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Characteristic / Test Conditions Drain-Source Breakdown Voltage (VGS = 0V, ID = 250µA) Drain-Source On-State Resistance 2 (VGS = 10V, 2A) Zero Gate Voltage Drain Current (VDS = 1000V, VGS = 0V) Zero Gate Voltage Drain Current (VDS = 800V, VGS = 0V, TC = 125°C) Gate-Source Leakage Current (VGS = ±30V, VDS = 0V) Gate Threshold Voltage (VDS = VGS, ID = 1mA) 050-7118 Rev A 1-2004 MAXIMUM RATINGS All Ratings: TC = 25°C unless otherwise specified. Symbol VDSS ID IDM VGS VGSM PD TJ,TSTG TL IAR EAR EAS Parameter Drain-Source Voltage Continuous Drain Current @ TC = 25°C Pulsed Drain Current 1 Gate-Source Voltage Continuous Gate-Source Voltage Transient Total Power Dissipation @ TC = 25°C Linear Derating Factor Operating and Storage Junction Temperature Range Lead Temperature: 0.063" from Case for 10 Sec. Avalanche Current 1 (Repetitive and Non-Repetitive) Repetitive Avalanche Energy 1 Single Pulse Avalanche Energy 4 UNIT Volts Amps Volts Watts W/°C Amps mJ STATIC ELECTRICAL CHARACTERISTICS Symbol BVDSS RDS(on) IDSS IGSS VGS(th) UNIT Volts Ohms µA nA Volts MIN TYP MAX 1000 3.00 100 500 ±100 APT1003RKLL 1000 ±30 ±40 139 1.11 -55 to 150 300 425 G D S CAUTION: These Devices are Sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed. APT Website - http://www.advancedpower.com

  • Lower Input Capacitance • Increased Power Dissipation
  • Lower Miller Capacitance • Easier To Drive
  • Lower Gate Charge, Qg • TO-220 Package Power MOS 7 ® is a new generation of low loss, high voltage, N-Channel enhancement mode power MOSFETS. Both conduction and switching losses are addressed with Power MOS 7 by significantly lowering RDS(ON) and Qg. Power MOS 7 ® combines lower conduction and switching losses along with exceptionally fast switching speeds inherent with APT's patented metal gate structure. POWER MOS 7 R MOSFET APT1003RKLL 1000V 4A 3.00ΩΩΩΩΩ GD S TO-220

DYNAMIC CHARACTERISTICS APT1003RKLL 050-7118 Rev A 1-2004 Note: Duty Factor D = t1/t2 Peak TJ = PDM x ZθJC + TC PDM SINGLE PULSE ZθJC, THERMAL IMPEDANCE (°C/W) 10-5 10-4 10-3 10-2 10-1 1.0 RECTANGULAR PULSE DURATION (SECONDS) FIGURE 1, MAXIMUM EFFECTIVE TRANSIENT THERMAL IMPEDANCE, JUNCTION-TO-CASE vs PULSE DURATION 1.0 0.80 0.60 0.40 0.20 0.5 0.1 0.3 0.7 0.9 0.05

1 Repetitive Rating: Pulse width limited by maximum junction

2 Pulse Test: Pulse width < 380 µs, Duty Cycle < 2%

3 See MIL-STD-750 Method 3471

4 Starting T j = +25°C, L = 53.13mH, RG = 25Ω , Peak IL = 4A 5 dv/dt numbers reflect the limitations of the test circuit rather than the device itself. IS ≤ -ID4A di/dt ≤ 700A/µs VR ≤ VDSS TJ ≤ 150°C 6 Eon includes diode reverse recovery. See figures 18, 20. APT Reserves the right to change, without notice, the specifications and information contained herein. Characteristic / Test Conditions Continuous Source Current (Body Diode) Pulsed Source Current 1 (Body Diode) Diode Forward Voltage 2 (VGS = 0V, IS = -ID4A) Reverse Recovery Time (IS = -ID4A, dlS/dt = 100A/µs) Reverse Recovery Charge (IS = -ID4A, dlS/dt = 100A/µs) Peak Diode Recovery dv/dt 5 UNIT Amps Volts ns µC V/ns MIN TYP MAX 1.3 560 3.2 Symbol RθJC RθJA MIN TYP MAX 0.90 UNIT °C/W Characteristic Junction to Case Junction to Ambient Symbol IS ISM VSD t rr Q rr dv/dt Symbol Ciss Coss Crss Qg Qgs Qgd td(on) tr td(off) tf Eon Eoff Eon Eoff Characteristic Input Capacitance Output Capacitance Reverse Transfer Capacitance Total Gate Charge 3 Gate-Source Charge Gate-Drain ("Miller") Charge Turn-on Delay Time Rise Time Turn-off Delay Time Fall Time Turn-on Switching Energy Turn-off Switching Energy Turn-on Switching Energy 6 Turn-off Switching Energy MIN TYP MAX 694 135 UNIT pF nC ns µJ SOURCE-DRAIN DIODE RATINGS AND CHARACTERISTICS THERMAL CHARACTERISTICS Test Conditions VGS = 0V VDS = 25V f = 1 MHz VGS = 10V VDD = 500V ID = 4A @ 25°C RESISTIVE SWITCHING VGS = 15V VDD = 500V ID = 4A @ 25°C RG = 1.6Ω INDUCTIVE SWITCHING @ 25°C VDD = 667V, VGS = 15V ID = 4A, RG = 5Ω INDUCTIVE SWITCHING @ 125°C VDD = 667V, VGS = 15V ID = 4A, RG = 5Ω