DATASHEET SEARCH SITE | WWW.ALLDATASHEET.COM

Document overview

  • Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
  • PDF pages: 14

Technical content

Features

3216 Dome lens type, Water clear epoxy

2010.03.30 Page 2

□□1105W Surface Mount IRED/Dome Lens Type (Ta=25℃) TYP. I F (mA) MIN. TYP. I F (mA) DNK1105W GaAlAs 865 20 2.8 8.0 20 AN1105W GaAs 950 20 1.0 1.4 20 Water Clear Part No. Material IE (ｍW/sr) Lens Color Radiant IntensityPeak Wavelength λｐ (nm) Color and Luminous Intensity

2010.03.30 Page 3

□□1105W Surface Mount IRED/Dome Lens Type Conditions DNK AN TYP. 1.40 1.22 MAX. 1.65 1.40 Reverse Current V R=5V I R MAX. 100 10 μA MIN. 2.8 1.0 TYP. 8.0 1.4 Total Output Power I F=20mA Po TYP. 4 2 mW Peak Wavelength I F=20mA λp TYP. 865 950 nm Spectral Half-width I F=20mA ⊿λ TYP. 45 45 nm MIN. - - TYP. 50 0.5 Response Time I F=20mA tr/tf TYP. 7 700 ns Cut-off Frequency IF=20mADC±5mA, -3db from 0.1MHz fc Half Intensity Angle I F=20mA 2 θ1/2 TYP. IF=20mA deg. MHz IE 25 30 Item Symbol V mW/sr Unit Forward Voltage I F=20mA Radiant Intensity VF Characteris tics (Ta=25℃) (Ta=25℃) DNK AN Power Dissipation P d 80 75 mW Forward Current I F 50 50 mA Pulse Forward Current ※1 IFRM 300 300 mA ⊿IFRM 4.00 4.00 mA/ ℃ Revers e Voltage V R 55 V Operating Temperature T opr ℃ Storage Temperature T stg ℃ Unit Derating (Ta=25℃ or higher) -30～+85 -40～+100 Absolute Maximum Ratings Item Symbol ※1 IFRM Measurement condition : Pulse Width≦100μs, Duty≦1/100 Absolute Maximum Ratings Electro-Optical Characteristics

2010.03.30 Page 4

□□1105W Surface Mount IRED/Dome Lens Type (Ta=25℃) MIN. MAX. MIN. MAX. A 2.8 5.6 1.0 2.0 B 4 . 08 . 0 1 . 42 . 8 C 5.6 11.2 2.0 4.0 D 8.0 16.0 - - E 11.2 22.4 - - Rank AN IF=20mA I F=20mA DNK Radiant Intensity Rank ※Please contact our sales staff concerning rank designation.

2010.03.30 Page 5

□□1105W Surface Mount IRED/Dome Lens Type 100 1000 0.001 0.01 0.1 1 100 Technical Data（DNK） Spatial Distribution Example Condition : Ta = 25℃ Spectral Distribution Relative Intensity vs. Wavelength Condition : Ta = 25℃, IF = 20mA Wavelength [nm] Relative Intensity Forward Voltage vs. Forward Current Condition : Ta = 25℃ Forward Voltage : VF(V) Forward Current IF(mA) Duty Ratio vs. Pulse Forward Current Condition : Ta = 25℃, tw ≦ 100μs Duty Ratio Pulse Forward Current IFRM(mA) 0.0 0.2 0.4 0.6 0.8 1.0 1.2 700 800 900 1000

2010.03.30 Page 6

□□1105W Surface Mount IRED/Dome Lens Type -30 -10 10 30 50 70 90 100 150 200 250 300 350 -30 -10 10 30 50 70 90 Duty=1% Duty=5% Duty=50% DC Duty=20% Duty=10% 100 1000 1.0 1.2 1.4 1.6 1.8 -40 -20 0 20 40 60 80 100 Technical Data（DNK） Derating Ambient Temperature vs. Maximum Forward Current Pulse Width tw≦100μsec Ambient Temperature : Ta(℃) Power dissipation vs. Ambient Temperature Ambient Temperature : Ta(℃) Ambient Temperature vs. Forward Voltage Condition : IF = 20mA Ambient Temperature : Ta (℃) Forward Voltage VF(V) Pulse Forward Voltage vs. Pulse Forward Current Condition : Ta=25℃, tw≦100μs, Duty≦1/100 Pulse Forward Voltage : VFM(V) Pulse Forward Current IFRM(mA) Maximum Forward Current : IF MAX. (mA) Power Dissipation : Pd (mW)

2010.03.30 Page 7

□□1105W Surface Mount IRED/Dome Lens Type 0.1 1.0 10.0 100.0 1 10 100 1000 0.1 1.0 10.0 11 0 1 0 0 0.1 -40 -20 0 20 40 60 80 100 Technical Data（DNK） Pulse Forward Current vs. Relative Total Power Condition : tw≦100μs, Duty≦1/100, Ta = 25℃ Forward Current : IFRM (mA) Forward Current vs. Relative Total Power Condition : Ta = 25℃ Forward Current : IF (mA) Relative Total Power Ambient Temperature vs. Relative Total Power Condition : IF = 20mA Ambient Temperature : Ta (℃) Relative Total Power Relative Total Power

2010.03.30 Page 8

□□1105W Surface Mount IRED/Dome Lens Type Technical Data（AN） Spatial Distribution Example Condition : Ta = 25℃ Spectral Distribution Relative Intensity vs. Wavelength Condition : Ta = 25℃, IF = 20mA Wavelength [nm] Relative Intensity Forward Voltage vs. Forward Current Condition : Ta = 25℃ Forward Voltage : VF(V) Forward Current IF(mA) Duty Ratio vs. Pulse Forward Current Condition : Ta = 25℃, tw ≦ 100μs Duty Ratio Pulse Forward Current IFRM(mA)

2010.03.30 Page 9

□□1105W Surface Mount IRED/Dome Lens Type Technical Data（AN） Ambient Temperature vs. Pulse Forward Current Condition : tw≦100μs, Duty≦1/100 Ambient Temperature : Ta(℃) Ambient Temperature vs. Forward Current Ambient Temperature : Ta(℃) Forward Current : IF (mA) Ambient Temperature vs. Forward Voltage Condition : IF = 20mA Ambient Temperature : Ta (℃) Pulse Forward Current IFRM(mA) Forward Voltage VF(V) Pulse Forward Voltage vs. Pulse Forward Current Condition : Ta=25℃, tw≦100μs, Duty≦1/100 Pulse Forward Voltage : VFM(V) Pulse Forward Current IFRM(mA)

2010.03.30 Page 10

□□1105W Surface Mount IRED/Dome Lens Type Technical Data（AN） Forward Current vs. Relative Total Power Condition : - - Pulse, tw≦100μs, Duty≦1/100, Ta = 25℃ Forward Current : IF (mA) Ambient Temperature vs. Peak Wavelength Condition : IF = 20mA Ambient Temperature : Ta(℃) Peak Wavelength λp( n m ) Relative Total Power Ambient Temperature vs. Relative Total Power Condition : IF = 20mA Ambient Temperature : Ta (℃) Relative Total Power

2010.03.30 Page 11

□□1105W Surface Mount IRED/Dome Lens Type Package Dimensions Recommended Soldering Pattern (Unit: mm) Taping Specification (Unit: mm) (Unit: mm) Quantity: 2,000pcs/ reel (standard) Weight: (7.81)mg 1105W-TR (Surface Mount) 1105W-RR (Reverse Mount) Surface Mount Reverse Mount

2010.03.30 Page 12

□□1105W Surface Mount IRED/Dome Lens Type Reflow Soldering Conditions Manual Soldering Conditions Iron tip temp. Soldering time and frequency 3 s 1 time 350 ℃ (MAX.) (MAX.) (MAX.) (30 W Max.) 1) The above profile temperature gives the maximum temperature of the LED resin surface. Please set the temperature so as to avoid exceeding this range. 2) Total times of reflow soldering process shall be no more than 2 times. When the second reflow soldering process is performed, intervals between the first and second reflow should be short as possible (while allowing some time for the component to return to normal temperature after the first reflow) in order to prevent the LED from absorbing moisture. 3) Temperature fluctuation to the LED during the pre-heating process shall be minimized.

2010.03.30 Page 13

□□1105W Surface Mount IRED/Dome Lens Type Reliability Testing Result Failure Criteria Items Symbols Conditions Failure criteria Radiant Intensity I E IF Value of each product Radiant Intensity Testing Min. Value ＜ Initial Value x 0.5 Forward Voltage V F IF Value of each product Forward Voltage Testing Max. Value ＞ Spec. Max. Value x 1.2 Reverse Current I R VR = Maximum Rated Reverse Voltage V Testing Max. Value ≧ Spec. Max. Value x 2.5 Reliability Testing Result Applicable Standard Duration Failure Room Temp. Operating Life EIAJ ED- 4701/100(101) 1,000 h 0/25 Resistance to Soldering Heat EIAJ ED- 4701/300(301) Twice 0/25 Temperature Cycling EIAJ ED- 4701/100(105) 5 cycles 0/25 Wet High Temp. Storage Life EIAJ ED- 4701/100(103) 1,000 h 0/25 High Temp. Storage Life EIAJ ED- 4701/200(201) 1,000 h 0/25 Low Temp. Storage Life EIAJ ED- 4701/200(202) 1,000 h 0/25 Vibration, Variable Frequency EIAJ ED- 4701/400(403) 2 h 0/1098.1m/s (10G), 100 ～ 2KHz sweep for 20min., XYZ each direction Testing Conditions Ta = 25℃, IF = Maxium Rated Current Minimum Rated Storage Temperature(30min) ～Normal Temperature(15min) ～Maximum Rated Storage Temperature(30min) ～Normal Temperature(15min) (Pretreatment) Individual standard (Reflow Soldering) Pre-heating 150℃～180℃ 120s Operating Heating 230℃ Min. Peak temperature 260℃ Ta = Maximum Rated Storage Temperature Ta = Minimum Rated Storage Temperature 2010.12.30

2010.03.30 Page 14

□□1105W Surface Mount IRED/Dome Lens Type Special Notice to Customers Using the Products and Technical Information Shown in This Data Sheet 1) The technical information shown in the data sheets are limited to the typical characteristics and circuit examples of the referenced products. It does not constitute the warranting of industrial property nor the granting of any license. 2) For the purpose of product improvement, the specifications, characteristics and technical data described in the data sheets are subject to change without prior notice. Therefore it is recommended that the most updated specifications be used in your design. 3) When using the products described in the data sheets, please adhere to the maximum ratings for operating voltage, heat dissipation characteristics, and other precautions for use. We are not responsible for any damage which may occur if these specifications are exceeded. 4) The products that have been described to this catalog are manufactured so that they will be used for the electrical instrument of the benchmark (OA equipment, telecommunications equipment, AV machine, home appliance and measuring instrument). The application of aircrafts, space borne application, transportation equipment, medical equipment and nuclear power control equipment, etc. needs a high reliability and safety, and the breakdown and the wrong operation might influence the life or the human body. Please consult us beforehand if you plan to use our product for the usages of aircrafts, space borne application, transportation equipment, medical equipment and nuclear power control equipment, etc. except OA equipment, telecommunications equipment, AV machine, home appliance and measuring instrument. 5) In order to export the products or technologies described in this data sheet which are under the “Foreign Exchange and Foreign Trade Control Law,” it is necessary to first obtain an export permit from the Japanese government. 6) No part of this data sheet may be reprinted or reproduced without prior written permission from Stanley Electric Co., Ltd. 7) The most updated edition of this data sheet can be obtained from the address below: http://www.stanley-components.com