AN3150 FREESCALE | Alldatasheet
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THROUGH-HOLE (DIP) STYLE COMPONENTS Dual in-line and other styles of through-hole components packages are typically wave soldered where the leads protrude through the circuit board and exposed to a flux bath then immersed into molten solder as the board is passed over a solder wave to create the solder connection. In this application the top board surface and component body are not directly exposed to high temperatures. SOLDERING PRECAUTIONS Wave solder does not typically expose component to excessive temperature, but there may be cases where components are subjected to secondary reflow cycle during double side board assembly. Vapor phase soldering process is not recommended for open cavity devices. There is a potential for liquid to ingress into the cavity or possibility of condensation to form in cavity of the device. IR reflow is not recommended due to potential damage to plastic features as result of radiation heat transfer. MPXA, MPXH, MPXM and MPXV series pressure sensors with port adapters should not be exposed to temperatures greater than 245°C. Suffix designations for these devices are; C, AP , DP and GSX. MPX series pressure sensors with port adapters should not be exposed to temperatures greater than 220°C. The suffix designations for these devices are; AP, GP, DP, AS, GS,ASX or GSX. Refer to the following table for listing of device types and recommended maximum temperature exposure. The reflow temperature profile for surface mount devices must be in accordance with JEDEC STD. 020. Refer to following link for specific profile details. http://www.jedec.org/download/search/jstd020c.pdf Devices provided with a mounting bracket for special applications are to be excluded.
limits shown in Table 1 with minimized duration. Table 1. Pressure Sensors
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