AP3211
Document overview
- Manufacturer or author: Diodes Incorporated
- PDF pages: 11
Technical content
Features
Input Voltage Range: 4.5V to 18V Output Voltage Adjustable from 0.81V to 15V Fixed 1.4MHz Frequency High Efficiency: up to 92% Output Current: 1.5A Current Mode Control Built-In Over Current Protection Built-In Thermal Shutdown Function Built-In UVLO Function Built-In Over Voltage Protection Built-In Soft-Start Pin Assignments (Top View) BS GND FB EN IN SW 3 4 Pin 1 Mark SOT-23-6
Applications
LCD TV DPF Portable DVD Typical Applications Circuit 49.9k 16.3k IN EN BS SW FB L1 4.7mH C1 10mF 25V VIN=12V GND CB 10nF 22mF 6.3V VOUT=3.3V (1.5A) ON OFF AP3211
Document number: DS41396 Rev. 2 - 2 2 of 11 www.diodes.com September 2018 © Diodes Incorporated AP3211 Pin Descriptions Pin Number Pin Name Function 1 BS Bootstrap pin. A bootstrap capacitor is connected between the BS pin and SW pin. The voltage across the bootstrap capacitor drives the internal high-side NMOS switch.
2 GND Ground pin
Feedback pin. This pin is connected to an external resistor divider to program the system output voltage. When V FB exceeds 20% of the nominal regulation value of 0.81V, the OVP is triggered. When V FB < 0.25V, the oscillator frequency is lowered to realize short circuit protection. 4 EN Control input pin. Forcing this pin above 1.5V enables the IC. Forcing this pin below 0. 4V shuts down the IC. When the IC is in shutdown mode, all functions are disabled to decrease the supply current below 1µA. 5 IN Supply input pin. A capacitor should be connected between the IN pin and GND to keep the DC input voltage constant. 6 SW Power switch output pin. This pin is connected to the inductor and bootstrap capacitor. Functional Block Diagram REFERENCE VOLTAGE ERR AMP PWM COMPARATORFB GND EN VDD/VDD1 REGULATOR IN OSC 1.4MHz/ 400KHz RAMP GENERATOR VLIMIT R R S OSC Q SWITCH/LDO SW CS CL BOOSTRAP REGULATOR VREF BSHICCUP FB CL SS SS 2A/V SCHOTTKEY 1pF 220k27pF 3.3V
Document number: DS41396 Rev. 2 - 2 3 of 11 www.diodes.com September 2018 © Diodes Incorporated AP3211 Absolute Maximum Ratings (Note 1) Symbol Parameter Rating Unit VIN Input Pin Voltage -0.3 to 20 V VEN EN Pin Voltage -0.3 to VIN+0.3 V VSW SW Pin Voltage 21 V VBS Bootstrap Pin Voltage -0.3 to VSW+6 V VFB Feedback Pin Voltage -0.3 to 6V V θJA Thermal Resistance 220 º C/W TJ Operating Junction Temperature +150 ºC TSTG Storage Temperature -65 to +150 ºC TLEAD Lead Temperature (Soldering, 10sec) +260 ºC – ESD (Human Body Model) 2000 V – ESD (Machine Model) 200 V Note 1: Stresses greater than those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, a nd functional operation of the device at these or any other conditions beyond those indicated under “Recommended Operating Condi tions” is not implied. Exposure to “Absolute Maximum Ratings” for extended periods may affect device reliability. Recommended Operating Conditions Symbol Parameter Min Max Unit VIN Input Voltage 4.5 18 V IOUT (MAX) Maximum Output Current 1.5 – A TA Operating Ambient Temperature -40 +85 ºC
Document number: DS41396 Rev. 2 - 2 4 of 11 www.diodes.com September 2018 © Diodes Incorporated AP3211 Electrical Characteristics (VIN = VEN = 12V, VOUT = 3.3V, TA = +25° C, unless otherwise specified.) Symbol Parameter Conditions Min Typ Max Unit VIN Input Voltage – 4.5 – 18 V IQ Quiescent Current VFB = 0.9V – 0.8 1.1 mA ISHDN Shutdown Supply Current VEN = 0V – 0.1 1.0 µA VFB Feedback Voltage – 0.785 0.810 0.835 V VFBOV Feedback Over Voltage Threshold – – 0.972 – V IFB Feedback Bias Current VFB = 0.85V -0.1 – 0.1 µA RDSON Switch On-resistance ISW = 1A – 0.35 – ILEAK Switch Leakage Current VIN = 18V, VEN = 0V – 0.1 10 µA ILIM Switch Current Limit – 1.8 2.4 – A VENH EN Pin Threshold – 1.5 – – V VENL – – – 0.4 VUVLO Input UVLO Threshold VIN Rising 3.3 3.8 4.3 V VHYS Input UVLO Hysteresis – – 0.2 – V fOSC1 Oscillator Frequency – 1.1 1.4 1.7 MHz fOSC2 Short Circuit – 460 – kHz DMAX Max. Duty Cycle VFB = 0.6V – 90 – % DMIN Min. Duty Cycle VFB = 0.9V – – 0 % tON Minimum On Time – – 100 – ns TOTSD Thermal Shutdown – – +160 – ºC THYS Thermal Shutdown Hysteresis – – +20 – ºC tSS Soft-start Time – – 200 – µs Note 2: RDSON , tON, TOTSD, THYS and tSS are guaranteed by design.
Document number: DS41396 Rev. 2 - 2 5 of 11 www.diodes.com September 2018 © Diodes Incorporated AP3211 Performance Characteristics (TA = +25º C, VIN = 12V, VEN = 5V, VOUT = 3.3V, unless otherwise noted.) Efficiency vs. Output Current Quiescent Current vs. Temperature Feedback Voltage vs. Temperature Output Voltage vs. Output Current Output Voltage vs. Input Voltage Maximum Output Current vs. Input Voltage 0.01 0.1 0.5 1 2 100 Efficiency (%) Output Current (A) VIN=12V,VOUT=3.3V VIN=12V,VOUT=5V -60 -40 -20 0 20 40 60 80 100 120 140 160 0.60 0.65 0.70 0.75 0.80 0.85 0.90 0.95 1.00 1.05 1.10 Quiescent Current (mA) Temperature ( o VIN=12V VFB=0.9V VEN=5V -60 -40 -20 0 20 40 60 80 100 120 140 160 0.40 0.48 0.56 0.64 0.72 0.80 0.88 0.96 Feedback Voltage (V) Temperature ( o 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8 VIN=12V, VOUT=3.3V Output Voltage (V) Output Current (A) 4 6 8 10 12 14 16 18 20 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 Maximum Output Current (A) Input Voltage (V) VOUT=3.3V 4 6 8 10 12 14 16 18 20 2.6 2.7 2.8 2.9 3.0 3.1 3.2 3.3 3.4 3.5 3.6 3.7 3.8Output Voltage (V) Input Voltage (V) IOUT=1.2A IOUT=1.5A
Document number: DS41396 Rev. 2 - 2 6 of 11 www.diodes.com September 2018 © Diodes Incorporated AP3211 Performance Characteristics (Cont. TA = +25º C, VIN = 12V, VEN = 5V, VOUT = 3.3V, unless otherwise noted.) Output Ripple (IOUT=1.5A) Load Transient (IOUT=1 to 1.5A) Enable Turn-on Characteristic (Resistance Load, RLOAD=2.6) Enable Turn-off Characteristic (Resistance Load, RLOAD=2.6) Short Circuit Protection (IOUT=1.5A) Short Circuit Recovery (RLOAD=2.6) VOUT (AC) 20mV/div VSW 5V/div IL 1A/div VIN 10V/div VOUT (AC) 100mV/div IL 1A/div VEN 3.8V/div VOUT 1V/div VSW 5V/div IL 1A/div VEN 3.4V/div VOUT 1V/div VSW 5V/div IL 1A/div VOUT 2V/div VFB 1V/div IL 1A/div VSW 10V/div Time (400ns/div) Time (100ms/div) Time (400ms/div) Time (400ms/div) Time (100ms/div) Time (10ms/div) VOUT 2V/div VFB 1V/div IL 1A/div VSW 10V/div
Document number: DS41396 Rev. 2 - 2 7 of 11 www.diodes.com September 2018 © Diodes Incorporated AP3211 Performance Characteristics (Cont. TA = +25º C, VIN = 12V, VEN = 5V, VOUT = 3.3V, unless otherwise noted.) Over Voltage Protection (IOUT=1.5A) Over Voltage Recovery (IOUT=1.5A) VFB 500mV/div VOUT 2V/div IL 1A/div VSW 10V/div Time (200ms/div) Time (20ms/div) VFB 500mV/div VOUT 2V/div IL 1A/div VSW 10V/div
Document number: DS41396 Rev. 2 - 2 8 of 11 www.diodes.com September 2018 © Diodes Incorporated AP3211
Ordering Information
AP3211 X X – X PackingPackageProduct Name TR : Tape & ReelK : SOT-23-6 RoHS/Green G1:RoHS Compliant and Green Package Temperature Range Part Number Marking ID Packing SOT-23-6 -40 to +85C AP3211KTR-G1 GCI Tape & Reel
Document number: DS41396 Rev. 2 - 2 9 of 11 www.diodes.com September 2018 © Diodes Incorporated AP3211 Package Outline Dimensions (All dimensions in mm(inch).) (1) Package Type: SOT-23-6 2.820(0.111) 3.100(0.122) 2.650(0.104) 3.000(0.118) 1.500(0.059) 1.700(0.067) 0.950(0.037)TYP 1.800(0.071) 2.000(0.079) 0.300(0.012) 0.500(0.020) 0.700(0.028)REF 0.100(0.004) 0.200(0.008) 0.200(0.008) 0.300(0.012) 0.600(0.024) 0.000(0.000) 0.150(0.006) 0.900(0.035) 1.300(0.051) 1.450(0.057) MAX 1 2 3 456 Pin 1 Mark
Document number: DS41396 Rev. 2 - 2 10 of 11 www.diodes.com September 2018 © Diodes Incorporated AP3211 Suggested Pad Layout (1) Package Type: SOT-23-6 E E G Z Y X Dimensions Z (mm)/(inch) G (mm)/(inch) X (mm)/(inch) Y (mm)/(inch) E (mm)/(inch)
Document number: DS41396 Rev. 2 - 2 11 of 11 www.diodes.com September 2018 © Diodes Incorporated AP3211 IMPORTANT NOTICE DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCH ANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the application or use of this document or any product described herein; neither does Diodes Incorporated convey any licens e under its patent or trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies wh ose products are represented on Diodes Incorporated website, harmless against all damages. Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel. Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising ou t of, di rectly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application. Products described herein may be covered by one or more United States, internation al or foreign patents pending. Product names and markings noted herein may also be covered by one or more United States, international or foreign trademarks. This document is written in English but may be translated into mul tiple languages for reference. Only the English version of this document is the final and determinative format released by Diodes Incorporated. LIFE SUPPORT Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or system s without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein: A. Life support devices or systems are devices or systems which: 1. are intended to implant into the body, or 2. support or sustain life and whose failure to perform when properly used in accorda nce with instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user. B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support d evices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety -critical, life support devices or systems, notwithstanding any devices - or systems -related information or support that may be pr ovided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems. Copyright © 2018, Diodes Incorporated www.diodes.com