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Document overview

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Technical content

Features

  • Mutual Capacitive Touch Sensing
  • Single Power Supply: 2.8V to 3.6V Operation V oltage; LDO inside to Support 1.6V to 2.0V Operation V oltage Up to 17/23 Drive Lines and 10/12 Sense Lines
  • Charge Pump Support up to 6V , Doubling SNR
  • Internal Two-wire Serial Control Bus I 2C
  • Single-end Integrator with Programmable Gain Control
  • Multiplexed Analog Digitization with 12-bit Resolution Scan SAR ADCs and Its Dedicated 2X to 8X Accumulator XSRAM Buffers Features (Continued)
  • Single Cycle 8051 CPU Core, Maximum Opera- ting Clock up to 28MHz from IOSC (Zero Wait State) 4 to 28MHz Internal Oscillator (IOSC) 32k-byte Flash ROM 6k-byte Internal SRAM Two 16-bit Timers T0/T1 Configurable I 2C Slave Controller and SPI Slave Controller Shared with the Same Ports  With Asynchronous I 2C Slave Address Detection Logic Design

4 General Purpose GPIO Pins

One External Interrupt Pin

  • ISP/IAP via I²C Port
  • Operation Temperature Range: -40°C to 85°C
  • Package Type Altern atives: QFN-5×5-40 and QFN-6×6-48
  • RoHS Compliance Operating Mode: Mode Description Power-down No scan with power-down mode Idle While only 8051 CPU core is idle, all peripherals remain active Standard Higher scan rate when fingers are on panel, IOSC can up to 4MHz to 28MHz

Applications

  • Mobile Phones
  • Personal Digital Assistants
  • Smart Hand-held or Gaming Devices

Figure 1. Package Types of AP386X

Figure 2. Pin Configuration of AP3860 (Top View)

Figure 3. Pin Configuration of AP3861 (Top View)

P r e l i m i n a r y D a t a s h e e t Superior Multi-touch Capacitive Touch Screen Controller AP386X Aug. 2013 Rev. 1. 0 BC D Semiconductor Manufacturing Limited Pin Description Pin Number Pin Name Pin Type Pin Function QFN-5×5-40 AP3860 QFN-6×6-48 AP3861 40, 1 to 16 6 to 22 D16 to D0 I/O, A Driving Lines 16 to 0 These pins can also be configured as I/O bi-directional ports for test - 48, 1 to 5 D22 to D17 I/O, A Driving Lines 22 to 17 These pins can also be configured as I/O bi-directional ports for test 17 23 VDDHV O High Voltage. 6V Charge pump high V oltage. This output pin can be configured as VDD3V or 6V accordingly 18, 30 24, 35 VDD3V P Supply Voltage. 2.8V to 3.6V A good decoupling capacitor between VDD3V and VSS pins is critical for good performance 19 25 VSS P Ground Voltage. 0V 20 26 VDD18 O Internal Regulator Output. 1.6V to 2.0V Typical decoupling capacitors of 0.1 F and 10 F should be connected between VDD18 and VSS 21 27 TESTEN I Test Mode Enable High Active This pin has an internal weakly pull low resistor connected. If it is connected high, the chip enters into Test Mode condition 22 28 SS/SCL I/O SS/SCL This pin can be configured as the SCL signal of the I2C master or I 2C slave controller. When I 2C is enabled, the pin is configured as an open-collector. While in SPI mode, this pin is configured as the slave chip select pin 23 29 SCK/ GPIO3 I/O Port 1.3 GPIO 8051 P1.3 GPIO. This pin can also be configured as the serial clock from SPI master while SPI interface is activated 24 30 MOSI/ SDA I/O SDA This pin can be configured as the SDA signal of the I2C master or I 2C slave controller. In this operation mode, this pin should also be configured as open-collector. While SPI interface is selected, the pin serves as the data port from SPI master to SPI slave 25 31 MISO/ GPIO2 I/O Port 1.2 GPIO 8051 P1.2 GPIO. This pin can also be configured as the output data pin from slave to master for SPI interface

P r e l i m i n a r y D a t a s h e e t Superior Multi-touch Capacitive Touch Screen Controller AP386X Aug. 2013 Rev. 1. 0 BC D Semiconductor Manufacturing Limited Pin Description (Continued) Pin Number Pin Name Pin Type Pin Function QFN-5×5-40 AP3860 QFN-6×6-48 AP3861 26 32 RSTN I Reset Low Active Typically connect a resistor to VDD3V and a capacitor to VSS. Low asserted and threshold at 0.5*VDD. When forced low, the chip enters into reset condition. This pin should not be connected to any level above VDD 27 33 WAKE/ GPIO0 I/O Port 1.0 GPIO 8051 P1.0 GPIO. This pin can also be configured as the wakeup pin from the host 28 34 INT/ GPIO1 I/O Port 1.1 GPIO 8051 P1.1 GPIO. Open Drain output. This pin can also be configured as the interrupt pin to notify the host 29, 31 to 39 36 to 45 S0 to S9 I/O, A Sensing Lines 0 to 9 These pins can also be configured as I/O bi-directional ports for test - 46, 47 S10, S11 I/O, A Sensing Lines 10 to 11 These pins can also be configured as I/O bi-directional ports for test 41 49 EP Exposed Pad “I/O” means input/output; “I” means input; “O” means Output; “P” means power; “A” means analog. SCL and SDA Pin Description Pull-up Enable The pull-up enable for SCL and SDA is activated for AP386X, meaning that AP386X always has pull-up SCL and SDA to VDD3V. During reset, SCL and SDA are as input pin. Moreover, if the pin connecting to the system is floating, the internal pull-up will tie the pin to VDD3V (10k ). After AP386X is reset, SCL and SDA are input until its corresponding register is configured. Mode Selection SCL and SDA can be used in I 2C and SPI mode. AP386X can enable I 2C mode (SCL and SDA configured as open drain pin) by register setting. Wakeup SCL and SDA can be used for wakeup input signals in different mode. While I 2C mode is enabled, a START protocol (SDA is low and SCL is high) on SCL and SDA is a wakeup signal to AP386X. While SPI mode is enabled, an active low on th e pin of SCL (serving as a slave select in SPI) is a wakeup signal to AP386X. Moreover, a wakeup signal can be asserted by host from GPIO0. INT/GPIO1 GPIO1 can be configured as open-drain or push-pull mode. Furthermore, GPIO1 pin has internal pull-up to VDD3V (60k) or VDD18 (10k) based on different register definition.

Figure 4. Functional Block Diagram of AP386X

P r e l i m i n a r y D a t a s h e e t Superior Multi-touch Capacitive Touch Screen Controller AP386X Aug. 2013 Rev. 1. 0 BC D Semiconductor Manufacturing Limited G1: Green Blank: Tray TR: Tape & Reel

Ordering Information

Package Temperature Range Part Number Marking ID Packing Type QFN-5x5-40 -40 to 85°C AP3860FNTR-G1 3860FN Tape & Reel QFN-6x6-48 AP3861FN-G1 3861FN Tray AP3861FNTR-G1 3861FN Tape & Reel BCD Semiconductor's Pb-free products, as designated wi th "G1" in the part number, are RoHS compliant and green. AP386X Support 3” to 8” Touch Panel, Listed Below: PN TX/RX Multi-touch Package Panel size AP3860 17/10 10 points 100Hz QFN-5x5-40 3” to 7” AP3861 23/12 10 points 100Hz QFN-6x6-48 4” to 8” Package FN: QFN-5×5-40 /QFN-6×6-48 0: AP3860 1: AP3861

P r e l i m i n a r y D a t a s h e e t Superior Multi-touch Capacitive Touch Screen Controller AP386X Aug. 2013 Rev. 1. 0 BC D Semiconductor Manufacturing Limited Absolute Maximum Ratings (Note 1) Parameter Symbol Value Unit Supply V oltage (Pin VDD3V) V DD 0 to 4 V Analog Input V oltage (Other pins) -0.3 to V DD+0.3 V Logic Input V oltage -0.3 to V DD+0.3 V Thermal Resistance (Simulation, Junction to Ambient) JA TBD °C/W Maximum Junction Temperature T J 100 °C Operating Temperature T OP -40 to 85 °C Storage Temperature T STG -65 to 150 °C ESD (Human Body Model) ESD HBM 8000 V Note 1: Stresses greater than those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional op eration of the device at these or any other conditions beyond those indicated under “Recommended Operating Co nditions” is not implied. Exposure to “Absolute Maximum Ratings” for extended periods may affect device reliability. Recommended Operating Conditions Parameter Symbol Min Max Unit Supply V oltage (Pin VDD3V) V DD 2.8 3.6 V Operating Ambient Temperature T A -40 85 ºC

P r e l i m i n a r y D a t a s h e e t Superior Multi-touch Capacitive Touch Screen Controller AP386X Aug. 2013 Rev. 1. 0 BC D Semiconductor Manufacturing Limited

Electrical Characteristics

TA=25°C, VDD=2.8V to 3.6V, I2C bus frequency=400kHz, 12-bit mode, unless otherwise noted. Parameter Symbol Conditions Min Typ Max Unit Quiescent Current Standard mode fOSC=4 to 28MHz Power-down mode Idle mode mA VDD18 Output V oltage V DD18 1.6 1.8 2.0 V Charge Pump V oltage V DDHV Charge pump enable 5.8 6 6.3 V Internal Operating Frequency fOSC 4 28 MHz DA/AC Characteristics for AFE Parameter Symbol Conditions Min Typ Max Unit ADC DC Accuracy Resolution 12 Bits No Missing Codes Standard modes 11 12 Bits Integral Linearity Error INL Standard modes ±3 LSB Differential Linearity Error Offset Error Gain Error DNL ±1.5 LSB LSB LSB Analog Input Full-scale Input Span 0 V DD V ADC Sampling Dynamics Throughput Rate 500 ksps Switched-capacitor Integrator Output V oltage Range 0.3 V DD-0.3 V Integrator Capacitor C INT 40 pF

P r e l i m i n a r y D a t a s h e e t Superior Multi-touch Capacitive Touch Screen Controller AP386X Aug. 2013 Rev. 1. 0 BC D Semiconductor Manufacturing Limited Electrical Characteristics (Continued) DA/AC Characteristics for 8051 CPU Core, Digital GPIO Pins, Digital Peripherals Parameter Symbol Conditi ons Min Typ Max Unit RSTN Input V oltage Threshold VRSTN_H Low to high level 1.56 1.71 V VRSTN_L High to low level 1.16 1.30 Input High V oltage V IH 0.7*V DD V DD V Input Low V oltage V IL -0.3 0.5 V Output High V oltage V OH V DD-0.6 V Output Low V oltage V OL 0.4 V High Level Output Current I OH @V OH(Min) 1 mA Low Level Output Current I OL @V OL(Max) 1 mA Internal Pull-up Resistance R PU SCL, SDA, INT 10 kOther Pins 34 74 Internal Pull-down Resistance RPD 29 86 k Output Rise Time t RISE CLOAD=20pF and 10% to 90% 5 ns Output Fall Time t FALL CLOAD=20pF and 10% to 90% 5 ns GPIO Output Operating Frequency C LOAD =20pF 0 5 MHz SCK Frequency f SCK 2 MHz SCL Clock Frequency f SCLI2C 0 400 kHz

P r e l i m i n a r y D a t a s h e e t Superior Multi-touch Capacitive Touch Screen Controller AP386X Aug. 2013 Rev. 1. 0 BC D Semiconductor Manufacturing Limited Mechanical Dimensions QFN-5×5-40 Unit: mm(inch)

P r e l i m i n a r y D a t a s h e e t Superior Multi-touch Capacitive Touch Screen Controller AP386X Aug. 2013 Rev. 1. 0 BC D Semiconductor Manufacturing Limited Mechanical Dimensions (Continued) QFN-6×6-48 Unit: mm(inch) 5.900(0.232) 6.100(0.240) 6.100(0.240) 5.900(0.232) Pin 1 Mark 0.400(0.016) BSC 0.000(0.000) 0.050(0.002) 0.200(0.008) REF0.150(0.006) 0.250(0.010) N13 N25 N37 N48 0.300(0.012) 0.500(0.020) PIN # 1 IDENTIFICATION See DETAIL A Pin 1 Options DETAIL A 123 123 Symbol J=K A min(mm) max(mm) max(mm) min(mm)min(inch) min(inch)max(inch) max(inch) Option1 Option2 4.400 4.150 4.600 4.450 0.173 0.181 0.163 0.175 0.800 0.900 0.700 0.800 0.028 0.031 0.031 0.035 J K A

P r e l i m i n a r y D a t a s h e e t Superior Multi-touch Capacitive Touch Screen Controller AP386X Aug. 2013 Rev. 1. 0 BC D Semiconductor Manufacturing Limited Mounting Pad Layout QFN-5×5-40 Dimensions X=Y (mm)/(inch) X1=Y2 (mm)/(inch) Y1=X2 (mm)/(inch) X3=Y3 (mm)/(inch) E (mm)/(inch)

P r e l i m i n a r y D a t a s h e e t Superior Multi-touch Capacitive Touch Screen Controller AP386X Aug. 2013 Rev. 1. 0 BC D Semiconductor Manufacturing Limited Mounting Pad Layout (Continued) QFN-6×6-48 Dimensions X=Y (mm)/(inch) X1=Y2 (mm)/(inch) Y1=X2 (mm)/(inch) X3=Y3 (mm)/(inch) E (mm)/(inch)

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800 Yi Shan Road, Shanghai 200233, China

Tel: +86-21-6485 1491, Fax: +86-21-5450 0008 MAIN SITE REGIONAL SALES OFFICE Shenzhen Office Shanghai SIM-BCD Semiconductor Manufacturing Co., Ltd., Shenzhen Office Unit A Room 1203, Skyworth Bldg., Gaoxin Ave.1.S., Nanshan District, Shenzhen, China Tel: +86-755-8826 7951 Fax: +86-755-8826 7865 Taiwan Office BCD Semiconductor (Taiwan) Company Limited 4F, 298-1, Rui Guang Road, Nei-Hu District, Taipei, Taiwan Tel: +886-2-2656 2808 Fax: +886-2-2656 2806 USA Office BCD Semiconductor Corp. 30920 Huntwood Ave. Hayward, CA 94544, USA Tel : +1-510-324-2988 Fax: +1-510-324-2788 - Headquarters BCD Semiconductor Manufacturing Limited No. 1600, Zi Xing Road, Shanghai ZiZhu Science-based Industrial Park, 200241, China Tel: +86-21-24162266, Fax: +86-21-24162277 IMPORTANT NOTICE BCD Semiconductor Manufacturing Limited reserves the right to make changes without further notice to any products or specifi- cations herein. BCD Semiconductor Manufacturing Limited does not assume any responsibility for use of any its products for any particular purpose, nor does BCD Semiconductor Manufacturing Limited assume any liability arising out of the application or use of any its products or circuits. BCD Semiconductor Manufacturing Limited does not convey any license under its patent rights or other rights nor the rights of others. - Wafer Fab Shanghai SIM-BCD Semiconductor Manufacturing Co., Ltd.

800 Yishan Road, Shanghai 200233, China

Tel: +021-6485-1491, Fax: +86-021-5450-0008 MAIN SITE REGIONAL SALES OFFICE Shenzhen Office Shanghai SIM-BCD Semiconductor Manufacturing Co., Ltd., Shenzhen Office Unit A Room 1203,Skyworth Bldg., Gaoxin Ave.1.S., Nanshan District Shenzhen 518057, China Tel: +86-0755-8660-4900, Fax: +86-0755-8660-4958 Taiwan Office (Taipei) BCD Semiconductor (Taiwan) Company Limited Tel: +886-2-2656 2808 Fax: +886-2-2656-2806/26562950 Taiwan Office (Hsinchu) BCD Semiconductor (Taiwan) Company Limited 8F, No.176, Sec. 2, Gong-Dao 5th Road, East District HsinChu City 300, Taiwan, R.O.C Tel: +886-3-5160181, Fax: +886-3-5160181 - Headquarters BCD (Shanghai) Micro-electronics Limited No. 1600, Zi Xing Road, Shanghai ZiZhu Science-based Industrial Park, 200241, P. R.C. Tel: +86-021-2416-2266, Fax: +86-021-2416-2277 USA Office BCD Semiconductor Corp.

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