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Document overview
- Manufacturer or author: Diodes Incorporated
- PDF pages: 16
Technical content
Features
Quasi-Resonant Operation under all Line and Load Condition Non-Audible-Noise Quasi-Resonant Control High-Voltage Startup Embedded VCC LDO to Guarantee Wide Range VCC_IN Voltage Low VCC Charge Current Reduces Standby Power in Output Short Situation Adaptive Burst Mode Operation with Output Voltage Adaptive Output Power Limit with Output Voltage Soft Start during Startup Process Frequency Fold Back for High Average Efficiency Constant Over Current Protection Secondary Winding Short Protection with FOCP Frequency Dithering for Reducing EMI VCC Maintain Mode Useful Pin Fault Protection: SENSE Pin Floating FB/Opto-Coupler Open/Short Comprehensive System Protection Feature: Programmable External OTP Over Load Protection (OLP) Brown In/Out Protection Secondary-Side OVP (SOVP) and UVP (SUVP) SSOP-9 (Type CJ) is Available Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) Halogen and Antimony Free. “Green” Device (Note 3) Pin Assignments (Top View) SSOP-9 (Type CJ)
Applications
Switching AC-DC Adapter/Charger ATX/BTX Auxiliary Power Set-Top Box (STB) Power Supply Open Frame Switching Power Supply Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS), 2011/65/EU (RoHS 2) & 2015/863/EU (RoHS 3) compliant. 2. See https://www.diodes.com/quality/lead-free/ for more information about Diodes Incorporated’s definitions of Halogen - and Antimony-free, "Green" and Lead-free. 3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds.
Document number:DS41016 Rev. 5 - 2 2 of 16 www.diodes.com May 2019 © Diodes Incorporated AP3303 NEW PRODUCT Typical Applications Circuit CY1 R 4 R8C6 C 3 R19 C9 GND GATE FB SENSE VCC-IN AP3303 DEM R18 DRISR VCC GND VDD AREF VDET R20 C12 C13 HV VCC CTRL RT1 APR347 CC1 GND AP43771 OCDRV VCCC15 CC2V5V PWR_EN VBUS VFBIFB OTP ISENP RT2C16 C18 C19 R22 C20 R25 C11 DN DP Vo GND CON1Q3 CC2 CC1 D+AC R11 NTC1 R10 BD1 C2 R14 R15 C10 R13 R12 D9D8 Pin Descriptions Pin Number Pin Name Function
1 CTRL Programmable External Protection
2 FB Feedback. Directly Connected to the Opto-coupler 3 DEM Valley Detection for QR Control. Sample VOUT to Realize SOVP and SUVP Protection
4 VCC_IN Wide Range Input Supply Voltage to Produce VCC
5 GND Signal Ground
6 GATE Gate Driver Output
7 VCC Supply Voltage of Driver and Control Circuits
8 SENSE Sense the Primary Current
9 HV High Voltage Input. Sense Line Voltage and Provide Startup Current to VCC
Document number:DS41016 Rev. 5 - 2 3 of 16 www.diodes.com May 2019 © Diodes Incorporated AP3303 NEW PRODUCT Functional Block Diagram 250ns LEB Soft Driver 12V Timer Jitter 7.3V 7.7V VCC_OVP OLP 35V 33V VCC_OVP UVLO 15.8V 6.7V Internal Bias Auto Recovery Protection AP3303 R PWM BMRef CTRL_H Latch-off Protection FOCP CTRL_L Hold SOVP SSCP SS VDD Vo Sense1.25V FOCP 0.1V QD CLK RB DFF 3.8ms Delay SSCP OTP VCC VDD OTP 0.475V 2.6V SOVP SUVP 50mV Line sense Valley LOVP Brownout 6.0V SUVP 15V VCC UVLO 630VDC LOVP BNO Brownout LOVP CC 105VDC 96VDCHold Hold CPRef CPRef DEM FOCP 4.2V 70ms Debounce OLP 100mA 4.5V 1.0V 10K CTRL_H CTRL_L VDD Line Comp Line Line BMRef Jitter With Jitter SS Valley GND GATE SENSE VCC FB DEM VCC_IN HV CTRL 4 9
Document number:DS41016 Rev. 5 - 2 4 of 16 www.diodes.com May 2019 © Diodes Incorporated AP3303 NEW PRODUCT Absolute Maximum Ratings (Note 4) Symbol Parameter Rating Unit VHV HV Pin Input Voltage 700 V VCC_IN LDO Supply Voltage 120 V VCC Power Supply Voltage 34.5 V IO Gate Output Current 350 mA VFB, VSENSE, VCTRL, VDEM Input Voltage to FB, SENSE, CTRL, DEM -0.3 to 7 V θJA Thermal Resistance (Junction to Ambient) (Note 5) 177 °C/W PD Power Dissipation at TA < +25°C 500 mW TJ Operating Junction Temperature -40 to +150 °C TSTG Storage Temperature Range +150 °C ESD Human Body Model (Except HV Pin and VCC_IN Pin) (Note 6) 3,000 V Charge Device Model 650 V Note: 4. Stresses greater than those listed under Absolute Maximum Ratings can cause permanent damage to the device. These are stress ratings only , and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to Absolute Maximum Ratings for extended periods can affect device reliability. 5. Test condition: Device mounted on FR-4 substrate PC board, 2oz copper, with 1inch2 cooling area. 6. HV devices are ESD sensitive (HBM : VHV = 600V, VCC_IN = 450V). Recommended Operating Conditions Symbol Parameter Min Max Unit VCC Supply Voltage 10 28 V TA Ambient Temperature -40 +85 °C
Document number:DS41016 Rev. 5 - 2 5 of 16 www.diodes.com May 2019 © Diodes Incorporated AP3303 NEW PRODUCT Electrical Characteristics (@TA = -40 to +85° C, VCC = 18V, unless otherwise specified.) Symbol Parameter Condition Min Typ Max Unit Supply Voltage (VCC Pin) IST Startup Current — — 1 15 μA ICC Operating Supply Current VFB = 4V, CL = 0nF (Note 7) 1.2 1.6 2.2 mA ICC-FAULT Operating Current when Fault Occurs VFB = 4V, VSENSE = 0V (Note 7) 0.25 0.4 0.55 VST Startup Voltage — 14.3 15.8 16.3 V VM VCC Maintain Voltage — — 7.3 — V VUVLO Shutdown Voltage — 6.1 6.7 7.1 V VCC-OVP VCC OVP Voltage — 32 33 34 V PWM Section/Oscillator Section fOSC-MAX Maximum Clamp Frequency (Note 7) — 120 — kHz fOSC-MIN Minimum Clamp Frequency (Note 7) 20 24 28 kHz fOSC-JITTER Valley Blanking Time Dithering (Note 7) — ±12 — % tDITHER Frequency Dithering Period — — 4 — ms Current Sense Section (SENSE Pin) VSENSE-MAX Current Limit Threshold IDEM_SOURCE = 200µA 0.89 0.96 1.04 V VTH-FOCP FOCP Voltage — — 1.25 — V tDELAY-FOCP FOCP Debounce Time (Note 8) — — 7 — Cycles tLEB Leading Edge Blanking Time — 150 250 350 ns VTH-SSCP SSCP Voltage — — 100 — mV tSOFT-ST Soft-Start Time — 3 4 8 ms tDELAY-SENSE Sense Propagation Delay (Note 9) — — 100 — ns Feedback Input Section (FB Pin) KFB-SENSE The Ratio of Input Voltage to Current Sense Voltage (Note 9) — — 4 — V/V RFB Input Impedance — 20 30 40 kΩ IFB-SOURCE Source Current VFB = 0V 0.1 0.2 0.3 mA GQR QR Mode Frequency Modulation Slope Versus VFB (Note 9) — — 94 — kHz/V VBURST Threshold for Entering Burst Mode VDEM < 0.75V — 0.66 — V 0.75V < VDEM < 1.45V — 0.8 — V VDEM > 1.45V — 0.933 — V tON-MAX Maximum on Time (Note 7) 16 18.5 21 μs tDELAY-OLP Delay of Over Load Protection (Note 9) — — 70 — ms VFB-OLP Over Load Protection (Note 9) — — 4.2 — V Notes: 7. Data measured in IC test mode. 8. Cycle-by-Cycle limit delay time contains OCP comparator delay time and driver delay time, Guaranteed by design. 9. Guaranteed by design.
Document number:DS41016 Rev. 5 - 2 6 of 16 www.diodes.com May 2019 © Diodes Incorporated AP3303 NEW PRODUCT Electrical Characteristics (@TA = -40 to +85° C, VCC = 18V, unless otherwise specified.) (continued) Symbol Parameter Condition Min Typ Max Unit Output Section (GATE Pin) VGATE-L Output Low Level (Note 9) IO = 20mA, VCC = 12V — — 1 V VGATE-H Output High Level (Note 9) IO = 20mA, VCC = 12V 7 — — V VGATE-CLP Output Clamping Voltage — 7.6 — 9.6 V tGATE-RISE Rising Time (Note 9) CL = 1nF, VCC = 13V — 150 300 ns tGATE-FALL Falling Time (Note 9) CL = 1nF, VCC = 13V — 50 100 ns Demagnetization Section (DEM Pin) VTH-DEM De-Magnetization Voltage (Note 9) — — 50 — mV VCLP-L Low Level for Clamping Voltage IDEM = 200µ A (Source Current) -50 -5 — mV VCLP-H High Level for Clamping Voltage IDEM = -1mA (Sink Current) — 6 — V VTH-SOVP-L SOVP Threshold for Startup — 1.0 1.1 1.2 V VTH-SOVP-H SOVP Threshold for Steady State — 2.5 2.6 2.7 V tDEB-SOVP SOVP Debounce Time — — 7 — Cycle VTH-SUVP-L SUVP Threshold for Hiccup — — 0.475 — V tDEB-SUVP SUVP Debounce Time — — 7 — Cycle tBLANK-SUVP SUVP Blank Time after Startup — 15 20 25 ms tSAMPLE Sample Delay Time (Note 9) — — 2 — µs LDO Section ( VCC_IN Pin/VCC Pin ) VCC LDO Regulated Voltage (Power Supply Voltage) VCC Open, VCC_IN = 10V 9.0 9.8 10 V VCC Open, VCC_IN = 40V 14 15 16 V ILDO Operating Current VCC = 12V, VCC_IN = 40V 6 8 11 mA HV Section (HV Pin) ICHARGE-L Charge Current VCC = 0V, VHV = 100V — 0.23 — mA ICHARGE-H VCC = 6V, VHV = 100V — 2 — mA ICHARGE-FAULT Charge Current if Fault Occurs VCC = 6V, VHV = 100V — 100 — µA VBR-IN Brown In Voltage — 100 105 110 V VBR-OUT Brown Out Voltage — 92 97 102 V tBR-IN Delay of Brown In (Note 9) — — 100 — µs tBR-OUT Delay of Brown Out (Note 9) — — 50 — ms VLOVP Line OVP (Note 9) — — 630 — V VHV HV Pin Input Voltage (Note 10) — — — 700 V Notes: 9. Guaranteed by design. 10. The drain-source voltage is 80% of VDS in the aging condition.
Document number:DS41016 Rev. 5 - 2 7 of 16 www.diodes.com May 2019 © Diodes Incorporated AP3303 NEW PRODUCT Electrical Characteristics (@TA = -40 to +85° C, VCC = 18V, unless otherwise specified.) (continued) Symbol Parameter Condition Min Typ Max Unit Protection Section (CTRL Pin) ICTRL-SOURCE Source Current — -110 -100 -90 μA VTH-CTRL-L Low Threshold — 0.97 1 1.03 V tCTRL-BLANK Blank Time when VCTRL is Low — — 20 — ms VTH-CTRL-H High Threshold — 2.9 3 3.1 V VCTRL-CLP Clamp Voltage (Note 11) ICTRL= -2mA — 4.5 — V tDELAY-HICC Delay of Hiccup Protection (Note 9) SUVP, SOVP, Line OVP, VCC OVP, FOCP, SSCP, CTRL Pin Protection — 7 — Cycles Internal OTP Section OTP OTP Threshold (Note 9) — — +150 — °C THYS OTP Recovery Hysteresis tDEB-OTP OTP Debounce Time — — 7 — Cycle Notes: 9. Guaranteed by design. 11. The sourcing current of CTRL pin must be limited below 5mA. Otherwise it may cause permanent damage to the device. Performance Characteristics Startup Voltage vs. Ambient Temperature VUVLO vs. Ambient Temperature VTH-SUVP-L vs. Ambient Temperature FB Pin Input Impedance vs. Ambient Temperature -40 -20 0 20 40 60 80 100 VUVLO (V) Ambient Temperature ( o -40 -20 0 20 40 60 80 100 VST (V) Ambient Temperature ( o -40 -20 0 20 40 60 80 100 FB Pin Input Impedance (k) Ambient Temperature ( o -40 -20 0 20 40 60 80 100 0.1 0.2 0.3 0.4 0.5 0.6 VTH-SUVP-L (V) Ambient Temperature ( o
Document number:DS41016 Rev. 5 - 2 8 of 16 www.diodes.com May 2019 © Diodes Incorporated AP3303 NEW PRODUCT Performance Characteristics (continued) ILDO vs. Ambient Temperature VBR-IN vs. Ambient Temperature VTH-SOVP-L vs. Ambient Temperature -40 -20 0 20 40 60 80 100 100 105 110 VBR-IN (V) Ambient Temperature ( o -40 -20 0 20 40 60 80 100 6.0 6.5 7.0 7.5 8.0 8.5 9.0 9.5 10.0 ILDO (mA) Ambient Temperature ( o -40 -20 0 20 40 60 80 100 0.6 0.8 1.0 1.2 1.4 VTH-SOVP-L (V) Ambient Temperature ( o
Document number:DS41016 Rev. 5 - 2 11 of 16 www.diodes.com May 2019 © Diodes Incorporated AP3303 NEW PRODUCT Operation Description (continued) Constant Over Current Protection Cycle-by-cycle current limit is a popular method to achieve output over current protection. Act ually, the turn -off delay of the MOSFET and the higher switching frequency always result in the higher OCP current at high line voltage. To obtain a constant OCP current val ue with universal input voltage, AP3303 adopts an effective line compensation circu itry. The function block is illustrated in Figure 4. The current IDEM which reflects line voltage is scaled down and inversed to IL_OPP within AP3303, this IL_OPP flows through the inner compensation resistor ROPP and an external filtering resistor RF, and then the final line compensation voltage is formed as: Where VS is the sense voltage of RS As above formula indicates, changing the compensation voltage at different line voltage is a good way to balance the OCP curr ent. In a real system, usually keep the value fixed (220kΩ is recommended). To change the line compensation voltage, a good solution is to change . Whenever the RF is changed, adjust the CF at the same time to offer an enough RC time to filter the spike on SENSE pin. DEM Line Voltage Detector IL_OPP Auxiliary RDEM RDOWN ROPP OCPVREF1 HV Gate Rs RF CF SENSE SOVP2.6V SUVP 0.475V IDEM Vs Figure 4 HV Start-Up Circuit A built-in HV Start-Up circuit in AP3303 can help to simplify the power system design for ultra low standby application. For AP3303, there are two HV Start-Up charging current s: the I CHARGE-L when VCC is lower than 3V and the I CHARGE-H when the V CC voltage rises above 3V, which can prevent the IC from overheat when V CC short- to-GND fault happens. The HV Start -Up circuit will stop working and have no additional power dissipation when VCC voltage reaches the VST, then the AP3303 starts working and will supply energy to VCC from auxiliary winding. However, the charg ing process described above is only for the normal system startup condition. Once some system faults occur and the protection process is triggered, AP3303 will shut down and VCC voltage will begin to decrease. The HV Start-Up circuit starts working again when VCC voltage decreases below V CC-UVLO, and charges the V CC capacitor with current of I CHARGE-FAULT. This special design can reduce the input power dissipation when system fault happens, especially for output short condition. The HV Start-Up circuit working process is illustrated in Figure
Document number:DS41016 Rev. 5 - 2 13 of 16 www.diodes.com May 2019 © Diodes Incorporated AP3303 NEW PRODUCT Operation Description (continued) Externally Triggered Protection The AP3303 reserves flexible protection mode for power design. The CTRL pin can achieve external programmable protection. A high threshold of VTH-CTRL-H is set for any over voltage protection . If the CTRL pin voltage is higher than the threshold for 7 switching cycle s, the CTRL -High protection will be triggered. A low threshold of V TH-CTRL-L is usually used for external over temperature protection. To realize the external OTP, a proper NTC should be connected from the CTRL pin to the ground. An inner current of 100µA flows through the NTC from the CTRL pin. If the CTRL pin voltage is lower than the VTH-CTRL-L for 32ms duration at least, the CTRL-Low protection will be triggered. Whenever the protection is triggered, the system will stop the output drive signal and will restart after the VCC voltage falling below the UVLO voltage. System Protection LOVP, FOCP, SSCP, VCC OVP, OTP The AP3303 provides versatile protection to ensure the reliability of the power system. LOVP achieves line voltage overvoltage protectio n, if the detected AC line voltage is higher than V LOVP for 7 switching cycles, the LOVP protection will be triggered. FOCP protec tion is an ultra-fast short- current protection which is helpful to avoid catastrophic damage of the system when the secondary rectifier is short. The pri mary peak current will be monitored by SENSE pin through a primary sense resistor, whenever the sampled voltage reaches the threshold of V TH-FOCP for 7 switching cycles continuously, the FOCP protection will be activated to shut down the switching pulse. SSCP might be triggered at ultra -low DC bus voltage condition or other failure condition that short the SENSE pin to ground. The SSCP module senses the voltage across the primary sense resistor with a delay of 3µ s after the rising edge of primary GATE signal, this sensed signal is compared with V TH-SSCP. If it is lower than V TH-SSCP for 7 switching cycles, the SSCP protection will be triggered and the drive signal will be disabled. All these protections describe d above will restart the system when the V CC voltage falls below UVLO. Although the external OTP can be easily implemented through CTRL pin, the AP3303 still reserves the inner OTP with a hysteresis for any necessary use. VCC Maintain Mode During light-load or transient-load condition, VFB will drop and be lower than VBURST, thus the PWM drive signal will be stopped, and there is no energy for transferring to the output. Therefore, the IC VCC supply voltage may decrease to the UVLO threshold voltage and system may enter the unexpected restart mode. To avoid this, the AP3303 holds a so-called VCC maintain mode which can supply energy to VCC. When VCC decreases to a setting threshold as VM, the VCC maintain mode will be awaked and a charging current of ICHARGE-H will flow to the VCC pin. With VCC maintain mode, the VCC is not easy to touch the shutdown threshold during the startup process and transient load condition. This will also simplify the system design. The minimum V CC voltage is suggested to be designed a little higher than V CC maintain threshold thus can achieve the best balance between the power loss and step load performance. Leading-Edge Blanking Time A narrow spike on the leading edge of the current waveform can usually be observed when the power MOSFET is turned on. A 250n s leading- edge blank is built -in to prevent the false -trigger caused by the turn -on spike. During this period, the current limit comparator and the PWM comparator are disabled and the gate driver cannot be switched off. At the time of turning -off the MOSFET, a negative undershoot (mayb e larger than -0.3V) can occur on the SENSE pin. So it is strongly recommended to add a small RC filter or at least connect a resistor “R” on this pin to protect the IC (Shown as Figure 7). SENSE GATE Large undershoot (more than -0.3V) may damage the SENSE pin R C Necessary Figure 7
Document number:DS41016 Rev. 5 - 2 14 of 16 www.diodes.com May 2019 © Diodes Incorporated AP3303 NEW PRODUCT
Ordering Information
13 : Tape and Reel Product Name PackingPackage S9 : SSOP-9 (Type CJ) Part Number Package Marking ID Packing AP3303S9-13 SSOP-9 (Type CJ) AP3303 4000/Tape and Reel Marking Information SSOP-9 (Type CJ) AP3303 (Top View) YY WW X X Marking ID Logo WW : Week : 01~52; 52 YY : Year : 19, 20, 21 ~ X X : Internal Code 1 2 3 4 represents 52 and 53 week 9 8 7 6
Document number:DS41016 Rev. 5 - 2 15 of 16 www.diodes.com May 2019 © Diodes Incorporated AP3303 NEW PRODUCT Package Outline Dimensions (All dimensions in mm) Please see http://www.diodes.com/package-outlines.html for the latest version. (1) Package Type: SSOP-9 (Type CJ) SSOP-9 (Type CJ) Dim Min Max Typ A 1.35 1.75 -- A1 0.10 0.25 -- A2 1.350 1.550 -- b 0.270 0.430 -- c 0.170 0.258 -- D 4.70 5.10 -- E 5.80 6.20 -- E1 3.80 4.00 -- e -- -- 1.00 L 0.40 1.27 -- θ 0 8 -- All Dimensions in mm Suggested Pad Layout Please see http://www.diodes.com/package-outlines.html for the latest version. (1) Package Type: SSOP-9 (Type CJ) Dimensions Value (in mm) C 1.00 G 3.40 X 0.60 Y 2.00 Y1 7.40 be E A D A1c L XC Y1G Y
Document number:DS41016 Rev. 5 - 2 16 of 16 www.diodes.com May 2019 © Diodes Incorporated AP3303 NEW PRODUCT IMPORTANT NOTICE DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the application or use of this document or any product described herein; neither does Diodes Incorporated convey any license unde r its patent or trademark rights, nor the rights of others. Any Customer or user of th is document or products described herein in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diod es Incorporated website, harmless against all damages. Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel. Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising ou t of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application. Products described herein may be covered by one or more United States, internation al or foreign patents pending. Product names and markings noted herein may also be covered by one or more United States, international or foreign trademarks. This document is written in English but may be translated into mul tiple languages for reference. Only the English version of this document is the final and determinative format released by Diodes Incorporated. LIFE SUPPORT Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the ex press written approval of the Chief Executive Officer of Diodes Incorporated. As used herein: A. Life support devices or systems are devices or systems which: 1. are intended to implant into the body, or 2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided i n the labeling can be reasonably expected to result in significant injury to the user. B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support d evices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety -critical, life support devices or systems, notwithstanding any devices - or systems -related information or support that may be pr ovided by Diodes Incor porated. Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems. Copyright © 2019, Diodes Incorporated www.diodes.com