AN1102F

TAN1102F STANLEY | Alldatasheet

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Surface Mount IRED/Right Angle Type Right Angle type, Water clear epoxy

2009.11.15 Page 2

˘˘1102F Surface Mount IRED/Right Angle Type (Ta=25ˆ)Color and Luminous Intensity TYP. IF (mA) MIN. TYP. IF (mA) TAN1102F 940 20 0.8 1.6 20 AN1102F 950 20 0.35 0.5 20 Part No. Material IE (̼W/sr) Lens Color Radiant IntensityPeak Wavelength λ̿ (nm) GaAs

2009.11.15 Page 3

˘˘1102F Surface Mount IRED/Right Angle Type Conditions TAN AN TYP. 1.20 1.22 MAX. 1.40 1.40 Reverse Current VR=5V IR MAX. 10 10 μA MIN. 0.8 0.35 TYP. 1.6 0.5 Total Output Power IF=20mA Po TYP. 5.7 2 mW Peak Wavelength IF=20mA λp TYP. 940 950 nm Spectral Half-width IF=20mA ᷎λ TYP. 50 45 nm 30(Вx) 35(Вx) 110(Вy) 120(Вy) MIN. - - TYP. - - Response Time IF=20mA tr/tf TYP. 1000 700 ns Cut-off Frequency IF=20mADC±5mA, -3db from 0.1MHz fc Half Intensity Angle IF=20mA 2θ1/2 TYP. IF=20mA deg. MHz IE Item Symbol V mW/sr Unit Forward Voltage IF=20mA Radiant Intensity VF Characteristics (Ta=25ˆ) (Ta=25ˆ) TAN AN Power Dissipation Pd 70 75 mW Forward Current IF 50 50 mA Pulse Forward Current ˞1 IFRM 300 300 mA ᷎IF 0.67 0.67 mA/ˆ ᷎IFRM 4.00 4.00 mA/ˆ Reverse Voltage VR 5 5 V Operating Temperature Topr ˆ Storage Temperature Tstg ˆ Unit Derating (Ta=25ˆ or higher) -30ʙ+85 -40ʙ+100 Absolute Maximum Ratings Item Symbol ˞1 IFRM Measurement condition : Pulse Widthʽ100Жs, Dutyʽ1/100 Absolute Maximum Ratings Electro-Optical Characteristics ˞ ВxɿProduct long side axis,В͈ɿProduct short side axis

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˘˘1102F Surface Mount IRED/Right Angle Type (Ta=25ˆ) Radiant Intensity Rank ˞Please contact our sales staff concerning rank designation. MIN. MAX. MIN. MAX. A 0.8 1.6 0.35 0.70 B 1.1 2.2 0.50 1.00 C 1.6 3.2 0.70 1.40 D 2.2 4.4 - - E 3.2 6.4 - - 3BOL AN IF=20mA IF=20mA IE(mW/sr) TAN

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˘˘1102F Surface Mount IRED/Right Angle Type 0.0 0.2 0.4 0.6 0.8 1.0 1.2 700 800 900 1000 1100 100 1000 0.001 0.01 0.1 1 100 1.0 1.1 1.2 1.3 Technical DataʢTANʣ Spatial Distribution Example Condition : Ta = 25ˆ Spectral Distribution Relative Intensity vs. Wavelength Condition : Ta = 25ˆ, IF =20mA Wavelength [nm] Relative Intensity Forward Voltage vs. Forward Current Condition : Ta = 25ˆ Forward Voltage : VF(V) Forward Current IF(mA) Duty Ratio vs. Pulse Forward Current Condition : Ta = 25ˆ, tw ʽ 100Жs Duty Ratio Pulse Forward Current IFRM(mA) y x

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˘˘1102F Surface Mount IRED/Right Angle Type 100 150 200 250 300 350 -30 -10 10 30 50 70 90 Duty=1% Duty=5% Duty=50% Duty=20% Duty=10% DC -30 -10 10 30 50 70 90 100 1000 1.0 1.1 1.2 1.3 1.4 -40 -20 0 20 40 60 80 100 Technical DataʢTANʣ Ambient Temperature vs. Forward Voltage Condition : IF = 20mA Ambient Temperature : Ta (ˆ) Forward Voltage VF(V) Pulse Forward Voltage vs. Pulse Forward Current Condition : Ta=25ˆ, twʽ100Жs, Dutyʽ1/100 Pulse Forward Voltage : VFM(V) Pulse Forward Current IFRM(mA) Derating Ambient Temperature vs. Maximum Forward Curren Pulse Width twʽ100Жsec Ambient Temperature : Ta(ˆ) Power Dissipation vs. Ambient Temperature Ambient Temperature : Ta(ˆ) Power Dissipation : Pd (mW) Maximum Forward Current : IF MAX. (mA)

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˘˘1102F Surface Mount IRED/Right Angle Type 0.01 0.1 100 1 10 100 1000 0.01 0.1 1 10 100 0.1 -40 -20 0 20 40 60 80 100 Technical DataʢTANʣ Ambient Temperature vs. Relative Total Power Condition : IF = 20mA Ambient Temperature : Ta (ˆ) Relative Total Power Forward Current vs. Relative Total Power Condition : Ta = 25ˆ Forward Current : IF (mA) Pulse Forward Current vs. Relative Total Power Condition : twʽ100Жs, Dutyʽ1/100, Ta = 25ˆ Pulse Forward Current : IFRM (mA)

2009.11.15 Page 8

˘˘1102F Surface Mount IRED/Right Angle Type Technical DataʢANʣ Spatial Distribution Example Condition : Ta = 25ˆ Spectral Distribution Relative Intensity vs. Wavelength Condition : Ta = 25ˆ, IF = 20mA Wavelength [nm] Relative Intensity Forward Voltage vs. Forward Current Condition : Ta = 25ˆ Forward Voltage : VF(V) Forward Current IF(mA) Duty Ratio vs. Pulse Forward Current Condition : Ta = 25ˆ, tw ʽ 100Жs Duty Ratio Pulse Forward Current IFRM(mA) y x

2009.11.15 Page 9

˘˘1102F Surface Mount IRED/Right Angle Type Technical DataʢANʣ Ambient Temperature vs. Pulse Forward Current Condition : twʽ100Жs, Dutyʽ1/100 Ambient Temperature : Ta(ˆ) Ambient Temperature vs. Forward Current Ambient Temperature : Ta(ˆ) Forward Current : IF (mA) Ambient Temperature vs. Forward Voltage Condition : IF = 20mA Ambient Temperature : Ta (ˆ) Pulse Forward Current IFRM(mA) Forward Voltage VF(V) Pulse Forward Voltage vs. Pulse Forward Current Condition : Ta=25ˆ, twʽ100Жs, Dutyʽ1/100 Pulse Forward Voltage : VFM(V) Pulse Forward Current IFRM(mA)

2009.11.15 Page 10

˘˘1102F Surface Mount IRED/Right Angle Type Technical DataʢANʣ Forward Current vs. Relative Total Power Condition : - - Pulse, twʽ100Жs, Dutyʽ1/100, Ta = 25ˆ Forward Current : IF (mA) Ambient Temperature vs. Peak Wavelength Condition : IF = 20mA Ambient Temperature : Ta(ˆ) Peak Wavelength Еp (nm) Relative Total Power Ambient Temperature vs. Relative Total Power Condition : IF = 20mA Ambient Temperature : Ta (ˆ) Relative Total Power

2009.11.15 Page 11

˘˘1102F Surface Mount IRED/Right Angle Type Package Dimensions Recommended Soldering Pattern (Unit: mm) Taping Specification (Unit: mm) (Unit: mm) Quantity: 3,000pcs/ reel (standard) Weight: (8.5)mg

2009.11.15 Page 12

˘˘1102F Surface Mount IRED/Right Angle Type Reflow Soldering Conditions Manual Soldering Conditions Iron tip temp. Soldering time and frequency 3 s 1 time 350 ˆ (MAX.) (MAX.) (MAX.) (30 W Max.) 1) The above profile temperature gives the maximum temperature of the LED resin surface. Please set the temperature so as to avoid exceeding this range. 2) Total times of reflow soldering process shall be no more than 2 times. When the second reflow soldering process is performed, intervals between the first and second reflow should be short as possible (while allowing some time for the component to return to normal temperature after the first reflow) in order to prevent the LED from absorbing moisture. 3) Temperature fluctuation to the LED during the pre-heating process shall be minimized.

2009.11.15 Page 13

˘˘1102F Surface Mount IRED/Right Angle Type Reliability Testing Result Failure Criteria Items Symbols Conditions Failure criteria Radiant Intensity IE IF Value of each product Radiant Intensity Testing Min. Value ʻ Initial Value x 0.5 Forward Voltage VF IF Value of each product Forward Voltage Testing Max. Value ʼ Spec. Max. Value x 1.2 Reverse Current IR VR = Maximum Rated Reverse Voltage V Testing Max. Value ʾ Spec. Max. Value x 2.5 Cosmetic Appearance - - Occurrence of notable decoloration, deformation and cracking Reliability Testing Result Applicable Standard Duration Failure Room Temp. Operating Life EIAJ ED- 4701/ 100(101) 1,000 h 0/ 25 Resistance to Soldering Heat EIAJ ED- 4701/ 300(301) Twice 0/ 25 Temperature Cycling EIAJ ED- 4701/ 100(105) 5 cycles 0/ 25 Wet High Temp. Storage Life EIAJ ED- 4701/ 100(103) 1,000 h 0/ 25 High Temp. Storage Life EIAJ ED- 4701/ 200(201) 1,000 h 0/ 25 Low Temp. Storage Life EIAJ ED- 4701/ 200(202) 1,000 h 0/ 25 Vibration, Variable Frequency EIAJ ED- 4701/ 400(403) 2 h 0/ 1098.1m/ s (10G), 100 ʙ 2KHz sweep for 20min., XYZ each direction Testing Conditions Ta = 25ˆ, IF = Maxium Rated Current Minimum Rated Storage Temperature(30min) ʙNormal Temperature(15min) ʙMaximum Rated Storage Temperature(30min) ʙNormal Temperature(15min) Ta = 60ʶ2ˆ, RH = 90ʶ5% (Pretreatment) Individual standard (Reflow Soldering) Pre-heating 150ˆʙ180ˆ 120s Operating Heating 230ˆ Min. Peak temperature 260ˆ Ta = Maximum Rated Storage Temperature Ta = Minimum Rated Storage Temperature

2009.11.15 Page 14

˘˘1102F Surface Mount IRED/Right Angle Type Special Notice to Customers Using the Products and Technical Information Shown in This Data Sheet 1) The technical information shown in the data sheets are limited to the typical characteristics and circuit examples of the referenced products. It does not constitute the warranting of industrial property nor the granting of any license. 2) For the purpose of product improvement, the specifications, characteristics and technical data described in the data sheets are subject to change without prior notice. Therefore it is recommended that the most updated specifications be used in your design. 3) When using the products described in the data sheets, please adhere to the maximum ratings for operating voltage, heat dissipation characteristics, and other precautions for use. We are not responsible for any damage which may occur if these specifications are exceeded. 4) The products that have been described to this catalog are manufactured so that they will be used for the electrical instrument of the benchmark (OA equipment, telecommunications equipment, AV machine, home appliance and measuring instrument). The application of aircrafts, space borne application, transportation equipment, medical equipment and nuclear power control equipment, etc. needs a high reliability and safety, and the breakdown and the wrong operation might influence the life or the human body. Please consult us beforehand if you plan to use our product for the usages of aircrafts, space borne application, transportation equipment, medical equipment and nuclear power control equipment, etc. except OA equipment, telecommunications equipment, AV machine, home appliance and measuring instrument. 5) In order to export the products or technologies described in this data sheet which are under the “Foreign Exchange and Foreign Trade Control Law,”it is necessary to first obtain an export permit from the Japanese government. 6) No part of this data sheet may be reprinted or reproduced without prior written permission from Stanley Electric Co., Ltd. 7) The most updated edition of this data sheet can be obtained from the address below: http://www.stanley-components.com