AP2303

AP2303

Document overview

• Manufacturer or author: Diodes Incorporated
• PDF pages: 16

Technical content

Features

• Support DDR-II (VTT = 0.9V), DDR-III (VTT = 0.75V), DDR-IIIL (VTT = 0.675V), DDR-IV (VTT = 0.6V) Application
• Source and Sink up to 1.75A Current
• Output Voltage Accuracy Over Full Load: ± 2% (max.)
• Soft Start-up and Shutdown along with VIN, VCNTL and VREFEN Rising and Shutdown along with VIN, VCNTL and VREFEN Dropping
• Flexible Output by 2 External Resistors
• Requires minimum 10µ F Output Ceramic Capacitor for Application
• Current Limit Protection for Both Source and Sink
• OTSD Protection
• Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
• Halogen and Antimony Free. “Green” Device (Note 3)
• For automotive applications requiring specific change control (i.e. parts qualified to AEC-Q100/101/104/200, PPAP capable, and manufactured in IATF 16949 certified facilities), please contact us or your local Diodes representative. https://www.diodes.com/quality/product-definitions/ Pin Assignments (Top View) SOIC-8 (Top View) PSOP-8

Applications

• DDR-II/DDR-III/DDR-IIIL/DDR-IV memory systems
• Desktop PCs, notebook mother boards
• Graphic cards
• STB, LCD-TV, Web-TV Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS), 2011/65/EU (RoHS 2) & 2015/863/EU (RoHS 3) compliant. 2. See https://www.diodes.com/quality/lead-free/ for more information about Diodes Incorporated’s definitions of Halogen - and Antimony-free, "Green" and Lead-free. 3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds. VIN GND VREFEN VOUT NC NC VCNTL NC 5VO U T G N D VIN NC NC VCNTL NC VREFEN Exposed Pad THE AP2303 IS NOT RECOMMENDED FOR NEW DESIGNS. PLEASE CONTACT US.

Document number: DS36546 Rev. 4 - 3 2 of 16 www.diodes.com April 2024 © 2024 Copyright Diodes Incorporated. All Rights Reserved. AP2303 Typical Applications Circuit VIN VCNTL VREFEN AP2303 VOUT GND RTT COUT VCNTL=3.3V/5V R2 CSS CCNTL CIN VIN=1.8V/1.5V/1.35V/1.2V RDUMMY Shutdown Enable Pin Descriptions Pin Number Pin Name Function 1 VIN Unregulated input supply. A small 10µ F MLCC should be connected from this pin to GND.

2 GND Ground

3 VREFEN Reference voltage input and active low shutdown control pin. Pulling the pin to ground turns off device by BJT or FET. When it is released, a soft-start will take for about 0.1ms. 4 VOUT Regulated voltage output. A minimum of 10µ F ceramic capacitor to ground is required to assure stability. 5, 7, 8 NC No Connection 6 VCNTL VCNTL supplies the internal control circuitry and provides the drive voltage. — Exposed Pad The exposed pad should be connected to ground copper for better heat dissipation performance.

Document number: DS36546 Rev. 4 - 3 3 of 16 www.diodes.com April 2024 © 2024 Copyright Diodes Incorporated. All Rights Reserved. AP2303 Functional Block Diagram Enable Thermal Shutdown Current Limit Error Amplifier and Soft Start Power On Reset VCNTL EN VREF OTSD POR VIN VREFEN VOUT GND

Document number: DS36546 Rev. 4 - 3 4 of 16 www.diodes.com April 2024 © 2024 Copyright Diodes Incorporated. All Rights Reserved. AP2303 Absolute Maximum Ratings (Note 4) Symbol Parameter Rating Unit VIN Power Input Voltage -0.3 to 6 V VCNTL Control Input Voltage -0.3 to 6 V VREFEN Reference Input Voltage -0.3 to 6 V TSTG Storage Temperature +150 °C TJ Junction Temperature +150 °C TLEAD Lead Temperature (Soldering, 10sec) +260 °C θJA Thermal Resistance (Junction to Ambient) (Note 5) PSOP-8 80 °C/W SOIC-8 110 θJC Thermal Resistance (Junction to Case) PSOP-8 38 °C/W SOIC-8 50 ESD ESD (Human Body Model) 2000 V ESD ESD (Machine Model) 200 V Notes: 4. Stresses greater than those listed under “Absolute Maximum Ratings” can cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “Recommended Operating Conditions” is not implied. Exposure to “Absolute Maximum Ratings” for extended periods can affect device reliability. 5. θJA is measured with the component mounted on a 2-Layer FR-4 board with 2.54cm*2.54cm thermal sink pad in free air. Recommended Operating Conditions Symbol Parameter Min Max Unit VCNTL Control Input Voltage (Note 6) 3.0 5.5 V VIN Power Input Voltage 1.2 5.5 V VREFEN Reference Input Voltage 0.6 VCNTL-2.2 V TJ Operating Junction Temperature Range -40 +125 °C TA Operating Ambient Temperature Range -40 +85 °C Note: 6. Keep VCNTL ≥ VIN in operation power on and power off sequences.

Document number: DS36546 Rev. 4 - 3 5 of 16 www.diodes.com April 2024 © 2024 Copyright Diodes Incorporated. All Rights Reserved. AP2303 (Ceramic), COUT = 10µF (Ceramic), unless otherwise specified.) Symbol Parameter Conditions Min Typ Max Unit Input IVCNTL VCNTL Operating Current No Load — 0.5 1.5 mA ISD-VCNTL VCNTL Input Current in Shutdown Mode VREFEN < 0.15V — 30 50 µA ISD-VIN VIN Input Current in Shutdown Mode VREFEN < 0.15V -1 — 1 µA IVREFEN VREFEN Leakage Current VREFEN = 0.75V -1 — 1 µA Output VOS Output Offset Voltage (Note 7) No Load -10 0 10 mV VDROPOUT Dropout Voltage VCNTL = 3.3V, IOUT = 1A — 220 — mV VCNTL = 3.3V, IOUT = 1.5A — 400 — VCNTL = 3.3V, IOUT = 1.75A — 520 — VLOAD Load Regulation IOUT = 0A to 1.75A -20 — 20 mV IOUT = 0A to -1.75A -20 — 20 Protection ILIMIT Current Limit Source 1.75 — — A Sink — — -1.75 ISHORT Short Current VOUT = 0V — 2 — A VOUT = VIN — -2 — TSHDN Thermal Shutdown Temperature 3.3V ≤ VCNTL ≤ 5V — +160 — °C — Thermal Shutdown Hysteresis — — +30 — °C Start-up & Shutdown Function VIH VREFEN Shutdown Threshold Voltage Output = High 0.4 — — V VIL Output = Low — — 0.15 VCNTL-ON VCNTL Shutdown Threshold Voltage Output = High 2.9 — — V VCNTL-OFF Output = Low — — 2.2 VIN-ON VIN Shutdown Threshold Voltage Output = High 1.1 — — V VIN-OFF Output = Low — — 0.4 Note: 7. VOS is the voltage measurement defined as VOUT subtracted from VREFEN.

Document number: DS36546 Rev. 4 - 3 6 of 16 www.diodes.com April 2024 © 2024 Copyright Diodes Incorporated. All Rights Reserved. AP2303 Performance Characteristics Output Offset Voltage vs. Ambient Temperature Dropout Voltage vs. Output Current Source Current Limit vs. VCNTL Input Voltage Sink Current Limit vs. VCNTL Input Voltage VCNTL Operating Input Current vs. Ambient Temperature VCNTL Standby Current vs. Ambient Temperature -40 -20 0 20 40 60 80 100 120 0.0 0.5 1.0 1.5 2.0 2.5 3.0 Output Offset Voltage (mV) Ambient Temperature ( o 100 150 200 250 300 350 400 450 500 550 600 650 700 Dropout Voltage (mV) Output Current (A) VCNTL=3.3V TA=-40 o C TA=25 o C TA=85 o C 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8 4.0 Source Current Limit (A) VCNTL Input Voltage (V) VIN=1.5V, VREFEN=0.75V TA=-40 o C TA=25 o C TA=85 o C -1.0 -1.2 -1.4 -1.6 -1.8 -2.0 -2.2 -2.4 -2.6 -2.8 -3.0 -3.2 -3.4 -3.6 -3.8 -4.0 Sink Current Limit (A) VCNTL Input Voltage (V) VIN=1.5V, VREFEN=0.75V TA=-40 o C TA=25 o C TA=85 o C -40 -20 0 20 40 60 80 100 120 400 450 500 550 600 650 700 VCNTL Operating Input Current (A) Ambient Temperature ( o VCNTL=5V -40 -20 0 20 40 60 80 100 120 VCNTL Standby Current (A) Ambient Temperature ( o VCNTL=5V, VREFEN=0.15V

Document number: DS36546 Rev. 4 - 3 7 of 16 www.diodes.com April 2024 © 2024 Copyright Diodes Incorporated. All Rights Reserved. AP2303 Performance Characteristics (continued) Output Voltage vs. Source Current (DDR-III) Output Voltage vs. Sink Current (DDR-III) Output Voltage vs. Source Current (DDR-IV) Output Voltage vs. Sink Current (DDR-IV) VIN Input Current vs. VIN Input Voltage VIN Input Current vs. VCNTL Input Voltage 0.730 0.735 0.740 0.745 0.750 0.755 0.760 0.765 0.770 Output Voltage (V) Source Current (A) VIN=1.5V, VCNTL=3.3V, VREFEN=0.75V TA=-40 o C TA=25 o C TA=85 o C 0.730 0.735 0.740 0.745 0.750 0.755 0.760 0.765 0.770 Output Voltage (V) Sink Current (A) VIN=1.5V, VCNTL=3.3V, VREFEN=0.75V TA=-40 o C TA=25 o C TA=85 o C 0.580 0.585 0.590 0.595 0.600 0.605 0.610 0.615 0.620 Output Voltage (V) Source Current (A) VIN=1.2V, VCNTL=3.3V, VREFEN=0.6V TA=-40 o C TA=25 o C TA=85 o C 0.580 0.585 0.590 0.595 0.600 0.605 0.610 0.615 0.620 Output Voltage (V) Sink Current (A) VIN=1.2V, VCNTL=3.3V, VREFEN=0.6V TA=-40 o C TA=25 o C TA=85 o C VIN Input Current (A) VIN Input Voltage (V) VCNTL=5V，VREFEN=0.9V No Load 200 400 600 800 1000 1200 1400 1600 1800 2000 VIN Input Current (A) VCNTL Input Voltage (V) VIN=1.5V, VREFEN=0.75V No Load TA=-40 o C TA=25 o C TA=85 o C

Document number: DS36546 Rev. 4 - 3 8 of 16 www.diodes.com April 2024 © 2024 Copyright Diodes Incorporated. All Rights Reserved. AP2303 Performance Characteristics (continued) Source Load Transient (DDR-III) Sink Load Transient (DDR-III) (CIN=COUT=10µ F, IOUT=0A to 1.75A, (CIN=COUT=10µ F, IOUT=0A to -1.75A, Source Load Transient (DDR-IV) Sink Load Transient (DDR-IV) (CIN=COUT=10µ F, IOUT=0A to 1.75A, (CIN=COUT=10µ F, IOUT=0A to -1.75A, VREFEN Power On VREFEN Power Off (CIN=COUT=10µF, RLOAD=5Ω, VCNTL=5V) (CIN=COUT=10µF, RLOAD=5Ω, VCNTL=5V) VOUT 20mV/div IOUT 1A/div Time 100µs/div VOUT 20mV/div IOUT 1A/div Time 100µs/div VIN 500mV/div VREFEN 50mV/div VREFEN 50mV/div VIN 500mV/div VOUT 20mV/div IOUT 1A/div Time 100µs/div VOUT 20mV/div IOUT 1A/div Time 100µs/div VREFEN 50mV/div VIN 500mV/div VIN 500mV/div VREFEN 50mV/div VREFEN 500mV/div IOUT 200mA/div Time 100µs/div VREFEN 500mV/div IOUT 200mA/div Time 100µs/div VIN 1V/div VOUT 500mV/div VOUT 500mV/div VIN 1V/div

Document number: DS36546 Rev. 4 - 3 9 of 16 www.diodes.com April 2024 © 2024 Copyright Diodes Incorporated. All Rights Reserved. AP2303 Performance Characteristics (continued) VIN Power On VIN Power Off (CIN=COUT=10µF, RLOAD=5Ω, VCNTL=5V) (CIN=COUT=10µF, RLOAD=5Ω, VCNTL=5V) VCNTL Power On VCNTL Power Off (CIN=COUT=10µF, RLOAD=5Ω) (CIN=COUT=10µF, RLOAD=5Ω) VOUT 500mV/div VIN 1V/div VREFEN 1V/div IOUT 200mA/div VOUT 500mV/div VIN 1V/div VREFEN 1V/div IOUT 200mA/div Time 100µs/div Time 500ms/div VOUT 500mV/div VIN 1V/div VCNTL 2V/div IOUT 200mA/div VOUT 500mV/div VIN 1V/div VCNTL 2V/div IOUT 200mA/div Time 100µs/div Time 100µs/div

Document number: DS36546 Rev. 4 - 3 10 of 16 www.diodes.com April 2024 © 2024 Copyright Diodes Incorporated. All Rights Reserved. AP2303

1. Input Capacitor The input capacitor of VIN should be placed to VIN pin as close as possible. Use a low ESR, 10µ F or larger MLCC capacitor to provide surge current during load transient. The input capacitor for VCNTL is recommended to be 0.47µ F or larger to decouple the supply voltage of the AP2303’s control circuitry. 2. Output Capacitor The output capacitor is recommended with a 10µ F or higher MLCC capacitor which will be sufficient at full temperature range. An aluminum electrolytic capacitor with low ESR also should be larger than 10µ F. The output capacitor should be placed to VOUT pin as close as possible. 3. Reference Voltage A reference voltage is applied to the VREFEN pin by a resistor divider between VIN and GND pins. And a 0.1µ F to 1µ F bypass capacitor is preferred to form a low-pass filter to reduce the noise from VIN. More capacitance and large resistance will increase the start-up time after VIN power-up. 4. Thermal Consideration There’s an internal thermal protection circuitry of the AP2303 to protect device during overload conditions. For continuous operation, make sure not to exceed the operating junction temperature range of +125° C. The power dissipation definition in device is: PD=(VIN - VOUT)xIOUT+VINxIQ The maximum power dissipation depends on the thermal resistance of IC package, PCB layout and the surrounding airflow. The maximum power dissipation can also be calculated as: PD(MAX) = (TJ(MAX)-TA)/θJA The maximum power dissipation for PSOP-8 package at TA = +25° C can be calculated as:

Document number: DS36546 Rev. 4 - 3 11 of 16 www.diodes.com April 2024 © 2024 Copyright Diodes Incorporated. All Rights Reserved. AP2303

Ordering Information

AP2303 XX XX – XX PackingPackageProduct Name TR : Tape & ReelM : SOIC-8 G1 : Green RoHS/Green MP : PSOP-8 Diodes IC’s Pb-free products with "G1" suffix in the part number, are RoHS compliant and green. Part Number Package Temperature Range Marking ID Packing Qty. Carrier AP2303MTR-G1 SOIC-8 -40C to +85C 2303M-G1 4000 Tape & Reel AP2303MPTR-G1 PSOP-8 2303MP-G1 4000 Tape & Reel Marking Information (1) SOIC-8 (Top View) (2) PSOP-8 (Top View) First and Second Lines: Logo and Marking ID Third Line: Date Code Y: Year WW: Work Week of Molding A: Assembly House Code XX: 7th and8th Digits of Batch No. 2303M -G1 YWWAXX 2303MP -G1 YWWAXX First and Second Lines: Logo and Marking ID Third Line: Date Code Y: Year WW: Work Week of Molding A: Assembly House Code XX: 7th and 8th Digits of Batch No.

Document number: DS36546 Rev. 4 - 3 12 of 16 www.diodes.com April 2024 © 2024 Copyright Diodes Incorporated. All Rights Reserved. AP2303 Package Outline Dimensions (All dimensions in mm(inch).) Please see http://www.diodes.com/package-outlines.html for the latest version. (1) Package Type: SOIC-8 0 ° 8 ° 1 ° 7 ° R0.150(0.006) R0.150(0.006) 1.000(0.039) 0.300(0.012) 0.510(0.020) 1.350(0.053) 1.750(0.069) 0.100(0.004) 0.300(0.012) 3.800(0.150) 4.000(0.157) 7 ° 20:1 D 1.270(0.050) TYP 0.150(0.006) 0.250(0.010) 8 ° D 5.800(0.228) 6.200(0.244) 0.600(0.024) 0.725(0.029) 0.320(0.013) 8 ° 0.450(0.017) 0.820(0.032) 4.700(0.185) 5.100(0.201) Note: Eject hole, oriented hole and mold mark is optional. Option 1 Option 1 Option 2 0.350(0.014) TYP TYP TYP 9°~ 9°~

Document number: DS36546 Rev. 4 - 3 13 of 16 www.diodes.com April 2024 © 2024 Copyright Diodes Incorporated. All Rights Reserved. AP2303 Package Outline Dimensions (continued. All dimensions in mm(inch).) Please see http://www.diodes.com/package-outlines.html for the latest version. (2) Package Type: PSOP-8 5.800(0.228) 6.200(0.244) 1.270(0.050) 0.400(0.016) 3.800(0.150) 4.000(0.157) 0.150(0.006) TYP 0.250(0.010) 0.150(0.006) 1.350(0.053) 1.550(0.061) 2.110(0.083) 2.710(0.107) 2.750(0.108) 3.402(0.134) 5.100(0.201) Note: Eject hole, oriented hole and mold mark is optional. 0.300(0.012)

Document number: DS36546 Rev. 4 - 3 14 of 16 www.diodes.com April 2024 © 2024 Copyright Diodes Incorporated. All Rights Reserved. AP2303 Suggested Pad Layout Please see http://www.diodes.com/package-outlines.html for the latest version. (1) Package Type: SOIC-8 Grid placement courtyard ZG Y E X Dimensions Z (mm)/(inch) G (mm)/(inch) X (mm)/(inch) Y (mm)/(inch) E (mm)/(inch)

Document number: DS36546 Rev. 4 - 3 15 of 16 www.diodes.com April 2024 © 2024 Copyright Diodes Incorporated. All Rights Reserved. AP2303 Suggested Pad Layout (continued) Please see http://www.diodes.com/package-outlines.html for the latest version. (2) Package Type: PSOP-8 G E X Y Y1 Z Dimensions Z (mm)/(inch) G (mm)/(inch) X (mm)/(inch) Y (mm)/(inch) (mm)/(inch) (mm)/(inch) E (mm)/(inch)

Document number: DS36546 Rev. 4 - 3 16 of 16 www.diodes.com April 2024 © 2024 Copyright Diodes Incorporated. All Rights Reserved. AP2303 IMPORTANT NOTICE 1. DIODES INCORPORATED (Diodes) AND ITS SUBSIDIARIES MAKE NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO ANY INFORMATION CONTAINED IN THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTI CULAR PURPOSE OR NON -INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). 2. The Information contained herein is for informational purpose only and is provided only to illustrate the operation of Diodes ’ products described herein and application examples. Diodes does not assume any liability arising out of the application or use of this document or any product described herein. This document is intended for skilled and technically trained engineering customers and users who design with Diodes’ products. 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