DATASHEET SEARCH SITE | WWW.ALLDATASHEET.COM
Document overview
- Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 6
Technical content
2.4 – 2.5 GHZ
2012 Series
Product Specification – February 22, 2013 V.0
www.yageo.com Feb. 22, 2013 V1 WIRELESS COMPONENTS Product specification Ceramic Chip Antenna
FEATURES
Compact size Omni-directional Radiation Tape & reel automatic mounting Reflow process compatible RoHS compliant
APPLICATIONS
2.4GHz WiFi device Bluetooth gadget Zigbee device ISM band equipment
ORDERING INFORMATION
All part numbers are identified by th e series, packing type, material, size, antenna type, working frequency and packing quantity. PART NUMBER ANT 2012 L L00 R 2400A (1) PRODUCT ANT = Antenna (2) SIZE 2012 = 2.0 ×1.2 mm (3) ANTENNA TYPE L,F,A = Chip Antenna (4) SERIAL NO. L00 (5) PACKING STYLE R = Tape and Reel (6) WORKING FREQUENCY 2400 = 2.4GHz PHYCOMP CTC CAN4311714002454K 12NC 431171400245
www.yageo.com Feb. 22, 2013 V1 WIRELESS COMPONENTS Product specification Ceramic Chip Antenna SPECIFICATION DESCRIPTION VALUE Centre Frequency 2.45 GHz Bandwidth 370 MHz (Typ.) Return Loss 10 dBi min Polarization Linear Azimuth Beamwidth Omni-directional Peak Gain 3.77 dBi (Typ.) Impedance 50 Ω Operating Temperature - 40~105 ℃ Maximum Power 1 W Termination Ni / Sn (Environmentally-Friendly Leadless) Resistance to Soldering Heats 260℃ , 10sec. NOTE 1. The specification is defined on Yageo evaluation board Table 1 OOUUTTLLIINNEESS YNH0033 Side ViewTop View Bot t om View L W T A S1 S2 Fig. 1 Antenna outlines DIMENSIONS DIMENSION L (mm) 2.00 ±0.20 W (mm) 1.25 ±0.20 T (mm) 1.10 ±0.10 A (mm) 0.15 ±0.10 Table 2 Machinical Dimension TERMINAL NAME FUNCTION Feeding Point S2 Soldering Point Table 3 T ermination configuration
www.yageo.com Feb. 22, 2013 V1 WIRELESS COMPONENTS Product specification Ceramic Chip Antenna YNH0034 Unit : mm 45 7 Bottom Layer Top Layer Unit : mm 0.40 1.70 Matching Circuit 1.40 3.0 1.0 Fig. 3 Outlook and dimension of evaluation board REFERENCE DESIGN OF EVALUATION BOARD Fig. 4 Details of soldering Pad
www.yageo.com Feb. 22, 2013 V1 WIRELESS COMPONENTS Product specification Ceramic Chip Antenna 2.0 2.1 3.0 f (GHz) Return loss (dB) − 50 − 30 − 10 YNH0004 Fig. 5 Return loss YNH0035 Y X Z Z axle X axle Y axle Gain (dBi) 5.00 − 0.00 − − 5.00 − − 10.00 − − 15.00 − − 20.00 − − 25.00 − − 30.00 − − 35.00 − Fig. 6 Radiation pattern Frequency = 2.45 GHz Max gain = 3.77 dBi, at (90,240) MEG (mean effective gain)= -193 dBi Directivity (dB) = 4.61 Efficiency = -0.84 dB, 82.93 % ELECTRICAL PERFORMANCES Evaluation board and XYZ direction Marker data 1. 2.21GHz, -10dB 2. 2.45GHz, -28.5dB 3. 2.58GHz, -10dB
www.yageo.com Feb. 22, 2013 V1 WIRELESS COMPONENTS Product specification Ceramic Chip Antenna
REVISION HISTORY
REVISION DATE CHANGE NOTIFICATION DESCRIPTION Version 0 Feb. 22, 2013 - - New data sheet for SMD type antenna, 2.45GHz application, 2012 series