduct: 1. Use thisproductina shieldedroom orany othertestfacilityas definedinthenotification#173 issuedby MinistryofInternalAffairsand Communicationson March 28,2006,based on Sub-section1.1ofArticle6 oftheMinistry’s RuleforEnforcementofRadioLaw of Japan, 2. Use thisproductonlyafteryou obtainedthelicenseofTestRadioStationas providedinRadioLaw ofJapan withrespecttothis product,or 3. Use ofthisproductonlyafteryou obtainedtheTechnicalRegulationsConformityCertificationas providedinRadioLaw ofJapan with respecttothisproduct.Also,pleasedo nottransferthisproduct,unlessyou givethesame noticeabove tothetransferee.Pleasenote thatifyou couldnotfollowtheinstructionsabove,you willbe subjecttopenaltiesofRadioLaw ofJapan. Texas InstrumentsJapan Limited (address)24-1,Nishi-Shinjuku6 chome, Shinjuku-ku,Tokyo, Japan http://www.tij.co.jp 【ご使用にあたっての注】 本開発キットは技術基準適合証明を受けておりません。 本製品のご使用に際しては、電波法遵守のため、以下のいずれかの措置を取っていただく必要がありますのでご注意ください。 1. 電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用いただく。 2. 実験局の免許を取得後ご使用いただく。 3. 技術基準適合証明を取得後ご使用いただく。 なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。 上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。 日本テキサス・インスツルメンツ株式会社 東京都新宿区西新宿６丁目２４番１号 西新宿三井ビル http://www.tij.co.jp SPACER SPACER SPACER SPACER SPACER SPACER SPACER SPACER SPACER SPACER SPACER SPACER SPACER SPACER SPACER SPACER SPACER

EVALUATION BOARD/KIT/MODULE (EVM) WARNINGS, RESTRICTIONS AND DISCLAIMERS For FeasibilityEvaluationOnly,inLaboratory/DevelopmentEnvironments.Unlessotherwiseindicated,thisEVM isnota finished electricalequipmentand notintendedforconsumer use.Itisintendedsolelyforuse forpreliminaryfeasibilityevaluationin laboratory/developmentenvironmentsby technicallyqualifiedelectronicsexpertswho arefamiliarwiththedangersand applicationrisks associatedwithhandlingelectricalmechanicalcomponents,systemsand subsystems.Itshouldnotbe used as allorpartofa finishedend product. Your SoleResponsibilityand Risk.You acknowledge,representand agreethat: 1. You have uniqueknowledgeconcerningFederal,Stateand localregulatoryrequirements(includingbutnotlimitedtoFood and Drug Administrationregulations,ifapplicable)whichrelatetoyourproductsand whichrelatetoyouruse (and/orthatofyouremployees, affiliates,contractorsordesignees)oftheEVM forevaluation,testingand otherpurposes. 2. You have fulland exclusiveresponsibilitytoassurethesafetyand complianceofyourproductswithallsuch lawsand otherapplicable regulatoryrequirements,and alsotoassurethesafetyofany activitiestobe conductedby you and/oryouremployees,affiliates, contractorsordesignees,usingtheEVM. Further,you areresponsibletoassurethatany interfaces(electronicand/ormechanical) between theEVM and any human body aredesignedwithsuitableisolationand means tosafelylimitaccessibleleakagecurrentsto minimizetheriskofelectricalshockhazard. 3. You willemploy reasonablesafeguardstoensurethatyouruse oftheEVM willnotresultinany propertydamage, injuryordeath,even iftheEVM shouldfailtoperformas describedorexpected. 4. You willtakecareofproperdisposaland recyclingoftheEVM ’s electroniccomponents and packingmaterials. CertainInstructions.ItisimportanttooperatethisEVM withinTI’s recommended specificationsand environmentalconsiderationsperthe userguidelines.ExceedingthespecifiedEVM ratings(includingbutnotlimitedtoinputand outputvoltage,current,power,and environmentalranges)may cause propertydamage, personalinjuryordeath.Iftherearequestionsconcerningtheseratingspleasecontact a TIfieldrepresentativepriortoconnectinginterfaceelectronicsincludinginputpower and intendedloads.Any loadsappliedoutsideofthe specifiedoutputrangemay resultinunintendedand/orinaccurateoperationand/orpossiblepermanentdamage totheEVM and/or interfaceelectronics.PleaseconsulttheEVM User's Guide priortoconnectingany loadtotheEVM output.Ifthereisuncertaintyas tothe loadspecification,pleasecontacta TIfieldrepresentative.Duringnormaloperation,some circuitcomponents may have case temperatures greaterthan60°C as longas theinputand outputaremaintainedata normalambientoperatingtemperature.These components include butarenotlimitedtolinearregulators,switchingtransistors,pass transistors,and currentsense resistorswhichcan be identifiedusingthe EVM schematiclocatedintheEVM User's Guide.When placingmeasurement probesnearthesedevicesduringnormaloperation,please be aware thatthesedevicesmay be verywarm tothetouch.As withallelectronicevaluationtools,onlyqualifiedpersonnelknowledgeable inelectronicmeasurement and diagnosticsnormallyfoundindevelopmentenvironmentsshoulduse theseEVMs. Agreement toDefend,Indemnifyand Hold Harmless.You agreetodefend,indemnifyand holdTI,itslicensorsand theirrepresentatives harmlessfromand againstany and allclaims,damages, losses,expenses,costsand liabilities(collectively,"Claims")arisingoutoforin connectionwithany use oftheEVM thatisnotinaccordancewiththetermsoftheagreement.ThisobligationshallapplywhetherClaims ariseunderlawoftortorcontractorany otherlegaltheory,and even iftheEVM failstoperformas describedorexpected. Safety-Criticalor Life-CriticalApplications.Ifyou intendtoevaluatethecomponents forpossibleuse insafetycriticalapplications(such as lifesupport)where a failureoftheTIproductwouldreasonablybe expectedtocause severepersonalinjuryordeath,such as devices whichareclassifiedas FDA ClassIIIorsimilarclassification,thenyou must specificallynotifyTIofsuch intentand enterintoa separate Assuranceand IndemnityAgreement. MailingAddress:Texas Instruments,PostOfficeBox 655303,Dallas,Texas 75265 Copyright© 2013,Texas InstrumentsIncorporated

Texas InstrumentsIncorporatedand itssubsidiaries(TI)reservetherighttomake corrections,enhancements,improvementsand other changes toitssemiconductorproductsand servicesperJESD46, latestissue,and todiscontinueany productorserviceperJESD48, latest issue.Buyersshouldobtainthelatestrelevantinformationbeforeplacingordersand shouldverifythatsuch informationiscurrentand complete.Allsemiconductorproducts(alsoreferredtohereinas “components”)aresoldsubjecttoTI’s termsand conditionsofsale suppliedatthetimeoforderacknowledgment. TIwarrantsperformanceofitscomponents tothespecificationsapplicableatthetimeofsale,inaccordancewiththewarrantyinTI’s terms and conditionsofsaleofsemiconductorproducts.Testingand otherqualitycontroltechniquesareused totheextentTIdeems necessary tosupportthiswarranty.Exceptwhere mandated by applicablelaw,testingofallparametersofeach component isnotnecessarily performed. TIassumes no liabilityforapplicationsassistanceorthedesignofBuyers’products.Buyersareresponsiblefortheirproductsand applicationsusingTIcomponents.To minimizetherisksassociatedwithBuyers’productsand applications,Buyersshouldprovide adequatedesignand operatingsafeguards. TIdoes notwarrantorrepresentthatany license,eitherexpressorimplied,isgrantedunderany patentright,copyright,mask work right,or otherintellectualpropertyrightrelatingtoany combination,machine,orprocessinwhichTIcomponents orservicesareused.Information publishedby TIregardingthird-partyproductsorservicesdoes notconstitutea licensetouse such productsorservicesora warrantyor endorsementthereof.Use ofsuch informationmay requirea licensefroma thirdpartyunderthepatentsorotherintellectualpropertyofthe thirdparty,ora licensefromTIunderthepatentsorotherintellectualpropertyofTI. 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No TIcomponents areauthorizedforuse inFDA ClassIII(orsimilarlife-criticalmedicalequipment)unlessauthorizedofficersoftheparties have executeda specialagreementspecificallygoverningsuch use. OnlythoseTIcomponents whichTIhas specificallydesignatedas militarygradeor“enhanced plastic”aredesignedand intendedforuse in military/aerospaceapplicationsorenvironments.Buyeracknowledgesand agreesthatany militaryoraerospaceuse ofTIcomponents whichhave not been so designatedissolelyattheBuyer's risk,and thatBuyerissolelyresponsibleforcompliancewithalllegaland regulatoryrequirementsinconnectionwithsuch use. TIhas specificallydesignatedcertaincomponents as meetingISO/TS16949 requirements,mainlyforautomotiveuse.Inany case ofuse of non-designatedproducts,TIwillnotbe responsibleforany failuretomeet ISO/TS16949. Products Applications Audio www.ti.com/audio Automotiveand Transportationwww.ti.com/automotive Amplifiers amplifier.ti.com Communicationsand Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP ® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energyand Lighting www.ti.com/energy Clocksand Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space,Avionicsand Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Videoand Imaging www.ti.com/video RFID www.ti-rfid.com OMAP ApplicationsProcessors www.ti.com/omap TIE2E Community e2e.ti.com WirelessConnectivity www.ti.com/wirelessconnectivity MailingAddress:Texas Instruments,PostOfficeBox 655303,Dallas,Texas 75265 Copyright© 2013,Texas InstrumentsIncorporated