AN1187

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www.microchip.com/memory Serial Memory Products ■ Serial EEPROM ■ Serial SRAM Serial Memory Products

2 Serial Memory Products

A broad portfolio of high performance, best-in-class Serial Memory Products to meet all your design requirements. Microchip offers the broadest range of Serial EEPROM devices (from 128 bits to 1 Mbit) over the widest operating voltage (1.7 to 5.5V) and temperature ranges (up to 150ºC). Innovative low-power designs and extensive testing have ensured industry leading endurance and best-in-class quality at low costs. SPI-compatible Serial SRAM devices are available in 64 and 256 Kbit options and up to 20 MHz. These low power devices provide additional external serial RAM with high-speed performance and are available in standard 8-pin packages. Microchip Supports Your Designs Throughout The Product Life Cycle

Key Beneﬁ ts ■ Lower system costs – innovative products, tiny packages, low power consumption, fewer I/O pins, small form factor ■ Save I /O pins on the MCU – more compact designs, add additional features ■ Secure data with write-protect options ■ Highest quality EEPROMs – Zero PPM initiatives – Triple-test ﬂ ow – >1M cycles E/W endurance ■ Faster time to market – Short lead times – Complete tools support ■ Robust designs – broad operating conditions ■ Long product life cycles ■ Global sales & engineering support Key Features ■ Serial architecture – I2C, SPI, UNI/O, Microwire ■ Broad range of densities ■ Tiny 3, 5, 6 and 8-pin packages, die & wafer ■ Innovative, low power designs ■ Industry leading endurance ■ Wide temperature and voltage range ■ Fast read and write times ■ Flexible: – Byte write capability – Package options – Custom programming options – Application-speciﬁ c serial memory ■ Microchip owned fabs, In-house testing ■ Automotive ﬂ ow on all products Serial EEPROM ■ SPI, I2C™, Microwire, UNI/O® Bus ■ Non-Volatile Memory ■ 128 bits-1Mbit ■ 1.7V-5.5V ■ 1M Cycles E/W Endurance ■ Fast Read/Write Times ■ Low Power Consumption Serial SRAM ■ SPI Bus, 20 MHz ■ Volatile Memory ■ 8, 32 Kbytes ■ Infinite Endurance ■ Zero Write Speeds ■ Low Power Outstanding Quality Innovative Products Reliable Supply Serial Memory Advantages Serial Memory Products Serial EEPROM Bus Comparison Parameter I 2CM i c r o w i r e U N I / OS P I Density Range 128b-1 Mbit 1 Kb-16 Kb 1 Kb-16 Kbit 1Kb-1 Mbit Speed Up to 1 MHz Up to 3 MHz Up to 100 KHz Up to 20 MHz I/O Pins 2: Clock, Data 4: Clock, CS, DI, DO 1: Clock/Data 4: SCK, CS, DI, DO Package Options PDIP, SOIC, SOIJ, TSSOP, MSOP, 2x3 T-DFN, 6x5 DFN, SOT-23, SC70, WLCSP PDIP, SOIC, TSSOP, MSOP, 2x3 T-DFN, SOT-23 PDIP, SOIC, TSSOP, MSOP, 2x3 T-DFN, SOT-23, TO92, WLCSP PDIP, SOIC, SOIJ, TSSOP, MSOP, 2x3 T-DFN, 6x5 DFN, SOT-23 Security Options HW HW SW HW, SW Pricing Least Expensive Most Expensive

4 Serial Memory Products

■ ESD Protection > 4000V Human Body Model (HBM) > 400V Machine Model (MM) > 1000V Charged Device Model ■ Latch-up protection > 200 mA on all pins ■ ESD Induced Latch-up > 100V (MM) on V DD; >400V on all I/O > 1M cycles Endurance and > 200 years data retention ■ Up to 150°C Operation (reads and writes) ■ Power-On Reset (POR) and Brown-Out Reset (BOR) – Effective protection against noisy automotive environments – Eliminates false writes ■ Schmitt Trigger input filters for noise reduction ■ Complete traceability including die location on wafer Innovative designs combined with in-house fabrication and outstanding testing methodology has helped create the industry’s highest quality Serial EEPROM. Microchip offers a broad selection of standard and application speciﬁ c Serial EEPROM devices that are available in all the standard serial busses – I2C, SPI, Microwire and the new single I/O UNI/O® bus. Quality ■ Microchip delivers highest quality EEPROMs in the world ■ World-class line yields (over 99%) ■ ISO/TS16949-compliant ■ Industry leader with triple test flow – every cell of every part is tested three times ■ Near zero PPM field bit fails ■ Statistical process control and continuous improvement procedures in all facilities ■ Robustness and reliability designed in ■ Automotive grade/flow MAC Address Chips EUI-48™ & EUI-64™ Node Address Partial Array Write Protect ½, ¼ and Whole Array WP Options DIMM-DDR2/3 Reversible S/W Write Protect; I2C Extended Temperature -55ºC to 150ºC VESA Monitors DDC1™/DDC2™ Interface Very Low Voltage 1.5V EEPROM UNI/O® Bus 1 Kb-16 Kb; 1.8V-5.5V SPI 1 Kb-1 Mb; 1.8V-5.5V 8-SOIC (SN) 5 x 6 mm 8-DFN (MF) 5 x 6 mm 8-SOIC (SM) 5 x 8 mm 8-PDIP (P) 8 x 9.5 mm Die/Wafer WL-CSP 5-SC70 (LT) 2 x 2 mm 3-SOT (TT) 3 x 2.5 mm 5 & 6-SOT (OT) 3 x 3 mm 8-TDFN (MC/MNY) 2 x 3 mm 8-MSOP (MS) 3 x 5 mm 8-TSSOP (ST) 3 x 6.5 mm ... Specialty/Application Specific EEPROMs Standard EEPROMs I2C™ 128b-1 Mb; 1.7V-5.5V Microwire 1 Kb-16 Kb; 1.8V-5.5V Packages Serial EEPROMs

Memory Packages – more memory in less space! Serial EEPROM devices from Microchip are available in a wide variety of tiny, innovative packages to help minimize your design – save board space and cost! ■ WLCSP – die-sized package – smallest form factor EEPROM package in the world! ■ SC70 – smallest 5-lead EEPROM package! ■ 5-SOT-23 available up to 64 Kbit; 8-TDFN up to 128 Kbit, 8-SOIC up to 1 Mbit (I2C) Density Max Speed SOIC SN SOT-23 OT/TT TSSOP TS TDFN MNY/MC PDIP P MSOP MS SOIJ SM DFN MF SC70 LT TO92 TO Wafer W/S/WF WLCSP CS 5x6 3x3 3x6.5 2x3 8x9.5 3x5 5x8 5x6 2x2 Die Die I2C™ Bus 1.7V-5.5V 128bit-2K 400 KHz X 5 XX X X 5 X 4K-32K 400 KHz X 5 XX X X X X 64K 1 MHz X 5 XX X X X X X 128K 1 MHz XX X X X X X X X 256K 1 MHz XX X X X X X X 512K 1 MHz XX X X X X X

1 Mbit 1 MHz XX X

Microwire Bus 1.8V-5.5V 1K-16K 3 MHz X 6 XX X X X SPI Bus 1.8V-5.5V 1K-4K 10 MHz X 6 XX X X X 8K-64K 10 MHz XX X X X X 128K, 256K 10 MHz XX X X X X 512K 20 MHz X 14 XX X X

1 Mbit 20 MHz XX X X

® Single-Wire Bus 1.8V-5.5V 1K-16K 100 KHz X 3 XX X X X X Package Sizes 8-SOIC (SN) 5 x 6 mm 8-DFN (MF) 5 x 6 mm 8-SOIC (SM) 5 x 8 mm 8-PDIP (P) 8 x 9.5 mm Die/Wafer WL-CSP 5-SC70 (LT) 2 x 2 mm 3-SOT (TT) 3 x 2.5 mm . . 5 & 6-SOT (OT) 3 x 3 mm 8-TDFN (MC/MNY) 2 x 3 mm 8-MSOP (MS) 3 x 5 mm 8-TSSOP (ST) 3 x 6.5 mm WLCSP – World’s Smallest EEPROM Package WLCSP from Microchip is bumped die with a redistribution layer to route the bond pads to the bumps. ■ True ‘die-sized’ packages ■ Industry’s smallest package, form factor ■ Lowest proﬁ le package ■ Available in I 2C, UNI/O buses ■ Compatible with standard surface mount assembly lines ■ Fit a large density into a small space ■ Applications: mobile phones, security cameras, sensors, servers, networking, RF, medical, portable electronics WLCSP 4 Kbit I2C <1 x 1 mm Actual Size Enlarged to Show Detail Wafer Level Chip Scale Packaging

6 Serial Memory Products

Application-Specific EEPROMs Innovative EEPROM options to help you get to market faster and deliver the highest performance at lowest costs. Serial Memory Products – Application Examples Microchip Strengths Applications Automotive Quality, PPAP, long product life cycles, AEC Q-100 & TSO-16949 compliant, in-house testing, triple-test ﬂ ow Transmission, ABS, Power Train, Airbag, Entertainment System, Mirror Controllers, GPS, Steering Control Medical Outstanding quality, and reliability, tiny packages, low power, Microchip owned fabs Blood Glucose Meters, Hearing Aid, Medical Imaging Devices, XRAY , Oxygen Concentrator, ECG Industrial Robust designs, high endurance, wide operating range, custom part options Metering, Industrial Control, Security Systems, Alarm Systems, Sensor Networks, Battery Chargers Consumer Short lead times, excellent supply, innovative packages, application speciﬁ c options, low power LCD TV , Set Top Box, Printers, Blue Tooth, Wireless, Laptop, Mouse, Networking, DDR2/3, Camera, POS, Appliances Specialty EEPROM Applications Application/Market Design Challenge Solution Products Beneﬁ ts Monitors, Projectors, Flat Panel Display DDC1™ & DDC2™, EDID & E-EDID speciﬁ cation Vesa products 24LCS21A, 24LCS22A Quick, easy plug & play options Networking, Ethernet, Wi-Fi, ZigBee® EUI-48™/EUI-64™ MAC Address MAC address chips 24AA02E48, 11AA02E48, 25AA02E48 Easy access, Low-cost, Plug & play, Additional EEPROM PCs and Laptops – DRAM DIMM Modules DDR1/2/3 Speciﬁ cation DIMM SPD products, Temp sensor with EEPROM 24LCS52, 34XX02, MCP98242 Customizable software enabled WP Industrial, Consumer Electronics Systems that require locked and/or re-writeable memory Write-protect options I 2C, SPI, UNI/O and Microwire Options available One lower cost device replace two stand-alone parts HDCP Chipset (TV) Adding HDCP keys to your chipset Secure wafer programming service 4K/8K – I 2C, SPI, Microwire Secure, No code duplication, Lower overall costs, Factory-programmed serialization Industrial Need devices to operate beyond -40C to +125C High temp. EEPROMs: up to 150°C Low temp EEPROMs: down to -55°C

1 Kbit, I

Robust design, Reduce chances of ﬁ eld failures Automotive Automotive Qualiﬁ cation Special manufacturing ﬂ ow All Robust design, Hassle-free solution Consumer Electronics, Medical Need Very Low Voltage Very Low Voltage EEPROMs 24VL014, 24VL024, 34VL02 Low power operation, Reduced system voltage

Flexibility and Low Cost Access Quickly add EUI-48 to your networking application and get to market faster ■ Buy code only when needed. ■ No added programming and serialization cost – Reduce System Costs ■ Come with no volume restrictions. ■ Additional EEPROM to store conﬁ guration settings ■ Unique ID Plug-and-Play Devices EUI-48 address embedded in a 2K-bit Serial EEPROM ■ Quick and easy access to IEEE MAC addresses – Read code directly off Serial EEPROM ■ Available in SPI, I 2C and UNI/O bus ■ At least 1.5 Kb of Serial EEPROM memory ■ Available in SOIC and SOT-23 packages ■ Write-protected codes ■ EUI-48 and EUI-64 compatible – EUI-48: Networking, Ethernet, Wi-Fi (IEEE 802.11), Bluetooth – EUI-64: ZigBee (IEEE802.15.4), MiWi™, FireWire, IPv6 EUI-48™/EUI-64™ MAC Address Chips Need fast, easy and inexpensive access to MAC addresses? Use pre-programmed MAC address chips from Microchip. No serialization needed; unique ID. EUI-48 Programmed Serial EEPROMs provide low cost and easy access to IEEE MAC Addresses. These plug-and-play devices allow you to quickly add a MAC address to your networking application eliminating the need for programming and serialization on the MCU – helping you save cost and get to market quicker. For more information visit: www.microchip.com/MAC 24AA02E48

100 KHz

10 MHz

I2C and SPI Serial EEPROMs with Optional Range from -55°C to +150°C ■ Automotive turbo chargers and exhaust gas recirculation ■ Automotive fan motors, air valves, flaps and spark plugs ■ Aerospace ■ Mining (certifications for use in explosive atmospheres available) 150oC Partial Array Write-Protect I2C EEPROMs Microchip’s family of partial array write-protect (WP) EEPROMs offers hardware write-protect capability for only a part of the memory array. These I2C EEPROM devices are available from 1 Kb-64 Kbit. 32 & 64 Kbit 1/4 Array WP1/2 Array WP User data, real-time updates, data that changes

1 Kbit-16 Kbit

Calibration parameters, unique ID, data that never changes ■ Can be custom programmed in any memory density. Contact Microchip sales for more information.

8 Serial Memory Products

2.5-5.5V 1.8-5.5V UNI/O® EEPROM Using UNI/O EEPROM can free up MCU pins for new features. Microchip’s new UNI/O Serial EEPROM uses only ONE connection to the host microcontroller. This compares to two or three pins for I2C, and three to six pins for Microwire or SPI buses. This new, proprietary bus offers advanced features like a status register and write-protection on demand, along with all I /O and memory array and command functions through a single pin. Save I/O Pins A single I/O EEPROM can simplify your design and reduce system cost ■ Free up pins on the MCU – Add new features to your application – Move to a smaller MCU – reduce cost ■ Free up pins on your connector – Smaller connector – lower cost ■ Single I /O interface – more compact design Single I/O EEPROM One I/O for clock, data & control ■ Single I /O interface ■ 1-16 Kbit memory densities ■ 1.8-5.5V operating voltage ■ 10-100 KHz operating frequency ■ Status register, SW write-protect ■ 3-pin SOT-23, 8-pin SOIC, MSOP & TDFN ■ 1M Erase/Write cycles ■ UNI/O software drivers available for many popular microcontrollers See Ap Note section for more information. ■ Convert UNI/O from 3-pins to 2-pins – check out Ap Note AN1213. VCC MCU UNI/O® VCC I2C™ UNI/O ® VCC VCC R1 R2 I2C™ SDA SCL WP Single I/O, No pull-up resistors needed. ■ Save board space ■ Save pins on the MCU ■ Add additional features VCC MCU SDA SCL WP www.microchip.com/unio The UNI/O Advantage

The Serial Advantage – Not Just Price Feature Traditional Parallel SRAM Microchip Serial SRAM I/O Connection to MCU 16-20 4 Standby Current 3 mA 1 μA Active Current 50 mA 1-10 mA Lowest Operating Voltage 3.0V 1.7V Footprint 100 mm2 20 mm2 Smallest Packages 28-TSSOP, 28-SOIC 8-TSSOP, 8-SOIC Do you need a simple, inexpensive way to add RAM to your application? Microchip offers external RAM where you need it. Microchip’s new serial SRAM family provides a way to easily and inexpensively add external RAM to almost any application. These serial devices use less power and fewer I/O connections than traditional parallel SRAM. And, they allow designers to use a smaller microcontroller rather than moving to a larger microcontroller just to get more on-board RAM. Serial SRAM Flexible RAM Expansion Quickly and easily add external high-speed SRAM ■ 8 and 32 Kbyte options ■ 20 MHz clock speed ■ Low standby and operating currents ■ Fast writes with zero latency ■ Unlimited endurance ■ 8-SOIC, 8-TSSOP, 8-PDIP Increased Performance Add features to your current microcontroller and get to market faster ■ Add functionality to your current design ■ No need to buy a large microcontroller just for the RAM ■ Familiar 4-pin SPI interface ■ Cost reduce your current design ■ Scratchpad, buffering, high endurance applications ■ Applications: m etering, POS terminals, printers, internet radio, ethernet, Wi-Fi ■ Replace parallel RAM ■ Any application needing low cost RAM23A640

16 MHz

1.5V-1.95V 23K640

20 MHz

2.7V-3.6V 64 Kb 23A256

20 MHz256 Kb

www.microchip.com/sram

10 Serial Memory Products

Main Goals – Zero Defects ■ Full verification of data sheet parameters for functional compliance at die and package level. ■ Removal of manufacturing defects to ensure highest quality and reliability. ■ Screening out of functional devices that may fail in the future. 1: Wafer Probe Full functional tests on 100% of die and bits; 85ºC or 125ºC 5000 erase/write cycles on all bits Key Aspects: Endurance Testing MAVERICK HVST TVPP 250ºC up to 24 hours Equivalent to 100 years at 85ºC Key Aspects: Functional Test Verify Margins GBN EDIO LVHF SBY 2: Wafer Probe 2nd 100% bit test (25ºC) full-functional screen Any die with charge loss in any cell between the 2 probes is rejected to prevent infant mortality Retention Bake Assembly & Final Test Microchip’s Triple Test and Wafer-level Burn-in Procedure Moving beyond traditional burn-in to wafer level burn-in with the Triple Test Flow specifically targeted for memory cells has helped create the industry’s most reliable memory products. ■ Extensive Testing – Every cell in every die is tested three times, including specific endurance and data retention tests to ensure highest quality. ■ HVST, LVHF and TVPP tests target specific defects. ■ Maverick, SBY and GBN target overall failure patterns and trends. ■ Insight into failure modes along with flexible test flow ensures continues improvement. Traditional Burn-in (Old Technology) General purpose non-specific testing procedure for random logic cells ■ Non-specific and untargeted testing mechanism – Increases failure rates. ■ Expensive, time consuming and inefficient. ■ Introduces defect modes like bent leads and EOS that sometimes go undetected . Triple Test Flow Microchip tests every cell in wafer form twice, then performs a final test after assembly. Microchip’s best-in-class field performance is the combined result of world class manufacturing, wafer level burn-in and wafer probe quality screens. Microchip’s Triple Test Flow is currently the most robust testing procedure for serial EEPROM devices in the industry. It tests each cell of each die three times and also performs extensive endurance and data retention tests to ensure quality and reliability. Infant mortality of Microchip serial EEPROMs is among the lowest in the industry due to this extensive testing, excellent fabrication and highly reliable memory cell design. Good Die in a Bad Neighborhood (GBN) and Edge Die Ink Out (EDIO) Special algorithms target devices that function, but are suspect because of their proximity to clusters of failing devices or edge die. Wafer Probe Quality Screens Microchip performs additional in-house testing during wafer probe to ensure quality and eliminate any devices that are outside the normal distribution or might possibly fail in the future. High Voltage Stress Test (HVST) HVST targets weak devices with oxide defects in RAM and logic circuits by stressing the oxides at higher than normal voltages. Time at Vpp (TVPP) TVPP targets oxide defects in EEPROM cells, charge pumps and other high-voltage circuits. Programming voltages (V PP) are applied to the memory array for an extended period of time in order to highlight any weak devices. Low Voltage High Frequency (LVHF) LVHF targets signal paths that are partially blocked and therefore more resistive than normal. LVHF eliminates these devices by requiring them to operate faster than specified and at voltages lower than specified. What Does All of This Mean? ■ <<1 PPM Field Failures ■ Best-in-class endurance ■ Industry-leading data retention Failing Die Passing Die Rejected by GBN screen Rejected by EDIO screen Rejected by EDIO screen (Concept)

Consistent, Reliable Supply of the Highest Quality Products Perfected testing mechanisms along with streamlined in-house fabrication ensures the highest efﬁ ciency, shortest lead times and lowest costs. “Quality Comes First” is at the top of the list of Guiding Values for Microchip Technology. As an ISO/TS-16949 certified supplier since 2003, Microchip’s Aggregate System uniquely supports our commitment to exceptional quality. In an environment where enterprise-wide commitment to continuous improvement is demonstrated and every employee is responsible for quality. With more than 20 years of experience in serving the demanding requirements of customers worldwide, Microchip Technology has a proven track record of success in delivering the total product solution to our valued customers that is cost effective and reliable. Corporate Headquarters Chandler, Arizona Fab 2 Tempe, Arizona Fab 4 Gresham, Oregon Product Assembly/Test Bangkok, Thailand www.microchip.com/quality ■ EEPROMs built at Microchip owned fabs (Gresham, OR, Tempe, AZ) ■ No obsolescence policy – industry’s longest product life cycles ■ 100% in-house testing on all of our products ■ AECQ100, TS19649 and automotive grade compliant ■ Industry’s shortest lead times ■ Excellent global sales and technical support Microchip: A leader in non-volatile memory for over 20 years.

12 Serial Memory Products

MPLAB® Starter Kit for Serial Memory Products (DV243003) Reduce time to market and create a rock-solid design using the MPLAB Starter Kit for Serial Memory Products. It includes everything necessary to quickly develop a robust and reliable Serial EEPROM design, and greatly reduces the time required for system integration and hardware/software fine-tuning. ■ 3.3V and 5.0V on-board voltage selection ■ Supports Microchip UNI /O bus, I²C, SPI and Microwire Serial EEPROMs ■ 1.8V to 5.5V external voltage support ■ Includes free copy of MPLAB IDE ■ USB interconnect Total Endurance™ Software Total Endurance Software provides a comprehensive model that helps estimate the endurance and reliability of Microchip Serial EEPROM devices. By providing operating conditions based on your application, all design trade-offs affecting reliability can be accurately estimated both graphically and numerically in PPM, FIT and MTBF modes, saving time and ensuring a truly robust design. Resources to Get You Started Quickly Reduce development time and cost with our development tools. Competitive market conditions force businesses to examine every aspect of their product life cycle to maximize productivity and minimize expense. Easy-to-learn, low-cost common development tools are one way to reduce risk and get to market quicker. UNI/O® Bus Parasitic Power Demo Board (AC243004) The UNI/O Bus Parasitic Power Demo Board is designed to illustrate how a standard half-wave rectifier and capacitor circuit can be used to parasitically extract power for a UNI /O device from the SCIO signal as described in application note, AN1213 “Powering a UNI /O® Bus Device Through SCIO”. This reduces the number of connections necessary for adding a UNI /O device to your application down to two: SCIO and VSS. Serial EEPROM PIM PICtail™ Pack (AC243003) The Serial EEPROM PIM PICtail Modules are a series of boards designed around Microchip Serial EEPROM devices. The boards are designed to interface with the PICtail Plus connector as well as the MPLAB Starter Kit for Serial Memory Products and the PICkit 3, allowing you to get started right out of the box. ■ Plug-and-play with PICtail Plus connector and PICkit 3 connector ■ Test points for oscilloscope connections for firmware debugging (I²C and UNI/O only) ■ Microwire Buses are included for maximum flexibility in developing your application www.microchip.com/devtools

Looking for reference code to interface with our serial memory? Select your serial protocol, microcontroller and preferred implementation below. Memory Application Notes – PIC® MCUs Protocol Memory Type Recommended Usage Implementation PIC10 PIC12 PIC16 PIC18 PIC24/ dsPIC33 PIC32 UNI/O Bus EEPROM AN1194 (General Usage) Assembly – Firmware Delay AN1174 1 AN11741 AN11882 AN11741 AN11882 AN1183 AN1213 (Parasitic Power) Assembly – Hardware Delay AN1196 2 AN11962 AN1187 C – Hardware Delay AN1251 2 AN12512 AN1191 AN1236 I²C EEPROM AN1028 Assembly – Bit Bang AN982 AN982 AN974 AN979 Assembly – Hardware Port AN976 AN989 C – Bit Bang AN997 AN1100 C – Hardware Port AN991 AN1079 Microwire EEPROM AN1029 Assembly – Bit Bang AN993 AN999 Assembly – Hardware Port AN975 AN1020 C – Bit Bang AN1004 C – Hardware Port AN1023 SPI EEPROM AN1040 Assembly – Bit Bang AN909 AN1006 Assembly – Hardware Port AN966 AN1000 C – Bit Bang AN1018 AN1096 C – Hardware Port AN1040 AN1069 SRAM AN1245 – AN1287 AN1269 AN1262 AN1277 All EEPROMs AN1019 EEPROM Endurance Tutorial AN536 Basic Serial EEPROM Operation AN603 Continuous Improvement Note 1: Written for baseline (12-bit program word) cores. 2: Written for mid-range (14-bit program word) cores. Memory Application Notes – Third-Party MCUs Protocol Implementation 8051 MSP430 UNI/O Bus Assembly – Hardware Delay AN1184 C – Hardware Delay AN1185 AN1186 I²C Assembly – Bit Bang AN1147 Assembly – Hardware Port AN1190 C – Bit Bang AN1195 C – Hardware Port AN1113 SPI Assembly – Bit Bang AN1198 Assembly – Hardware Port AN1197 C – Bit Bang AN1193 C – Hardware Port AN1073 www.microchip.com/appnotes

14 Serial Memory Products

I2C™ Memory Products Device Density (Organization) Max Clock Frequency Operating Voltage (AA, LC, C) Temperature (I, E, H) Endurance (E/W Cycles) Data Retention Write Protect (Hardware) Packages 24XX00 128 bits (x8) 400 kHz 1.7V-5.5V -40°C to +125ºC 1M 200 years No PDIP, SOIC, TSSOP, SOT-23, 2x3 T-DFN 24XX01/014 1 Kbit (x8) 400 kHz 1.7V-5.5V -40°C to +150ºC 1M 200 years W, ½ PDIP, SOIC, TSSOP, SOT-23, 2x3 T-DFN, MSOP, SC70 24XX02/024 2 Kbits (x8) 400 kHz 1.7V-5.5V -40°C to +125ºC 1M 200 years W, ½ PDIP, SOIC, TSSOP, SOT-23, 2x3 T-DFN, MSOP, SC70 24XX04 4 Kbits (x8) 400 kHz 1.7V-5.5V -40°C to +125ºC 1M 200 years W, ½ PDIP, SOIC, TSSOP, SOT-23, 2x3 T-DFN, MSOP, WLCSP 24XX08 8 Kbits (x8) 400 kHz 1.7V-5.5V -40°C to +125ºC 1M 200 years W, ½ PDIP, SOIC, TSSOP, SOT-23, 2x3 T-DFN, MSOP 24XX16 16 Kbits (x8) 400 kHz 1.7V-5.5V -40°C to +125ºC 1M 200 years W, ½ PDIP, SOIC, TSSOP, SOT-23, 2x3 T-DFN, MSOP, WLCSP 24XX32 32 Kbits (x8) 400 kHz 1.7V-5.5V -40°C to +125ºC 1M 200 years W, ¼ PDIP, SOIC, TSSOP, SOT-23, 2x3 T-DFN, MSOP, WLCSP 24XX64/65 64 Kbits (x8) 1 MHz 1.7V-5.5V -40°C to +125ºC 1M/10M 200 years W, ¼ PDIP, SOIC, TSSOP, SOT-23, 2x3 T-DFN, MSOP, WLCSP 24XX128 128 Kbits (x8) 1 MHz 1.7V-5.5V -40°C to +125ºC 1M 200 years Yes PDIP, SOIC, TSSOP, 2x3 T-DFN, 6x5 DFN, MSOP, WLCSP 24XX256 256 Kbits (x8) 1 MHz 1.7V-5.5V -40°C to +125ºC 1M 200 years Yes PDIP, SOIC, TSSOP, 6x5 DFN, MSOP, WLCSP 24XX512 512 Kbits (x8) 1 MHz 1.7V-5.5V -40°C to +125ºC 1M 200 years Yes PDIP, SOIC, TSSOP, 6x5 DFN, WLCSP 24XX1025 1 Mbit (x8) 1 MHz 1.7V-5.5V -40°C to +125ºC 1M 200 years Yes PDIP, SOIC, SOIJ, 6x5 DFN SPI EEPROM Products Device Density (Organization) Max Clock Frequency Operating Voltage (AA, LC) Temperature (I, E, H) Endurance (E/W Cycles) Data Retention Write Protect (Software) Packages 25XX010A 1 Kbit (x8) 10 MHz 1.8V-5.5V -40°C to +150ºC 1M 200 years W, ½, ¼ PDIP, SOIC, TSSOP, 2x3 T-DFN, MSOP, SOT-23 25XX020A 2 Kbits (x8) 10 MHz 1.8V-5.5V -40°C to +150ºC 1M 200 years W, ½, ¼ PDIP, SOIC, TSSOP, 2x3 T-DFN, MSOP, SOT-23 25XX040A 4 Kbits (x8) 10 MHz 1.8V-5.5V -40°C to +150ºC 1M 200 years W, ½, ¼ PDIP, SOIC, TSSOP, 2x3 T-DFN, MSOP, SOT-23 25XX080C/D 8 Kbits (x8) 10 MHz 1.8V-5.5V -40°C to +150ºC 1M 200 years W, ½, ¼ PDIP, SOIC, TSSOP, MSOP, 2x3 T-DFN 25XX160C/D 16 Kbits (x8) 10 MHz 1.8V-5.5V -40°C to +150ºC 1M 200 years W, ½, ¼ PDIP, SOIC, TSSOP, MSOP, 2x3 T-DFN 25XX320A 32 Kbits (x8) 10 MHz 1.8V-5.5V -40°C to +150ºC 1M 200 years W, ½, ¼ PDIP, SOIC, TSSOP, MSOP, 2x3 T-DFN 25XX640A 64 Kbits (x8) 10 MHz 1.8V-5.5V -40°C to +150ºC 1M 200 years W, ½, ¼ PDIP, SOIC, TSSOP, MSOP, 2x3 T-DFN 25XX128 128 Kbits (x8) 10 MHz 1.8V-5.5V -40°C to +150ºC 1M 200 years W, ½, ¼ PDIP, SOIC, TSSOP, 6x5 DFN 25XX256 256 Kbits (x8) 10 MHz 1.8V-5.5V -40°C to +150ºC 1M 200 years W, ½, ¼ PDIP, SOIC, TSSOP, 6x5 DFN 25XX512 512 Kbits (x8) 20 MHz 1.8V-5.5V -40°C to +125ºC 1M 200 years W, ½, ¼ PDIP, SOIC, 6x5 DFN 25XX1024 1 Mbit (x8) 20 MHz 1.8V-5.5V -40°C to +125ºC 1M 200 years W, ½, ¼ PDIP, SOIJ, 6x5 DFN 2. I = -40ºC to 85ºC; E = -40ºC to 125ºC; H = -40ºC to 150ºC 3. Pb-Free, Halogen Free and RoHS Compliant 4. Write Protect: W = Whole Array, ½ = Half Array, ¼ = Quarter Array 5. ESD protection > 4 kV (HBM); > 400V (MM) on all pins 6. H Temp is SOIC only Microwire EEPROM Products Device Density (x8 or x16) Max Clock Frequency Operating Voltage (AA, LC, C) Temperature (I, E) Endurance (E/W Cycles) Data Retention Write Protect (Hardware) Read Current Packages 93XX46A/B/C 1 Kbit 3 MHz 1.8V-5.5V -40°C to +125ºC 1M 200 years No 1 mA PDIP, SOIC, TSSOP, SOT-23, 2x3 T-DFN, MSOP 93XX56A/B/C 2 Kbits 3 MHz 1.8V-5.5V -40°C to +125ºC 1M 200 years No 1 mA PDIP, SOIC, TSSOP, SOT-23, 2x3 T-DFN, MSOP 93XX66A/B/C 4 Kbits 3 MHz 1.8V-5.5V -40°C to +125ºC 1M 200 years No 1 mA PDIP, SOIC, TSSOP, SOT-23, 2x3 T-DFN, MSOP 93XX76A/B/C 8 Kbits 3 MHz 1.8V-5.5V -40°C to +125ºC 1M 200 years Yes 1 mA PDIP, SOIC, TSSOP, 2x3 T-DFN, MSOP 93XX86A/B/C 16 Kbits 3 MHz 1.8V-5.5V -40°C to +125ºC 1M 200 years Yes 1 mA PDIP, SOIC, TSSOP, 2x3 T-DFN, MSOP A: x8 Organization, B: x16 Organization, C: Selectable x8 or x16 Organization UNI/O® Bus EEPROM Products Device Density (Organization) Max Clock Frequency Operating Voltage (AA, LC) Temperature (I, E) Endurance (E/W Cycles) Data Retention Write Protect (Software) Packages 11XX010 1 Kbit (x8) 100 kHz 1.8V-5.5V -40°C to +125ºC 1M 200 years W, ½, ¼ PDIP, SOIC, TSSOP, SOT-23, 2x3 T-DFN, MSOP, TO92, WLCSP 11XX020 2 Kbits (x8) 100 kHz 1.8V-5.5V -40°C to +125ºC 1M 200 years W, ½, ¼ PDIP, SOIC, TSSOP, SOT-23, 2x3 T-DFN, MSOP, TO92, WLCSP 11XX040 4 Kbits (x8) 100 kHz 1.8V-5.5V -40°C to +125ºC 1M 200 years W, ½, ¼ PDIP, SOIC, TSSOP, SOT-23, 2x3 T-DFN, MSOP, TO92, WLCSP 11XX080 8 Kbits (x8) 100 kHz 1.8V-5.5V -40°C to +125ºC 1M 200 years W, ½, ¼ PDIP, SOIC, TSSOP, SOT-23, 2x3 T-DFN, MSOP, TO92, WLCSP 11XX160 16 Kbits (x8) 100 kHz 1.8V-5.5V -40°C to +125ºC 1M 200 years W, ½, ¼ PDIP, SOIC, TSSOP, SOT-23, 2x3 T-DFN, MSOP, TO92, WLCSP Serial SRAM Products Device Density Organization) Max Clock Frequency Operating Voltage (A, K) Temperature (I, E) Read Current (mA) Max Standby Current Packages 23x640 8KB (64 Kbits) 20 MHz 1.8V, 3V -40°C to +125ºC 3 mA 4 μA PDIP, SOIC, TSSOP 23X256 32 KB (256 Kbits) 20 MHz 1.8V, 3V -40°C to +125ºC 3 mA 4 μA PDIP, SOIC, TSSOP 2. All Devices are Pb-Free, RoHS Compliant and Halogen Free For up to date product information visit: www.microchip.com/memory

Package Type: SN 8-SOIC (150 mil) TT/OT 3/5/6 SOT-23 ST 8-TSSOP P 8-PDIP SM 8-SOIJ (208 mil) MS 8-MSOP Operating Temperature Range: I: Industrial (-40°C to +85°C) E: Extended Industrial Range (-40°C to +125°C) H: Extended (-40°C to +150°C) Tape and Reel T: Tape and Reel blank: Standard (bulk) Density: 00: 128 bits 01/010/014: 1 Kbit 02/020/024: 2 Kbit 04/040: 4 Kbit 08/080: 8 Kbit 16/160: 16 Kbit Voltage Range: AA 1.8V-5.5V LC 2.5V-5.5V C 4.5V-5.5V K 1.8-3.6V A 1.5-1.95V VL 1.5V-3.6V Bus Type: 24/34: I 25: SPI 93: Microwire 11: UN I/O Bus 23: SRAM (SPI) Part Number Suffix Designations Ordering information for Microchip SEEPROM products.

24 AA 02 T - I /SN

Serial Memory Ordering Information We can pre-program your EEPROMs before they ship. Microchip offers custom programming options in package and die: ■ QTP – All devices are programmed with same data ■ SQTP – Each device is programmed with unique data Do you have special product requirements? Microchip offers customized versions of existing products: ■ Lower V DD (<1.5V in some cases) ■ Extreme temperature (< -55ºC to >+150ºC) ■ More endurance, up to 10M cycles ■ Lower current specs (read, write, standby) ■ Higher speed ■ Customer design modiﬁ cations: – Different I2C and UNI/O addresses – Custom voltage ranges Get started today… additional resources at: www.microchip.com/memory ■ Datasheets and application notes (with code) ■ Verilog, IBIS models ■ Usage recommendation ap notes ■ Webinars at www.microchip.com/webinars ■ Samples at www.microchip.com/samples ■ Tools and demo boards MNY/MC/MF 8-TDFN/DFN LT 5-SC70 W/WF/S Wafer/Die CS WLCSP – die size TO TO92 32/320: 32 Kbit 64/640: 64 Kbit 128: 128 Kbit 256: 256 Kbit 512: 512 Kbit 1024/1025: 1 Mbit Programming & Special Services

The Microchip name and logo, the Microchip logo, MPLAB, PIC and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. PICkit, PICtail and Total Endurance is a trademark of Microchip Technology © 2010, Microchip Technology Incorporated, All Rights Reserved. Printed in the U.S.A. 3/10 DS22239A *DS22239A* Microchip Technology Inc. 2355 W. Chandler Blvd. Chandler, AZ 85224-6199 www.microchip.com AMERICAS Atlanta Tel: 678-957-9614 Boston Tel: 774-760-0087 Chicago Tel: 630-285-0071 Cleveland Tel: 216-447-0464 Dallas Tel: 972-818-7423 Detroit Tel: 248-538-2250 Kokomo Tel: 765-864-8360 Los Angeles Tel: 949-462-9523 Santa Clara Tel: 408-961-6444 Toronto Mississauga, Ontario Tel: 905-673-0699 EUROPE Austria - Wels Tel: 43-7242-2244-39 Denmark - Copenhagen Tel: 45-4450-2828 France - Paris Germany - Munich Tel: 49-89-627-144-0 Italy - Milan Tel: 39-0331-742611 Netherlands - Drunen Tel: 31-416-690399 Spain - Madrid Tel: 34-91-708-08-90 UK - Wokingham Tel: 44-118-921-5869 ASIA/PACIFIC Australia - Sydney Tel: 61-2-9868-6733 China - Beijing Tel: 86-10-8528-2100 China - Chengdu Tel: 86-28-8665-5511 China - Hong Kong SAR Tel: 852-2401-1200 China - Nanjing Tel: 86-25-8473-2460 China - Qingdao Tel: 86-532-8502-7355 China - Shanghai Tel: 86-21-5407-5533 China - Shenyang Tel: 86-24-2334-2829 China - Shenzhen Tel: 86-755-8203-2660 China - Wuhan Tel: 86-27-5980-5300 China - Xiamen Tel: 86-592-2388138 China - Xian Tel: 86-29-8833-7252 China - Zhuhai Tel: 86-756-3210040 Sales Office Listing ASIA/PACIFIC India - Bangalore Tel: 91-80-3090-4444 India - New Delhi Tel: 91-11-4160-8631 India - Pune Tel: 91-20-2566-1512 Japan - Yokohama Tel: 81-45-471- 6166 Korea - Daegu Tel: 82-53-744-4301 Korea - Seoul Tel: 82-2-554-7200 Malaysia - Kuala Lumpur Tel: 60-3-6201-9857 Malaysia - Penang Tel: 60-4-227-8870 Philippines - Manila Tel: 63-2-634-9065 Singapore Tel: 65-6334-8870 Taiwan - Hsin Chu Tel: 886-3-6578-300 Taiwan - Kaohsiung Tel: 886-7-536-4818 Taiwan - Taipei Tel: 886-2-2500-6610 Thailand - Bangkok Tel: 66-2-694-1351 3/26/09 Support Microchip is committed to supporting its customers in developing products faster and more efficiently. We maintain a worldwide network of field applications engineers and technical support ready to provide product and system assistance. In addition, the following service areas are available at www.microchip.com: ■ Support link provides a way to get questions answered fast: http://support.microchip.com ■ Sample link offers evaluation samples of any Microchip device: http://sample.microchip.com ■ Forum link provides access to knowledge base and peer help: http://forum.microchip.com ■ Buy link provides locations of Microchip Sales Channel Partners: www.microchip.com/sales Training If additional training interests you, then Microchip can help. We continue to expand our technical training options, offering a growing list of courses and in-depth curriculum locally, as well as significant online resources – whenever you want to use them. ■ Regional Training Centers: www.microchip.com/rtc ■ MASTERs Conferences: www.microchip.com/masters ■ Worldwide Seminars: www.microchip.com/seminars ■ eLearning: www.microchip.com/webseminars ■ Resources from our Distribution and Third Party Partners www.microchip.com/training

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A broad portfolio of high performance, best-in-class Serial Memory Products to meet all your design requirements. 3/10

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