AP2553AW6

AP2552 DIODES | Alldatasheet

Document overview

• Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
• PDF pages: 16

Technical content

Features

• Up to 2.1A maximum load current
• Accurate adjustable current limit, 75mA - 2350mA
• ±6% accurate adjustable current limit, 1.61A with R LIM = 15kΩ
• Constant-current (AP2552/ 53) during over-current
• Output latch-off (AP2552A/53A) at over-current
• Fast short-circuit re sponse time: 2µs (typ)
• Reverse current blocking during shutdown and reverse current limiting during enable
• Operating range: 2.7V – 5.5V
• Built-in soft-start with 3ms typical rise time
• Over-current , output ove r-voltage and thermal protection
• Fault report (FAULT) with blanking time
• ESD protection: 2kV HBM, 500V CDM
• Active low (AP2552/52A) or active high (AP2553/53A) enable
• Ambient temperature range: -40ºC to +85°C
• SOT26 and DFN2020-6 package: Available in “Green”Molding Compound (No Br, Sb)
• Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
• Halogen and Antimony Free. “Green” Device (Note 3)
• 15kV ESD Protection per IEC 61000-4-2 (with external capacitance)
• UL Recognized, File Number (to be completed)
• IEC60950-1 CB Scheme Certified (to be completed) Notes: 1. No purposely added lead. Fully EU Dire ctive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. 2. See http://www.diodes.com for more in formation about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free. 3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds.

AP2552/AP2553/AP2552A/AP2553A Document number: DS35404 Rev. 5 - 2 2 of 16 www.diodes.com December 2012 © Diodes Incorporated NEW PRODUCT AP2552/ AP2553/ AP2552A/ AP2553A Typical Applications Circuit 120µF Output Capacitance is a Requirement of USB Available Options Part Number Channel Enable Pin (EN) Recommended Maximum Continuous Load Current (A) Current-Limit Protection Package AP2552 1 Active Low 2.1 Constant-Current U-DFN2020C-6 SOT26 AP2553 1 Active High AP2552A 1 Active Low 2.1 Latch-Off U-DFN2020C-6 SOT26 AP2553A 1 Active High Pin Descriptions Pin Name Pin Number I/O Function AP2552W6-7 AP2553W6-7 AP2552FDCG-7 AP2553FDCG-7 IN 1 1 6 6 I Input, connect a 0.1µF or greater ceramic capacitor from IN to GND as close to IC as possible. GND 2 2 5 5 — Ground, connect to external exposed pad. EN 3 — 4 — I Enable input, logic low turns on power switch. EN — 3 — 4 I Enable input, logic high turns on power switch. FAULT 4 4 3 3 O Active-low open-drain output, asserted during over- current, over-temperature, or reverse-voltage conditions. ILIM 5 5 2 2 O Use external resistor to set current-limit threshold; recommended 10kΩ≦RLIM≦232kΩ. OUT 6 6 1 1 O Output Exposed Pad — — Pad Pad — No internal connection; recommend to connect to GND externally for improved power dissipation.

AP2552/AP2553/AP2552A/AP2553A Document number: DS35404 Rev. 5 - 2 3 of 16 www.diodes.com December 2012 © Diodes Incorporated NEW PRODUCT AP2552/ AP2553/ AP2552A/ AP2553A Functional Block Diagram

AP2552/AP2553/AP2552A/AP2553A Document number: DS35404 Rev. 5 - 2 4 of 16 www.diodes.com December 2012 © Diodes Incorporated NEW PRODUCT AP2552/ AP2553/ AP2552A/ AP2553A Absolute Maximum Ratings (@TA = +25°C, unless otherwise specified.) Symbol Parameter Ratings Unit ESD HBM Human Body Model ESD Protection 2 kV ESD CDM Charged Device Model ESD Protection 500 V VIN, Vout, VFAULT , VILIM, , ENV ENV Voltage on IN, OUT, FAULT , ILIM, EN, EN -0.3 to +6.5 V Continuous FAULT sink current 25 mA ILIM source current 1 mA Iload Maximum Continuous Load Current Internal Limited A TJmax Maximum Junction Temperature -40 to +150 °C TST Storage Temperature Range (Note 4) -65 to +150 °C Note: 4. UL Recognized Rating from -30°C to +70°C (Diodes qualified T ST from -65°C to +150°C) Caution: Stresses greater than the 'Absolute Maximum Ratings' sp ecified above, may cause permanent damage to the device. These are stress ratings only; functional operation of the device at th ese or any other conditions exceeding those indicated in this specification is not implied. Device reliability may be affected by exposure to absolute maximum rating conditions for extended periods of time. Semiconductor devices are ESD sensitive and may be damaged by ex posure to ESD events. Suitable ESD precautions should be taken when handling and transporting these devices. Dissipation Rating Table Board Package Thermal Resistance θ JA Thermal Resistance θJC TA ≤ +25°C Power Rating Derating Factor Above TA = +25°C TA = +70°C Power Rating TA = +85°C Power Rating High-K (Note 5) W6 160 °C/W 55° C/W 625mW 6.25mW/ °C 340mW 250mW High-K (Note 5) FDC 120 °C/W 34° C/W 833mW 8.33mW/ °C 450mW 330mW Note: 5. The JEDEC high-K (2s2p) board used to derive this data was a 3in x 3in, multilayer board with 1-ounce internal power a nd ground planes with 2-ounce copper traces on top and bottom of the board. Recommended Operating Conditions (@TA = +25°C, unless otherwise specified.) Symbol Parameter Min Max Unit VIN Input Voltage 2.7 5.5 V IOUT Continuous Output Current (-40°C ≤ TA ≤ +85°C) 0 2.1 A , ENV ENV Enable Voltage 0 5.5 V VIH High-Level Input Voltage on EN or EN 2.0 V IN V VIL Low-Level Input Voltage on EN or EN 0 0.8 V RLIM Current-Limit Threshold Resistor Range (1% initial tolerance) 10 210 k Ω IO Continuous FAULT Sink Current 0 10 mA Input De-Coupling Capacitance, IN to GND 0.1 µF TA Operating Ambient Temperature -40 +85 °C TJ Operating Junction Temperature -40 +125 °C

AP2552/AP2553/AP2552A/AP2553A Document number: DS35404 Rev. 5 - 2 5 of 16 www.diodes.com December 2012 © Diodes Incorporated NEW PRODUCT AP2552/ AP2553/ AP2552A/ AP2553A Electrical Characteristics (@TA = +25°C, VIN = 2.7V to 5.5V, VEN = 0V or VEN = VIN, RFAULT = 10kΩ, unless otherwise specified.) Symbol Parameter Test Conditions (Note 6) Min Typ Max Unit Supply VUVLO Input UVLO VIN rising 2.4 2.65 V ΔVUVLO Input UVLO Hysteresis VIN decreasing 25 mV ISHDN Input Shutdown Current VIN = 5.5V, disabled, OUT = open 0.1 1 µA IQ Input Quiescent Current VIN = 5.5V, enabled, OUT = open, RLIM = 20kΩ 100 140 µA VIN = 5.5V, enabled, OUT = open, RLIM = 210kΩ 80 120 µA IREV Reverse Leakage Current Disabled, VIN = 0V, VOUT = 6V, IREV at VIN 0.01 1 µA Power Switch RDS(ON) Switch On-Resistance SOT26 package, TJ = +25°C, VIN = 5.0V 70 95 mΩ -40 o C ≤ TA ≤ +85°C 135 U-DFN2020-6 package TJ = +25°C, VIN = 5.0V 80 105 -40 o C ≤ TA ≤ +85°C 150 tR Output Turn-On Rise Time VIN = 5.5V, CL = 1µF, RLOAD = 100Ω. See Figure 1 1.1 1.5 ms VIN = 2.7V, CL = 1µF, RLOAD = 100Ω. 0.7 1 ms tF Output Turn-Off Fall Time VIN = 5.5V, CL = 1µF, RLOAD = 100Ω. See Figure 1 0.1 0.5 ms VIN = 2.7V, CL = 1µF, RLOAD = 100Ω. 0.1 0.5 ms Current Limit ILIMIT Current-Limit Threshold (maximum DC output current), VOUT = VIN -0.5V RLIM = 10kΩ -40°C ≤ TA ≤ +85°C 2200 2365 2542 mA RLIM = 15kΩ -40°C ≤ TA ≤ +85°C 1540 1632 1730 RLIM = 20kΩ TJ = +25°C 1180 1251 1326 -40°C ≤ TA ≤ +85°C 1160 1251 1340 RLIM = 49.9kΩ TJ = +25°C 500 530 562 -40°C ≤ TA ≤ +85°C 485 529 573 RLIM = 210kΩ 121 142 162 ILIM shorted to IN or GND 50 75 100 ISHORT Short-Circuit Current Limit, OUT connected to GND RLIM = 10kΩ 2620 mA RLIM = 15kΩ 1820 RLIM = 20kΩ 1380 RLIM = 49.9kΩ 570 RLIM = 210kΩ 150 ILIM shorted to IN or GND 75 tSHORT Short-Circuit Response Time VOUT = 0V to IOUT = ILIMIT (OUT shorted to ground) See Figure 2 2 µs Enable Pin ILEAK-EN EN Input Leakage Current VIN = 5V, VEN = 0V and 6V -0.5 0.5 µA tON Turnon Time CL = 1µF, RL = 100Ω. See Figure 1 3 ms tOFF Turnoff Time CL = 1µF, RL = 100Ω. See Figure 1 1 ms Output Discharge RDIS Discharge Resistance (Note 7) VIN = 5V, disabled, IOUT =1mA 600 Ω RDIS_LATCH Discharge Resistance During Latch-Off V IN = 5V, latch-off, AP2552A/53A only 1000 Ω Notes: 6. Pulse-testing techniques maintain junction temperature close to ambient temperature; thermal effects must be taken into account separately. 7. The discharge function is active when the device is disabled (when enable is de-asserted or during power-up power-down when VIN< VUVLO). The discharge function offers a resistive discharge path for the external storage capacitor for limited time.

AP2552/AP2553/AP2552A/AP2553A Document number: DS35404 Rev. 5 - 2 9 of 16 www.diodes.com December 2012 © Diodes Incorporated NEW PRODUCT AP2552/ AP2553/ AP2552A/ AP2553A Application Note The AP2552/53 AND AP2552A/53A are integrated high-side power switc hes optimized for Universal Serial Bus (USB) that requires pr otection functions. The power switches are equipped with a driver that controls the gate voltage and incorporates slew-rate limitation. This, along with the various protection features and special functions, makes these power switches ideal for hot-swap or hot-plug applications. Protection Features: Under-Voltage Lockout (UVLO) Whenever the input voltage falls below UVLO threshold (~2.5V), the power switch is turned off. This facilitates the design of h ot-insertion systems where it is not possible to turn off the power switch before input power is removed. Over-Current and Short-Circuit Protection An internal sensing FET is employed to c heck for over-current conditions. Unlike current-sense resistors, sense FETs do not inc rease the series resistance of the current path. When an overcurrent condition is detected, the device maintains a constant output current and r educes the output voltage accordingly. Complete shutdown occurs only if the fault stays long enough to activate thermal limiting. The different overload conditions and the corresponding response of the AP2552/53 AND AP2552A/53A are outlined below: S.NO Conditions Explanation Behavior of the AP2552/53 AND AP2552A/53A

1 Short-circuit condition at

Output is shorted before input voltage is applied or before the part is enabled The IC senses the short circui t and immediately clamps output current to a certain safe level namely I SHORT.

2 Short-circuit or overcurrent

condition that occurs when the part is enabled.

• At the instance the overload occurs, higher current may flow for a very short period of time before the current limit function can react.
• After the current limit functi on has tripped (reached the over- current trip threshold), the device switches into current limiting mode and the current is clamped at I SHORT /ILIMIT. Gradual increase from nominal operating current to ILIMIT Load increases gradually until the current-limit threshold.(I TRIG) The current rises until I LIMIT or thermal limit. Once the threshold has been reached, the device switches into its current limiting mode and is set at ILIMIT. Note that when the output has been shorted to GND at extremely low temperature (< -30°C), a minimum 120- μF electrolytic capacitor on the output pin is recommended. A correct capacitor type with capacitor voltage rating and temperature characteristics must be prop erly chosen so that capacitance value does not drop too low at the extremely lo w temperature operation. A recommended capacitor should have t emperature characteristics of less than 10% variation of capacitance change when operated at extremely low temp. Our recommended aluminum electrolytic capacitor type is Panasonic FC series. Current-Limit Threshold Programming The current-limit threshold can be programmed using an external resistor. The current-limit threshold is proportional to the current sourced out of ILIM. The recommended 1% resistor range for R LIM is 10k Ω ≤RLIM≤210kΩ. Figure 15 includes current-limit tolerance due to variations caused by temperature and process. This graph does not include the external re sistor tolerance. The traces routing the RLIM resistor to t he AP2552/53 and AP2552A/53A should be as short as possible to reduce parasitic effects on the current-limit accuracy. To design below a maximum current-limit threshold, find the intersection of R LIM and the maximum desired load current on the I OS(max) (ILIM) curve and choose a value of R LIM above this value. Programming the current limit below a maximum threshold is important to avoid current limiting upstream power supplies causing the input voltage bus to droop. The resulting minimum current-limit threshold is the i ntersection of the selected value of RLIM and the IOS(min) (ILIM) curve.

Figure 15. Current-Limit Threshold vs RLIM clamped at this IROCP level. comparator trip point ie; the difference between the output voltage and the input voltage. removed. FAULT de-assertion de-glitch time is same as the de-assertion time.

AP2552/AP2553/AP2552A/AP2553A Document number: DS35404 Rev. 5 - 2 11 of 16 www.diodes.com December 2012 © Diodes Incorporated NEW PRODUCT AP2552/ AP2553/ AP2552A/ AP2553A Application Note (cont.) Reverse-Current and Reverse-Voltage Protection (cont.) For AP2552A/53A, once ROVP is activated and when the condition exis ts for more than 5ms (TYP), output device is disabled and sh utdown. This is called the "Time from Reverse-Voltage Condition to MOSFET Turn Off”. FAULT assertion occurs at a de-glitch time of 4ms after ROVP is reached. Recovery from this fault is achiev ed by recycling power or toggling EN. FAULT de-assertion de-glitch time is same as t he de-assertion time. Special Functions: Discharge Function When enable is de-asserted, or when the input voltage is under UVLO level, the discharge function is active. The output capacitor is discharged through an internal NMOS that has a discharge resistance of 100 Ω. Hence, the output voltage drops down to zero. The time taken for discharge is dependent on the RC time constant of the resistance and the output capacitor. FAULT Response The FAULT open-drain output goes active low for any of following faults: Current limit threshold, short- circuit current limit, reverse-voltage condition or thermal shutdown. The time from when a fault condition is encountered to wh en the FAULT output goes low is 7ms (TY P). The FAULT output remains low until over-current, short-circuit current limit and over-tempera ture conditions are removed. Connecting a heavy capacitive load to the output of the device can cause a momentary Over-current condi tion, which does not trigger the FAULT due to the 7ms deglitch timeout. This 7-ms timeout is also applicable for over-current recovery and over-temperature recovery. The AP2552/53 a nd AP2552-2/53A are designed to eliminate errone ous over-current reporting without the need for external components, such as an RC delay network. For the AP2552/53 and AP2552A/53A when the reverse voltage condition is triggered, FAULT output goes low after 4ms (TYP). This 4ms (TYP) timeout is also applicable for the recovery from reverse voltage fault. When the ILIM pin is shorted to IN or GND, current-limit th reshold and short-circuit current limit will be clamped at typically 75mA.When the ILIM pin is shorted to IN or GND the AP2552/53 and AP2552A/53A FAULT pi n will not assert during current limiting conditions; The FAU LT pin will assert during short circuit conditions. Power Supply Considerations A 0.01-μF to 0.1-μF X7R or X5R ceramic bypass capacitor between IN and GND, cl ose to the device, is recommended. This limits the input voltage drop during line transients. Placing a high-value electrolytic capacitor on the input (10 μF minimum) and output pin(120µF) is recommended when the output load is heavy. This precaution also reduces power-supply transients that may cause ringing on the i nput. Additionally, bypassing thedeviceoutput with a 0.1 μF to 4.7μF ceramic capacitor improves the immunity of the device to short-circuit transients. This capacitor also prevents output from going negative during turn-off due to parasiticinductance. Power Dissipation and Junction Temperature The low on-resistance of the internal MOSFET allows the small surface-mount packages to pass large current. Using the maximum o perating ambient temperature (TA) and RDS(ON), the power dissipation can be calculated by: P D = RDS(ON)× I Finally, calculate the junction temperature: T J = PD x θJA + TA Where: T A= Ambient temperature °C θJA = Thermal resistance P D = Total power dissipation Generic Hot-Plug Applications In many applications it may be necessary to remove modules or pc boards while the main unit is still operating. These are consi dered hot-plug applications. Such implementations require t he control of current surges seen by the main power supply and the card being inserted. The most effective way to control these surges is to limit and slowly ramp the current and voltage being applied to the card, similar to the way in which a power supply normally turns on. Due to the controlled rise times and fall times of the AP2552/53 AND AP2552A/53A, these devices can be used to provide a softer start-up to devices being hot-plugged into a powered system. The UVLO feature of the AP2552/53 AND AP2552A/ 53A also ensures that the switch is off after the card has been removed, and that the switch is off during the next insertion.

AP2552/AP2553/AP2552A/AP2553A Document number: DS35404 Rev. 5 - 2 12 of 16 www.diodes.com December 2012 © Diodes Incorporated NEW PRODUCT AP2552/ AP2553/ AP2552A/ AP2553A Application Note (cont.) Generic Hot-Plug Applications By placing the AP2552/53 AND AP2552A/53A between the V CC input and the rest of the circuitry, t he input power reaches these devices first after insertion. The typical rise time of the switch is approxim ately 1ms, providing a slow voltage ramp at the output of the d evice. This implementation controls system surge current and provides a hot-plugging mechanism for any device.

Ordering Information

7 : Tape & Reel Latch-off Blank : Non Latch-off FDC : U-DFN2020C-6 W6 : SOT26 A : Latch-off Enable 2 : Active Low 3 : Active High Part Number Enable Active Output Fault Condition Package Code Packaging 7” Tape and Reel Quantity Part Number Suffix AP2552W6-7 Low Output Current Limits W6 SOT26 3000/Tape & Reel -7 AP2552FDC-7 FDC U-DFN2020C-6 3000/Tape & Reel -7 AP2553W6-7 High W6 SOT26 3000/Tape & Reel -7 AP2553FDC-7 FDC U-DFN2020C-6 3000/Tape & Reel -7 AP2552AW6-7 Low Output Latches Off W6 SOT26 3000/Tape & Reel -7 AP2552AFDC-7 FDC U-DFN2020C-6 3000/Tape & Reel -7 AP2553AW6-7 High W6 SOT26 3000/Tape & Reel -7 AP2553AFDC-7 FDC U-DFN2020C-6 3000/Tape & Reel -7 Marking Information (1) SOT26 1 2 3 XX Y W X XX : Identification Code Y : Year 0~9 X : Internal Code ( Top View ) W : Week : A~Z : 1~26 week; a~z : 27~52 week; z represents 52 and 53 week Device Package Identification Code AP2552W6 SOT26 BJ AP2553W6 SOT26 BK AP2552AW6 SOT26 BM AP2553AW6 SOT26 BN

AP2552/AP2553/AP2552A/AP2553A Document number: DS35404 Rev. 5 - 2 13 of 16 www.diodes.com December 2012 © Diodes Incorporated NEW PRODUCT AP2552/ AP2553/ AP2552A/ AP2553A Marking Information (cont.) (2) U-DFN2020C-6 ( Top View ) XX Y : Year : 0~9 X : Internal Code XX : Identification Code W : Week : A~Z : 1~26 week; a~z : 27~52 week; z represents 52 and 53 week Y W X Device Package Identification Code AP2552FDC U-DFN2020C-6 BJ AP2553FDC U-DFN2020C-6 BK AP2552AFDC U-DFN2020C-6 BM AP2553AFDC U-DFN2020C-6 BN Package Outline Dimensions (All dimensions in mm.) Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for latest version. (1) Package Type: SOT26 (2) Package Type: U-DFN2020-6 SOT26 Dim Min Max Typ A 0.35 0.50 0.38 B 1.50 1.70 1.60 C 2.70 3.00 2.80 D ⎯ ⎯ 0.95 H 2.90 3.10 3.00 J 0.013 0.10 0.05 K 1.00 1.30 1.10 L 0.35 0.55 0.40 M 0.10 0.20 0.15 α 0° 8° ⎯ All Dimensions in mm U-DFN2020-6 Dim Min Max Typ A 0.57 0.63 0.60 A1 0 0.05 0.03 A3 ⎯ ⎯ 0.15 b 0.20 0.30 0.25 D 1.95 2.075 2.00 D2 1.45 1.65 1.55 e ⎯ ⎯ 0.65 E 1.95 2.075 2.00 E2 0.76 0.96 0.86 L 0.30 0.40 0.35 All Dimensions in mm A M J LD B C H K SEATING PLANE D e Pin#1 ID L b D2/2 E2E A A3

AP2552/AP2553/AP2552A/AP2553A Document number: DS35404 Rev. 5 - 2 14 of 16 www.diodes.com December 2012 © Diodes Incorporated NEW PRODUCT AP2552/ AP2553/ AP2552A/ AP2553A Suggested Pad Layout Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version. (1) Package Type: SOT26 (2) Package Type: U-DFN2020-6 Dimensions Value (in mm) Z 3.20 G 1.60 X 0.55 Y 0.80 C1 2.40 C2 0.95 Dimensions Value (in mm) Z 1.67 G 0.15 X1 0.90 X2 0.45 Y 0.37 C 0.65 G G YC Z Y X Z Y C2C2 G

AP2552/AP2553/AP2552A/AP2553A Document number: DS35404 Rev. 5 - 2 15 of 16 www.diodes.com December 2012 © Diodes Incorporated NEW PRODUCT AP2552/ AP2553/ AP2552A/ AP2553A Taping Orientation (Note 11) (1) Package Type: SOT26 (2) Package Type: U-DFN2020-6 Notes: 11. The taping orientation of the other package type can be found on our website at http://www.diodes.com/datasheets/ap02007.pdf

AP2552/AP2553/AP2552A/AP2553A Document number: DS35404 Rev. 5 - 2 16 of 16 www.diodes.com December 2012 © Diodes Incorporated NEW PRODUCT AP2552/ AP2553/ AP2552A/ AP2553A IMPORTANT NOTICE DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhanc ements, improvements, corrections or ot her changes without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability ari sing out of the application or use of this document or an y product described herein; neither does Diodes Incorporated convey any license under its patent or trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applica tions shall assume all risks of such use and will agree to hold Diodes Incorporated a nd all the companies whose products are represented on Diodes Incorporated website, harmless against all damages. Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel. Should Customers purchase or use Diodes Incorporated products for any unintended or una uthorized application, Customers shall i ndemnify and hold Diodes Incorporated and its representativ es harmless against all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application. Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings noted herein may also be covered by one or more United States, international or foreign trademarks. This document is written in English but may be translated into multiple languages for reference. Only the English version of t his document is the final and determinative format released by Diodes Incorporated. LIFE SUPPORT Diodes Incorporated products are specifically not authorized for use as critical component s in life support devices or systems without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein: A. Life support devices or systems are devices or systems which: 1. are intended to implant into the body, or 2. support or sustain life and whose failure to perform when proper ly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user. B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. Customers represent that they have all necessary expertise in the safety and regulatory ramifi cations of their life support dev ices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or s ystems-related information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems. Copyright © 2012, Diodes Incorporated www.diodes.com