AP2552

AP2552/AP2553/AP2552A/AP2553A

Document overview

Manufacturer or author: Diodes Incorporated
PDF pages: 17

Technical content

Features

Up to 2.1A Maximum Load Current
Accurate Adjustable Current Limit, 75mA to 2365mA
±6% Accurate Adjustable Current Limit, 1.632A with RLIM = 15kΩ
Constant-Current (AP2552/53) During Over-Current
Output Latch-Off (AP2552A/53A) at Over-Current
Fast Short-Circuit Response Time: 2µs (Typ.)
Reverse Current Blocking During Shutdown and Reverse Current Limiting During Enable
Operating Range: 2.7V to 5.5V
Built-in Soft-Start with 3ms Typical Rise Time
Over-Current, Output Over-Voltage and Thermal Protection
Fault Report (FAULT) with Blanking Time
ESD Protection: 2kV HBM, 500V CDM
Active Low (AP2552/52A) or Active High (AP2553/53A) Enable
Ambient Temperature Range: -40ºC to +85°C
SOT26 and U -DFN2020-6 (Type C) Packages : Available in “Green” Molding Compound (No Br, Sb)
15kV ESD Protection per IEC 61000- 4-2 ( With External Capacitance)
UL Recognized, File Number E322375, Vol. 1
1IEC60950-1 CB Scheme Certified
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
For automotive applications requiring specific change control (i.e. parts qualified to AEC-Q100/101/200, PPAP capable, and manufactured in IATF 16949 certified facilities), please contact us or your local Diodes representative. https://www.diodes.com/quality/product-definitions/ Pin Assignments 3 4 6OUT ILIM FAULT EN GND IN (Top View) U-DFN2020-6 Top View SOT26 OUTIN GND EN ILIM FAULT

Applications

Set-Top Boxes
LCD TVs & Monitors
Residential Gateways
Laptops, Desktops, Servers, e-Readers, Printers, Docking Stations, HUBs Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS), 2011/65/EU (RoHS 2) & 2015/863/EU (RoHS 3) compliant. 2. See https://www.diodes.com/quality/lead-free/ for more information about Diodes Incorporated’s definitions of Halogen - and Antimony-free, "Green" and Lead-free. 3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds. SOT26 U-DFN2020-6 (Type C) (Top View) (Top View) EN/EN EN/EN NOT RECOMMENDED FOR NEW DESIGN USE AP22652/AP22653/AP22652A/AP22653A

AP2552/AP2553/AP2552A/AP2553A Document number: DS35404 Rev. 12 - 3 2 of 17 www.diodes.com September 2021 © Diodes Incorporated AP2552/AP2553 AP2552A/AP2553A Typical Applications Circuit (Note 4) Note 4: 120µF output capacitance is a requirement of USB. Available Options Part Number Channel Enable Pin (EN/EN) Recommended Maximum Continuous Load Current (A) Current-Limit Protection Package AP2552 1 Active Low 2.1 Constant-Current U-DFN2020-6 (Type C) SOT26 AP2553 1 Active High AP2552A 1 Active Low 2.1 Latch-Off U-DFN2020-6 (Type C) SOT26 AP2553A 1 Active High Pin Descriptions Pin Name Pin Number I/O Function SOT26 U-DFN2020-6 (Type C) AP2552/ AP2552A AP2553/ AP2553A AP2552/ AP2552A AP2553/ AP2553A IN 1 1 6 6 I Input, connect a 0.1µF or greater ceramic capacitor from IN to GND as close to IC as possible. GND 2 2 5 5 — Ground, connect to external exposed pad. EN 3 — 4 — I Enable input, logic low turns on power switch. EN — 3 — 4 I Enable input, logic high turns on power switch. FAULT 4 4 3 3 O Active-low open -drain output, asserted during over - current, over -temperature, or reverse- voltage conditions. ILIM 5 5 2 2 O Use ex ternal resistor to set current -limit threshold; recommended 10kΩ ≦ RLIM ≦ 210kΩ. OUT 6 6 1 1 O Output Exposed Pad — — Pad Pad — No internal connection; recommend to connect to GND externally for improved power dissipation. It should not be used as electri cal ground conduction path. FAULT EN/EN

AP2552/AP2553/AP2552A/AP2553A Document number: DS35404 Rev. 12 - 3 3 of 17 www.diodes.com September 2021 © Diodes Incorporated AP2552/AP2553 AP2552A/AP2553A Functional Block Diagram Thermal Sense OUT GND UVLO Current Limit Current Sense Discharge Control Driver IN 4ms Deglitch Time Reverse Voltage Comparator Reverse Current Limit EN 8ms Deglitch 8ms Deglitch FLG ILIM 5ms Deglitch Time AP2553A Thermal Sense OUT GND UVLO Current Limit Current Sense Discharge Control Driver IN 4ms Deglitch Time Reverse Voltage Comparator Reverse Current Limit EN 8ms Deglitch 8ms Deglitch FLG ILIM AP2553 AP2552A/ AP2553A AP2553/ AP2553A AP2552/ AP2553 EN/EN EN/EN FAULT FAULT

AP2552/AP2553/AP2552A/AP2553A Document number: DS35404 Rev. 12 - 3 4 of 17 www.diodes.com September 2021 © Diodes Incorporated AP2552/AP2553 AP2552A/AP2553A Absolute Maximum Ratings (@TA = +25°C, unless otherwise specified.) Symbol Parameter Ratings Unit ESD HBM Human Body Model ESD Protection 2 kV CDM Charged Device Model ESD Protection 500 V IEC System Level Surges per IEC61000-4-2. 1999 Applied to Output Terminals of EVM (Note 6) 15 kV VIN, VOUT, VFAULT , VILIM, ,ENV ENV Voltage on IN, OUT, FAULT , ILIM, EN, EN -0.3 to +6.5 V — Continuous FAULT Sink Current 25 mA — ILIM Source Current 1 mA ILOAD Maximum Continuous Load Current Internal Limited A TJ(MAX) Maximum Junction Temperature -40 to +150 °C TSTG Storage Temperature Range (Note 5) -65 to +150 °C Notes: 5. UL Recognized Rating from -30°C to +70°C (Diodes Incorporated qualified TSTG from -65°C to +150°C). 6. External capacitors need to be connected to the output, EVM board was tested with capacitor 2.2µF 50V 0805. This level is a pass test only and not a limit. Caution: Stresses greater than the 'Absolute Maximum Ratings' specified above, can cause permanent damage to the device. These are stress ratings only; functional operation of the device at these or any other conditions exceeding those indicated in this specification is not i mplied. Device reliability can be affected by exposure to absolute maximum rating conditions for extended periods of time . Semiconductor devices are ESD sensitive and can be damaged by exposure to ESD events. Suitable ESD precautions should be taken when handling and transporting these devices. Dissipation Rating Table Board Package Thermal Resistance θJA Thermal Resistance θJC TA ≤ +25°C Power Rating Derating Factor Above TA = +25°C TA = +70°C Power Rating TA = +85°C Power Rating High-K (Note 7) SOT26 160°C/W 55°C/W 625mW 6.25mW/°C 340mW 250mW High-K (Note 7) U-DFN2020-6 (Type C) 120°C/W 34°C/W 833mW 8.33mW/°C 450mW 330mW Note: 7. The JEDEC high-K (2s2p) board used to derive this data was a 3inch × 3inch, multilayer board with 1oz internal power and ground planes with 2oz copper traces on top and bottom of the board. Recommended Operating Conditions (@TA = +25°C, unless otherwise specified.) Symbol Parameter Min Max Unit VIN Input Voltage 2.7 5.5 V IOUT Continuous Output Current (-40°C ≤ TA ≤ +85°C) 0 2.1 A ,ENV ENV Enable Voltage 0 5.5 V VIH High-Level Input Voltage on EN orEN 2.0 VIN V VIL Low-Level Input Voltage on EN or EN 0 0.8 V RLIM Current-Limit Threshold Resistor Range (1% Initial Tolerance) 10 210 kΩ IO Continuous FAULT Sink Current 0 10 mA — Input De-Coupling Capacitance, IN to GND 0.1 — µF TA Operating Ambient Temperature -40 +85 °C TJ Operating Junction Temperature -40 +125 °C

AP2552/AP2553/AP2552A/AP2553A Document number: DS35404 Rev. 12 - 3 5 of 17 www.diodes.com September 2021 © Diodes Incorporated AP2552/AP2553 AP2552A/AP2553A Electrical Characteristics (@TA = +25°C, VIN = 2.7V to 5.5V, VEN = 0V or VEN = VIN, RFAULT = 10kΩ, unless otherwise specified.) Symbol Parameter Test Conditions (Note 8) Min Typ Max Unit Supply VUVLO Input UVLO VIN Rising — 2.4 2.65 V ∆VUVLO Input UVLO Hysteresis VIN Decreasing — 25 — mV ISHDN Input Shutdown Current VIN = 5.5V, Disabled, OUT = Open — 0.1 1 µA IQ Input Quiescent Current VIN = 5.5V, Enabled, OUT = Open, RLIM = 20kΩ — 100 140 µA VIN = 5.5V, Enabled, OUT = Open, RLIM = 210kΩ — 80 120 µA IREV Reverse Leakage Current Disabled, VIN = 0V, VOUT = 5.5V, IREV at VIN — 0.01 1 µA Power Switch RDS(ON) Switch On-Resistance U-DFN2020-6 (Type C) Package TJ = +25°C, VIN = 5.0V — 80 105 tR Output Turn-On Rise Time VIN = 5.5V, CL = 1µF, RLOAD = 100Ω. See Figure 1 — 1.1 1.5 ms VIN = 2.7V, CL = 1µF, RLOAD = 100Ω. — 0.7 1 ms tF Output Turn-Off Fall Time VIN = 5.5V, CL = 1µF, RLOAD = 100Ω. See Figure 1 0.1 — 0.5 ms VIN = 2.7V, CL = 1µF, RLOAD = 100Ω. 0.1 — 0.5 ms Current Limit ILIMIT Current-Limit Threshold (Maximum DC Output Current), VOUT = VIN -0.5V RLIM = 10kΩ -40°C ≤ TA ≤ +85°C 2200 2365 2542 mA RLIM = 15kΩ -40°C ≤ TA ≤ +85°C 1540 1632 1730 RLIM = 20kΩ TJ = +25°C 1180 1251 1326 -40°C ≤ TA ≤ +85°C 1160 1251 1340 RLIM = 49.9kΩ TJ = +25°C 500 530 562 -40°C ≤ TA ≤ +85°C 485 529 573 RLIM = 210kΩ 121 142 162 ILIM Shorted to IN or GND 50 75 100 ISHORT Short-Circuit Current Limit, OUT Connected to GND RLIM = 10kΩ — 2620 — mA RLIM = 15kΩ — 1820 — RLIM = 20kΩ — 1380 — RLIM = 49.9kΩ — 570 — RLIM = 210kΩ — 150 — ILIM Shorted to IN or GND — 75 — tSHORT Short-Circuit Response Time VOUT = 0V to IOUT = ILIMIT (OUT shorted to ground) See Figure 2 — 2 — µs Enable Pin ILEAK-EN EN Input Leakage Current VIN = 5V, VEN = 0V and 6V -0.5 — 0.5 µA tON Turn-On Time CL = 1µF, RL = 100Ω. See Figure 1 — — 3 ms tOFF Turn-Off Time CL = 1µF, RL = 100Ω. See Figure 1 — — 1 ms Output Discharge RDIS Discharge Resistance (Note 9) VIN = 5V, Disabled, IOUT =1mA — 600 — Ω RDIS_LATCH Discharge Resistance During Latch-Off V IN = 5V, Latch-Off, AP2552A/53A Only — 1000 — Ω Notes: 8. Pulse-testing techniques maintain junction temperature close to ambient temperature; thermal effects must be taken into account separately. 9. The discharge function is active when the device is disabled (when enable is de -asserted or during power-up power-down when VIN < VUVLO). The discharge function offers a resistive discharge path for the external storage capacitor for limited time.

AP2552/AP2553/AP2552A/AP2553A Document number: DS35404 Rev. 12 - 3 9 of 17 www.diodes.com September 2021 © Diodes Incorporated AP2552/AP2553 AP2552A/AP2553A

Application Information

The AP2552/53 and AP2552A/53A are integrated high- side power switches optimized for Universal Serial Bus (USB) that require protection functions. The power switches are equipped with a driver that controls the gate voltage and incorporates slew -rate limitation. This, along with the various protection features and special functions, makes these power switches ideal for hot-swap or hot-plug applications. Protection Features Under-Voltage Lockout (UVLO) Whenever the input voltage falls below UVLO threshold (~2.5V), the power switch is turned off. This facilitates the design of hot -insertion systems where it is not possible to turn off the power switch before input power is removed. Over-Current and Short-Circuit Protection An internal sensing FET is employed to che ck for over-current conditions. Unlike current-sense resistors, sense FETs do not increase the series resistance of the current path. When an overcurrent condition is detected, AP2552/53 maintains a constant output current and reduces the output voltage accordingly. Complete shutdown occurs only if the fault stays long enough to activate thermal limiting. For AP2552A/53A, w hen an overcurrent condition is detected, the devices will limit the current until the overload condition is removed or the internal deglitch time (7ms typical) is reached, and AP2552A/53A will be turned off. AP2552A/53A will remain latched off until power is cycled or the device enable is toggled. The different overload conditions and the corresponding response of the AP2552/53 and AP2552A/53A are outlined below: NO Conditions Explanation Behavior of the AP2552/53

1 Short-circuit condition at

Output is shorted before input voltage is applied or before the part is enabled The IC senses the short circuit and immediately clamps output current to a certain safe level namely ISHORT.

2 Short-circuit or overcurrent

condition that occurs when the part is enabled.

At the instance the overload occurs, higher current may flow for a very short period of time before the current limit function can react.
After the current limit function has tripped (reached the over - current trip threshold), the device switches into current limiting mode and the current is clamped at ISHORT /ILIMIT. Gradual increase from nominal operating current to ILIMIT Load increases gradually until the current-limit threshold.(ITRIG) The current rises until I LIMIT or thermal limit. Once the threshold has been reached, the device switches into its current limiting mode and is set at I LIMIT. NO Conditions Explanation Behavior of the AP2552A/53A

Output is shorted before input voltage is applied or before the part is enabled The IC senses the short circuit and immediately clamps output current to a certain safe level namely I SHORT. When the internal deglitch time (7ms typical) is reached and the devices will be turned off. condition that occurs when the part is enabled.

At the instance the overload occurs, higher current may flow for a very short period of time before the current limit function can react.
After the current limit function has tripped (reached the over - current trip threshold), the device switches into current li miting mode and the current is clamped at I SHORT /ILIMIT. When the internal deglitch time (7ms typical) is reached and the devices will be turned off. Gradual increase from nominal operating current to I LIMIT Load increases gradually until the current-limit threshold.(I TRIG) The current rises until I LIMIT or thermal limit. Once the threshold has been reached, the device switches into its current limiting mode and is set at I LIMIT. When the internal deglitch time (7ms typical) is reached and the devices will be turned off. Over-Current FAULT Signal The FAULT signal could be asserted in response to OCP before the device reaches its current limit. The output current upon FAULT signal triggered will be lower than the I _limit value. To implement FAULT signal for precision system protection control, it is recommended to leave enough margin from maximum continuous operating current for each RLIM value condition. For latch-off version, when over current is detected, device current will be clamped and device will latch off once FAULT signal asserted. To implement FAULT signal for precision system protection control, leave enough margin from maximum continuous operating current is highly recommended. Please consult Diodes Incorporated representative about margin recommendation for each RLIM value condition.

AP2552A/53A should be as short as possible to reduce parasitic effects on the current-limit accuracy. value of RLIM and the IOS(MIN) (ILIM) curve. Figure 15. Current-Limit Threshold vs. RLIM

AP2552/AP2553/AP2552A/AP2553A Document number: DS35404 Rev. 12 - 3 11 of 17 www.diodes.com September 2021 © Diodes Incorporated AP2552/AP2553 AP2552A/AP2553A Application Information (continued) Reverse-Current and Reverse-Voltage Protection The USB specification does not allow an output device to source current back into the USB port. In a normal MOSFET switch, current will flow in reverse direction (from the output side to the input side) when the output side voltage is higher than the input side. A reverse- current limit (ROCP) feature is implemented in the AP2552/53 and AP2552A/53A to limit such back currents. The ROCP circuit is activated when the output voltage is higher than the input voltage. After the reverse current circuit has tripped (reached the reverse current trip threshold), the current is clamped at this IROCP level. In addition to ROCP, reverse over -voltage protection ( ROVP) is also implemented. The RO VP circuit is activated by the reverse voltage comparator trip point; i.e., the difference between the output voltage and the input voltage. For AP2552/53, once ROVP is activated, FAULT assertion occurs at a de- glitch time of 4ms. Recovery from ROVP is au tomatic when the fault is removed. FAULT de-assertion de-glitch time is same as the de-assertion time. For AP2552A/53A, once ROVP is activated and when the condition exists for more than 5ms (Typ.), output device is disabled and shut down. This is called the "Time from Reverse -Voltage Condition to MOSFET Turn Off ". FAULT assertion occurs at a de- glitch time of 4ms after ROVP is reached. Recovery from this fault is achieved by recycling power or toggling EN. FAULT de- assertion de-glitch time is same as the de- assertion time. Special Functions Discharge Function When enable is de- asserted, or when the input voltage is under UVLO level, the discharge function is active. The output capacitor is discharged through an internal NMOS that has a discharge resistance of 100Ω. Hence, the output voltage drops down to zero. The time taken for discharge is dependent on the RC time constant of the resistance and the output capacitor. FAULT Response The FAULT open- drain output goes active low for any of following faults: Current limit threshold, short - circuit current limit, reverse- voltage condition or thermal shutdown. The time from when a fault condition is encountered to when the FAULT output goes low is 7ms ( Typ.). The FAULT output remains low until over -current, short -circuit current limit and over -temperature conditions are removed. Connecting a heavy capacitive load to the output of the device can cause a momentary o ver-current condition, which does not trigger the FAULT due to the 7ms deglitch timeout. This 7ms timeout is also applicable for over-current recovery and over-temperature recovery. The AP2552/53 and AP2552A/53A are designed to eliminate erroneous over-current reporting without the need for external components, such as an RC delay network. For the AP2552/53 and AP2552A/53A when the reverse voltage condition is triggered, FAULT output goes low after 4ms (Typ.). This 4ms (Typ.) timeout is also applicable for the recovery from reverse voltage fault. When the ILIM pin is shorted to IN or GND, current -limit threshold and short-circuit current limit will be clamped at typically 75mA. When the ILIM pin is shorted to IN or GND , the AP2552/53 and AP2552A/53A FAULT pin will not assert during current limiting conditions; The FAULT pin will assert during short circuit conditions. For latch-off version, once Fault signal is triggered, device will stay off until EN pin is toggled or power is restarted. Power Supply Considerations A 0.01μF to 0.1μF X7R or X5R ceramic bypass capacitor between IN and GND, close to the device, is recommended. This limits the input voltage drop during line transients. Placing a high-value electrolytic capacitor on the input (10μF minimum) and output pin (120µF) is recommended when the output load is heavy. This precaution also reduces power -supply transients that may cause ringing on the input. Additionally, bypassing the device output with a 0.1μF to 4.7μF ceramic capacitor improves the immunity of the device to short-circuit transients. This capacitor also prevents output from going negative during turn-off due to parasitic inductance. Power Dissipation and Junction Temperature The low on- resistance of the internal MOSFET allows the small surface- mount packages to pass large current. Using the maximum operating ambient temperature (T A) and RDS(ON), the power dissipation can be calculated by: PD = RDS(ON)× I2 Finally, calculate the junction temperature: TJ = PD x θJA + TA Where: TA = Ambient temperature °C θJA = Thermal resistance PD = Total power dissipation

AP2552/AP2553/AP2552A/AP2553A Document number: DS35404 Rev. 12 - 3 12 of 17 www.diodes.com September 2021 © Diodes Incorporated AP2552/AP2553 AP2552A/AP2553A Application Information (continued) Generic Hot-Plug Applications In many applications it may be necessary to remove modules or PC boards while the main unit is still operating. These are considered hot-plug applications. Such implementations require the control of current surges seen by the main power supply and the card being ins erted. The most effective way to control these surges is to limit and slowly ramp the current and voltage being applied to the card, similar to the way in which a power supply normally turns on. Due to the controlled rise and fall time of the AP2552/53 and AP2552A/53A, these devices can be used to provide a softer start-up to devices being hot -plugged into a powered system. The UVLO feature of the AP2552/53 and AP2552A/53A also ensures that the switch is off after the card has been removed, and that the switch is off during the next insertion. Generic Hot-Plug Applications By placing the AP2552/53 and AP2552A/53A between the VCC input and the rest of the circuitry, the input power reaches these devices first after insertion. The typical rise time of the switch is approximately 1ms, providing a slow voltage ramp at the output of the devic e. This implementation controls system surge current and provides a hot-plugging mechanism for any device.

Ordering Information

7/7R : Tape & Reel AP255 X X XXX - XX Enable Latch-Off Package Packing 2 : Active Low 3 : Active High Blank : Non Latch-off A : Latch-off W6 : SOT26 FDC : U-DFN2020-6 (Type C) Part Number Enable Active Output Fault Condition Package Code Packaging 7” Tape and Reel Quantity Part Number Suffix AP2552W6-7 Low Output Current Limits W6 SOT26 3000/Tape & Reel -7 AP2552FDC-7 FDC U-DFN2020-6 (Type C) 3000/Tape & Reel -7 AP2552FDC-7R FDC U-DFN2020-6 (Type C) 3000/Tape & Reel -7R AP2553W6-7 High W6 SOT26 3000/Tape & Reel -7 AP2553FDC-7 FDC U-DFN2020-6 (Type C) 3000/Tape & Reel -7 AP2553FDC-7R FDC U-DFN2020-6 (Type C) 3000/Tape & Reel -7R AP2552AW6-7 Low Output Latches Off W6 SOT26 3000/Tape & Reel -7 AP2552AFDC-7 FDC U-DFN2020-6 (Type C) 3000/Tape & Reel -7 AP2552AFDC-7R FDC U-DFN2020-6 (Type C) 3000/Tape & Reel -7R AP2553AW6-7 High W6 SOT26 3000/Tape & Reel -7 AP2553AFDC-7 FDC U-DFN2020-6 (Type C) 3000/Tape & Reel -7 AP2553AFDC-7R FDC U-DFN2020-6 (Type C) 3000/Tape & Reel -7R

AP2552/AP2553/AP2552A/AP2553A Document number: DS35404 Rev. 12 - 3 13 of 17 www.diodes.com September 2021 © Diodes Incorporated AP2552/AP2553 AP2552A/AP2553A Marking Information (1) SOT26 1 2 3 XX Y W X XX : Identification Code Y : Year 0~9 X : Internal Code (Top View) W : Week : A~Z : 1~26 week; a~z : 27~52 week; z represents 52 and 53 week Part Number Package Identification Code AP2552W6-7 SOT26 BJ AP2553W6-7 SOT26 BK AP2552AW6-7 SOT26 BM AP2553AW6-7 SOT26 BN (2) U-DFN2020-6 (Type C) (Top View) XX Y : Year : 0~9 X : Internal Code XX : Identification Code W : Week : A~Z : 1~26 week; a~z : 27~52 week; z represents 52 and 53 week Y W X Part Number Package Identification Code AP2552FDC-7 U-DFN2020-6 (Type C) BJ AP2552FDC-7R U-DFN2020-6 (Type C) BJ AP2553FDC-7 U-DFN2020-6 (Type C) BK AP2553FDC-7R U-DFN2020-6 (Type C) BK AP2552AFDC-7 U-DFN2020-6 (Type C) BM AP2552AFDC-7R U-DFN2020-6 (Type C) BM AP2553AFDC-7 U-DFN2020-6 (Type C) BN AP2553AFDC-7R U-DFN2020-6 (Type C) BN

AP2552/AP2553/AP2552A/AP2553A Document number: DS35404 Rev. 12 - 3 14 of 17 www.diodes.com September 2021 © Diodes Incorporated AP2552/AP2553 AP2552A/AP2553A Package Outline Dimensions Please see http://www.diodes.com/package-outlines.html for the latest version. (1) Package Type: SOT26 D e E1 E b A2 A1 Seating Plane L c a (2) Package Type: U-DFN2020-6 (Type C) D E e b L A A3 Seating Plane Pin #1 ID Z(4x) SOT26 Dim Min Max Typ A1 0.013 0.10 0.05 A2 1.00 1.30 1.10 A3 0.70 0.80 0.75 b 0.35 0.50 0.38 c 0.10 0.20 0.15 D 2.90 3.10 3.00 e - - 0.95 e1 - - 1.90 E 2.70 3.00 2.80 E1 1.50 1.70 1.60 L 0.35 0.55 0.40 a - - 8° a1 - - 7° All Dimensions in mm U-DFN2020-6 Type C Dim Min Max Typ A 0.57 0.63 0.60 A1 0.00 0.05 0.02 A3 –– –– 0.15 b 0.25 0.35 0.30 D 1.95 2.075 2.00 D2 1.55 1.75 1.65 E 1.95 2.075 2.00 E2 0.86 1.06 0.96 e –– –– 0.65 L 0.25 0.35 0.30 Z –– –– 0.20 All Dimensions in mm

AP2552/AP2553/AP2552A/AP2553A Document number: DS35404 Rev. 12 - 3 15 of 17 www.diodes.com September 2021 © Diodes Incorporated AP2552/AP2553 AP2552A/AP2553A Suggested Pad Layout Please see http://www.diodes.com/package-outlines.html for the latest version. (1) Package Type: SOT26 Y1 G X Y C (2) Package Type: U-DFN2020-6 (Type C) Y X C Dimensions Value (in mm) C 2.40 C1 0.95 G 1.60 X 0.55 Y 0.80 Y1 3.20 Dimensions Value (in mm) C 0.650 X 0.350 X1 1.650 X2 1.700 Y 0.525 Y1 1.010 Y2 2.400

AP2552/AP2553/AP2552A/AP2553A Document number: DS35404 Rev. 12 - 3 16 of 17 www.diodes.com September 2021 © Diodes Incorporated AP2552/AP2553 AP2552A/AP2553A Taping Orientation (Note 10) (1) Package Type: SOT26 (2) Package Type (-7) : U-DFN2020-6 (Type C) (3) Package Type (-7R) : U-DFN2020-6 (Type C)

AP2552/AP2553/AP2552A/AP2553A Document number: DS35404 Rev. 12 - 3 17 of 17 www.diodes.com September 2021 © Diodes Incorporated AP2552/AP2553 AP2552A/AP2553A IMPORTANT NOTICE DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). Diodes Incorporated and its subsidiaries reserve the right to make m odifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applic ations shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporat ed website, harmless against all damages. Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel. Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and hold Diodes Incorporated and its representatives harmles s against all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application. Products described herein may be covered by one or more U nited States, international or foreign patents pending. Product names and markings noted herein may also be covered by one or more United States, international or foreign trademarks. This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the final and determinative format released by Diodes Incorporated. LIFE SUPPORT Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein: A. Life support devices or systems are devices or systems which: 1. are intended to implant into the body, or 2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user. B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated produc ts in such safety -critical, life support devices or systems, notwithstanding any devices - or systems -related information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporat ed and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems. Copyright © 2020, Diodes Incorporated www.diodes.com

Summary

The AP2552/53and AP2552A/53A are single channel precision adjustable current-limited switches optimized for the applications... Rev erse

Description