APBA3010SURKSGC KINGBRIGHT | Alldatasheet
Document overview
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Technical content
Features
3.0mmx1.0mm RIGHT ANGLE SMT LED, 2.0mm THICKNESS. LOW POWER CONSUMPTION. WIDE VIEWING ANGLE. IDEAL FOR BACKLIGHT AND INDICATOR. VARIOUS COLRS AND LENS TYPES AVAILABLE. PACKAGE : 2000PCS / REEL.
SPEC NO: DSAD1090 REV NO: V.2 DATE: DEC/29/2003 PAGE : 2 OF 5 APPROVED: J. Lu CHECKED: Allen Liu DRAWN: S.J.HOU Selection Guid e Note: 1. θ1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value. Part No. Dice Lens Type Iv (mcd) @ 20mA Viewing Angle Min. Typ. 2 θ θ θ θ 1/2 APBA3010SURKSGC HYPER RED (InGaAlP) WATER CLEAR 110 200 SUPER BRIGHT GREEN (GaP) 2.6 12 140° Electrical / Optical Characteristics at T A =25 °C Absolute Maximum Ratings at T A =25 °C Note: 1. 1/10 Duty Cycle, 0.1ms Pulse Width. Symbol Parameter Device Typ. Max. Test Conditions Units λpeak Peak Wavelength Hyper Red Super Bright Green 650 565 nm IF=20mA λD Dominate Wavelength Hyper Red Super Bright Green 635 568 nm IF=20mA ∆λ 1/2 Spectral Line Half -width Hyper Red Super Bright Green 30 nm IF=20mA C Capacitance Hyper Red Super Bright Green 15 pF VF=0V;f=1MHz VF Forward Voltage Hyper Red Super Bright Green 1.95 2.2 2.5
2.5 V IF=20mA
IR Reverse Current All 10 uA VR = 5V Parameter Hyper Red Super Bright Green Units Power dissipation 170 105 mW DC Forward Current 30 25 mA Peak Forward Current [1] 185 140 mA Reverse Voltage 5 5 V Operating / storage Temperature -40°C To +85°C
SPEC NO: DSAD1090 REV NO: V.2 DATE: DEC/29/2003 PAGE : 3 OF 5 APPROVED: J. Lu CHECKED: Allen Liu DRAWN: S.J.HOU APBA3010SURKSGC Hyper Red
SPEC NO: DSAD1090 REV NO: V.2 DATE: DEC/29/2003 PAGE : 4 OF 5 APPROVED: J. Lu CHECKED: Allen Liu DRAWN: S.J.HOU Super Bright Green
SPEC NO: DSAD1090 REV NO: V.2 DATE: DEC/29/2003 PAGE : 5 OF 5 APPROVED: J. Lu CHECKED: Allen Liu DRAWN: S.J.HOU Recommended Soldering Pattern (Units : mm ) Tape Specifications (Units : mm ) APBA3010SURKSGC SMT Reflow Soldering Instructions Number of reflow process shall be less than 2 times and cooling process to normal temperature is required between first and second soldering process.