Interface

AP25810L

Diodes Incorporated

USB Type-C, Downstream-Facing Port Controller with 3A Power Switch

Manufacturer: Diodes Incorporated

Document: 2 Pages / 405Kb

Request Quote Download Datasheet Read online HTML view

More from Diodes Incorporated Browse A parts

Online Datasheet

Read AP25810L online.

AP25810L

Document overview

Manufacturer or author: Diodes Incorporated
PDF pages: 24

Technical content

Features

 USB-C Rev. 2.0 Compliant DFP Controller  Connector Attach or Detach Detection  STD, 1.5A or 3A Capability Advertisement on CC  Super-Speed Polarity Determination  VBUS Application and Discharge  VCONN Application to Electronically Marked Cable  Audio and Debug Accessory Identification  0.7μA (typ) IDDQ When Port Is Unattached  Three Input Supply Options  IN1: USB Charging Supply  IN2: VCONN Supply  AUX: Device Power Supply  Power Wake Supports Low Power in System Hibernate (S4) and OFF (S5) Power States  30mΩ (typ) High-Side MOSFET  Pin-Strapped 1.7A or 3.4A ILIM (±7.1%)  Port Power Management Enables Power Resource Optimization Across Multiple Ports  Transient Protection for CC1/CC2 Lines  IEC 61000-4-2 Contact Discharge ±8kV  IEC 61000-4-2 Air Gap Discharge ±15kV  Thermally Efficient Low Profile Package  Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)  Halogen and Antimony Free. “Green” Device (Note 3)  An automotive-compliant part is available under separate datasheet (AP25810LQ) Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS), 2011/65/EU (RoHS 2) & 2015/863/EU (RoHS 3) compliant. 2. See https://www.diodes.com/quality/lead-free/ for more information about Diodes Incorporated’s definitions of Hal ogen- and Antimony-free, "Green" and Lead-free. 3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds. W-QFN3040-20 (Type A1)

Document number: DS42393 Rev. 5 - 2 2 of 24 www.diodes.com February 2023 © 2023 Copyright Diodes Incorporated. All Rights Reserved. AP25810L Typical Applications Circuit AP25810L FAULT IN1 IN2 AUX EN OUT CC2 GND CC1 CHG CHG_HI REF_RTN DEBUG REF LD_DET UFP POL AUDIO Thermal Pad 6 x 100kΩ (optional) Power Switch Status Signals Type-C DFP Status Signals USB Type-C Connector 4.5V~6.5V 4.5V~5.5V 2.9V~5.5V Bus Power CC Power 100kΩ (1%) 120µF Control Signals 10µF VBUS Pin Descriptions Pin Number Pin Name I/O Pin function FAULT O Fault event indicator. Open-drain logic output that asserts low to indicate a current-limit or thermal shutdown event due to overtemperature. 2 IN1 I VBUS input supply. Internal power switch connects IN1 to OUT. 3 IN1 I VBUS input supply. Internal power switch connects IN1 to OUT. 4 IN2 I VCONN input supply. Internal power switch connects IN2 to CC1 or CC2. Short to IN1 if only one supply is used. 5 AUX I Auxiliary input supply. Connect to an always-alive system rail to use the power-wake feature. Short to IN1 and IN2 if only one supply is used. 6 EN I Enable logic input. Turns the device on and off. 7 CHG I Charge-logic input to select between standard USB (500mA for a Type-C receptacle supporting only USB 2.0, and 900mA for Type-C receptacle supporting USB 3.1) or a Type-C current-sourcing ability. 8 CHG_HI I High-charge logic input to select between 1.5A and 3A Type-C current sourcing capability. Valid when CHG is set to Type-C current. 9 REF_RTN I Precision signal-reference return. Connect to the REF pin via a 100kΩ, 1% resistor. 10 REF I Analog input used to generate the internal current reference. Connect a 1% or better, 100ppm, 100kΩ resistor between this pin and REF_RTN.

11 CC1 I/O Analog input/output that connects to the Type-C receptacle CC1 pin

12 GND — Power ground

13 CC2 I/O Analog input/output that connects to the Type-C receptacle CC2 pin.

14 OUT O Power switch output

15 OUT O Power switch output

DEBUG O Open-drain logic output that asserts when a Type-C debug accessory is identified on the CC lines. AUDIO O Open-drain logic output that asserts when a Type-C audio accessory is identified on the CC lines. POL O Polarity open-drain logic output that signals which Type-C CC pin is connected to the CC line. This gives the information needed to multiplex the super-speed lines. Asserted when the CC2 pin is connected to the CC line in the cable. UFP O Open-drain logic output that asserts when a Type-C UFP is identified on the CC lines. LD_DET O Load-detect open-drain logic output that signals when a device set to source Type-C 3A current is sourcing over 1.95A, nominal. — Thermal Pad — Thermal pad on the bottom of the package. The thermal pad is internally connected to GND and is used to heatsink the device to the circuit board. Connect the thermal pad to the GND plane.

Document number: DS42393 Rev. 5 - 2 3 of 24 www.diodes.com February 2023 © 2023 Copyright Diodes Incorporated. All Rights Reserved. AP25810L Functional Block Diagram Current Limit Charge Pump Thermal Sense Gate Control CC Monitor Control Logic REF_RTN REF CHG_HI CHG EN AUX IN2 IN1 AUDIO DEBUG UFP POL FAULT LD_DET CC2 CC1 OUT UVLO UVLO UVLO Current Sense Current Sense Current Sense

Document number: DS42393 Rev. 5 - 2 4 of 24 www.diodes.com February 2023 © 2023 Copyright Diodes Incorporated. All Rights Reserved. AP25810L Absolute Maximum Ratings (@ TA = +25°C, unless otherwise specified.) (Note 4) Symbol Parameter Ratings Unit ESD HBM Human Body Model ESD Protection ±2 kV CDM Charged Device Model ESD Protection ±750 V IEC system level IEC 61000-4-2. Contact Discharge, CC1/CC2 (Note 5) ±8 kV IEC system level IEC 61000-4-2. Air Gap Discharge, CC1/CC2 (Note 5) ±15 kV Pin voltage IN1, IN2, AUX, EN, CHG, CHG_HI, REF, LD_DET , FAULT , UFP , POL , AUDIO DEBUG , OUT, CC1 & CC2 -0.3 to +7 V REF_RTN Internally connected to GND V Pin positive source current, ISRC OUT, REF, CC1, CC2 Internally limited A Pin positive sink current, ISNK OUT (while applying VBUS) 5 A CC1, CC2 (while applying VCONN) 1 A LD_DET FAULT , UFP , POL , AUDIO , DEBUG Internally limited mA RθJA Thermal Resistance, Junction to Ambient (Note 6) W-QFN3040-20 (Type A1) 40 °C/W RθJC Thermal Resistance, Junction to Case (Note 6) W-QFN3040-20 (Type A1) 5 °C/W TJ(max) Maximum Junction Temperature +180 °C TST Storage Temperature -65 to +150 °C Notes: 4. Stresses greater than those listed under Absolute Maximum Ratings can cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to Absolute Maximum Ratings for extended periods can affect device reliability. 5. EVM have been tested per typical circuit with capacitors connected to the VIN and VOUT. 6. RθJA and RθJC are measured at TA = +25°C on a high effective thermal conductivity four-layer test board per JEDEC 51-7. Recommended Operating Conditions (Note 7) Symbol Parameter Min Max Unit VIN Supply voltage IN1 4.5 6.5 V IN2 4.5 5.5 V AUX 2.9 5.5 V VOUT Output voltage OUT 0 6.5 V VI Input voltage EN, CHG, CHG_HI 0 5.5 V VIH High-level input voltage EN, CHG, CHG_HI 1.17 — V VIL Low-level voltage EN, CHG, CHG_HI — 0.58 V VPU Pull-up voltage Used on LD_DET , FAULT , UFP , POL , AUDIO , DEBUG 0 5.5 V ISRC Positive source current OUT — 3 A CC1 or CC2 when supplying VCONN — 350 mA ISNK Positive sink current (10ms moving average) LD_DET , FAULT , UFP , POL , AUDIO , DEBUG — 10 mA ISNK_PULSE Positive repetitive pulse sink current LD_DET , FAULT , UFP , POL , AUDIO , DEBUG — Internally limited mA RREF Reference resistor 98 102 kΩ TA Operating ambient temperature -40 +85 °C Note: 7. Refer to the Typical Applications Circuit.

Electrical Characteristics

are at +25°C. All voltages are with respect to GND. IOUT and IOS defined positive out of the indicated pin, unless otherwise specified.) Symbol Parameter Test Conditions Min Typ Max Unit OUT – POWER SWITCH RDS(on) On-resistance (Note 8) TJ = +25°C, IOUT = 3A — 30 37 mΩ -40°C ≤ TJ ≤ +85°C, IOUT = 3A — 30 46 -40°C ≤ TJ ≤ +125°C, IOUT = 3A — 30 55 IREV OUT to IN reverse leakage current VOUT = 6.5V, VIN1 = VEN = 0V -40°C ≤ TJ ≤ +85°C, IREV is current out of IN1 pin — 0 3 μA OUT – CURRENT LIMIT IOS Short circuit current limit (Notes 8 & 9) VCHG = 0V or VCHG = VAUX and VCHG_HI = 0V 1.58 1.7 1.9 A VCHG = VAUX and VCHG_HI = VAUX (Note 9) 3.16 3.4 3.8 RREF = 10Ω (Note 9) — — 7 OUT – DISCHARGE RDIS Discharge resistance AP25810LDFZ20-13: VOUT = 4V, UFP signature removed from CC lines, time < tw_DCHG 400 500 600 Ω AP25810LDFZ20-13-01: VOUT = 4V, UFP signature removed from CC lines, time < tw_DCHG 10 20 60 RBDIS Bleed discharge resistance VOUT = 4V, No UFP signature on CC lines, time > tw_DCHG 100 150 250 kΩ REF VO Output voltage — 0.78 0.8 0.82 V IOS Short circuit current RREF = 10Ω 9.5 — 15.3 μA FAULT VOL Output low voltage I FAULT = 1mA — — 350 mV IOFF Off-state leakage V FAULT = 5.5V — — 1 μA LD_DET VOL Output low voltage I LD_DET = 1mA — — 350 mV IOFF Off-state leakage V LD_DET = 5.5V — — 1 μA ITH OUT sourcing, rising threshold current for load detect (Note 9) AP25810LDFZ20-13 1.8 1.95 2.1 A AP25810LDFZ20-13-01 1.8 1.95 2.25 — Hysteresis (Note 9) — — 125 — mA CC1, CC2 – VCONN POWER SWITCH RDS(on) On-resistance TJ = +125°C, IOUT = 250mA — 365 420 mΩ -40°C ≤ TJ ≤ +85°C, IOUT = 250mA — 365 530 -40°C ≤ TJ ≤ +125°C, IOUT = 250mA — 365 600 CC1, CC2 – VCONN POWER SWITCH – CURRENT LIMIT IOS Short-circuit current limit (Note 9) — 380 450 520 mA RREF = 10Ω (Note 9) — — 800 CC1, CC2 – CONNECT MANAGEMENT – DANGLING ELECTRONICALLY MARKED CABLE MODE ISRC Sourcing current on the pass-through CC line 0V ≤ VCCx ≤ 1.5V 64 80 96 μA Sourcing current on the Ra CC line 0V ≤ VCCx ≤ 1.5V 64 80 96 Notes: 8. Pulse-testing techniques maintain junction temperature close to ambient temperature; thermal effects must be taken into account separately. 9. Specification is guaranteed by design.

Document number: DS42393 Rev. 5 - 2 6 of 24 www.diodes.com February 2023 © 2023 Copyright Diodes Incorporated. All Rights Reserved. AP25810L Electrical Characteristics (continued) are at +25°C. All voltages are with respect to GND. IOUT and IOS defined positive out of the indicated pin, unless otherwise specified.) Symbol Parameter Test Conditions Min Typ Max Unit CC1, CC2 – CONNECT MANAGEMENT – ACCESSORY MODE ISRC CCx sourcing current (CC2 – audio, CC1-debug) 0V ≤ VCCx ≤ 1.5V 64 80 96 μA CCx sourcing current (CC1 – audio, CC2-debug) 0V ≤ VCCx ≤ 1.5V — 0 — CC1, CC2 – CONNECT MANAGEMENT – UFP MODE ISRC Sourcing current with either IN1 or IN2 in UVLO 0V ≤ VCCx ≤ 1.5V VIN1 < VTH_UVLO_IN1 or VIN2 < VTH_UVLO_IN2 64 80 96 μA ISRC Sourcing current VCHG = 0V and VCHG_HI = 0V 0V ≤ VCCx ≤ 1.5V 75 80 85 μA VCHG = VAUX and VCHG_HI = 0V 0V ≤ VCCx ≤ 1.5V 170 180 190 VCHG = VAUX and VCHG_HI = VAUX 0V ≤ VCCx ≤ 2.45V 312 330 348 UFP POL , AUDIO , DEBUG VOL Output low voltage ISNK_PIN = 1mA — — 250 mV IOFF Off-state leakage VPIN = 5.5V — — 1 μA EN, CHG, CHG_HI – LOGIC INPUTS VTH Rising threshold voltage — — 0.925 1.15 V VTH Falling threshold voltage — 0.65 0.875 — V — Hysteresis — — 45 — mV IIN Input current VEN = 0V or 6.5V -0.5 — 0.5 μA OVERTEMPERATURE SHUTDOWN TTH_OTSD2 Rising threshold temperature for device shutdown (Note 9) — +155 — — °C — Hysteresis (Note 9) — — +20 — °C TTH_OTSD1 Rising threshold temperature for OUT/VCONN switch shutdown in current limit (Note 9) — +135 — — °C — Hysteresis (Note 9) — — +20 — °C IN1 VTH_UVLO_IN1 Rising threshold voltage for UVLO — 3.9 4.1 4.3 V — Hysteresis — — 100 — mV IIN1(DIS) Disabled supply current VEN = 0V, -40°C ≤ TJ ≤ +85°C — — 1 μA IIN1(CC_OPEN) Enabled supply current with CC lines open -40°C ≤ TJ ≤ +85°C — — 1 μA IIN1(Ra) Enabled supply current with accessory or dangling electronically marked cable signature on CC lines — — — 4 μA IIN1(Rd) Enabled supply current with UFP attached VCHG = 0V, or VCHG = VAUX and VCHG_HI = 0V — 150 200 μA — — 160 220

Document number: DS42393 Rev. 5 - 2 7 of 24 www.diodes.com February 2023 © 2023 Copyright Diodes Incorporated. All Rights Reserved. AP25810L Electrical Characteristics (continued) are at +25°C. All voltages are with respect to GND. IOUT and IOS defined positive out of the indicated pin, unless otherwise specified.) Symbol Parameter Test Conditions Min Typ Max Unit IN2 VTH_UVLO_IN2 Rising threshold voltage for UVLO — 3.9 4.1 4.3 V — Hysteresis — — 100 — mV IIN2(DIS) Disabled supply current VEN = 0V, -40°C ≤ TJ ≤ +85°C — — 1 μA IIN2(CC_OPEN) Enabled supply current with CC lines open -40°C ≤ TJ ≤ +85°C — — 1 μA IIN2(Ra) Enabled supply current with accessory or dangling electronically marked cable signature on CC lines — — — 4 μA IIN2(Rd) Enabled supply current with UFP signature on CC lines (Includes IN current that provides the CC output current to the UFP Rd resistor) VCHG = 0V, 0V ≤ VCCx ≤ 1.5V — 120 140 μA VCHG = VIN and VCHG_HI = 0V, 0V ≤ VCCx ≤ 1.5V — 210 250 0V ≤ VCCx ≤ 2.45V — 360 400 AUX VTH_UVLO_AUX Rising threshold voltage for UVLO — 2.65 2.75 2.85 V — Hysteresis — — 100 — mV IAUX(DIS) Disabled supply current VEN = 0V, -40°C ≤ TJ ≤ +85°C — — 1 μA IAUX(CC_OPEN) Enabled internal supply current with CC lines open –40°C ≤ TJ ≤ 85°C — 0.2 1 μA IAUX(Ra) Enabled supply current with accessory or dangling active cable signature on CC lines — — 160 200 μA IAUX(Rd_noIN) Enabled supply current with UFP termination on CC lines and with either IN1 or IN2 in UVLO VIN1 < VTH_UVLO_IN1 or VIN2 < VTH_UVLO_IN2 — 145 200 μA IAUX(Rd) Enabled supply current with UFP termination on CC lines — — 120 150 μA Switching Characteristics are at +25°C. All voltages are with respect to GND. IOUT and IOS defined positive out of the indicated pin, unless otherwise specified.) Symbol Parameter Test Conditions Min Typ Max Unit OUT – POWER SWITCH tr Output-voltage rise time VIN1 = 5V, CL = 1μF, RL = 100Ω (measured from 10% to 90% of final value) 1.2 1.8 2.5 ms tf Output-voltage fall time — 0.10 0.35 ms ton Output-voltage turn-on time VIN1 = 5V, CL = 1μF, RL = 100Ω 2.5 3.5 5 ms toff Output-voltage turn-off time — 0.10 0.35 ms OUT – CURRENT LIMIT tios Current-limit response time to short circuit (Note 9) VIN1 – VOUT = 1V, RL = 10mΩ, see Figure 1 — 3.5 — μs FAULT tDEGA Asserting deglitch due to overcurrent — 5.5 8.2 10.7 ms tDEGA(OC) Asserting deglitch due to overtemperature in current limit — — 0 — ms tDEGA(OT) Deasserting deglitch — 5.5 8.2 10.7 ms LD_DET tDEGA Asserting deglitch — 45 65 96 ms tDEGD Deasserting deglitch — 1.45 2.15 2.9 s

© 2023 Copyright Diodes Incorporated. All Rights Reserved. Figure 17. Brown-Out Test source capabilities (for example, VBUS > 5V) are not implemented. of the Type-C specification that pertain to understanding the operation of the AP25810L device (a DFP device) are described as follows. communication is used to swap roles.

Host mode: the port can only be host (provider of power).
Device mode: the port can only be device (consumer of power).
Dual-role mode: the port can be either host or device. Port types:
DFP (downstream-facing port): Host
UFP (upstream-facing port): Device
DRP (dual-role port): Host or device Valid DFP-to-UFP connections:
Table 1 describes valid DFP-to-UFP connections.
Host-to-host and device-to-device have no functions.

Table 1. DFP-to-UFP Connections Note: 10. This may be automatic or manually driven.

© 2023 Copyright Diodes Incorporated. All Rights Reserved. current broadcast to a valid UFP, configure VCONN, and detect Debug or Audio Adapter Accessory attachment. Table 2. AP25810L Response to Various Attachments to Its Port DEBUG are open-drain outputs; pull high with 100kΩ to AUX when used. Tie to GND or leave open when not used. USB-C current advertisement by setting the current limit as shown in Table 3. Table 3. USB-C Current Advertisement

© 2023 Copyright Diodes Incorporated. All Rights Reserved. FAULT with a pullup resistor to AUX. FAULT can be left open or tied to GND when not used. overall safety of the system. TTH_OTSD2 > TTH_OTSD1. that minimal power/heat is dissipated. The device attempts to power up when temperature decreases by +20°C. temperature coefficient resistor, or better, yields the best current limit accuracy and overall device performance. asserts the open drain AUDIO pin low to indicate the detection of such a device. Table 4. Audio Accessory Detection AUDIO pin to enable accessory mode circuits to support the audio function. AUDIO can be tied to GND or left open. The Type-C spec. supports an optional debug-accessory mode, used for debug only and not to be used for communicating with commercial products. asserted, the system can enter debug mode for factory testing or a similar functional mode. Table 5. Debug Accessory Detection Table 6. Plug Polarity Detection

© 2023 Copyright Diodes Incorporated. All Rights Reserved. Figure 23. Power Wake Table 7. Recommended Buck Converter Note: 12. 3.5A is for 3A single Type-C ports or dual ports with 1.5A capability each. Table 8. Recommended LDO Table 9. Recommended NAND Gate

Application Information

The AP25810L is a Type -C DFP controller that supports all Type -C DFP required functions. The AP25810L only applies power to V BUS when it detects that a UFP is attached and removes power when it detects the UFP is detached. The device exposes its identity via its CC pin advertising its current capability based on CHG and CHG_HI pin set tings. The AP25810L also limits its advertised current internally and provides robust protection to a fault on the system VBUS power rail. After a connection is established by the AP25810L, the device is capable of providing VCONN to power circuits in the cable plug on the CC pin that is not connected to the CC wire in the cable. VCONN is internally current limited and has its own supply pin IN2. Apart from providing charging current to a UFP, the AP25810L also supports Audio and Debug accessory modes. The following design procedure can be used to implement a full featured Type-C DFP. Design Requirements Input and Output Capacitance Input and output capacitance improves the performance of the device. The actual capacitance should be optimized for the particular application. For all applications, a 0.1μF or greater ceramic bypass capacitor between INx and GND is recommended as close to the device as possible for local noise decoupling. All protection circuits, such as the AP25810L device, have the potential for input voltage overshoots and output voltage undershoots. Input voltage overshoots can be caused by either of two effects. The first cause is an abrupt application of input voltage in conjunction with input power -bus inductance and input capacitance when the INx pin is high-impedance (before turn on). Theoretically, the peak voltage is 2 times the applied voltage. The second cause is due to the abrupt reduction of output short-circuit current when the AP25810L device turns off and energy stored in the input inductance drives the input voltage high. Input voltage droops may also occur with large load steps and as the AP25810L output is shorted. Applications with large input inductance (for instance, connecting the evaluation board to the bench power supply through long cables) may require large input capacitance to prevent the voltage overshoot from exceeding the absolute maximum voltage of the device. The fast current -limit speed of the AP25810L device to hard output short circuits isolates the input bus from faults. However, ceramic inpu t capacitance in the range of 1 μF to 22μF adjacent to the AP25810L input aids in both response time and limiting the transient seen on the input power bus. Momentary input transients to 6.5V are permitted. Output voltage undershoot is caused by the inductance of the output power bus just after a short has occurred and the AP25810L device has abruptly reduced the OUT current. Energy stored in the inductance drives the OUT voltage down, and potentially negative, as it discharges. An application with large output inductance (such as from a cable) benefits from the use of a high- value output capacitor to control voltage undershoot. When implementing 5.0A USB-standard application, 120 μF minimum output capacitance is required. Typically, a 150μF electrolytic capacitor is used, which is sufficient to control voltage undershoots. Because in Type-C applications, DFP is a cold socket when no UFP is attached, the output capacitance should be placed at the INx pin versus the OUT pin, as is done in USB-A ports. It is also recommended to put a 10μF ceramic capacitor on the OUT pin for better voltage bypass. Detailed Design Procedure The AP25810L device supports up to three different input voltages, based on the application. In the simplest implementation, all input pins are tied to a single voltage source set to 5 V. However, it is recommended to set a slightly higher (100 mV to 200 mV) input vol tage, when possible, to compensate for IR loss from the source to the Type-C connector. Other design considerations are listed as follows:

Place at least 120μF of bypass capacitance close to the INx pins versus the OUT pin, as Type-C is a coldsocket connector.
A 10μF bypass capacitor is recommended to be placed near a Type-C receptacle VBUS pin to handle load transients.
Depending on the maximum current-level advertisement supported by the Type-C port in the system, set the CHG and CHG_HI levels accordingly.
EN, CHG, and CHG_HI pins can be tied directly to GND or VAUX without a pullup resistor. – CHG and CHG_HI can also be dynamically controlled by a microcontroller to change the current advertisement level to the UFP.
When an open-drain output of the AP25810L device is not used, it can be left open or tied to GND.
Use a 1% 100kΩ resistor to connect between the REF and REF_RTN pins, placing it close to the device pin and isolated from switching noise on the board.

Ordering Information

DFZ20: W-QFN3040-20 (Type A1) -13 : Tape & Reel -13-01: Tape & Reel Vout Voltage L : 5.5V AP25810X XXXXX – XX–XX Part Number Part Number Suffix Package Code Package Packing Qty. Carrier AP25810LDFZ20-13 -13 DFZ W-QFN3040-20 (Type A1) 3000 13” Tape & Reel AP25810LDFZ20-13-01 -13-01 DFZ W-QFN3040-20 (Type A1) 3000 13” Tape & Reel Marking Information W-QFN3040-20 (Type A1) (Top View) XX Y : Year : 0 to 9 (ex: 3 = 2023) X : Internal Code XX : Identification Code W : Week : A to Z : week 1 to 26; a to z : week 27 to 52; z represents week 52 and 53Y W X F F : Space for AP25810LDZ20-13; 1 for AP25810LDFZ20-13-01 Part Number Package Identification Code AP25810LDFZ20-13 W-QFN3040-20 (Type A1) 5B AP25810LDFZ20-13-01 W-QFN3040-20 (Type A1) 5B

Document number: DS42393 Rev. 5 - 2 23 of 24 www.diodes.com February 2023 © 2023 Copyright Diodes Incorporated. All Rights Reserved. AP25810L Package Outline Dimensions Please see http://www.diodes.com/package-outlines.html for the latest version. W-QFN3040-20 (Type A1) W-QFN3040-20 (Type A1) Dim Min Max Typ A 0.70 0.80 0.75 A1 0.00 0.05 0.02 A3 0.203 REF b 0.15 0.25 0.20 D 3.00 BSC D2 1.55 1.65 1.60 E 4.00 BSC E2 2.55 2.65 2.60 e 0.50 BSC k 0.20 -- -- L 0.35 0.45 0.40 All Dimensions in mm Suggested Pad Layout Please see http://www.diodes.com/package-outlines.html for the latest version. W-QFN3040-20 (Type A1) Dimensions Value (in mm) C 0.500 X 0.250 X1 0.700 X2 1.600 X3 2.800 Y 0.700 Y1 0.250 Y2 2.600 Y3 3.800 Mechanical Data  Moisture Sensitivity: Level 1 per J-STD-020  Terminals: Finish – Matte Tin Plated Leads, Solderable per MIL-STD-202, Method 208  Weight: 0.03728 grams (Approximate) A kL D E e b C0.35x45° X Y C

Document number: DS42393 Rev. 5 - 2 24 of 24 www.diodes.com February 2023 © 2023 Copyright Diodes Incorporated. All Rights Reserved. AP25810L IMPORTANT NOTICE 1. DIODES INCORPORATED (Diodes) AND ITS SUBSIDIARIES MAKE NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO ANY INFORMATION CONTAINED IN THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICUL AR PURPOSE OR NON -INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). 2. The Information contained herein is for informational purpose only and is provided only to illustrate the operation of Diodes’ products described herein and application examples. Diodes does not assume any liability arising out of the application or use of this document or any product described herein. This document is intended for skilled and technically trained engineering customers and users who design with Diodes’ products. Diodes’ products may be used to facilitate safety-related applications; however, in all instances customers and users are responsible for (a) selecting the appropriate Diodes products for their applications, (b) evaluating the suitability of Diodes’ products for their intended applications, (c) ensuring their applications, which incorporate Diodes’ products, comply the applicable legal and regulatory requirements as well as sa fety and functional- safety related standards, and (d) ensuring they design with appropriate safeguards (including testing, validation, quality con trol techniques, redundancy, malfunction prevention, and appropriate treatment for aging degradation) to minimize the risks associated with their applications. 3. Diodes assumes no liability for any application-related information, support, assistance or feedback that may be provided by Diodes from time to time. Any customer or user of this document or products described herein will assume all risks and liabilities associated with such use, and will hold Diodes and all companies whose products are represented herein or on Diodes’ websites, harmless against all damages and liabilities. 4. Products described herein may be covered by one or more United States, international or foreign patents and pending patent applications. Product names and markings noted herein may also be covered by one or more United States, international or foreign trademarks and trademark applications. Diodes does not convey any license under any of its intellectual property rights or the rights of any third parties (including third parties whose products and services may be described in this document or on Diodes’ website) under this document. 5. Diodes’ p roducts are provided subject to Diodes’ Standard Terms and Conditions of Sale (https://www.diodes.com/about/company/terms-and-conditions/terms-and-conditions-of-sales/) or other applicable terms. This document does not alter or expand the applicable warranties provided by Diodes. Diodes does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel. 6. Diodes’ products and technology may not be used for or incorporated into any products or systems whose manufacture, use or sa le is prohibited under any applicable laws and regulations. Should customers or users use Diodes’ products in contrave ntion of any applicable laws or regulations, or for any unintended or unauthorized application, customers and users will (a) be solely responsible for any da mages, losses or penalties arising in connection therewith or as a result thereof, and (b) indemnif y and hold Diodes and its representatives and agents harmless against any and all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim relating to any noncompliance with the applicable laws and regulations, as well as any unintended or unauthorized application. 7. While efforts have been made to ensure the information contained in this document is accurate, complete and current, it may c ontain technical inaccuracies, omissions and typographical errors. Diodes does not warrant that information contained in this document is error -free and Diodes is under no obligation to update or otherwise correct this information. Notwithstanding the foregoing, Diodes reserves the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the final and determinative format released by Diodes. 8. Any unauthorized copying, modification, distribution, transmission, display or other use of this document (or any portion her eof) is prohibited. Diodes assumes no responsibility for any losses incurred by the customers or users or any third parties arising from any such unauthorized use. 9. This Notice may be periodically updated with the most recent version available at https://www.diodes.com/about/company/terms-and- conditions/important-notice The Diodes logo is a registered trademark of Diodes Incorporated in the United States and other countries. DIODES is a trademark of Diodes Incorporated in the United States and other countries. All other trademarks are the property of their respective owners. © 2023 Diodes Incorporated. All Rights Reserved. www.diodes.com

Product Information

AP25810L specifications and overview.

Summary

USB Type-C, Downstream-Facing Port Controller with 3A Power Switch

Description

USB Type-C, Downstream-Facing Port Controller with 3A Power Switch

Source title AP25810L Datasheet(PDF) - Diodes Incorporated

Related Parts

More parts from the same family.

Browse manufacturer