AP63200 DIODES | Alldatasheet

Document overview

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Technical content

Features

  • V IN 3.8V to 32V
  • 2A Continuous Output Current
  • 0.8V ± 1% Reference Voltage
  • 22µA Ultralow Quiescent Current
  • Switching Frequency o 500kHz: AP63200 and AP63201 o 1.1MHz: AP63203 and AP63205
  • Pulse Width Modulation (PWM) Regardless of Output Load o AP63201
  • Supports Pulse Frequency Modulation (PFM) o AP63200, AP63203, and AP63205 o Up to 80% Efficiency at 1mA Light Load o Up to 88% Efficiency at 5mA Light Load
  • Fixed Output Voltage o 3.3V: AP63203 o 5.0V: AP63205
  • Proprietary Gate Driver Design for Best EMI Reduction
  • Frequency Spread Spectrum (FSS ) to Reduce EMI
  • Precision Enable Threshold to Adjust UVLO
  • Protection Circuitry o Overvoltage Protection o Cycle-by-Cycle Peak Current Limit o Thermal Shutdown
  • Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
  • Halogen and Antimony Free. “Green” Device (Note 3) Pin Assignments 3 4 6FB EN VIN GND SW BST TSOT26 TOP VIEW

Applications

  • 12V and 24V Distributed Power Bus Supplies
  • Flat Screen TV Sets and Monitors
  • Power Tools and Laser Printers
  • White Goods and Small Home Appliances
  • FPGA, DSP, and ASIC Supplies
  • Home Audio
  • Network Systems
  • Set Top Boxes
  • Gaming Consoles
  • Consumer Electronics Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS), 2011/65/EU (RoHS 2) & 2015/863/EU (RoHS 3) compliant. 2. See https://www.diodes.com/quality/lead-free/ for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free. 3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds. AP63200/AP63201/AP63203/AP63205 Document number: DS41326 Rev. 2 - 2 1 of 18 www.diodes.com January 2019 © Diodes Incorporated

Figure 1. Typical Application Circuit Figure 2. Efficiency vs. Output Current 1 FB Feedback sensing terminal for the output voltage. Connect this pin to the resistive divider of the output. See Setting the Output Voltage section for more details. programing the UVLO. See Enable section for more details.

3 VIN

switching of the IC. See Input Capacitor section for more details. from SW to the output load. Note that a capacitor is required from SW to BST to power the high-side switch. capacitor is recommended from SW to BST to power the high-side switch.

4 GND

6 BST

Figure 3. Functional Block Diagram

AP63200/AP63201/AP63203/AP63205 Absolute Maximum Ratings (Note 4) (@T A = +25°C, unless otherwise specified.) Symbol Parameter Rating Unit VIN Supply Voltage -0.3 to +35.0 (DC) V VSW Switch Node Voltage -1.0 to VIN + 0.3 V VBST Bootstrap Voltage VSW - 0.3 to VSW + 6.0 V VFB Feedback Voltage -0.3V to +6.0 V VEN Enable/UVLO Voltage -0.3V to +35.0 V TST Storage Temperature - 65 to +150 °C TJ Junction Temperature +160 °C TL Lead Temperature +260 °C ESD Susceptibility (Note 5) HBM Human Body Mode 2000 V CDM Charge Device Model 1000 V Notes: 4 . Stresses greater than the 'Absolute Maximum Ratings' specified above may cause permanent damage to the device. These are stress ratings only; functional operation of the device at these or any other conditions exceeding those indicated in this specification is not implied. Device reliability may be affected by exposure to absolute maximum rating conditions for extended periods of time. 5 . Semiconductor devices are ESD sensitive and may be damaged by exposure to ESD events. Suitable ESD precautions should be taken when handling and transporting these devices. Thermal Resistance (Note 6) Symbol Parameter Rating Unit θJA Junction to Ambient T SOT26 89 °C/W θJC Junction to Case T SOT26 39 °C/W Note: 6. Test condition for TSOT26: Device mounted on FR-4 substrate, single-layer PC board, 2oz copper, with minimum recommended pad layout. Recommended Operating Conditions (Note 7) (@TA = +25°C, unless otherwise specified.) Symbol Parameter Min Max Unit VIN Supply Voltage 3.8 32 V TA Operating Ambient Temperature Range -40 +85 °C Note: 7. The device function is not guaranteed outside of the recommended operating conditions. AP63200/AP63201/AP63203/AP63205 Document number: DS41326 Rev. 2 - 2 4 of 18 www.diodes.com January 2019 © Diodes Incorporated

AP63200/AP63201/AP63203/AP63205 Electrical Characteristics (TA = +25°C, VIN = 12V, unless otherwise specified. Min/Max limits apply across the recommended ambient temperature range, -40°C to +85°C, and input voltage range, 3.8V to 32V). Symbol Parameter Test Conditions Min Typ Max Unit ISHDN Shutdown Supply Current VEN = 0V — 1 3 µA IQ Supply Current (Quiescent) AP63201 : VEN = OPEN, VFB = 1.0V — 258 — µA AP6320 0/AP63203/AP63205: VEN = OPEN, VFB = 1.0V — 22 — µA UVLO VIN Under Voltage Threshold (Rising) — 3.30 3.50 3.70 V VIN Under Voltage Threshold Hysteresis — — 440 — mV R DS(ON)1 High-Side Switch On-Resistance (Note 8) — — 125 — m Ω R DS(ON)2 Low -Side Switch On-Resistance (Note 8) — — 68 — m Ω IPEAK_LIMIT HS Peak Current Limit (Note 8) — 2.5 2.8 3.1 A IVALLEY_LIMIT LS Valley Current Limit (Note 8) — 2.5 3.2 3.9 A fSW Oscillator Frequency AP63200/AP63201 — 500 — kHz AP63203/AP63205 — 1100 — kHz FSS Frequency Spread Spectrum — — ±6 — % tON Minimum On Time — — 80 — ns VFB Feedback Voltage CCM, AP63200/AP63201 792 800 808 mV CCM, AP63203 3.27 3.30 3.33 V CCM, AP63205 4.95 5.00 5.05 V VEN_ H EN Logic High — 1.15 1.18 1.23 V VEN_ L EN Logic Low — 1.05 1.10 1.15 V IEN EN Input Current VEN = 1.5V — 5.5 — μA VEN = 1V — 1.5 — μA tSS Soft-Start Period — — 4 — ms TSD Thermal Shutdown (Note 8) — — + 160 — °C THYS Thermal Hysteresis (Note 8) — — + 25 — °C Note: 8 . Compliance to the datasheet limits is assured by one or more methods: production test, characterization, and/or design. AP63200/AP63201/AP63203/AP63205 Document number: DS41326 Rev. 2 - 2 5 of 18 www.diodes.com January 2019 © Diodes Incorporated

AP63200/AP63201/AP63203/AP63205

Application Information

L 2.2μH 30.9kΩ 62kΩ 100nF 2x22μF 10μF VIN EN SW BST FB GND OUTPUT VOUT 1.2V INPUT 100pF Figure 20. Typical Application Circuit of AP63200/AP63201 Figure 21. Typical Application Circuit of AP63203/AP63205

1 PWM Operation Control

The AP63200/AP63201/AP63203/AP63205 device is a 3.8V-to-32V input, 2A output, EMI friendly, fully integrated synchronous buck converter. when Q2 is on. On the rising edge of next clock cycle, Q2 turns off, and Q1 turns on. This sequence repeats every clock cycle. AP63200/AP63201/AP63203/AP63205 footprint as well as minimizes the external component count. subharmonic oscillation when the duty cycle is greater than 50% for peak current mode control. sacrificing the MOSFET switching times.

MOSFET peak current limit, overvoltage protection, and overtemperature protection.

2 Pulse Frequency Modulation

light load conditions, they can achieve power efficiency of up to 88% at a 5mA load condition. The quiescent current of AP6320 0, AP63203 and AP63205 is 22μA typical under a no-load, non-switching condition.

3 Enable

voltage falls below its lower threshold (typical 1.1V, falling), the internal SS voltage is discharged to ground and device operation is disabled.

  1. The resistive divider resistor values are calculated by equations Eq.1 and Eq.2.

Figure 22. Programming UVLO

  • V ON is the rising edge voltage to enable the regulator
  • V OFF is the falling edge voltage to disable the regulator AP63200/AP63201/AP63203/AP63205 Document number: DS41326 Rev. 2 - 2 10 of 18 www.diodes.com January 2019 © Diodes Incorporated

multiple power rails to minimize input inrush current. The amount of capacitance is calculated by equation Eq.3.

  • C d is the time delay capacitance in nF
  • t s is the delay time in ms The EN pin is a high voltage pin and can be directly connected to VIN to automatically start up the device as VIN increases.

4 Undervoltage Lockout

AP63200/AP63201/AP63203/AP63205 is disabled. In this event, both the high-side and low-side power MOSFETs are turned off.

5 EMI Reduction with Frequency Spread Spectrum and Ringing-free Switching Node

to spread the switching noise over a wider frequency band and therefore reduces conducted and radiated interference at a particular frequency. waveform for SW is shown in Figure 23. Figure 23. AP63203/AP63205 SW Node Waveform

6 Overcurrent Protection

down. After 16ms of off time, the buck converter restarts powering up. H iccup mode reduces the power dissipation in the overcurrent condition.

7 Thermal Shutdown

normal power-up cycle with soft-start.

8 Power Derating Characteristics

Where PD is the power dissipated by the regulator and θJA is the thermal resistance from the junction of the die to the ambient temperature. temperature is shown in Figure 24. Figure 24. Output Current Derating Curve vs. Temperature, VIN = 12V

9 Setting the Output Voltage

Table 1 shows a list of recommended component selections for common output voltages for AP6300 and AP63201 referencing Figure 20. Table 1. Recommended Component Selections for AP63200/AP63201 Tables 2 and 3 show recommended component selections for AP63203 and AP63205 referencing Figure 21. Table 2. Recommended Component Selections for AP63203 Table 3. Recommended Component Selections for AP63205

10 Inductor

to be 30% to 50% of the maximum load current of 2A. than 100mΩ. Use a larger inductance for improved efficiency under light load conditions.

11 Input Capacitor

to sustain the ripple current produced during the on time of Q1 . It must have a low ESR to minimize the losses. input capacitor which has an RMS rating greater than half of the maximum load current. surge protected or else capacitor failure could occur. Using a ceramic capacitor greater than 10µF is sufficient for most applications.

AP63200/AP63201/AP63203/AP63205 Application Information (continued)

12 Output Capacitor

The output capacitor keeps the output voltage ripple small, ensures feedback loop stability, and reduces the overshoot/undershoot of the output voltage during load transients. During the first few milliseconds of a load transient, the output capacitor supplies the current to the load. The converter recognizes the load transient and sets the duty cycle to maximum but the current slope is limited by the inductor value. The output capacitor, COUT , requirements can be calculated from equations Eq. 9 and Eq. 10. The ESR of the output capacitor dominates the output voltage ripple. The amount of ripple can be calculated from Eq. 9: An output capacitor with large capacitance and low ESR is the best option. For most applications, a 22µF to 68µF ceramic capacitor is sufficient. To meet the load transient requirement, COUT should be greater than the following calculated from Eq. 10: ? Eq. 10 Where ΔV is the maximum output overshoot voltage.

13 Bootstrap Capacitor

To ensure the proper operation, a ceramic capacitor must be connected between the BST and SW pins. A 100nF ceramic capacitor is sufficient. If the BST capacitor voltage falls below 2.3V, the boot undervoltage protection circuit turns Q2 on for 220ns to refresh the BST capacitor and raise its voltage back above 2.85V. The BST capacitor voltage threshold is always maintained to ensure enough driving capability for Q1. This operation may arise during long periods of no switching such as in PFM with light load conditions. Another event requires the refreshing of the BST capacitor is when the input voltage drops close to the output voltage. Under this condition, the regulator enters low dropout mode by holding Q1 on for multiple clock cycles. To prevent the BST capacitor from discharging, Q2 is forced to refresh. The effective duty cycle is approximately 100% so that it acts as an LDO to maintain the output voltage regulation. AP63200/AP63201/AP63203/AP63205 Document number: DS41326 Rev. 2 - 2 14 of 18 www.diodes.com January 2019 © Diodes Incorporated

  1. The AP63200/AP63201/AP63203/AP63205 device works at 2A current load, so heat dissipation is a major concern in the layout of the PCB.

2oz copper for both the top and bottom layers is recommended.

  1. Provide sufficient vias for the input and output capacitors’ GND side to dissipate heat to the bottom layer.
  2. Make the bottom layer under the device as the GND layer for heat dissipation. The GND layer should be as large as possible to provide
  3. Place the VIN capacitors as close to the device as possible.
  4. Place the feedback components as close to FB as possible.
  5. See Figure 25 for reference.

Figure 25. Recommended Layout

AP63200/AP63201/AP63203/AP63205

Ordering Information

Please see http://www.diodes.com/package-outlines.html for additional latest information such as Mechanical Data and Device Tape Orientation. AP 6320X XX - X PackingProduct Version Package 7 : Tape & ReelWU : TSOT 260: AP 63200 1: AP 63201 3: AP 63203 5: AP 63205 Part Number M ode Frequency VOUT Package Code Tape and Reel Quantity Part Number Suffix AP63200WU -7 PWM/ PFM 500kHz Adjustable WU 3000 -7 AP63201WU -7 PWM Only 500kHz Adjustable WU 3000 -7 AP63203WU -7 PWM/ PFM 1100kHz 3.3V WU 3000 -7 AP63205WU -7 PWM/ PFM 1100kHz 5V WU 3000 -7 Marking Information TSO T26 1 2 3 XX Y W X XX : Identification Code Y : Year 0~9 X : Internal Code (Top View) W : Week : A~Z : 1~26 week; a~z : 27~52 week; z represents 52 and 53 week Part Number Package Identification Code AP63200WU -7 TSOT26 T2 AP63201WU -7 TSOT26 T3 AP63203WU -7 TSOT26 T4 AP63205WU -7 TSOT26 T5 AP63200/AP63201/AP63203/AP63205 Document number: DS41326 Rev. 2 - 2 16 of 18 www.diodes.com January 2019 © Diodes Incorporated

AP63200/AP63201/AP63203/AP63205 Package Outline Dimensions Please see http://www.diodes.com/package-outlines.html for the latest version. TSOT26 TSOT26 Dim Min Max Typ A ฀ 1.00 — A1 0.010 0.100 — A2 0.840 0.900 — D 2.800 3.000 2.900 E 2.800 BSC E1 1.500 1.700 1.600 b 0.300 0.450 — c 0.120 0.200 — e 0.950 BSC e1 1.900 BSC L 0.30 0.50 — L2 0.250 BSC θ 0° 8° 4° θ1 4° 12° — All Dimensions in mm Suggested Pad Layout Please see http://www.diodes.com/package-outlines.html for the latest version. TSOT26 Dimensions Value (in mm) C 0.950 X 0.700 Y 1.000 Y1 3.199 D E1/2 E E/2 e A Seating Plane0 L Gauge Plane 01( 4x) 01( 4x) c b Seating Plane C X Y AP63200/AP63201/AP63203/AP63205 Document number: DS41326 Rev. 2 - 2 17 of 18 www.diodes.com January 2019 © Diodes Incorporated

AP63200/AP63201/AP63203/AP63205 IMPORTANT NOTICE DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMEN T, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated website, harmless against all damages. Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel. Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application. Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings noted herein may also be covered by one or more United States, international or foreign trademarks. This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the final and determinative format released by Diodes Incorporated. LIFE SUPPORT Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein: A. Life support devices or systems are devices or systems which: 1. are intended to implant into the body, or 2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user. B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. C ustomers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems. Copyright © 2019, Diodes Incorporated www.dio des.com AP63200/AP63201/AP63203/AP63205 Document number: DS41326 Rev. 2 - 2 18 of 18 www.diodes.com January 2019 © Diodes Incorporated