AMMC-3040 HP | Alldatasheet

Document overview

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Technical content

Features

  • High IIP3 : +23 dBm W i d e B a n d w i d t h  RF: 18-36 GHz  LO: 18-36 GHz I F : D C - 3 G H z  Fundamental or Sub-Harmonic Mixing  Up or Down Converter  Conversion Loss: 9.5dB  P1dB : +17 dBm  Low LO Drive Power: + 2 dBm  Usable to 42 GHz

Applications

 Point-to-Point Radio  LMDS S A T C O M

AMMC-3040 DC Specifications/Physical Properties[1] AMMC-3040 RF Specifications Zo=50 Ω , Tb = 25°C, IF Output = 2 GHz, LO Input Power = +2 dBm, RF Input Power = -20 dBm, except as noted. Symbol Parameters and Test Conditions Units Min. Typ. Max. VD1, 2, 3, 4 Drain Supply Operating Voltage V 2 3.5 5 Id1 First Stage Drain Supply Current Vdd = 3.5 V, Vg1 = −0.5 V mA 50 ID2, 3, 4 T otal Drain Supply Current for Stages 2, 3 and 4 (Vdd = 3.5 V, Vgg = −0.5 V) mA 225 VG1, 2, 3, 4 Gate Supply Operating Voltages (Idd = 250 mA) V -0.5 Vp Pinch-off Voltage (Vdd = 3.5 V, Idd < 10 mA V -1.5 θch-b Thermal Resistance[2] (Backside T emp. Tb= 25°C) °C/W 49 Notes: 1. Measured in wafer form with T chuck = 25°C. (Except θch-bs.) 2. Channel-to-backside Thermal Resistance ( θch-b)=58°C/Ω at T channel (T c)=150 °C as measured using the liquid crystal method. Thermal Resistance at backside temperature (Tb)=25 °C calculated from measured data. Symbol Parameters and Test Conditions Units V dd =3.5 V, I dd =250 mA V dd =4.5 V, I dd =150 mA Ty p. Max. Typ . Lc Conversion Loss, Down Conversion [1] dB 9.5 12 10 Lc Conversion Loss, Up Conversion [2] dB 10 10.5 ISOL L-R LO - RF Isolation at RF Frequency = 22 GHz [3] dB 31 32 P−1 dB Input Power at 1 dB Conversion Loss Compression, Down Conversion dBm 17 17 IIP3 Input 3 rd Order Intercept Point, Down Conversion at RF Frequency = 22 GHz [4] dBm 23 22 Notes: 1. 100% on-wafer RF test ing is done at RF frequency = 18, 22, and 32 GHz. 2. IF Input = 2 GHz, IF Input Power = -20 dBm, RF freq = LO + IF 3. Does not include LO amplifier gain of ~20 dB. 4. ∆f = 2 MHz, RF Input Power = -5 dBm.

Zo=50 Ω , Tb = 25°C, IF = 2 GHz, LO Input Power = +2 dBm, RF Input Power = -20 dBm, except as noted. Figure 1. Conversion Loss, UpConversion. Figure 2. Conversion Loss, Down Conversion. Figure 3. Conversion Loss, Up Conversion. Figure 4. Conversion Loss, Down Conversion. Figure 5. Conversion Loss Vs. LO Input Power, Up Figure 6. Conversion Loss Vs. LO Input Power, Figure 7. Input Power at 1 dB Conversion Loss Compression, Down Conversion. Figure 8. Input Power at 1 dB Conversion Loss Figure 9. Input Power at 1 dB Conversion Loss Compression, Down Conversion.

23 GHz

35 GHz

distributors, please go to our web site. Copyright  2004 Agilent T echnologies, Inc. as the circuit surrounding it. Figure 15. Note that all RF high end of the frequency range. attachment to the bond pads. dB for a duration of 76 ± 8 mS. should be handled with care. precautions should be taken.

  1. Ablebond 84-1 LM1 silver epoxy is
  2. Buckbee-Mears Corporation, St. Paul, MN,