AP2301SG-13

AP2301 DIODES | Alldatasheet

Document overview

• Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
• PDF pages: 18

Technical content

Features

• Single channel current-limited power switch
• Output discharge function
• Fast short-circuit response time: 2µs
• 2.5A accurate current limiting
• Reverse current blocking
• 70m Ω on-resistance
• Input voltage rang e: 2.7V – 5.5V
• Built-in soft-start with 0.6ms typical rise time
• Over-current and thermal protection
• Fault report (FLG) with blanking time (7ms typ)
• ESD protection: 2KV HBM, 300V MM
• Active low (AP2301) or active high (AP2311) enable
• Ambient temperature range: -40ºC to 85°C
• SO-8, MSOP-8-EP and DFN3030E-8: Available in “Green” Molding Compound (No Br, Sb)
• Lead Free Finish / RoHS Compliant (Note 1)
• UL Recognized, File Number E322375
• IEC60950-1 CB Scheme Certified

Applications

• LCD TVs & Monitors
• Set-Top-Boxes, Residential Gateways
• Laptops, Desktops, Servers, e-Readers
• Printers, Docking Stations, HUBs Pin Assignments ( Top View ) NC OUT FLG OUT GND EN IN IN SO-8 OUT FLG OUT GND EN IN IN ( Top View ) NC MSOP-8-EP ( Top View ) EN GND NC1 2IN FLG IN OUT OUT DFN3030E-8 Notes: 1. EU Directive 2002/95/EC (RoHS). All applicable RoHS exemptions applied. Please visit our website at http://www.diodes.com/products/lead_free.html.

2.0A SINGLE CHANNEL CURRENT-LIMITED POWER SWITCH AP2301/AP2311 Document number: DS32241 Rev. 1 - 2 2 of 18 www.diodes.com June 2010 © Diodes Incorporated NEW PRODUCT Typical Application Circuit 0.1uF IN GNDEN OUT ON 120uF Power Supply 2.7V to 5.5V 0.1uF OFF FLG Load 10k Enable Active High Available Options Part Number Channel Enable pin (EN) Recommended maximum continuous load current (A) Typical current limit (A) Package AP2301 1 Active Low 2.0A 2.5A SO-8 MSOP-8-EP DFN3030E-8 AP2311 1 Active High Pin Descriptions Pin Name Pin Number Descriptions GND 1 Ground IN 2, 3 Voltage input pin; connect a 0.1µF or larger ceramic capacitor from IN to GND as close as possible. (all IN pins must be tied together externally) EN 4 Enable input, active low (AP2301) or active high (AP2311) FLG 5 Over-temperature and over-current fault reporting with 7ms deglitch; active low open-drain output. FLG is disabled for 7ms after turn-on. OUT 6, 7 Voltage output pin (all OUT pins must be tied together externally) NC 8 No internal connection; recommend tie to OUT pins Exposed Pad - Recommend connecting to the GND externally for improved power dissipation

2.0A SINGLE CHANNEL CURRENT-LIMITED POWER SWITCH AP2301/AP2311 Document number: DS32241 Rev. 1 - 2 3 of 18 www.diodes.com June 2010 © Diodes Incorporated NEW PRODUCT Functional Block Diagram Thermal Sense FLG OUT GND IN EN UVLO Current Limit Current Sense Deglitch Discharge Control Driver Absolute Maximum Ratings Symbol Parameter Ratings Unit ESD HBM Human Body Model ESD Protection 2 KV ESD MM Machine Model ESD Protection 300 V VIN Input Voltage 6.5 V VOUT Output Voltage VIN + 0.3 V VEN , VFLG Enable Voltage 6.5 V Iload Maximum Continuous Load Current Internal Limited A TJmax Maximum Junction Temperature 150 °C TST Storage Temperature Range (Note 2) -65 to 150 °C Notes: 2. UL Recognized Rating from -30°C to 70°C (Diodes qualified TST from -65°C to 150°C) Recommended Operating Conditions Symbol Parameter Min Max Unit VIN Input voltage 2.7 5.5 V IOUT Output Current 0 2.0 A TA Operating Ambient Temperature -40 85 °C

2.0A SINGLE CHANNEL CURRENT-LIMITED POWER SWITCH AP2301/AP2311 Document number: DS32241 Rev. 1 - 2 4 of 18 www.diodes.com June 2010 © Diodes Incorporated NEW PRODUCT Electrical Characteristics (TA = 25oC, VIN = +5.0V, CIN = 0.1μF, CL = 1μF, unless otherwise stated) Symbol Parameter Test Conditions (Note 3) Min Typ. Max Unit VUVLO Input UVLO VIN rising 1.6 2.0 2.4 V ΔVUVLO Input UVLO Hysteresis V IN decreasing 50 mV ISHDN Input Shutdown Current Dis abled, OUT = open 0.1 1 μA IQ Input Quiescent Current Enabled, OUT = open 60 100 μA ILEAK Input Leakage Current Disab led, OUT grounded 0.1 1 μA IREV Reverse Leakage Current Disabled, V IN= 0V, VOUT= 5V, IREV at VIN 0.01 1 μA RDS(ON) Switch on-resistance VIN = 5V, IOUT= 2.0A TA = 25oC 70 84 mΩ -40oC ≤ TA ≤ 85oC 105 VIN = 3.3V, IOUT= 2.0A TA = 25oC 90 108 -40oC ≤ TA ≤ 85oC 135 ILIMIT Over-Load Current Limit (Note 4) VIN= 5V, VOUT= 4.5V -40 oC≤ TA ≤85oC 2.0 2.5 2.85 A ITrig Current limiting trigger threshold Output Current Slew rate (<100A/s) 2.5 A ISHORT Short-Circuit Current Limit Enabled into short circuit 2.75 A TSHORT Short-circuit Response Time V OUT = 0V to IOUT = ILIMIT (OUT shorted to ground) 2 μs VIL EN Input Logic Low Voltage V IN = 2.7V to 5.5V 0.8 V VIH EN Input Logic High Voltage V IN = 2.7V to 5.5V 2 V ILEAK-EN EN Input leakage VIN = 5V, VEN = 0V and 5.5V 0.01 1 μA ILEAK-O Output leakage current Disabled, V OUT= 0V 0.5 1 μA TD(ON) Output turn-on delay time CL= 1μF, Rload= 5Ω 0.1 ms TR Output turn-on rise time CL= 1μF, Rload= 5Ω 0.6 1.5 ms TD(OFF) Output turn-off delay time CL= 1μF, Rload= 5Ω 0.1 ms TF Output turn-off fall time CL= 1μF, Rload= 5Ω 0.05 0.1 ms RFLG FLG output FET on-resistance I FLG = 10mA 20 40 Ω IFOH FLG Off Current VFLG= 5V 0.01 1 μA TBlank FLG blanking time Assertion or deassertion due to overcurrent and over-temperature condition 4 7 15 ms TDIS Discharge time CL= 1μF, VIN = 5V, disabled to VOUT < 0.5V 0.6 ms RDIS Discharge resistance (Note 4) V IN = 5V, disabled, IOUT= 1mA 100 Ω TSHDN Thermal Shutdown Threshold Enabled 140 °C THYS Thermal Shutdown Hysteresis 20 °C θJA Thermal Resistance Junction-to- Ambient SO-8 (Note 5) 96 °C/W MSOP-8-EP (Note 6) 92 °C/W DFN3030E-8 (Note 6) 84 °C/W Notes: 3. Pulse-testing techniques maintain junction temperature close to ambient temperature; thermal effects must be taken into account separately. 4. The discharge function is active wh en the device is disabled (when enable is de-asserted or during power-up power-down when VIN < VUVLO). The discharge function offers a resistive discharge path for the external storage capacitor for limited time. 5. Device mounted on 2” x 2” FR-4 substrate PCB, 2oz copper, with minimum recommended pad layout. 6. Device mounted on 2” x 2” FR-4 substrate PCB, 2oz copper, with minimum recommended pad on top layer and thermal vias to bottom layer ground plane.

Figure 1. Voltage Waveforms: AP2301 (left), AP2311 (right)

2.0A SINGLE CHANNEL CURRENT-LIMITED POWER SWITCH AP2301/AP2311 Document number: DS32241 Rev. 1 - 2 6 of 18 www.diodes.com June 2010 © Diodes Incorporated NEW PRODUCT Typical Performance Characteristics (Continued) VOUT 2V/div Short-Circuit to No-Load Recovery Response FLG 5V/div TA=25°C VIN=5V ROUT=0Ω Output short circuit removed Short circuit present and device thermal cycles IIN 2A/div TA=25°C VIN=5V ROUT=0Ω VOUT 2V/div FLG 5V/div IIN 2A/div No-Load to Short-Circuit Transient Response Output short circuited Device enters current limit VOUT 2V/div Short-Circuit to Full-Load Recovery Response FLG 5V/div TA=25°C VIN=5V ROUT=2.5Ω Output short circuit removed Short circuit present and device thermal cycles IIN 2A/div TA=25°C VIN=5V ROUT=2.5Ω VOUT 2V/div FLG 5V/div I IN 2A/div Full-Load to Short-Circuit Transient Response Output short circuited Device turns off and re-enables into current limit Inrush Current TA=25°C VIN=5V ROUT=2.5Ω VEN 5V/div IOUT 1A/div CL=120uF CL=220uF CL=470uF Device Enabled Into Short-Circuit TA=25°C VIN=5V CL=120uF ROUT=1Ω VEN 5V/div I OUT 1A/div

2.0A SINGLE CHANNEL CURRENT-LIMITED POWER SWITCH AP2301/AP2311 Document number: DS32241 Rev. 1 - 2 7 of 18 www.diodes.com June 2010 © Diodes Incorporated NEW PRODUCT Typical Performance Characteristics (Continued) VIN 2V/div UVLO Decreasing TA=25°C VIN=5V ROUT=2.5Ω CL=120uF IOUT 2A/div VIN 2V/div IOUT 2A/div UVLO Increasing TA=25°C VIN=5V ROUT=2.5Ω CL=120uF VOUT 5V/div Short-Circuit with Blanking Time and Recovery IOUT 2A/div FLG 5V/div TA=25°C VIN=5V TA=25°C VIN=5V ROUT=2.5Ω CL=120uF VOUT 5V/div FLG 5V/div IOUT 1A/div Power ON VIN 5V/div

2.0A SINGLE CHANNEL CURRENT-LIMITED POWER SWITCH AP2301/AP2311 Document number: DS32241 Rev. 1 - 2 8 of 18 www.diodes.com June 2010 © Diodes Incorporated NEW PRODUCT Typical Performance Characteristics (Continued) Turn-on Time vs. Input voltage 100 Input Voltage (V) Turn-on Time (us) Turn-off Time vs. Input voltage 100 120 140 160 180 200 220 240 260 Input Voltage (V) Turn-off Time (us) Rise Time vs. Input voltage 100 200 300 400 500 600 700 800 900 1000 Input Voltage (V) Rise Time (us) Fall Time vs. Input voltage 100 Input Voltage (V) Fall Time (us) CL=1uF RL=5Ω TA=25°C CL=1uF RL=5Ω TA=25°C

2.0A SINGLE CHANNEL CURRENT-LIMITED POWER SWITCH AP2301/AP2311 Document number: DS32241 Rev. 1 - 2 9 of 18 www.diodes.com June 2010 © Diodes Incorporated NEW PRODUCT Typical Performance Characteristics (Continued) Supply Current,Output Enabled vs. Temperature 100 -50 -25 0 25 50 75 100 125 Tem perature (°C) Supply Current Output Enabled (uA) Supply Current,Output Disabled vs. Temperature -0.30 -0.25 -0.20 -0.15 -0.10 -0.05 0.00 0.05 0.10 0.15 0.20 0.25 0.30 -50 -25 0 25 50 75 100 125 Tem perature (°C) Supply Current Output Disabled (uA) RDS(ON) vs. Temperature 100 110 120 130 140 150 160 170 180 -50 -25 0 25 50 75 100 125 Temperature (°C) RDS(ON) (mΩ) Short-Circuit Output Current vs. Temperature 2.0 2.1 2.2 2.3 2.4 2.5 2.6 2.7 2.8 2.9 3.0 - 5 0- 2 5 0 2 5 5 0 7 51 0 0 1 2 5 Tem perature (°C) Short-Circuit Output Current (A) VIN=5.5V VIN=5V VIN=2.7V VIN=3.3V VIN=5.5V VIN=5V VIN=3.3V VIN=2.7V VIN=2.7V VIN=3.3V VIN=5.5V VIN=5V VIN=2.7V VIN=3.3V VIN=5V VIN=5.5V

2.0A SINGLE CHANNEL CURRENT-LIMITED POWER SWITCH AP2301/AP2311 Document number: DS32241 Rev. 1 - 2 10 of 18 www.diodes.com June 2010 © Diodes Incorporated NEW PRODUCT Typical Performance Characteristics (Continued) Undervoltage Lockout vs. Temperature 1.6 1.7 1.8 1.9 2.0 2.1 2.2 -50 -25 0 25 50 75 100 125 Temperature (°C) Undervoltage Lockout (V) Threshold Trip Current vs. Input Voltage 2.5 2.6 2.7 2.8 2.9 3.0 3.1 3.2 3.3 3.4 3.5 Input Voltage (V) Threshold Trip Current (A) CL=120uF TA=25°C UVLO Rising UVLO Falling

2.0A SINGLE CHANNEL CURRENT-LIMITED POWER SWITCH AP2301/AP2311 Document number: DS32241 Rev. 1 - 2 11 of 18 www.diodes.com June 2010 © Diodes Incorporated NEW PRODUCT Application Note Power Supply Considerations A 0.1μF to 2.2 μF X7R or X5R ceramic bypass capacitor placed between IN and GND, close to the device, is recommended. When an external power supply is used, or an additional ferrite bead is added to the input, high inrush current may cause voltage spikes higher than the device maximum input rating during short circuit condition. In this case a 2.2 μF or bigger capacitor is recommended. Placing a high-value electrolytic capacitor on the input and output pin(s) is recommended when the output load is heavy. This precaution reduces power-supply transients that may cause ringing on the inpu t. Additionally, bypassing the output with a 0.1 μF to 1.0μF ceramic capacitor improves the immunity of the device to short circuit transients. Over-current and Short Circuit Protection An internal sensing FET is employed to check for over-c urrent conditions. Unlike cu rrent-sense resistors, sense FETs do not increase the series resi stance of the current path. When an ov er-current condition is detected, the device maintains a constant output cu rrent and reduces the output voltage accordingly. Complete shutdown occurs only if the fault stays long enough to activate thermal limiting. Three possible overload conditions can occur. In the fi rst condition, the output has been shorted to GND before the device is enabled or before V IN has been applied. The AP2301/AP2311 senses the short circuit and immediately clamps output current to a certain safe level namely ILIMIT. In the second condition, an output short or an overload oc curs while the device is enabled. At the instance the overload occurs, higher inrush current may flow for a very short period of time before the current limit function can react. The input capacitor(s) rapidly discharge through the device, activating current limit circuitry. Protection is achieved by momentarily opening the P-MOS high-side power sw itch and then gradually turning it on. After the current limit function has tripped (reached the over-current trip threshold), the device switches into current limiting mode and the current is clamped at I LIMIT. In the third condition, the load has been gradually increased beyond the recommended operating current. The current is permitted to rise until the current-limit threshold (I TRIG) is reached or until the thermal limit of the device is exceeded. The AP2301/AP2311 is capable of delivering current up to the current-limit threshold without damaging the device. Once the threshold has been reached, the device switches into its current limiting mode and is set at ILIMIT. FLG Response When an over-current or over-temperature shutdown condition is encountered, the FLG open-drain output goes active low after a nominal 7-ms deglitch timeout. Th e FLG output remains low until both over-current and over- temperature conditions are removed. Connecting a heavy capacitive load to the output of the device can cause a momentary over-current condition, which does not tri gger the FLG due to the 7-ms deglitch timeout. The AP2301/AP2311 is designed to eliminate false over-current reporting without the need of external components to remove unwanted pulses. Power Dissipation and Junction Temperature The low on-resistance of the internal MOSFET allows the small surface-mount packa ges to pass large current. Using the maximum operating ambient temperature (TA) and RDS(ON), the power dissipation can be calculated by: PD = RDS(ON)× I2 Finally, calculate the junction temperature: TJ = PD x RθJA + TA Where: TA= Ambient temperature °C RθJA = Thermal resistance PD = Total power dissipation

2.0A SINGLE CHANNEL CURRENT-LIMITED POWER SWITCH AP2301/AP2311 Document number: DS32241 Rev. 1 - 2 12 of 18 www.diodes.com June 2010 © Diodes Incorporated NEW PRODUCT Application Note (Continued) Thermal Protection Thermal protection prevents the IC from damage when hea vy-overload or short-circuit faults are present for extended periods of time. The AP2301/AP2311 implements a th ermal sensing to monitor the operating junction temperature of the power distribution switch. Once t he die temperature rises to approximately 140°C due to excessive power dissipation in an over-current or short-circuit condition the internal thermal sense circuitry turns the power switch off, thus preventing the power swit ch from damage. Hysteresis is built into the thermal sense circuit allowing the device to cool down approximately 20°C before the switch turns back on. The switch continues to cycle in this manner until the load fault or input power is removed. The FLG open-drain output is asserted when an over-temperature shutdown or over-current occurs with 7-ms deglitch. Under-voltage Lockout (UVLO) Under-voltage lockout function (UVLO) keeps the inter nal power switch from being turned on until the power supply has reached at least 2V, even if the switch is enabled. Whenev er the input voltage falls below approximately 2V, the power switch is quickly turned off. This facilitates the design of hot-insertion systems where it is not possible to turn off the power switch before input power is removed. Discharge Function The discharge function of the device is active when enable is disabled or de-asserted. The discharge function with the N-MOS power switch implementation is activated and offers a resistive discharge path for the external storage capacitor. This is designed for discharging any residue of the output voltage when either no external output resistance or load resistance is present at the output.

Ordering Information

0 : Active Low 1 : Active High G : Green 7/13 : Tape & Reel1 : 1 Channel Channel GreenPackageEnable Packing S : SO-8 MP : MSOP-8-EP FGE : DFN3030E-8 Device Package Code Packaging (Note 7) 7”/13” Tape and Reel Quantity Part Number Suffix AP23X1SG-13 S SO-8 2500/Tape & Reel -13 AP23X1MPG-13 MP MSOP-8-EP 2500/Tape & Reel -13 AP23X1FGEG-7 FGE DFN3030E-8 3000/Tape & Reel -7 Notes: 7. Pad layout as shown on Diodes Inc. suggested pad layout document AP02001, which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.

2.0A SINGLE CHANNEL CURRENT-LIMITED POWER SWITCH AP2301/AP2311 Document number: DS32241 Rev. 1 - 2 13 of 18 www.diodes.com June 2010 © Diodes Incorporated NEW PRODUCT Marking Information (1) SO-8 AP23 X 1 ( Top view ) YY WW X X Part Number Logo WW : Week : 01~52; 52 YY : Year : 08, 09,10~ G : Green X : Internal Code 8765 1 2 34 0 : Active Low 1 : Active High 1 : 1 Channel represents 52 and 53 week (2) MSOP-8-EP AP23 X 1 ( Top view ) Y W X E Part Number Logo Y : Year : 0~9 A~Z : Green 87 65 1 234 0 : Active Low 1 : Active High 1 : 1 Channel a~z : 27~52 week; z represents W : Week : A~Z : 1~26 week; 52 and 53 week MSOP-8-EP (3) DFN3030E-8 XX : Identification Code ( Top View ) X : A~Z : Green X Y X X W Y : Year : 0~9 W : Week : A~Z : 1~26 week; a~z : 27~52 week; z represents 52 and 53 week Part Number Package Identification Code AP2301FGEG-7 DFN3030E-8 BB

2.0A SINGLE CHANNEL CURRENT-LIMITED POWER SWITCH AP2301/AP2311 Document number: DS32241 Rev. 1 - 2 14 of 18 www.diodes.com June 2010 © Diodes Incorporated NEW PRODUCT AP2311FGEG-7 DFN3030E-8 BC Package Outline Dimensions (All Dimensions in mm) (1) Package type: SO-8 1.27typ 0.3/0.5 7°~9° 4.85/4.95 3.85/3.95 5.90/6.10 0.15/0.25 7°~9° 0.62/0.82 0.10/0.20 Gauge Plane 0.254 Seating Plane 0.35max. 45° Detail "A" Detail "A" 1.30/1.50 1.75max. Land Pattern Recommendation (Unit: mm) 6x-1.27 8x-1.55 8x-0.60 5.4 0°/8° (2) Package type: MSOP-8-EP

2.0A SINGLE CHANNEL CURRENT-LIMITED POWER SWITCH AP2301/AP2311 Document number: DS32241 Rev. 1 - 2 15 of 18 www.diodes.com June 2010 © Diodes Incorporated NEW PRODUCT 2.9/3.1 0.75/0.95 2.9/3.1 4.7/5.1 0.65Bsc. 0.22/0.38 0.05 0.4/0.8 0.25 0.95Ref. Gauge plane 0°/8° "A" DETAIL "A" 1.35/1.65 1.65/1.95 EXPOSED PAD (BOTTOM) 8x-0.45 8x-1.4 6x-0.65 EXPOSED PAD (BOTTOM) Land Pattern Recommendation (Unit:mm) 4.4 1.10Max. 0.15Typ. 0.05/0.15 Package Outline Dimensions (Continued) (3) Package type: DFN3030E-8 Bottom View Side View 0.10 C

0.08 C Seating Plane

C 2.95/3.05 2.95/3.05 (Pin #1 ID) AB

0.10 CAB

0.25 A 2X- 0.25 B 2X- TOP MARK 0.15Typ. 0/0.05 0.57/0.63 0.30/0.60 0.65Typ. 0.20/0.30 8x-0.30 0.65 Land Pattern Recommendation (Unit: mm) Top View 8X- R0.20 1.40/1.60 8X- 8x-0.65 1.60 2.75 2.35 CL CL CL CL Pin #1

2.0A SINGLE CHANNEL CURRENT-LIMITED POWER SWITCH AP2301/AP2311 Document number: DS32241 Rev. 1 - 2 16 of 18 www.diodes.com June 2010 © Diodes Incorporated NEW PRODUCT Taping Orientation (Note 8) For DFN3030E-8

2.0A SINGLE CHANNEL CURRENT-LIMITED POWER SWITCH AP2301/AP2311 Document number: DS32241 Rev. 1 - 2 17 of 18 www.diodes.com June 2010 © Diodes Incorporated NEW PRODUCT Notes: 8. The taping orientation of the other package type can be found on our website at http://www.diodes.com/datasheets/ap02007.pdf

2.0A SINGLE CHANNEL CURRENT-LIMITED POWER SWITCH AP2301/AP2311 Document number: DS32241 Rev. 1 - 2 18 of 18 www.diodes.com June 2010 © Diodes Incorporated NEW PRODUCT IMPORTANT NOTICE DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). Diodes Incorporated and its subsidiaries rese rve the right to make modifications, enhanc ements, improvements, corrections or ot her changes without further notice to this document and any product described herein. Diodes Incorporated does not assume any liabi lity arising out of the application or use of this document or an y product described herein; neither does Diodes Incorporated convey any license under its patent or trademark rights, nor the rights of othe rs. Any Customer or user of this document or products desc ribed herein in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated website, harmless against all damages. Diodes Incorporated does not warrant or accept any liability what soever in respect of any prod ucts purchased through unauthorized sales channel. Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and hold Diodes Incorporated and its representatives har mless against all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application. Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings noted herein may also be covered by one or more United States, international or foreign trademarks. LIFE SUPPORT Diodes Incorporated products are specifica lly not authorized for use as critical co mponents in life support devices or systems without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein: A. Life support devices or systems are devices or systems which: 1. are intended to implant into the body, or 2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user. B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support dev ices or systems, and acknowledge and agree that they are solely responsi ble for all legal, regulatory and safety-related requirements concerning their products and any use of Diode s Incorporated products in such safety-cri tical, life support devices or systems, notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its repr esentatives against any damages ar ising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems. Copyright © 2010, Diodes Incorporated www.diodes.com