APGF0808VGTPBTSEETC KINGBRIGHT | Alldatasheet

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© 2017 Kingbright. All Rights Reserved. Spec No: DSAP1307 / 1203015019 Rev No: V.2B Date: 07/10/2017 Page 1 / 4 PACKAGE DIMENSIONS SELECTION GUIDE Notes: 1. θ1/2 is the angle from optical centerline where the luminous intensity is 1/2 of the optical peak value. 2. Luminous intensity / luminous flux: +/-15%. 3. Luminous intensity value is traceable to CIE127-2007 standards. APGF0808VGTPBTSEETC 0.8 x 0.8 x 0.2 mm Full-Color Surface Mount LED RECOMMENDED SOLDERING PATTERN (units : mm; tolerance : ± 0.1) Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is ±0.1(0.004") unless otherwise noted. 3. The specifications, characteristics and technical data described in the datasheet are subject to change without prior notice. 4. The device has a single mounting surface. The device must be mounted according to the specifications. DESCRIPTIONS z The Green source color devices are made with InGaN on SiC substrate Light Emitting Diode z The Blue source color devices are made with InGaN on SiC substrate Light Emitting Diode z The Hyper Red source color devices are made with AlGaInP on GaAs substrate Light Emitting Diode z Electrostatic discharge and power surge could Damage the LEDs z It is recommended to use a wrist band or anti-electrostatic glove when handling the LEDs z All devices, equipments and machineries must be electrically grounded

FEATURES

z 0.8 mm x 0.8 mm SMD LED, 0.2 mm thickness z Low power consumption z Can produce any color in visible spectrum z Package: 4000 pcs / reel z Moisture sensitivity level: 3 z RoHS compliant

APPLICATIONS

z Home and smart appliances z Wearable and portable devices z Healthcare applications ATTENTION Observe precautions for handling electrostatic discharge sensitive devices Part Number Emitting Color (Material) Lens Type Iv (mcd) @ 5mA [2] Viewing Angle [1] Min. Typ. 2θ1/2 APGF0808VGTPBTSEETC ■ Green (InGaN) 30 90 150° ■ Blue (InGaN) 5 20 150° ■ Hyper Red (AlGaInP) 10 30 130° Water Clear

© 2017 Kingbright. All Rights Reserved. Spec No: DSAP1307 / 1203015019 Rev No: V.2B Date: 07/10/2017 Page 2 / 4 ABSOLUTE MAXIMUM RATINGS at TA=25°C ELECTRICAL / OPTICAL CHARACTERISTICS at TA=25°C APGF0808VGTPBTSEETC Parameter Symbol Emitting Color Value Unit Typ. Max. Wavelength at Peak Emission IF = 5mA λpeak Green Blue Hyper Red 518 461 632 - nm Dominant Wavelength IF = 5mA λdom [1] Green Blue Hyper Red 527 467 624 - nm Spectral Bandwidth at 50% Φ REL MAX IF = 5mA Δλ Green Blue Hyper Red - nm Capacitance C Green Blue Hyper Red 100 110 - pF Forward Voltage IF = 5mA VF [2] Green Blue Hyper Red 2.9 1.95 3.2 3.1 2.3 V Reverse Current (VR = 5V) IR Green Blue Hyper Red uA Temperature Coefficient of λpeak IF = 5mA, -10°C ≤ T ≤ 85°C TCλpeak Green Blue Hyper Red 0.05 0.04 0.13 - nm/°C Temperature Coefficient of λdom IF = 5mA, -10°C ≤ T ≤ 85°C TCλdom Green Blue Hyper Red 0.03 0.03 0.06 - nm/°C Temperature Coefficient of VF IF = 5mA, -10°C ≤ T ≤ 85°C TCV Green Blue Hyper Red -3.0 -3.0 -1.9 - mV/°C Parameter Symbol Value Unit Green Blue Hyper Red Power Dissipation PD [1] mW Reverse Voltage VR 5 5 5 V Junction Temperature Tj 125 125 115 °C Operating Temperature Top -40 to +85 °C Storage Temperature Tstg -40 to +100 °C DC Forward Current IF [2] 10 10 10 mA Peak Forward Current IFM [3] 50 50 50 mA Electrostatic Discharge Threshold (HBM) - 1000 1000 3000 V Thermal Resistance (Junction / Ambient) Rth JA [4] 660 365 580 °C/W Thermal Resistance (Junction / Solder point) Rth JS [4] 535 260 500 °C/W Notes: 1. The dominant wavelength (λd) above is the setup value of the sorting machine. (Tolerance λd: ±1nm. ) 2. Forward voltage: ±0.1V. 3. Wavelength value is traceable to CIE127-2007 standards. 4. Excess driving current and / or operating temperature higher than recommended conditions may result in severe light degradation or premature failure. Notes: 1. Within 35mW when multiple chips are lightened 2. The maximum ratings are valid for the case of lighting a single chip When two chips are lit at the same time, each chip should be driven at a current lower than 50% of the absolute maximum ratings When three chips are lit at the same time, each chip should be driven at a current lower than 30% of the absolute maximum ratings 3. Duty Cycle ≤ 1 / 20, Pulse Width = 1ms. 4. Rth JA, Rth JS Results from mounting on PC board FR4 (pad size ≥16 mm 2 per pad). 5. Relative humidity levels maintained between 40% and 60% in production area are recommended to avoid the build-up of static electricity – Ref JEDEC/JESD625-A and JEDEC/J-STD-033.

© 2017 Kingbright. All Rights Reserved. Spec No: DSAP1307 / 1203015019 Rev No: V.2B Date: 07/10/2017 Page 3 / 4 20% 40% 60% 80% 100% 350 400 450 500 550 600 650 700 750 800 T a = 25 °C Green Wavelength (nm) Relative Intensity (a. u.) Blue Red 0.5 0.5 0.0 -90° -75° -60° -45° -30° -15° 75° 60° 45° 30° 0° 15° 90° 1.0 1.0 Ta = 25 °C R G,B T a = 25 °C Forward voltage (V) Forward current (mA) 0.0 0.5 1.0 1.5 2.0 2.5 0 5 10 15 20 Ta = 25 °C Forward current (mA) Luminous intensity normalised at 5 mA - 4 0 - 2 0 0 2 04 06 08 0 1 0 0 Ambient temperature (°C) Permissible forward current (mA) 0.0 0.5 1.0 1.5 2.0 2.5 - 4 0 - 2 00 2 04 06 08 0 1 0 0 Ambient temperature (°C) Luminous intensity normalised at T a = 25 °C Ta = 25 °C Forward voltage (V) Forward current (mA) 0.0 0.5 1.0 1.5 2.0 2.5 0 5 10 15 20 T a = 25 °C Forward current (mA) Luminous intensity normalised at 5 mA - 4 0 - 2 0 0 2 04 06 08 0 1 0 0 Ambient temperature (°C) Permissible forward current (mA) 0.0 0.5 1.0 1.5 2.0 2.5 - 4 0 - 2 00 2 04 06 08 0 1 0 0 Ambient temperature (°C) Luminous intensity normalised at T a = 25 °C T a = 25 °C Forward voltage (V) Forward current (mA) 0.0 0.5 1.0 1.5 2.0 2.5 0 5 10 15 20 T a = 25 °C Forward current (mA) Luminous intensity normalised at 5 mA - 4 0 - 2 0 0 2 04 06 08 0 1 0 0 Ambient temperature (°C) Permissible forward current (mA) 0.0 0.5 1.0 1.5 2.0 2.5 - 4 0 - 2 00 2 04 06 08 0 1 0 0 Ambient temperature (°C) Luminous intensity normalised at T a = 25 °C APGF0808VGTPBTSEETC TECHNICAL DATA RELATIVE INTENSITY vs. WAVELENGTH SPATIAL DISTRIBUTION HYPER RED Forward Current vs. Forward Voltage Luminous Intensity vs. Forward Current Forward Current Derating Curve Luminous Intensity vs. Ambient Temperature BLUE Forward Current vs. Forward Voltage Luminous Intensity vs. Forward Current Forward Current Derating Curve Luminous Intensity vs. Ambient Temperature GREEN Forward Current vs. Forward Voltage Luminous Intensity vs. Forward Current Forward Current Derating Curve Luminous Intensity vs. Ambient Temperature

© 2017 Kingbright. All Rights Reserved. Spec No: DSAP1307 / 1203015019 Rev No: V.2B Date: 07/10/2017 Page 4 / 4 APGF0808VGTPBTSEETC TECHNICAL DATA TAPE SPECIFICATIONS (units : mm) REEL DIMENSION (units : mm) PACKING & LABEL SPECIFICATIONS REFLOW SOLDERING PROFILE for LEAD-FREE SMD PROCESS Notes: 1. Don't cause stress to the LEDs while it is exposed to high temperature. 2. The maximum number of reflow soldering passes is 2 times. 3. Reflow soldering is recommended. Other soldering methods are not recommended as they might cause damage to the product. PRECAUTIONARY NOTES 1. The information included in this document reflects representative usage scenarios and is intended for technical reference on ly. 2. The part number, type, and specifications mentioned in this document are subject to future change and improvement without notice. Before production usage customer should refer to the latest datasheet for the updated specifications. 3. When using the products referenced in this document, please make sure the product is being operated within the environmental and electrical limits specified in the datasheet. If customer usage exceeds the specified limits, Kingbright will not be responsible for any subsequent issues. 4. The information in this document applies to typical usage in consumer electronics applications. If customer's application ha s special reliability requirements or have life-threatening liabilities, such as automotive or medical usage, please consult with Kingbright representative for further assistance. 5. The contents and information of this document may not be reproduced or re-transmitted without permission by Kingbright. 6. All design applications should refer to Kingbright application notes available at http://www.KingbrightUSA.com/ApplicationNotes