AP9579GM-HF VBSEMI | Alldatasheet
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P-Channel 60-V (D-S) MOSFET
FEATURES
- TrenchFET ® Power MOSFET 100 % UIS Te sted
APPLICATIONS
Load Switch Notes: a. Based on TC = 25 °C. b. Surface mounted on 1" x 1" FR4 board. PRODUCT SUMMARY VDS (V) RDS(on) () ID (A)a Qg (Typ.) - 60 0.0195 at VGS = - 10 V - 10 76 nC0.0250 at VGS = - 4.5 V - 9 S G D P-Channel MOSFET ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise noted Parameter Symbol Limit Unit Drain-Source Voltage VDS - 60 V Gate-Source Voltage VGS ± 20 Continuous Drain Current (TJ = 150 °C) TC = 25 °C ID - 10a A TC = 70 °C - 9 TA = 25 °C 8b TA = 70 °C - 8 b Pulsed Drain Current IDM - 50 Avalanche Current Pulse L = 0.1 mH IAS - 45 Single Pulse Avalanche Energy EAS 101 mJ Continuous Source-Drain Diode Current TC = 25 °C IS 69a ATA = 25 °C 2.1b Maximum Powe r Dissipation TC = 25 °C PD 104.2a W TC = 70 °C 66.7a TA = 25 °C 3.1b TA = 70 °C 2b Operating Junction and Stor age Temperature Range TJ, Tstg - 55 to 150 °C THERMAL RESISTANCE RATINGS Parameter Symbol Typical Maximu m Unit Maximum Junction-to-Ambientb Steady State RthJA 33 40 °C/W Maximum Junction-to-Case Steady State RthJC 0.98 1.2 SO-8 SD SD SD GD 5 Top View www.VBsemi.tw E-mail:China@VBsemi TEL:86-755-83251052 AP9579GM-HF A ll data sheet.com
Notes: a. Pu lse test; pulse width 300 µs, duty cycle 2 %. b. Guaranteed by design, not subject to production testing. Stresses beyond those listed und er “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. SPECIFICATIONS (TJ = 25 °C, unless othe rwise noted) Parameter Symbo l Test Conditions Min. Typ. Max. Unit Static Drain-Source Breakdown Voltage VDS VGS = 0 V, ID = - 250 µA - 60 V VDS Temperature Coefficient VDS/TJ ID = - 250 µA 68 mV/°CVGS(th) Temperature Coefficient VGS(th)/TJ - 5.2 Gate-Source Threshold Voltage VGS(th) VDS = VGS, ID = - 250 µA - 1 - 3 V Gate-Source Leakage IGSS VDS = 0 V, VGS = ± 20 V ± 100 nA Zero Gate Vo ltage Drain Current IDSS VDS = - 60 V, VGS = 0 V - 1 µAVDS = - 60 V, VGS = 0 V, TJ = 55 °C - 10 On-State Drain Currenta ID(on) VDS =-5 V, VGS = - 10 V - 120 A Drain-Source On-State Resistancea RDS(on) VGS = - 10 V, ID = - 30 A 0.0160 VGS = - 4.5 V, ID = - 20 A 0.0200 Forward Transconductancea gfs VDS = - 15 V, ID = - 50 A 20 S Dynamicb Input Capacitance Ciss VDS = - 25 V, VGS = 0 V, f = 1 MHz 3500 pFOutput Capacitance Coss 390 Reverse Transfer Capacitance Crss 290 Total Gate Charge Qg VDS = - 30 V, VGS = - 10 V, ID = - 55 A 76 115 nCVDS = - 30 V, VGS = - 4.5 V, ID = - 55 A 38 60 Gate-Source Charge Qgs 16 Gate-Drain Charge Qgd 19 Gate Resistance Rg f = 1 MHz 5.2 Tur n -On Delay Time td(on) VDD = - 2 V, RL = 2 ID - 10 A, VGEN = - 10 V, Rg = 1 10 15 ns Rise Time tr 71 5 Turn-Off Delay Time td(off) 70 110 Fall Time tf 40 60 Drain-Source Bod y Diode Characteristics Continuous Source-Drain Diode Current IS TC = 25 °C - 69 A Pulse Diode Forw ard Currenta ISM - 150 Body Diode Voltage VSD IS = - 30 A - 1 - 1.5 V Body Diode Reverse Recove ry Time trr IF = - 50 A, di/dt = 100 A/µs, TJ = 25 °C 45 68 ns Body Diode Reverse Recov ery Charge Qrr 59 120 nC Reverse Recov ery Fall Time ta 29 ns Reverse Recovery Rise Time tb 16 www.VBsemi.tw E-mail:China@VBsemi TEL:86-755-83251052 AP9579GM-HF A ll data sheet.com
TYPICAL CHARACTERISTICS (25 ° C, unless otherwise noted) Output Characteristics Transfer Characteristics On -Resistance vs. Drain Current VGS =5V 120 160 200 0 12345 VDS - Drain-to-SourceVoltage (V) ID - Drain Current (A) VGS =1 0t h ru 6 V VGS =4 V VGS =3 V 0 12345 VGS - Gate-to-Sou rce Voltage (V) ID - Drain Current (A) TC = 25 °C TC = 125 °C TC = - 55 °C 0.005 0.015 0.025 0.035 0.045 0.055 02 0 4 0 6 0 80 100 RDS(on) - On-Resistance (Ω) ID - Drain Current (A) VGS =1 0V VGS =4 . 5V Transfer Characteristics Transc onductance Capacitance 100 0 12345 VGS - Gate-to-Source Voltage (V) ID - Drain Current (A) TC = 25 °C TC = 125 °C TC = - 55 °C 100 01 2 2 4 3 6 4 8 60 ID - Drain Current (A) gfs - Transconductance (S) TC = 125 °C TC = - 55 °C TC = 25 °C Crss 1000 2000 3000 4000 5000 0 1 02 03 04 05 06 0 Ciss VDS - Drain-to-Source Voltage (V) C - Capacitance (pF) Coss www.VBsemi.tw E-mail:China@VBsemi TEL:86-755-83251052 AP9579GM-HF A ll data sheet.com
TYPICAL CHARACTERISTICS (25 °C, unless ot herwise noted) Gate Charge Source-Drain Diod e Forward Voltage Single Pulse Avalanche Current Capability vs. Time ID =5 5A 02 0 4 0 6 0 80 VGS - Gate-to-Source Voltage (V) Qg - Total Gate Charge (nC) VDS =3 0V VDS =2 0V TJ = 150 °C VSD - Source-to-Drain Voltage (V IS - Source Current (A) 100 TJ = 25 °C 0.0001 1000 0.1 - (A) IDav Tin - (s) 0.001 0.01 0.1 100 IAV (A) at TJ = 25 °C IAV (A) at TJ = 150 °C On-Resistance vs. Gate-to-Source Voltage On-Resistance vs. Gate-to-Source Vol tage Drain-Source Breakdown Voltage vs. Junction Temperature 0.5 0.8 1.1 1.4 1.7 2.0 - 50 - 25 0 25 50 75 100 125 150 TJ - Junction Temperature (°C) (Normalized)RDS(on) - On-Resistance ID = 20 A VGS =4 . 5V VGS =1 0V 0.00 0.02 0.04 0.06 0.08 0.10 0246 8 10 RDS(on) - On-Resistance (Ω) VGS - Gate-to-Source Voltage (V) TJ = 25 °C TJ = 150 °C ID =2 0A - 50 - 25 0 25 50 75 100 125 150 ID = 10 mA V(BR)DSS - (V) TJ - Temperature (°C) www.VBsemi.tw E-mail:China@VBsemi TEL:86-755-83251052 AP9579GM-HF A ll data sheet.com
TYPICAL CHARACTERISTICS (25 ° C, unless otherwise noted) Threshold Voltage Power Der ating, Junction-to-Case - 0.4 - 0.1 0.2 0.5 0.8 - 50 - 25 0 25 50 75 100 125 150 ID = 250 µA Variance (V)VGS(th) TJ - Temperature(°C) ID =1m A 100 120 140 0 25 50 75 100 125 150 TJ - Temperature (°C) Power (W) Max. Drain Current vs. Case Temperatur e Safe Operating Area, Junction-to-Case 0 25 50 75 100 125 150 TC - Case Temperature (°C) ID - Drain Current (A) VDS - Drain-to-Source Voltage (V) * VGS > minimu m VGS at which RDS(on) is specified 1000 0.1 1 10 100 0.1 100 - Drain Current (A)I D TC = 25 °C Single Pulse 100 µs 10 ms 100 ms, DC Limited byR DS(on)* BVDSS Limited 10 µs 1m s Normalized Thermal Transient Im pedance, Junction-to-Case 0.1 0.01 0.2 Duty Cycle = 0.5 Squ are WaveP ulse Duration (s) Normalized Effective Transient Thermal I mpedance 10-4 10-3 10-2 10-1 1 0.05 0.02 Single Pulse 0.1 www.VBsemi.tw E-mail:China@VBsemi TEL:86-755-83251052 AP9579GM-HF A ll data sheet.com
A 1.35 1.75 0.053 0.069 A1 0.10 0.20 0.004 0.008 B 0.35 0.51 0.014 0.020 C 0.19 0.2 5 0.0075 0.010 D 4.80 5.00 0.189 0.196 E 3.80 4.00 0.150 0.157 e 1.27 BSC 0.050 BSC H 5.80 6.20 0.228 0.244 h 0.25 0.50 0.010 0.020 L 0.50 0.93 0.020 0.037 q 0 °8 °0 °8 ° S 0.44 0.64 0.018 0.026 ECN: C-06527-Rev. I, 11-Sep-06 DWG: 5498 431 2 568 7 HE h x 45 C All Leads q 0.101 mm 0.004"LBA 1 A e D 0.25 mm (Gage Plane) SOIC (NARROW): 8-LEAD JEDEC Part N umber: MS-012 S www.VBsemi.tw E-mail:China@VBsemi TEL:86-755-83251052 AP9579GM-HF A ll data sheet.com
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