HHXC160ARA271MHA0G NPC | Alldatasheet
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No.849C/May.2015 Conductive Polymer Hybrid Aluminum Electrolytic Capacitors Please contact us for mass production schedule. Specifications in this bulletin are subject to change without notice. NIPPON CHEMI-CON CORPORATION 1755 1 HXCSeries
- High reliability and high voltage are realized by hybrid electrolyte
- Endurance with ripple current : 4,000 hours at 125℃
- Rated voltage range : 16 to 35Vdc, Capacitance range : 150 to 470μF
- For high temperature and high reliability applications. (Automotive equipment, Base station equipment, etc.)
- Halogen Free. ◆ SPECIFICATIONS Items Characteristics Category Temperature Range -55 to +125℃ Rated Voltage Range 16 to 35Vdc Capacitance Tolerance±20%（M） (at 20℃ , 120Hz) Leakage Current I=0.01CV Where, I : Max. leakage current (μA), C : Nominal capacitance (μF), V : Rated voltage (V) (at 20℃ after 2 minutes) Dissipation Factor (tanδ) Rated voltage (Vdc) 16V 25V 35V (at 20℃ , 120Hz)tanδ (Max.) 0.16 0.14 0.12 Low Temperature Characteristics (Max. Impedance Ratio) Endurance The following specifications shall be satisfied when the capacitors are restored to 20 ℃ after subjected to DC voltage with the rated ripple current is applied (the peak voltage shall not exceed the rated voltage) for 4,000 hours at 125℃ . Capacitance change ≦ ±30％ of the initial value D.F. (tanδ) ≦200％ of the initial specified value ESR ≦200％ of the initial specified value Leakage current ≦The initial specified value Shelf Life The following specifications shall be satisfied when the capacitors are restored to 20℃ after exposing them for 1,000 hours at 125℃ without voltage applied. Before the measurement, the capacitor shall be preconditioned by applying voltage according to Item 4.1 of JIS C 5101-4. Capacitance change ≦ ±30％ of the initial value D.F. (tanδ) ≦200％ of the initial specified value ESR ≦200％ of the initial specified value Leakage current ≦The initial specified value Bias Humidity Test The following specifications shall be satisfied when the capacitors are restored to 20℃ after subjecting them to the DC rated voltage at 85℃ , 85% RH for 2,000 hours. Appearance No significant damage Capacitance change ≦ ±30％ of the initial value D.F. (tanδ) ≦200％ of the initial specified value ESR ≦200％ of the initial specified value Leakage current ≦The initial specified value ◆PART NUMBERING SYSTEM 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 H H X C A R A M G Supplement code Size code Capacitance tolerance code Capacitance code (ex. 150μF:151, 470μF:471) Taping code Terminal code Voltage code (ex. 16V:160,35V:350) Series code Category Size Code φD L A B C W P ◆ MARKING EX) 35V150μF 26A 150 V HC
- Rated voltage symbol Rated voltage (Vdc) Symbol 16 C 25 E 35 V Vent for JA0 ◆DIMENSIONS ［mm］
- Terminal Code : AφD±0.5 0.3max. L±0.5 B±0.2 C±0.2 P A±0.2 W
No.849C/May.2015 Conductive Polymer Hybrid Aluminum Electrolytic Capacitors Please contact us for mass production schedule. Specifications in this bulletin are subject to change without notice. NIPPON CHEMI-CON CORPORATION 1755 2 HXCSeries ◆ STANDARD RATINGS WV (Vdc) Cap (μF) Size code ESR (mΩ max/20℃ , 100kHz) Rated ripple current (mArms/125℃ , 100kHz) Part No. 16 270 HA0 22 1,700 HHXC160ARA271MHA0G
470 JA0 18 2,100 HHXC160ARA471MJA0G
25 220 HA0 27 1,600 HHXC250ARA221MHA0G
330 JA0 20 2,000 HHXC250ARA331MJA0G
35 150 HA0 27 1,600 HHXC350ARA151MHA0G
270 JA0 20 2,000 HHXC350ARA271MJA0G
◆ RECOMMENDED REFLOW SOLDERING CONDITIONS The following conditions are recommended for air convection and infrared reflow soldering on the SMD products on to a glass epoxy circuit boards by cream solder. The dimensions of the glass epoxy boards with resist are 90×50×0.8mm. The temperatures shown are the surface temperature values on the top of the can and on the capacitor terminals. Reflow should be performed twice or less. Please ensure that the capacitor became cold enough to the room temperature (5 to 35℃ ) before the second reflow.
- Reflow Profile Size Code Preheat Time maintained above 217℃ Time maintained above 230℃ Peak temp. Reflow number HA0, JA0 150 to 180℃ 120 sec. max. 50 sec. max. 40 sec. max. 260℃ max. 1-cycle only 245℃ max. 2-cycle allowed PMASeriesNPCAP TM ◆STANDARD RATINGS
- Recommended Solder Land(Based on the PX series) [mm]
- Reflow Profile Location of capacitor c ab b Solder land on PC board 217 230 Peak Preheat Peak temperature Time (sec.) Max. period of time over 230℃ Temperature on the top of capacitor Temperature of capacitor terminal and (℃) Max. period of time over 217℃ ◆RECOMMENDED REFLOW SOLDERING CONDITIONS NIPPON CHEMI-CON CORPORATION 1595 Engineering Bulletin Conductive Polymer Aluminum Solid CapacitorsNo.824C / Oct.2012 Tentative Cap (μF) Rated ripple current (mArms/100kHz) Part No. APMA160ARA680MF40S40F40 APMA160ARA151MF60S18F60 APMA160ARA390MF40S 2,200 3,300 2,200 2,700 4,100 2,70040F40 APMA200ARA470MF40S45F40 APMA200ARA151MF60S20F60 APMA160ARA221MF60S 2,100 3,200 3,300 2,600 3,700 4,10018F60 APMA250ARA220MF40S50F40 APMA250ARA560MF60S26F60 APMA250ARA150MF40S 2,000 2,800 2,000 2,400 3,400 2,40050 544 1,200 312 470 1,500 1,760 275 700 187F40 150 150 220 WV (Vdc) Size code Leakage current (µAmax/after 2min.) ESR (mΩmax/ 20℃, 100k to 300kHz) Specifications in this bulletin are subject to change without notice. Please ask us for technical specifications before purchase and use. *1 Tx: Ambient temperature Voltage range(Vdc) Reflow number Preheat Time maintained above 230℃ Peak temp. 16 to 25V 1-cycle only 150℃ to 180 ℃ 120 sec.max. 50 sec.max. 250℃ max. 30 sec.max. 40 sec.max. 2-cycle allowed Time maintained above 217℃ 40 sec.max. Size code a b c F40,F60 1.63.51.9 Product specifications in this catalog are subject to change without notice.Request our product specifications before purchase and/or use. Please use our products based on the information contained in this catalog and product specifications. 1.0 1.4 1.9 2.3 3.1 4.5 4.0 6.0 6.0 Reflow soldering Reflow the capacitors within recommended reflow soldering conditions. Verify there is no temperature stress to the capacitors because the follow- ing differences might degrade capacitors electrically and mechanically. Please consult us if other reflow conditions are employed. 1.Location of components : Temperature increases at the edge of PC board more than the center. 2.Population of PC board : The lower the component population is, the more temperature rises. 3.Material of PC board : A ceramic made board needs more heat than a glass epoxy made board. The heat increase may cause damage to the capacitors. 4.Thickness of PC board : A thicker board needs more heat than a thin- ner board. The heat increase may damage the capacitors. 5.Size of PC board : A larger board needs more heat than a smaller board. The heat increase may damage the capacitors. 6.Solder thickness If very thin cream solder paste is to be used for SMD types, please consult with us. 7.Location of infrared ray lamps : IR reflow as well as hot plate reflow heats only on the reverse side of the PC board to lessen heat stress to the capacitors. 8.Vapor phase soldering (VPS) is not used. RECOMMENDED SOLDERING CONDITIONS AlchipTM MVA/MVE/MZR/MZJ/MZA/MVY/MZF/MZE/MZK/MLA/MLF/MLE/MLK/ MVL/MVJ/MVH/MHL/MHB/MHJ/MHK/MKB/MV-BP/MVK-BP 217 230 Peak Preheat Peak temp. Time (sec.) Max. period of time over 217℃ Max. period of time over 230℃ Temp (℃) D55, D60, D61, D73 E55, E60, E61, E73 F55, F60, F61, F73, F80, F90 H63 HA0 JA0 KE0, KG5 LH0, LN0 MH0, MN0 Size code Terminal code : A Terminal code : G a b 2.6 3.0 3.5 4.5 4.2 4.4 5.7 6.9 7.9 c 1.6 1.6 1.6 1.6 2.2 2.2 2.5 2.5 2.5 a 3.1 4.5 3.4 4.7 4.7 b 4.2 4.4 6.3 7.8 8.8 c 3.5 3.5 9.3 9.6 9.6
- Recommended Solder Land on PC Board c ba : Solder land on PC board Location of capacitor b ◆PRECAUTIONS FOR USERS Rework of soldering Use a soldering iron for rework. Do not exceed an iron tip temperature of 380±10℃ and an exposure time of 3±0.5 seconds. Mechanical stress Do not use the capacitors for lifting the PC board and give stress to the capacitor. Avoid bending the PC board. This may damage the capacitors. Cleaning assembly board Immediately after solvent cleaning, remove residual solvent with an air knife for at least 10 minutes. If the solvent is insufficiently dry, the capaci- tors may corrode. Coating on assembly board 1.Before curing coating material, remove the cleaning solvents from the assembly board. 2.Before conformal coating, a chloride free pre-coat material is recom- mended to decrease the stress on the capacitors. Molding with resin Internal chemical reaction gradually produces gas in the capacitor; then, increasing internal pressure. If the end seal of the capacitor is completely coverd by resin the gas will be unable to escape causing a potentially dangerous situation. The chlorine contained resin will penetrate into the end seal, reach the inside element, and cause damage of the capacitor. Others Refer to PRECAUTIONS AND GUIDELINES. Soldering method The capacitors of Alchip-series have no capability to withstand such dip or wave soldering as totally immerses components into a solder bath. Size code D55 to F90 H63 to JA0 KE0 to MN0 SMD type Vertical 63V(MVH), 80V 4 to 50V 6.3 to 50V 63 to 450V Voltage range (Vdc) Preheat 150 to 180℃ 120sec. max. 90sec. max 60sec. max. 60sec. max. 30sec. max. 30sec. max. 20sec. max. 60sec. max. 40sec. max. 30sec. max. 20sec. max. 20sec. max. 260℃max. 250℃max. 245℃max. 240℃max. 240℃max. 230℃max. Time maintained above 217℃ Peak temp. 2 times or less 2 times or less 2 times or less 2 times or less 2 times or less 2 times or less Reflow numberTime maintained above 230℃ 63 to 100, 400V 4 to 63V (Except 63V for MVH) The following conditions are recommended for air convection and infrared reflow soldering on the SMD products onto a glass epoxy circuit boards by cream solder. The dimensions of the glass epoxy boards with resist are 90×50×0.8mm for D55 to KG5 case code SMD capacitors and 180×90×0.8mm for LH0 to MN0 case codes SMD capacitors. The temperatures shown are the surface temperature values on the top of the can and on the capacitor terminals. Reflow should be performed twice or less. Please ensure that the capacitor became cold enough to the room temperature (5 to 35℃) before the second reflow. Consult with us when performing reflow profile in IPC / JEDEC (J-STD-020)
- Recommended soldering heat conditions (Except for Conductive Polymer Aluminum Solid Capacitors) Reflow soldering Reflow the capacitors within recommended reflow soldering conditions. Verify there is no temperature stress to the capacitors because the follow- ing differences might degrade capacitors electrically and mechanically. Please consult us if other reflow conditions are employed. 1.Location of components : Temperature increases at the edge of PC board more than the center. 2.Population of PC board : The lower the component population is, the more temperature rises. 3.Material of PC board : A ceramic made board needs more heat than a glass epoxy made board. The heat increase may cause damage to the capacitors. 4.Thickness of PC board : A thicker board needs more heat than a thin- ner board. The heat increase may damage the capacitors. 5.Size of PC board : A larger board needs more heat than a smaller board. The heat increase may damage the capacitors. 6.Solder thickness If very thin cream solder paste is to be used for SMD types, please consult with us. 7.Location of infrared ray lamps : IR reflow as well as hot plate reflow heats only on the reverse side of the PC board to lessen heat stress to the capacitors. 8.Please consult us about vapor phase soldering (VPS). [mm] ◆SURFACE MOUNT TYPE
- Recommended soldering heat conditions Flow soldering ：260±5℃ for 10+1 seconds Hand soldering ：380±10℃ for 3±0.5 seconds ◆RADIAL LEAD AND SNAP-IN TYPE 76 CAT. No. E1001O ALUMINUM ELECTROLYTIC CAPACITORS