AN504

AN504 STANLEY | Alldatasheet

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Package φ3.6 Right Angle type, Water clear epoxy Rank grouping parameter Soldering methods ESD Packing TTW (Through The Wave) soldering and manual soldering ※Please refer to Soldering Conditions about soldering. 2kV (HBM) Bulk : 200pcs(MIN.) Sorted by radiant intensity per rank taping Half Intensity Angle 2006.8.31

Pulse Forward Current ※1 IFRM mA ⊿IF mA/℃ ⊿IFRM mA/℃ Reverse Voltage V R V Operating Temperature T opr ℃ Storage Temperature T stg ℃ ※1 IFRM Measurement condition : Pulse Width≦100μs, Duty≦1/100 Electro-Optical Characteristics Conditions TYP. 1.3 MAX. 1.5 Reverse Current V R=5V I R MAX. 10 μA MIN. 1.5 TYP. 3 Total Output Power I F=50mA Po TYP. 5 mW Peak Wavelength I F=50mA λp TYP. 950 nm Spectral Half-width I F=50mA ⊿λ TYP. 45 nm Half Intensity Angle I F=50mA 2 θ1/2 TYP. 60 deg. MIN. - TYP. 0.5 Response Time I F=50mA tr/tf TYP. 700 ns Derating (Ta=25℃ or higher) Item Symbol Characteristics 1.33 13.3 -30~+85 -30~+100 Absolute Maximum Ratings 150 100 1,000 V mW/sr Unit Forward Voltage I F=50mA V F MHzCut-off Frequency IF=50mADC±5mA, -3db from 0.1MHz Radiant Intensity I F=50mA I E fc Page 2 Through-hole IRED/Right Angle Type AN504 2004.11.17 (Ta=25℃) (Ta=25℃)

˞Please contact our sales staff concerning rank designation. 2004.11.17 AN504 (Ta=25℃) MIN. MA X . A1 . 5 3 . 0 B2 . 1 4 . 2 C3 . 0 6 . 0 D4 . 2 8 . 4 E 6.0 12.0 Rank I F = 50mA IE（mW/ s r） Condition Through-hole IRED/Right Angle Type

2004.11.17 AN504 Technical Data Spatial Distribution Example Condition : Ta = 25℃ Spectral Distribution Relative Intensity vs. Wavelength Condition : Ta = 25℃, IF = 50mA Wavelength [nm] Relative Intensity Forward Voltage vs. Forward Current Condition : Ta = 25℃ Forward Voltage : VF(V) Forward Current IF(mA) Duty Ratio vs. Pulse Forward Current Condition : Ta = 25℃, tw ≦ 100μs Duty Ratio Pulse Forward Current IFRM(A) Through-hole IRED/Right Angle Type

2004.11.17 AN504 Technical Data Ambient Temperature vs. Pulse Forward Current Condition : tw≦100μs, Duty≦1/100 Ambient Temperature : Ta(℃) Ambient Temperature vs. Forward Current Ambient Temperature : Ta(℃) Forward Current : IF (mA) Ambient Temperature vs. Forward Voltage Condition : IF = 50mA Ambient Temperature : Ta (℃) Pulse Forward Current IFRM(mA) Forward Voltage VF(V) Through-hole IRED/Right Angle Type Ambient Temperature vs. Peak Wavelength Condition : IF = 50mA Ambient Temperature : Ta(℃) Peak Wavelength λp( n m )

2004.11.17 AN504 Technical Data Forward Current vs. Relative Total Power Condition : - - Pulse, tw≦100μs, Duty≦1/100, Ta = 25℃ ----DC Forward Current : IF (mA) Relative Total Power Ambient Temperature vs. Relative Total Power Condition : IF = 50mA Ambient Temperature : Ta (℃) Relative Total Power Through-hole IRED/Right Angle Type Pulse Forward Voltage vs. Pulse Forward Current Condition : Ta=25℃, tw≦100μs, Duty≦1/100 Pulse Forward Voltage : VFM(V) Pulse Forward Current : IFRM (mA)

(Unit: mm) 2004.11.17 AN504 Through-hole IRED/Right Angle Type

Through-hole IRED/Right Angle Type TTW (Through The Wave) soldering Conditions Solder Bath Temp. Dipping Time 265 ℃ 5 s (MAX.) (MAX.) Position At least 3.0 mm away from the root of lead Iron tip temp. Soldering time and frequency 3 s 1 time 400 ℃ (MAX.) (MAX.) (MAX.) (30 W Max.) Position At least 3.0 mm away from the root of lead 2007.8.31 Pre-heating 100 ℃ (MAX.) Resin surface temperature 1) The dip soldering process shall be twice maximum. 2) The product shall be cooled to normal temperature before the second dipping process. ※The detail is described to LED and Photodet ector handling precautions of home page: "Mounting through-hole Type Devices“ and "Soldering", and use it after the confirmation, please. Manual Soldering Conditions ※The detail is described to LED and Photodet ector handling precautions of home page: "Mounting through-hole Type Devices“ and "Soldering", and use it after the confirmation, please.

Through-hole IRED/Right Angle Type Reliability Testing Result Failure Criteria Items Symbols Conditions Failure criteria Luminous Intensity Iv IF Value of each product Luminous Intensity Testing Min. Value ＜ Spec. Min. Value x 0.5 Forward Voltage V F IF Value of each product Forward Voltage Testing Max. Value ≧ Spec. Max. Value x 1.2 Reverse Current I R VR = Maximum Rated Reverse Voltage V Testing Max. Value ≧ Spec. Max. Value x 2.5 Cosmetic Appearance - - Occurrence of notable decoloration, deformation and cracking Reliability Testing Result Applicable Standard Testing Conditions Duration Failure Room Temp. Operating Life EIAJ ED- 4701/100(101) Ta = 25℃, IF = Maxium Rated Current 1,000 h 0/25 Resistance to Soldering Heat EIAJ ED- 4701/300(302) 265±5℃, 3mm from package base 10s 0/25 Temperature Cycling EIAJ ED- 4701/100(105) Minimum Rated Storage Temperature(30min) ～Normal Temperature(15min) ～Maximum Rated Storage Temperature(30min) ～Normal Temperature(15min) 5 cycles 0/25 Wet High Temp. Storage Life EIAJ ED- 4701/100(103) Ta = 60±2℃, RH = 90±5% 1,000 h 0/25 High Temp. Storage Life EIAJ ED- 4701/200(201) Ta = Maximum Rated Storage Temperature 1,000 h 0/25 Low Temp. Storage Life EIAJ ED- 4701/200(202) Ta = Minimum Rated Storage Temperature 1,000 h 0/25 Lead Tension EIAJ ED- 4701/400(401) 10N,1time (□0.4 and Flat Package : 5N) 10s 0/10 Vibration, Variable Frequency EIAJ ED- 4701/400(403) 98.1m/s (10G), 100 ～ 2KHz sweep for 20min., XYZ each direction 2 h 0/10 2007.8.31

Special Notice to Customers Using the Products and Technical Information Shown in This Data Sheet AN504 Page 10 Through-hole IRED/Right Angle Type 1) The technical information shown in the data sheets are limited to the typical characteristics and circuit examples of the referenced products. It does not constitute the warranting of industrial property nor the granting of any license. 2) For the purpose of product improvement, the specifications, characteristics and technical data described in the data sheets are subject to change without prior notice. Therefore it is recommended that the most updated specifications be used in your design. 3) When using the products described in the data sheets, please adhere to the maximum ratings for operating voltage, heat dissipation characteristics, and other precautions for use. We are not responsible for any damage which may occur if these specifications are exceeded. 4) The products that have been described to this catalog are manufactured so that they will be used for the electrical instrument of the benchmark (OA equipment, telecommunications equipment, AV machine, home appliance and measuring instrument). The application of aircrafts, space borne application, transportation equipment, medical equipment and nuclear power control equipment, etc. needs a high reliability and safety, and the breakdown and the wrong operation might influence the life or the human body. Please consult us beforehand if you plan to use our product for the usages of aircrafts, space borne application, transportation equipment, medical equipment and nuclear power control equipment, etc. except OA equipment, telecommunications equipment, AV machine, home appliance and measuring instrument. 5) In order to export the products or technologies described in this data sheet which are under the “Foreign Exchange and Foreign Trade Control Law,” it is necessary to first obtain an export permit from the Japanese government. 6) No part of this data sheet may be reprinted or reproduced without prior written permission from Stanley Electric Co., Ltd. 7) The most updated edition of this data sheet can be obtained from the address below: http://www.stanley-components.com 2007.8.31