AN1111C STANLEY | Alldatasheet

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Package 1608 ( h = 0.7 mm) type, Water clear epoxy Rank grouping parameter Soldering methods ESD 2kV (HBM) Sorted by radiant intensity per rank taping Half Intensity Angle Assembly method Auto pick & place machine (Auto Mounter) Taping and reel 4,000pcs per reel in a 8mm width tape. (Standard) Reel diameter:φ180mm AN1111C Surface Mount IRED/1608 ( h = 0.7 mm) Type Reflow soldering and manual soldering ※Please refer to Soldering Conditions about soldering. 2007.8.31

2005.6.30 AN1111C Surface Mount IRED/1608 ( h = 0.7 mm) Type Absolute Maximum Ratings Item Symbol Unit Power Dissipation Pd mW Forward Current I F mA Pulse Forward Current ※1 IFRM mA ⊿IF mA/℃ ⊿IFRM mA/℃ Reverse Voltage V R V Operating Temperature T opr ℃ Storage Temperature T stg ℃ ※1 IFRM Measurement condition : Pulse Width≦100μs, Duty≦1/100 Electro-Optical Characteristics Conditions TYP. 1.22 MAX. 1.4 Reverse Current V R=5V I R MAX. 10 μA MIN. 0.2 TYP. 0.28 Total Output Power I F=20mA Po TYP. 2 mW Peak Wavelength I F=20mA λp TYP. 950 nm Spectral Half-width I F=20mA ⊿λ TYP. 45 nm 125(θx) 150(θy) MIN. - TYP. 0.5 Response Time I F=20mA tr/tf TYP. 700 ns TYP. deg. MHzCut-off Frequency IF=20mADC±5mA, -3db from 0.1MHz fc Half Intensity Angle I F=20mA 2 θ1/2 V mW/sr Unit Forward Voltage I F=20mA V F Radiant Intensity I F=20mA I E Absolute Maximum Ratings 300 Derating (Ta=25℃ or higher) Item Symbol Characteristics 0.67 -30～+85 -40～+100 (Ta=25℃) (Ta=25℃)

MIN. MAX. A0 . 2 0 0 . 4 0 B0 . 2 8 0 . 5 6 C0 . 4 0 0 . 8 0 I E（mW/sr） IF = 20mA ConditionRank Page 3 ˞Please contact our sales staff concerning rank designation. 2005.6.30 AN1111C (Ta=25℃) Surface Mount IRED/1608 ( h = 0.7 mm) Type Radiant Intensity Rank

2005.6.30 AN1111C Technical Data Spatial Distribution Example Condition : Ta = 25℃ Spectral Distribution Relative Intensity vs. Wavelength Condition : Ta = 25℃, IF = 50mA Wavelength [nm] Relative Intensity Forward Voltage vs. Forward Current Condition : Ta = 25℃ Forward Voltage : VF(V) Forward Current IF(mA) Duty Ratio vs. Pulse Forward Current Condition : Ta = 25℃, tw ≦ 100μs Duty Ratio Pulse Forward Current IFRM(A) Surface Mount IRED/1608 ( h = 0.7 mm) Type

2005.6.30 AN1111C Technical Data Ambient Temperature vs. Pulse Forward Current Condition : tw≦100μs, Duty≦1/100 Ambient Temperature : Ta(℃) Ambient Temperature vs. Forward Current Ambient Temperature : Ta(℃) Forward Current : IF (mA) Ambient Temperature vs. Forward Voltage Condition : IF = 50mA Ambient Temperature : Ta (℃) Pulse Forward Current IFRM(mA) Forward Voltage VF(V) Surface Mount IRED/1608 ( h = 0.7 mm) Type Pulse Forward Voltage vs. Pulse Forward Current Condition : Ta=25℃, tw≦100μs, Duty≦1/100 Pulse Forward Voltage : VFM(V) Pulse Forward Current IFRM(mA)

2005.6.30 AN1111C Technical Data Forward Current vs. Relative Total Power Condition : - - Pulse, tw≦100μs, Duty≦1/100, Ta = 25℃ Forward Current : IF (mA) Ambient Temperature vs. Peak Wavelength Condition : IF = 50mA Ambient Temperature : Ta(℃) Peak Wavelength λp( n m ) Relative Total Power Ambient Temperature vs. Relative Total Power Condition : IF = 50mA Ambient Temperature : Ta (℃) Relative Total Power Surface Mount IRED/1608 ( h = 0.7 mm) Type

Surface Mount IRED/1608 ( h = 0.7 mm) Type Package Dimensions Recommended Soldering Pattern (Unit: mm) Taping Specification (Unit: mm) (Unit: mm) Quantity: 4,000pcs/ reel (standard) Weight: (1.40)mg 2005.6.30

Surface Mount IRED/1608 ( h = 0.7 mm) Type Reflow Soldering Conditions Manual Soldering Conditions Iron tip temp. Soldering time and frequency 3 s 1 time 350 ℃ (MAX.) (MAX.) (MAX.) (30 W Max.) 1) The above profile temperature gives the maximum temperature of the LED resin surface. Please set the temperature so as to avoid exceeding this range. 2) Total times of reflow soldering process shall be no more than 2 times. When the second reflow soldering process is performed, intervals between the first and second reflow should be short as possible (while allowing some time for the component to return to normal temperature after the first reflow) in order to prevent the LED from absorbing moisture. 3) Temperature fluctuation to the LED during the pre-heating process shall be minimized. 2007.8.31

Surface Mount IRED/1608 ( h = 0.7 mm) Type Reliability Testing Result Failure Criteria Reliability Testing Result Applicable Standard Duration Failure Room Temp. Operating Life EIAJ ED- 4701/100(101) 1,000 h 0/25 Resistance to Soldering Heat EIAJ ED- 4701/300(301) Twice 0/25 Temperature Cycling EIAJ ED- 4701/100(105) 5 cycles 0/25 Wet High Temp. Storage Life EIAJ ED- 4701/100(103) 1,000 h 0/25 High Temp. Storage Life EIAJ ED- 4701/200(201) 1,000 h 0/25 Low Temp. Storage Life EIAJ ED- 4701/200(202) 1,000 h 0/25 Vibration, Variable Frequency EIAJ ED- 4701/400(403) 2 h 0/1098.1m/s (10G), 100 ～ 2KHz sweep for 20min., XYZ each direction Testing Conditions Ta = 25℃, IF = Maxium Rated Current Minimum Rated Storage Temperature(30min) ～Normal Temperature(15min) ～Maximum Rated Storage Temperature(30min) ～Normal Temperature(15min) (Pretreatment) Individual standard (Reflow Soldering) Pre-heating 150℃～180℃ 120s Operating Heating 230℃ Min. Peak temperature 260℃ Ta = Maximum Rated Storage Temperature Ta = Minimum Rated Storage Temperature Items Symbols Conditions Failure criteria Radiant Intensity I E IF Value of each product Radiant Intensity Testing Min. Value ＜ Initial Value x 0.5 Forward Voltage V F IF Value of each product Forward Voltage Testing Max. Value ＞ Spec. Max. Value x 1.2 Reverse Current I R VR = Maximum Rated Reverse Voltage V Testing Max. Value ≧ Spec. Max. Value x 2.5 Cosmetic Appearance - - Occurrence of notable decoloration, deformation and cracking 2007.8.31

Special Notice to Customers Using the Products and Technical Information Shown in This Data Sheet AN1111C Page 10 Surface Mount IRED/1608 ( h = 0.7 mm) Type 1) The technical information shown in the data sheets are limited to the typical characteristics and circuit examples of the referenced products. It does not constitute the warranting of industrial property nor the granting of any license. 2) For the purpose of product improvement, the specifications, characteristics and technical data described in the data sheets are subject to change without prior notice. Therefore it is recommended that the most updated specifications be used in your design. 3) When using the products described in the data sheets, please adhere to the maximum ratings for operating voltage, heat dissipation characteristics, and other precautions for use. We are not responsible for any damage which may occur if these specifications are exceeded. 4) The products that have been described to this catalog are manufactured so that they will be used for the electrical instrument of the benchmark (OA equipment, telecommunications equipment, AV machine, home appliance and measuring instrument). The application of aircrafts, space borne application, transportation equipment, medical equipment and nuclear power control equipment, etc. needs a high reliability and safety, and the breakdown and the wrong operation might influence the life or the human body. Please consult us beforehand if you plan to use our product for the usages of aircrafts, space borne application, transportation equipment, medical equipment and nuclear power control equipment, etc. except OA equipment, telecommunications equipment, AV machine, home appliance and measuring instrument. 5) In order to export the products or technologies described in this data sheet which are under the “Foreign Exchange and Foreign Trade Control Law,” it is necessary to first obtain an export permit from the Japanese government. 6) No part of this data sheet may be reprinted or reproduced without prior written permission from Stanley Electric Co., Ltd. 7) The most updated edition of this data sheet can be obtained from the address below: http://www.stanley-components.com 2007.8.31