ANT5010LL04R2400A YAGEO | Alldatasheet
Document overview
- Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 6
Technical content
2.4 – 2.5GHZ
5010 Series
Product Specification –April 22, 2013 V.0
www.yageo.com Apr. 22, 2013 V0 WIRELESS COMPONENTS Product specification Ceramic Chip Antenna
FEATURES
Compact size Omni-directional radiation Tape & reel automatic mounting Reflow process compatible RoHS compliant
APPLICATIONS
2.4 GHz WiFi device Bluetooth gadget Zigbee device ISM band equipment
ORDERING INFORMATION
All part numbers are identified by th e series, packing type, material, size, antenna type, working frequency and packing quantity. PART NUMBER ANT 5010 L L04 R 2400A (1) PRODUCT ANT = Antenna (2) SIZE 5010 = 5.0 × 1.0 mm (3) ANTENNA TYPE L,F,A = Chip Antenna (4) SERIAL NO. L04 (5) PACKING TYPE R = Tape and Reel (6) WORKING FREQUENCY 2400 = 2.4GHz PHYCOMP CTC CAN4311751042453K 12NC 431175104245
www.yageo.com Apr. 22, 2013 V0 WIRELESS COMPONENTS Product specification Ceramic Chip Antenna SPECIFICATION DESCRIPTION VALUE Working Frequency 2.45 GHz Bandwidth 210 MHz ( Typ. ) Return Loss 6.5 dB min Polarization Linear Azimuth Beamwidth Omni-directional Peak Gain 2.28 dBi (Typ.) Impedance 50 Ω Operating Temperature – 40 ~105 °C Maximum Power 1 W Termination Ni / Sn (Environmentally-Friendly Leadless) Resistance to Soldering Heats 260℃ , 10sec. NOTE 1. The specification is defined on Yageo evaluation board Ta ble 1 OOUUTTLLIINNEESS YNH0092 Side ViewTop View Bot t om View L W T A A S1 S2 Fig. 1 Antenna outlines DIMENSIONS DIMENSION L (mm) 5.10 ± 0.10 W (mm) 1.00 ± 0.10 T (mm) 1.00 ± 0.10 A (mm) 0.85 ± 0.15 Table 2 Machinical Dimension TERMINAL NAME FUNCTION S1 Feeding or Soldering Point S2 Soldering or Feeding Point Table 3 T ermination configuration
www.yageo.com Apr. 22, 2013 V0 WIRELESS COMPONENTS Product specification Ceramic Chip Antenna YNH0093 Unit : mm 40 20 17.5 Bottom Layer / GND Top Layer Unit : mm Matching Circuit 11.0 1.5 1.4 5.0 6.1 1.3 Fig. 2 Outlook and dimension of evaluation board REFERENCE DESIGN OF EVALUATION BOARD Fig. 3 Details of soldering Pad
www.yageo.com Apr. 22, 2013 V0 WIRELESS COMPONENTS Product specification Ceramic Chip Antenna YNH0094 2.0 3.0 f (GHz) Return loss (dB) −30 −18 1 3 Fig. 4 Return loss Z axle X axle Y axle Gain (dBi) 5.00 − 0.00 − −5.00 − − 10.00 − − 15.00 − − 20.00 − − 25.00 − − 30.00 − − 35.00 − YNH0095 Z X Y Fig. 5 Radiation pattern Frequency= 2.45 GHz Max gain = 2.28 dBi, at (90, 210) MEG (mean effective gain)= -0.96 dBi Directivity (dB) = 3.24 Efficiency = -0.82 dB, 82.80 % ELECTRICAL PERFORMANCES Evaluation board and XYZ direction Marker data 1. 2.35GHz, -6.5dB 2. 2.45GHz, -27.45dB 3. 2.56GHz, -6.5dB
www.yageo.com Apr. 22, 2013 V0 WIRELESS COMPONENTS Product specification Ceramic Chip Antenna
REVISION HISTORY
REVISION DATE CHANGE NOTIFICATION DESCRIPTION Version 0 Apr. 22, 2013 - - New datasheet for Ceramic Chip Antenna, 2.4 – 2.5 GHz application,