AN2173 STMICROELECTRONICS | Alldatasheet

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■ the Electromagnetic Interference (EMI) is measured for all loads. VIPer12 Demonstration Board (12V, single output voltage, see Application Note AN1734 for details). Figure 1. VIPer12-based Power Supply Assembly, Top View

1 VIPer12-based Power Supply Features and Assembly AN2173 - APPLICATION NOTE

1 VIPer12-based Power Supply Features and

  • Fixed 60kHz Switching Frequency
  • Switch mode General Purpose Power Supply
  • Burst Mode Operation in Standby for Blue Angel operation
  • Current Mode Control
  • Typical 75% Efficiency at Full Load
  • Auxiliary Undervoltage Lo ckout with Hysteresis
  • Output Short Circuit Protection
  • Thermal Shutdown Protection
  • Meets EN55022 Class B EMI specification

1.1 Layout and Component Placement

To meet Printed Circuit Board (PCB) space requirements, both sides of the PCB are used for either low or high voltage power supply mains by selecting the appropriate voltage rating for the bulk capacitors and the Metal Oxide Varistor (MOV). Surface-mount components should be used wherever possible to reduce the size of the assembly. The remaining axial lead devices (e.g., resistors, diode, and “pigtail” fuse) are mounted vertically to save PCB space. The line and neutral pins are molded into the bottom of the case and pass through two holes in the top of the case, and a line cord attachment is on the side opposite the line and neutral pins (see Figure 2 on page 5 and Figure 3 on page 5). The PCB size is determined by the overall dimensions and the side wall thicknesses of the case (1.78in x 1.78in, with rectangular mounting slots in each side). A 0.118in mounting hole is provided. Additional support using 0.75in PCB standoffs is recommended, with the component leads trimmed to 0.65in (max). See Appendix A. Schematics on page 12 and Appendix B. KIDDE VIPer12 Demo Board BOM on page 13 for details.

1.2 Assembly

insulation or triple-insulated wire may be required. Figure 2. PCB Layout Figure 3. PCB Component Placement

Figure 4. EMI Measurements (EMI EN5502, Class B)

1.3 Heat Sink Enhancement

Figure 5. Heat Sink Configuration

2 Operation Characteristics AN2173 - APPLICATION NOTE

2 Operation Characteristics

Figure 6. Drain to Source Voltage (V ds) and Drain Current (I d) Waveforms Figure 7. Power Supply Efficiency with Line Variation Note: Measured at full load, when the line is varied from 85V AC to 137VAC.

3 T ransformer Electrical Specifications AN2173 - APPLICATION NOTE

3 Transformer Electrical Specifications

Figure 10. Transformer Winding Schematic Table 1. Winding Inductance Ratings

4 Transformer Mechanical Information

Figure 11. Transformer Mechanical Drawing

0.19 REF

0.055 REF

Figure 12. VIPer12-based Power Supply Schematics

Table 2. Domestic Bill of Materials

1 C2 10uF/250V Electro Panasonic ECA-2EHG100

1 C3 47pF 1kV Ceramic Panasonic ECC-D3A470JGE

1 C4 22uF/25V Electro Panasonic ECA-1EM220

1 C6 47nF SMD 1206

2 C7, C8 330uF/25V Electro Panasonic EEU-FC1E331L

1 D3 200V 1A STMicroelectronics STTH102

1 R1 JUMPER

1 R2 2K 5% 1/2W

1 R4 220 5% 805

1 R5 1K 5% 0805

1 TR1 Output transformer Cramer Coil CVP11-021

1 U2 H11A817A Fairchild H11A817A

1 U3 TL431 STMicroelectronics TL431AIZ

1 U4 VIPer12A Dip STMicroelectronic VIPer12ADIP

1 MOV 220V Varistor

1 HS U4 Heat Sink

1 Output cable assembly

5 Revision History AN2173 - APPLICATION NOTE

5 Revision History

11-November-2005 1.0 First edition

Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the co nsequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publicati on are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics prod ucts are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectro nics. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners © 2005 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Ital y - Japan - Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America