AP3301
Document overview
- Manufacturer or author: Diodes Incorporated
- PDF pages: 16
Technical content
Features
Very Low Start-up Current Multi-Mode Control Quasi-Resonant Operation with Valley Lock Fixed Frequency CCM Operation at Low Line Heavy Load Non-Audible-Noise Quasi-Resonant Control Internal Slope Compensation Soft Start During Startup Process Frequency Fold Back for High Average Efficiency Secondary Winding Short Protection with FOCP Frequency dithering for Reducing EMI VCC Maintain Mode Useful Pin Fault Protection: SENSE Pin Floating FB/Opto-coupler Open/Short Comprehensive System Protection Feature: VCC Over Voltage Protection (VOVP) Over Load Protection (OLP) Brown Out Protection (BNO) Secondary Side OVP (SOVP) Mini Size Package of SOT26 Totally Lead-free & Fully RoHS Compliant (Notes 1 & 2) Halogen and Antimony Free. “Green” Device (Note 3) Pin Assignments (Top View) SOT26
Applications
Switching AC-DC Adapter/Charger ATX/BTX Auxiliary Power Set-Top Box (STB) Power Supply Open Frame Switching Power Supply Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. 2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen - and Antimony-free, "Green" and Lead-free. 3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds. 3 4 Pin 1 Mark 6GND FB DEM GATE VCC SENSE
Document number: DS38018 Rev. 5 - 2 2 of 16 www.diodes.com October 2016 © Diodes Incorporated AP3301 NEW PRODUCT Typical Applications Circuit Pin Descriptions Pin Number Pin Name Function 1 GND Signal ground. Current return for driver and control circuits 2 FB Feedback. Directly connected to the opto-coupler
3 DEM Valley detection for QR control, AC line voltage detection for Brown-in/Brown-out trigger current
4 SENSE Current Sense
5 VCC Supply voltage of driver and control circuits
6 GATE Gate driver output
Document number: DS38018 Rev. 5 - 2 3 of 16 www.diodes.com October 2016 © Diodes Incorporated AP3301 NEW PRODUCT Functional Block Diagram FB SENSE 6.4R DEM GATE GND VCC VDD Slope Compensation Line Voltage Detector Valley Switching SOVP3.8V IL_OPP BNO Valley OSC Tb1 Tb2 Burst0.6V/0.7V 1.3V 65mS OLP Soft Start LEB Jitter D CLK Q OPP QR Law Tb1 Tb2 Valley QR_ON ON Logic IL_OPP ON Power & Fault Management VCC 16V/7.6V Bias VDD 28V VCC_OVP VCC_OVP OLP OTP SOVP 1.8V FOCP FOCP BNO Tb1 Tb2 Burst FOCP VDD
Document number: DS38018 Rev. 5 - 2 4 of 16 www.diodes.com October 2016 © Diodes Incorporated AP3301 NEW PRODUCT Absolute Maximum Ratings (Note 4) Symbol Parameter Rating Unit VCC Power Supply Voltage 30 V IO Gate Output Current 350 mA VFB, VSENSE, VDEM Input Voltage to FB, SENSE,DEM -0.3 to 7 V θJA Thermal Resistance (Junction to Ambient) 250 °C/W PD Power Dissipation at TA < +25°C 500 mW TJ Operating Junction Temperature -40 to +150 °C TSTG Storage Temperature Range +150 °C – ESD (Human Body Model) 3000 V – ESD (Machine Model) 200 V Note 4: Stresses greater than those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. Thes e are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “Recommended Operating Condi tions” is not implied. Exposure to “Absolute Maximum Ratings” for extended periods may affect device reliability. Recommended Operating Conditions Symbol Parameter Min Max Unit VCC Supply Voltage 10 25 V TA Ambient Temperature -40 +85 °C
Document number: DS38018 Rev. 5 - 2 5 of 16 www.diodes.com October 2016 © Diodes Incorporated AP3301 NEW PRODUCT Electrical Characteristics (@TA = -40 to +85° C, VCC =18V, unless otherwise specified.) Symbol Parameter Conditions Min Typ Max Unit Supply Voltage (VCC Pin) IST Startup Current – – 1 5 μA ICC Operating Supply Current VFB=4V, CL=0nF (Note 5) 1.5 1.8 2 mA ICC-FAULT Operating Current If Fault Occurs VFB=4V, VCS=0V (Note 5) 0.15 0.3 0.45 mA VST Startup Voltage – 14.5 15.8 16.5 V VM VCC Maintain – 9.0 9.4 9.8 V VUVLO Shutdown Voltage – 7.1 7.6 8.1 V VCC-OVP VCC OVP – 27 28.5 30 V PWM Section/Oscillator Section fOSC-CCM CCM Oscillation Frequency – 57 62 67 kHz fOSC-MAXC Maximum Clamp Frequency – 110 120 130 kHz fOSC-GREEN Green Mode Frequency – 18 – 25 kHz fOSC-JITTER Frequency Dithering CCM (Note 6) – ±8 ±12 % Current Sense Section (SENSE Pin) VCS-MAX Maximum SENSE Voltage IDEM_SOURCE=150µA 0.8 0.88 0.96 V VTH-FOCP FOCP Voltage – 1.6 1.8 2.0 V tDELAY-FOCP FOCP Debounce Time (Note 6) – – 6 – Cycles tLEB LEB Time of SENSE – 150 250 350 ns tDELAY-CS Delay to Output (Note 6) – – 150 – ns Feedback Input Section (FB Pin) KFB-CS The Ratio of Input Voltage to Current Sense Voltage – – 3 – V/V RFB Input Impedance – 15 20 25 kΩ IFB-SOURCE Source Current VFB=0V 0.15 0.25 0.35 mA VFB-GREEN The Threshold Enter QR Mode – – 3 – V GQR QR Mode Frequency Modulation Slope Versus VFB – – 140 – kHz/V VBURST Input Voltage for Zero Duty – 1.35 1.55 1.75 V VFB-OLP Over Load Protection – – 4.5 – V tON-MAX Maximum On Time – 11 13 16 μs tSOFT-ST Soft-Start Time – – 5 – ms tDELAY-OLP Delay of Over Load Protection – – 70 – ms
Document number: DS38018 Rev. 5 - 2 6 of 16 www.diodes.com October 2016 © Diodes Incorporated AP3301 NEW PRODUCT Electrical Characteristics (Cont.) (@TA =-40 to +85° C, VCC =18V, unless otherwise specified.) Symbol Parameter Conditions Min Typ Max Unit Output Section (GATE Pin) VGATE-L Output Low Level IO=20mA, VCC=12V – – 1 V VGATE-H Output High Level IO=20mA, VCC=12V 8 – – V VGATE-CLP Output Clamping Voltage – 11 13 15 V tGATE-RISE Rising Time (Note 6) CL=1nF, VCC=13V – 140 200 ns tGATE-FALL Falling Time (Note 6) CL=1nF, VCC=13V – 50 100 ns Demagnetization Section (DEM Pin) VTH-DEM De-Magnetization Voltage – – 75 – mV IBNI Brown In Reference – 80 85 90 μA IBNO Brown Out Reference – 72 79 84 μA VTH-SOVP SOVP Threshold – 3.5 3.8 4.1 V tSAMPLE Sample Delay Time (Note 6) – – 2.5 – µs Delay Time Section tDELAY-BNO Brown Out Debounce Time – – 50 – ms tDELAY-LATCH Delay of Lacth Protection (Note 6) SOVP, VCC OVP – 6 – Cycles Internal OTP Section OTP OTP Enter (Note 6) – – +150 – °C THYS OTP Exit (Note 6) – – +125 – °C Notes: 5. Data measured in IC test mode. 6. Guaranteed by design.
Document number: DS38018 Rev. 5 - 2 7 of 16 www.diodes.com October 2016 © Diodes Incorporated AP3301 NEW PRODUCT Performance Characteristics Startup Voltage vs. Ambient Temperature Shutdown Voltage vs. Ambient Temperature Startup Current vs. Ambient Temperature Operating Current vs. Ambient Temperature -40 -20 0 20 40 60 80 100 120 140 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 Startup Current (A) Ambient Temperature ( o CCM Frequency vs. Ambient Temperature CCM Frequency vs. VCC -40 -20 0 20 40 60 80 100 120 1.0 1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8 1.9 2.0 Operating Current (mA) Ambient Temperature ( o VFB=3V, CL=0nF -40 -20 0 20 40 60 80 100 120 140 Startup Voltage (V) Ambient Temperature ( o -40 -20 0 20 40 60 80 100 120 140 6.6 6.8 7.0 7.2 7.4 7.6 7.8 8.0 8.2 8.4 8.6 8.8 9.0 Shutdown Voltage (V) Ambient Temperature ( o -40 -20 0 20 40 60 80 100 120 CCM Frequency (kHz) Ambient Temperature ( o VCC=18V 12 14 16 18 20 22 24 26 60.0 60.5 61.0 61.5 62.0 62.5 63.0 63.5 64.0 64.5 65.0 CCM Frequency (kHz) VCC (V)
Document number: DS38018 Rev. 5 - 2 8 of 16 www.diodes.com October 2016 © Diodes Incorporated AP3301 NEW PRODUCT Performance Characteristics (Cont.) VCC OVP vs. Ambient Temperature Green Mode Frequency vs. Ambient Temperature Maximum Clamp Frequency vs. Ambient Temperature FB Pin Input Impedance vs. Ambient Temperature VBURST vs. Ambient Temperature IBNI vs. Ambient Temperature -40 -20 0 20 40 60 80 100 120 28.0 28.2 28.4 28.6 28.8 29.0 29.2 29.4 29.6 29.8 30.0 VCC OVP (V) Ambient Temperature ( o -40 -20 0 20 40 60 80 100 120 Green Mode Frequency (kHz) Ambient Temperature ( o -40 -20 0 20 40 60 80 100 120 100 105 110 115 120 125 130 135 140 145 150 Maximum Clamp Frequency (kHz) Ambient Temperature ( o -40 -20 0 20 40 60 80 100 120 1.0 1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8 1.9 2.0 VBURST (V) Ambient Temperature ( o -40 -20 0 20 40 60 80 100 120 100 IBNI (A) Ambient Temperature ( o -40 -20 0 20 40 60 80 100 120 140 FB Pin Input Impedance (k) Ambient Temperature ( o
Document number: DS38018 Rev. 5 - 2 9 of 16 www.diodes.com October 2016 © Diodes Incorporated AP3301 NEW PRODUCT Performance Characteristics (Cont.) IBNO vs. Ambient Temperature VM vs. Ambient Temperature PIN3 Utilization for BNO/SOVP/OCP COMP DEM VCC SOVP/IBNI/IBNO Operation Description The AP3301 realizes Multi-Mode Operation including Burst mode, QR mode and CCM mode, which is specifically designed for off -line AC-DC power supply used in LCD moni tor, notebook adapter and battery charger applications. At medium load, the IC will enter valley lock QR mode with frequency foldback to improve system efficiency and EMI performance. It offers a cost effective solution with a versatile protection function. Figure 1 -40 -20 0 20 40 60 80 100 120 IBNO (A) Ambient Temperature ( o -40 -20 0 20 40 60 80 100 120 9.0 9.1 9.2 9.3 9.4 9.5 9.6 9.7 9.8 VM (V) Ambient Temperature ( o
Document number: DS38018 Rev. 5 - 2 10 of 16 www.diodes.com October 2016 © Diodes Incorporated AP3301 NEW PRODUCT Operation Description (Cont.) Multi-Mode Operation The switching frequency curve in Figure 1 shows three operation modes. Burst Mode At no load and light load, the system will operate at burst mode. In burst mode, the switching frequency i s fixed at about 22 kHz to avoid audible noise. When the FB voltage is lower than 1.55V, the controller will not provide driving signal and the FB voltage will rise above 1.65V, then the driving signal will resume. By this control strategy, the system will eliminate a bunch of pulses and the power loss is reduced. QR Mode QR is the abbreviation of Quasi-Resonant which means that the power MOSFET is forced to turn on at valleys of VDS. With QR control, the switching power loss will be reduced by lower voltag e stress of MOSFET. The V DS valley is detected by DEM pin through the voltage divider network of R DEM and RSOVP, once the divided voltage is less than 75mV during turning off internal of MOSFET, the counter in AP3301 will count it as one valley. At light l oad and medium load, the system will enter QR mode. As the load changes , the trend of the switching frequency in QR mode is modulated by AP3301 and following the internal arithmetic it is increased or decreased. In general when the turning -on valley change s, the frequency will jump to a new value, this frequency jump transit s quickly and the turning -on valley changes between two neighboring valleys back and forth , t his unstable condition introduces unacceptable audible noise. In benefit of Diodes proprietary “ Valley Lock” technology, the turning on valley is locked and will not switch iteratively when the load is changed. Meanwhile, the frequency dithering function is built in to reduce EMI emission. As Figure 2 shows, switching frequencies between the power increase and power decrease line are a little different because of the inherent characteristic of valley-lock QR control, and it will result in a tiny difference in efficiency. When the load increases, the switching frequency is also increased, a frequenc y of 120kHz is set to clamp the maximum operating frequency, if this 120 kHz is touched, the system will operate in normal DCM mode, and will return to QR if the load continues to increase. CCM Mode With the load increases, if the switching frequency decr eases below 62kHz in valley1 mode , CCM mode is implemented to achieve high efficiency. Usually at low line voltage, the system will enter CCM mode at heavy load, while high line voltage the system may still operate at QR mode with 1st or 2nd valley on. Start-up Current and UVLO The start-up current of AP3301 is optimized to realize ultra low current (1 A typical) so that VCC capacitor can be charged more quickly. The direct benefit of low start-up current is the availability of using large start-up resistor, which minimizes the resistor power loss for high voltage AC input. An UVLO comparator is inclu ded in AP3301 to detect the voltage on VCC pin. It ensures that AP3301 can draw adequate energy from hold -up capacitor during power-on. The turn-on threshold is 15.8V and the turn-off threshold is 7.6V. Current Sense Comparator and PWM Latch The AP3301 operates as a current mode controller, the output switch conduction is initiated by every oscillator cycle and is terminated w hen the peak inductor current reaches the threshold level established by the FB pin. The inductor current signal is converted to a voltage signal by inserting a reference sense resistor R S. The inductor current under normal operating conditions is controlled by the voltage at FB pin. The relation between peak inductor current (IPK) and VFB is: SFBPK RVI 3/)0.1( Moreover, FOCP with 1.8V threshold is only about tDELAY-FOCP delay, which can avoid some catastrophic damages such as secondary rectifier short test. Few drive cycles can alleviate the destruction range and get better protection. Leading-edge Blanking A narrow spike on the leading edge of the current waveform can usually be observed when the power MOSFET is turned on. A tLEB time leading- edge blank is built-in to prevent the false-triggering caused by the turn-on spike. During this period, the current limit comparator i s disabled and the gate driver cannot be switched off. At the time of turning off the MOSFET, a negative undershoot (maybe larger than -0.3V) can occur on the SENSE pin. So it is strongly recommended to add a small RC filter or at least connect a resistor “R” on this pin to protect the IC (Shown as Figure 2).
Document number: DS38018 Rev. 5 - 2 11 of 16 www.diodes.com October 2016 © Diodes Incorporated AP3301 NEW PRODUCT Operation Description (Cont.) Figure 2 Built-in Slope Compensation It is well known that a continuous current mode SMPS may become unstable when the duty cycle exceeds 50%. The built-in slope compensation can improve the stability, so there is no need for design engineer to spend much time on that. FB Pin and Short Circuit Protection This pin is normally connected to the opto -coupler and always paralleled with a capacitor for loop compensation. When the voltage at this pin is greater than VFB-OLP and lasts for about tDELAY-OLP, the IC will enter the protection mode. For AP3301, the system will enter hiccup mode to wait the VCC decreasing to low UVLO level, then the IC will try to restart until the failure removed. And when this voltage is less than 1.55V, the IC will stop the drive pulse immediately. Therefore, this feature can be used for short circuit protection, which makes the system immune from damage. Normally, output short makes the VFB value to the maximum because the opto-coupler is cut off. When VCC decreases to a setting threshold, the V CC maintain comparator will output some drive signal to make the system switch and provide a proper energy to VCC pin. The V CC maintain function will cooperate with the PWM and burst mode loop which can make the output voltage variation be within the regulation. This mode is very useful for reducing startup resistor loss and achieving a better standb y performance with a low value VCC capacitor. The VCC is not easy to touch the shutdown threshold during the startup process and step load. This will also simplify the system design. The minimum VCC voltage is suggested to be designed a little higher than V CC maintain threshold thus can achie ve the best balance between the standby and step load performance. Brown-in/Brown-out During turning-on interval of primary power MOSFET, the DEM pin is clamped to GND, the current flows through R DEM and pin DEM reflecting the rectified value of AC line voltage as showed as Figure 3, this current multiplies with R BNO represents the sample voltage of AC line voltage, take the peak value of the sample voltage to compare with the internal fixed threshold. When the AC source is on, the IC will send several d rive signals to confirm that the DEM pin current is higher than IBNI during primary MOSFET turning on time, then AP3301 starts to provide drive signal, and if the current decreases below IBNO for about 50ms, AP3301 enters brown out protection and no drive pulse output, a new startup will not begin until the sampled signal is lower than IBNI again and VCC is higher than VUVLO threshold. FB SENSE GATE GND DEM 6 AP3301 VCC Large undershoot (more than -0.3V) may damage the SENSE pin R C Necessary
Document number: DS38018 Rev. 5 - 2 12 of 16 www.diodes.com October 2016 © Diodes Incorporated AP3301 NEW PRODUCT Operation Description (Cont.) Figure 3 SOVP Protection Function For some applications, the system requires the output over voltage protection function. The DEM pin compares the divided voltage from the VCC winding with the inner threshold, when the voltage between R DEM and RSOVP is higher than VTH-SOVP during primary power MOSFET turning off duration, AP3301 will trigger SOVP function and the system will enter the latch protection mode. Since the value of VCC winding’s waveform reflects the output voltage precisely, the Secondary Output Voltage Protection (SOVP) can be achieved by this function. Other System Protection and Pin Fault Protection The AP3301 provides versatile system and p in fault protections. The OCP comparator realizes the cycle -by-cycle current limiting (OCP). In universal input line voltage, the IC realizes the constant over load protection (OLP). VCC over voltage protection can be app lied as the primary OVP or opto-coupler broken protection. The AP3301 also has pin fault connection protection including floating and short connection. The floa ting pin protection includes the SENSE, FB, etc. The short pin protection includes the DEM pin short protection. When these pins a re floated or DEM pin is shorted to ground, PWM switching will be disabled, thus protecting the power system. Internal OTP Protection Function The AP3301 integrates an internal temperature sensor. It has a trigger window of entering OTP mode at +150° C an d exiting at +125° C. The internal OTP protection mode is auto-recovery mode. DEM
3 Line Voltage
BNO VREF _ H VREF _ L 1 1 : HV Gate RS RF CF SENSE Inside AP 3301 IL_OPP IL_BNO IBNI/IBNO
Document number: DS38018 Rev. 5 - 2 13 of 16 www.diodes.com October 2016 © Diodes Incorporated AP3301 NEW PRODUCT
Ordering Information
TR : Tape & Reel G1 : Green Product Name RoHS/GreenPackage K6 : SOT26 Package Part Number Marking ID Packing SOT26 AP3301K6TR-G1 GTC 3000/Tape & Reel Marking Information (Top View) : Logo XXX: Marking ID (See Ordering Information)
Document number: DS38018 Rev. 5 - 2 14 of 16 www.diodes.com October 2016 © Diodes Incorporated AP3301 NEW PRODUCT Package Outline Dimensions (All dimensions in mm(inch).) (1) Package Type: SOT26 2.820(0.111) 3.100(0.122) 2.650(0.104) 3.000(0.118) 1.500(0.059) 1.700(0.067) 0.950(0.037)TYP 1.800(0.071) 2.000(0.079) 0.300(0.012) 0.500(0.020) 0.700(0.028)REF 0.100(0.004) 0.200(0.008) 0.200(0.008) 0.300(0.012) 0.600(0.024) 0.000(0.000) 0.150(0.006) 0.900(0.035) 1.300(0.051) 1.450(0.057) MAX 1 2 3 456 Pin 1 Mark
Document number: DS38018 Rev. 5 - 2 15 of 16 www.diodes.com October 2016 © Diodes Incorporated AP3301 NEW PRODUCT Suggested Pad Layout (1) Package Type: SOT26 E E G Z Y X Dimensions Z (mm)/(inch) G (mm)/(inch) X (mm)/(inch) Y (mm)/(inch) E (mm)/(inch)
Document number: DS38018 Rev. 5 - 2 16 of 16 www.diodes.com October 2016 © Diodes Incorporated AP3301 NEW PRODUCT IMPORTANT NOTICE DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). Diodes Incorporated and its subsidiaries re serve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability a rising out of the application or us e of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such appli cations shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diod es Incorporated website, harmless against all damages. Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel. Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and hold Diodes Incorporated and i ts representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application. Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings noted herein may also be covered by one or more United States, international or foreign trademarks. This document is written in English but may b e translated into multiple languages for reference. Only the English version of this document is the final and determinative format released by Diodes Incorporated. LIFE SUPPORT Diodes Incorporated products are specifically not authorized for use as cri tical components in life support devices or systems without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein: A. Life support devices or systems are devices or systems which: 1. are intended to implant into the body, or 2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided i n the labeling can be reasonably expected to result in significant injury to the user. B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety -critical, life support devices or systems, notwithstanding any devices - or systems -related information or support that may be provided by Diodes Incorporated. Furthe r, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems. Copyright © 2016, Diodes Incorporated www.diodes.com