AP2101 DIODES | Alldatasheet

Document overview

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Technical content

2A SINGLE CHANNEL CURRENT-LIMITED POWER SWITCH A P 2 1 0 1 / A P 2 1 1 1 R e v . 1 1 of 14 NOVEMBER 2009 www.diodes.com © Diodes Incorporated

  • Single USB port power switches with auto-discharge
  • Short-circuit current and thermal protection
  • 2.45A accurate current limiting
  • Fast transient response time: 5 μs
  • 90m Ω on-resistance
  • Reverse Current Blocking
  • Input voltage range: 2.7V – 5.5V
  • 0.6ms typical rise time
  • Very low shutdown current: 1 μA (max)
  • Fault report (FLG) with blanking time (7ms typ)
  • ESD protection: 4KV HBM, 300V MM
  • Active low (AP2101) or active high (AP2111) enable
  • Ambient temperature range: -35°C to 85°C
  • SOP-8L and MSOP-8L-EP (Exposed Pad): Available in “Green” Molding Compound (No Br, Sb)
  • Lead Free Finish / RoHS Compliant (Note 1)
  • UL Recognized, File Number E322375 (pending)
  • IEC60950-1 CB Scheme Certified The AP2101 and AP2111 are integrated high-side power switches optimized for Universal Serial Bus (USB) and other hot-swap applications. The family of devices complies with USB 2.0 and available with both polarities of Enable input. They offer current and thermal limiting and short circuit protection as well as controlled rise time, under-voltage lockout and auto-discharge functionalities. A 7ms deglitch capability on the open-drain Flag output prevents false over-current reporting and does not require any external components. All devices are available in SOP-8L and MSOP-8L-EP packages.
  • Consumer electronics – LCD TV & Monitor, Game Machines
  • Communications – Set-Top-Box, GPS, Smartphone
  • Computing – Laptop, Desktop, Servers, Printers, Docking Station, HUB 0.1uF IN GNDEN OUT ON 120uF Power Supply 2.7V to 5.5V 0.1uF OFF FLG Load 10k 10uF AP2111 Enable Active High Available Options Part Number Channel Enable pin (EN) Current limit (typical) Recommended maximum continuous load current AP2101 1 Active Low 2.45A 2.0A AP2111 1 Active High 2.45A 2.0A Features Description

Applications

Typical Application Circuit

2A SINGLE CHANNEL CURRENT-LIMITED POWER SWITCH A P 2 1 0 1 / A P 2 1 1 1 R e v . 1 2 of 14 NOVEMBER 2009 www.diodes.com © Diodes Incorporated AP 21 X 1 XX G - X 0 : Active Low 1 : Active High G : Green 13 : Tape & Reel1 : 1 Channel Channel GreenPackageEnable Packing S : SOP-8L MP : MSOP-8L-EP Device Package Code Packaging (Note 2) 13” Tape and Reel Quantity Part Number Suffix AP21X1SG-13 S SOP-8L 2500/Tape & Reel -13 AP21X1MPG-13 MP MSOP-8L-EP 2500/Tape & Reel -13 Notes: 1. EU Directive 2002/95/EC (RoHS). All applicable RoHS exemptions applied. Please visit our website at http://www.diodes.com/products/lead_free.html 2. Pad layout as shown on Diodes Inc. suggested pad layout document AP02001, which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf. SOP-8L ( Top View ) NC OUT FLG OUT GND EN IN IN MSOP-8L-EP NC OUT FLG OUT GND EN IN IN ( Top View ) Pin Name Pin Number Descriptions GND 1 Ground IN 2, 3 Voltage input pin (all IN pins must be tied together externally) EN 4 Enable input, active low (AP2101) or active high (AP2111) FLG 5 Over-current and over-temperature fault report; open-drain flag is active low when triggered OUT 6, 7 Voltage output pin (all OUT pins must be tied together externally) NC 8 No internal connection; recommend tie to OUT pins

Ordering Information

2A SINGLE CHANNEL CURRENT-LIMITED POWER SWITCH A P 2 1 0 1 / A P 2 1 1 1 R e v . 1 3 of 14 NOVEMBER 2009 www.diodes.com © Diodes Incorporated Functional Block Diagram Thermal Sense FLG OUT GND IN EN UVLO Current Limit Current Sense Deglitch Discharge Control Driver Absolute Maximum Ratings Symbol Parameter Ratings Units ESD HBM Human Body Model ESD Protection 4 KV ESD MM Machine Model ESD Protection 300 V VIN Input Voltage 6.5 V VOUT Output Voltage VIN + 0.3 V VEN , VFLG Enable Voltage 6.5 V Iload Maximum Continuous Load Current Internal Limited A TJmax Maximum Junction Temperature 150 °C TST Storage Temperature Range (Note 3) -65 to 150 °C Notes: 3. UL Recognized Rating from -30°C to 70°C (Diodes qualified TST from -65°C to 150°C) Recommended Operating Conditions Symbol Parameter Min Max Units VIN Input voltage 2.7 5.5 V IOUT Output Current 0 2.0 A TA Operating Ambient Temperature -35 85 °C

2A SINGLE CHANNEL CURRENT-LIMITED POWER SWITCH A P 2 1 0 1 / A P 2 1 1 1 R e v . 1 4 of 14 NOVEMBER 2009 www.diodes.com © Diodes Incorporated

Electrical Characteristics

(TA = 25°C, VIN = +5.0V, unless otherwise stated) Symbol Parameter Test Conditions (Note 4) Min Typ. Max Unit VUVLO Input UVLO R load=1kΩ 1.6 1.9 2.5 V ISHDN Input Shutdown Current Disabled, I OUT= 0 0.5 1 μA IQ Input Quiescent Current Enabled, I OUT= 0 45 70 μA ILEAK Input Leakage Current Disabled, OUT grounded 1 μA IREV Reverse Leakage Current Disabled, V IN= 0V, VOUT= 5V, IREV at VIN 0.05 μA RDS(ON) Switch on-resistance VIN = 5V, IOUT= 1.5A TA = 25°C MSOP8-EP 90 115 mΩ SOP-8L 95 115 -40°C ≤ TA ≤ 85°C 140 VIN = 3.3V, IOUT= 1.5A TA = 25°C 115 140 -40°C ≤ TA ≤ 85°C 170 ILIMIT Over-Load Current Limit VIN= 5V, VOUT= 4.5V, CL=120μF 2.1 2.45 2.8 A ITrig Current limiting trigger threshold Output Current Slew rate (<100A/s) , CL=100μF 2.5 A ISHORT Short-Circuit Current Limit Enabled into short circuit, CL=100μF 2.5 A TSHORT Short-circuit Response Time V OUT = 0V to IOUT = ILIMIT (short applied to output) 5 μs VIL EN Input Logic Low Voltage V IN = 2.7V to 5.5V 0.8 V VIH EN Input Logic High Voltage V IN = 2.7V to 5.5V 2 V ISINK EN Input leakage VEN = 5V 1 μA TD(ON) Output turn-on delay time CL=1μF, Rload=10Ω 50 μs TR Output turn-on rise time CL=1μF, Rload=10Ω 0.6 1.5 ms TD(OFF) Output turn-off delay time CL=1μF, Rload=10Ω 4 μs TF Output turn-off fall time CL=1μF, Rload=10Ω 0.03 0.1 ms RFLG FLG output FET on-resistance IFLG =10mA, CL=100μF 20 40 Ω TBlank FLG blanking time CIN=10μF, CL=100μF 4 7 15 ms RDIS Discharge resistance (Note 5) V IN = 5V, disabled, IOUT= 1mA 290 Ω TSHDN Thermal Shutdown Threshold Enabled, R load=1kΩ 140 °C THYS Thermal Shutdown Hysteresis 25 °C θJA Thermal Resistance Junction-to-Ambient SOP-8L (Note 6) 110 °C/W MSOP-8L-EP (Note 7) 60 °C/W Notes: 4. Pulse-testing techniques maintain junction temperature close to ambient temperature; thermal effects must be taken into account separately. 5. The discharge function is active when the device is disabled (when enable is de-asserted). The discharge function offers a resistive discharge path for the external storage capacitor. This is suitable only to discharge filter capacitors for limited time and c annot dissipate steady state currents greater than 8mA. 6. Test condition for SOP-8L: Device mounted on FR-4, 2oz copper, with minimum recommended pad layout. 7. Test condition for MSOP-8L-EP: Device mounted on 2” x 2” FR-4 substrate PC board, 2oz copper, with minimum recommended pa d on top layer and thermal vias to bottom layer ground plane.

Figure 1. Voltage Waveforms: AP2101 (left), AP2111 (right)

2A SINGLE CHANNEL CURRENT-LIMITED POWER SWITCH A P 2 1 0 1 / A P 2 1 1 1 R e v . 1 6 of 14 NOVEMBER 2009 www.diodes.com © Diodes Incorporated Typical Performance Characteristics (Continued) Short Circuit Current, Device Enabled Into Short 500us/div Inrush Current 1ms/div 0.6 Ω Load Connected to Enabled Device 2ms/div Short Circuit with Blanking Time and Recovery 50ms/div Power On 1ms/div Power Off 10ms/div Iout 1A/div Vflag 5V/div VIN=5V TA=25°C CL=100uF TA=25°C CL=100uF RL=2.5Ω Iout 2A/div Vout 5V/div Vout 5V/div Vflag 5V/div VIN=5V TA=25°C CL=100uF Vflag 5V/div Iout 1A/div Vin 5V/div Iout 500mA/div Ven 5V/div VIN=5V TA=25°C CL=100uF Iout 500mA/div Ven 5V/div V IN=5V TA=25°C RL=2.5Ω CL=470uF CL=220uF CL=100uF Vflag 5V/div Iout 1A/div Vin 5V/div Vout 5V/div TA=25°C CL=100uF RL=2.5Ω

2A SINGLE CHANNEL CURRENT-LIMITED POWER SWITCH A P 2 1 0 1 / A P 2 1 1 1 R e v . 1 7 of 14 NOVEMBER 2009 www.diodes.com © Diodes Incorporated Typical Performance Characteristics (Continued) Device Enabled 1ms/div Device Disabled 1ms/div UVLO Increasing 1ms/div UVLO Decreasing 10ms/div Turn-On Time vs Input Voltage 250 350 450 550 650 750 850 Input Voltage (V) Turn-On Time (us) Turn-Off Time vs Input Voltage Input Voltage (V) Turn-Off Time (us) Vflag 5V/div Iout 1A/div Ven 5V/div Vout 5V/div Vflag 5V/div Iout 1A/div Ven 5V/div Vout 5V/div CL=1uF RL=10Ω TA=25°C CL=1uF RL=10Ω TA=25°C Iout 500mA/div TA=25°C CL=100uF RL=2.5Ω Vin 2V/div Iout 500mA/div TA=25°C CL=100uF RL=2.5Ω Vin 2V/div VIN=5V TA=25°C CL=100uF RL=2.5Ω VIN=5V TA=25°C CL=100uF RL=2.5Ω

2A SINGLE CHANNEL CURRENT-LIMITED POWER SWITCH A P 2 1 0 1 / A P 2 1 1 1 R e v . 1 8 of 14 NOVEMBER 2009 www.diodes.com © Diodes Incorporated Typical Performance Characteristics (Continued) Rise Time vs Input Voltage 300 350 400 450 500 550 600 650 22 . 533 . 544 . 555 . 56 Input Voltage (V) Rise Time (us) Fall Time vs Input Voltage 22 . 533 . 544 . 555 . 56 Input Voltage (V) Fall Time (us) Supply Current, Output Enabled vs Ambient Temperature -60 -40 -20 0 20 40 60 80 100 Ambient Temperature (°C) Supply Current, Output Enabled (uA) Supply Current, Output Disabled vs Ambient Temperature 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 -60 -40 -20 0 20 40 60 80 100 A m bient Tem perature (°C) Supply Current, Output Disabled (uA) Static Drain-Source On-State Resistance vs Ambient Temperature 100 110 120 130 140 -60 -40 -20 0 20 40 60 80 100 A m bient Tem perature (°C) Static Drain-Source On-State Resistance (mΩ) Short-Circuit Output Current vs Ambient Temperature 2.30 2.35 2.40 2.45 2.50 2.55 2.60 2.65 2.70 -60 -40 -20 0 20 40 60 80 100 A m bient Tem perature (°C) Short-Circuit Output Current (A) Vin=3.3V Vin=5.0V Vin=3.3V CL=120uF Vin=5.0V Vin=3.3V Vin=5.5V Vin=5.0V Vin=5.5V Vin=3.3V CL=1uF RL=10Ω TA=25°C CL=1uF RL=10Ω TA=25°C Vin=5.0V

2A SINGLE CHANNEL CURRENT-LIMITED POWER SWITCH A P 2 1 0 1 / A P 2 1 1 1 R e v . 1 9 of 14 NOVEMBER 2009 www.diodes.com © Diodes Incorporated Typical Performance Characteristics (Continued) Undervoltage Lockout vs Ambient Temperature 1.90 1.95 2.00 2.05 2.10 2.15 -60 -40 -20 0 20 40 60 80 100 A m bient Tem perature (°C) Undervoltage Lockout (V) Threshold Trip Current vs Input Voltage 3.08 3.10 3.12 3.14 3.16 3.18 3.20 3.22 3.24 Input Voltage (V) Threshold Trip Current (A) Current Limit Response vs Peak Current 02468 1 0 1 2 Peak Current (A ) Current Limit Response (us) UVLO Falling UVLO Rising TA=25°C CL=68uF VIN=5V TA=25°C

2A SINGLE CHANNEL CURRENT-LIMITED POWER SWITCH A P 2 1 0 1 / A P 2 1 1 1 R e v . 1 10 of 14 NOVEMBER 2009 www.diodes.com © Diodes Incorporated Application Note Power Supply Considerations A 0.1- μF to 1- μF X7R or X5R ceramic bypass capacitor between IN and GND, close to the device, is recommended. Placing a high-value electrolytic capacitor on the input (10- μF minimum) and output pin(s) is recommended when the output load is heavy. This precaution reduces power-supply transients that may cause ringing on the input. Additionally, bypassing the output with a 0.01- μF to 0.1- μF ceramic capacitor improves the immunity of the device to short-circuit transients. Over-current and Short Circuit Protection An internal sensing FET is employed to check for over-current conditions. Unlike current-sense resistors, sense FETs do not increase the series resistance of the current path. When an overcurrent condition is detected, the device maintains a constant output current and reduces the output voltage accordingly. Complete shutdown occurs only if the fault stays long enough to activate thermal limiting. Three possible overload conditions can occur. In the first condition, the output has been shorted to GND before the device is enabled or before V IN has been applied. The AP2101/AP2111 senses the short circuit and immediately clamps output current to a certain safe level namely ILIMIT. In the second condition, an output short or an overload occurs while the device is enabled. At the instance the overload occurs, higher current may flow for a very short period of time before the current limit function can react. After the current limit function has tripped (reached the over-current trip threshold), the device switches into current limiting mode and the current is clamped at I LIMIT. In the third condition, the load has been gradually increased beyond the recommended operating current. The current is permitted to rise until the current-limit threshold (I TRIG) is reached or until the thermal limit of the device is exceeded. The AP2101/AP2111 is capable of delivering current up to the current-limit threshold without damaging the device. Once the threshold has been reached, the device switches into its current limiting mode and is set at I LIMIT. To protect against short circuit to GND at extremely low temperature (< -30 oC), a minimum 120- μF electrolytic capacitor on the output pin is recommended. A correct capacitor type with capacitor voltage rating and temperature characteristics must be properly chosen so that capacitance value does not drop too low at the extremely low temperature operation. A recommended capacitor should have temperature characteristics of less than 10% variation of capacitance change when operated at extremely low temp. Our recommended aluminum electrolytic capacitor type is Panasonic FC series. At low input voltage condition (V IN < 3V), the short circuit protection current may rise as high as twice the typical value. FLG Response When an over-current or over-temperature shutdown condition is encountered, the FLG open-drain output goes active low after a nominal 7-ms deglitch timeout. The FLG output remains low until both over-current and over-temperature conditions are removed. Connecting a heavy capacitive load to the output of the device can cause a momentary over-current condition, which does not trigger the FLG due to the 7-ms deglitch timeout. The AP2101/AP2111 is designed to eliminate false over-current reporting without the need of external components to remove unwanted pulses. Power Dissipation and Junction Temperature The low on-resistance of the internal MOSFET allows the small surface-mount packages to pass large current. Using the maximum operating ambient temperature (T A) and RDS(ON), the power dissipation can be calculated by: PD = RDS(ON)× I2

2A SINGLE CHANNEL CURRENT-LIMITED POWER SWITCH A P 2 1 0 1 / A P 2 1 1 1 R e v . 1 11 of 14 NOVEMBER 2009 www.diodes.com © Diodes Incorporated Application Note (Continued) Finally, calculate the junction temperature: TJ = PD x RθJA + TA Where: TA= Ambient temperature °C RθJA = Thermal resistance PD = Total power dissipation Thermal Protection Thermal protection prevents the IC from damage when heavy-overload or short-circuit faults are present for extended periods of time. The AP2101/AP2111 implements a thermal sensing to monitor the operating junction temperature of the power distribution switch. Once the die temperature rises to approximately 140°C due to excessive power dissipation in an over-current or short-circuit condition the internal thermal sense circuitry turns the power switch off, thus preventing the power switch from damage. Hysteresis is built into the thermal sense circuit allowing the device to cool down approximately 25°C before the switch turns back on. The switch continues to cycle in this manner until the load fault or input power is removed. The FLG open-drain output is asserted when an over-temperature shutdown or over-current occurs with 7-ms deglitch. Under-voltage Lockout (UVLO) Under-voltage lockout function (UVLO) keeps the internal power switch from being turned on until the power supply has reached at least 1.9V, even if the switch is enabled. Whenever the input voltage falls below approximately 1.9V, the power switch is quickly turned off. This facilitates the design of hot-insertion systems where it is not possible to turn off the power switch before input power is removed. Host/Self-Powered HUBs Hosts and self-powered hubs (SPH) have a local power supply that powers the embedded functions and the downstream ports. This power supply must provide from 5.25V to 4.75V to the board side of the downstream connection under both full-load and no-load conditions. Ho sts and SPHs are required to have current-limit protection and must report over-current conditions to the USB controller. Typical SPHs are desktop PCs, monitors, printers, and stand-alone hubs. Generic Hot-Plug Applications In many applications it may be necessary to remove modules or pc boards while the main unit is still operating. These are considered hot-plug applications. Su ch implementations require the control of current surges seen by the main power supply and the card being inserted. The most effective way to control these surges is to limit and slowly ramp the current and voltage being applied to the card, similar to the way in which a power supply normally turns on. Due to the controlled rise times and fall times of the AP2101/AP2111, these devices can be used to provide a softer start-up to devices being hot-plugged into a powered system. The UVLO feature of the AP2101/AP2111 also ensures that the switch is off after the card has been removed, and that the switch is off during the next insertion. By placing the AP2101/AP2111 between the V CC input and the rest of the circuitry, the input power reaches these devices first after insertion. The typical rise time of the switch is approximately 1ms, providing a slow voltage ramp at the output of the device. This implementation controls system surge current and provides a hot-plugging mechanism for any device.

2A SINGLE CHANNEL CURRENT-LIMITED POWER SWITCH A P 2 1 0 1 / A P 2 1 1 1 R e v . 1 12 of 14 NOVEMBER 2009 www.diodes.com © Diodes Incorporated Marking Information (1) SOP-8L AP21X X ( Top view ) YY WW X X Part Number Logo WW : Week : 01~52; 52 YY : Year : 08, 09,10~ G : Green X : Internal Code 8765 1 2 34 0 : Active Low 1 : Active High 1 : 1 Channel represents 52 and 53 week (2) MSOP-8L-EP AP21X X ( Top view ) Y W X E Part Number Logo Y : Year : 0~9 A~Z : Green 87 65 1 23 4 0 : Active Low 1 : Active High 1 : 1 Channel a~z : 27~52 week; z represents W : Week : A~Z : 1~26 week; 52 and 53 week MSOP-8L-EP

2A SINGLE CHANNEL CURRENT-LIMITED POWER SWITCH A P 2 1 0 1 / A P 2 1 1 1 R e v . 1 13 of 14 NOVEMBER 2009 www.diodes.com © Diodes Incorporated (1) Package Type: SOP-8L 1.27typ 0.3/0.5 7°~9° 4.85/4.95 3.85/3.95 5.90/6.10 0.15/0.25 7°~9° 0.62/0.82 0.10/0.20 Gauge Plane 0.254 Seating Plane 0.35max. 45° Detail "A" Detail "A" 1.30/1.50 1.75max. Land Pattern Recommendation (Unit: mm) 6x-1.27 8x-1.55 8x-0.60 5.4 0°/8° (2) Package Type: MSOP-8L-EP 2.9/3.1 0.75/0.95 2.9/3.1 4.7/5.1 0.65Bsc. 0.22/0.38 0.05 0.4/0.8 0.25 0.95Ref. Gauge plane 0°/8° "A" DETAIL "A" 1.35/1.65 1.65/1.95 EXPOSED PAD (BOTTOM) 8x-0.45 8x-1.4 6x-0.65 EXPOSED PAD (BOTTOM) Land Pattern Recommendation (Unit:mm) 4.4 1.10Max. 0.15Typ. 0.05/0.15 Package Information (All Dimensions in mm)

2A SINGLE CHANNEL CURRENT-LIMITED POWER SWITCH A P 2 1 0 1 / A P 2 1 1 1 R e v . 1 14 of 14 NOVEMBER 2009 www.diodes.com © Diodes Incorporated IMPORTANT NOTICE DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). Diodes Incorporated and its subsidiaries reserve the right to ma ke modifications, enhancements, improvements, corrections or ot her changes without further notice to this document and any product described herein. Diodes Incorporated does not assume any liabi lity arising out of the application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or trademark rights, nor the rights of others. Any Customer or user of this document or products desc ribed herein in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated website, harmless against all damages. Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthoriz ed sales channel. Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fee s arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized a pplication. Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings noted herein may also be covered by one or more United States, international or foreign trademarks. LIFE SUPPORT Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein: A. Life support devices or systems are devices or systems which: 1. are intended to implant into the body, or 2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user. B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support dev ices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its repr esentatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems. Copyright © 2009, Diodes Incorporated www.diodes.com