AMLPF16080G9DM1T76 WALSIN | Alldatasheet
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Page 1 of 6 ASC_AMLPF16080G9DM1T76_V02 Jul. 2018 AMLPF Series – 1608(0603)- RoHS Compliance MULTILAYER CERAMIC LOW PASS FILTER Halogens Free Product 698 ~ 960 MHz Working Frequency Automotive Qualified to AEC-Q200 P/N: AMLPF16080G9DM1T76 *Contents in this sheet are subject to change without prior notice.
Page 2 of 6 ASC_AMLPF16080G9DM1T76_V02 Jul. 2018
FEATURES
- Miniature footprint: 1.6 X 0.8 X 0.6 mm3 2. Low Insertion loss 3. High attenuation on harmonic suppressed 4. LTCC process
APPLICATIONS
- For 698 ~ 960 MHz Working Frequency CONSTRUCTION Top view DIMENSIONS Figure Symbol Dimension (mm) L 1.60 ± 0.15 W 0.80 ± 0.15 T 0.60 ± 0.10 A 0.175 ± 0.15 B 0.25 ± 0.15 C 0.25 ± 0.15 D 0.50 ± 0.15 E 0.20 ± 0.15 PIN Connection PIN Connection
1 GND 4 GND
2 I/O 5 I/O
3 GND 6 GND
Top view Bottom view Side view
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ELECTRICAL CHARACTERISTICS
AMLPF16080G9DM1T76 Specification Frequency range 698~960 MHz Insertion Loss 0.7 dB max. at +25 ℃ 1.0 dB max. at -55℃ ~ +125℃ Attenuation 25 dB min. @ 1554 ~ 1610 MHz 30 dB min. @ 1805 ~ 1830 MHz 30 dB min. @ 2110 ~ 2170 MHz 30 dB min. @ 1710 ~ 2700 MHz VSWR 2.0 max. Impedance 50 Ω Moisture sensitivity levels LEVEL 1 (Refer to : IPC/JEDEC J-STD-020) Operating & Storage Condition (Component) Operation Temperature Range: -55℃ ~ +125℃ Storage Temperature Range: -55℃ ~ +125℃ Storage Condition before Soldering (Included packaging material) Storage Temperature Range: +5 ~ +40 ℃ Humidity: 30 to 70% relative humidity Typical Electrical Chart LAND PATTERN Figure Unit: mm Line width to be designed to match 50 Ω characteristic impedance, depending on PCB material and thickness.
Page 4 of 6 ASC_AMLPF16080G9DM1T76_V02 Jul. 2018 RELIABILITY TEST TEST PROCEDURE / TEST METHOD REQUIREMENT Resistance to soldering heat (R.S.H) MIL-STD-202 method 210 Un-mounted chips completely immersed for 10±1second in a SAC solder bath at 270℃±5ºC No mechanical damage. Electrical specification shall satisfy the descriptions in electrical characteristics under the operational temperature range within -55 ~ 125°C. Loss of metallization on the edges of each electrode shall not exceed 25 Solderability J-STD-002 * Condition A Un-mounted chips 4hrs / 155C*dry then completely immersed for 50.5 sec in solder bath at 2355C. * Condition B Un-mounted chips steam 8 hrs then completely immersed for 101 sec. in solder bath at 260+0/-5C.. All terminations shall exhibit a continuous solder coating free from defects from a minimum of 95% of the critical surface area of any individual termination. Temperature cycling JESD22 method JA-104 1000 cycles, -55℃ ~ +125℃, dwell time 30min No mechanical damage. Electrical specification shall satisfy the descriptions in electrical characteristics under the operational temperature range within -55 ~ 125°C. Humidity MIL-STD-202 method 103 1000+48/-0 hours; 85C, 85% RH No mechanical damage. Electrical specification shall satisfy the descriptions in electrical characteristics under the operational temperature range within -55 ~ 125°C. High Temperature Exposure MIL-STD-202 method 108 1000+48/-0 hours; without load in a temperature chamber controlled 125±3°C No mechanical damage. Electrical specification shall satisfy the descriptions in electrical characteristics under the operational temperature range within -55 ~ 125°C. Mechanical Shock MIL-STD-202 method 213 1/2 Sine Pulse / 100g Peak / Velocity 12.3ft/sec No mechanical damage. Electrical specification shall satisfy the descriptions in electrical characteristics under the operational temperature range within -55 ~ 125°C. Board Flex AEC-Q200-005 RF component mounted on a 90mm glass epoxy resin PCB(FR4), bending once 2mm for 60sec No mechanical damage. Electrical specification shall satisfy the descriptions in electrical characteri stics under the operational temperature range within -55 ~ 125°C. Terminal strength AEC-Q200-006 Pressurizing force: 1.8Kg, Test time: 60±1sec. Only 0402 for 1.0kg/60sec No remarkable damage or removal of the terminations Vibration MIL-STD-202 method 204 Test 5g’s for 20min., 12 cycles each of 3 orientations No mechanical damage. Electrical specification shall satisfy the descriptions in electrical characteristics under the operational temperature range within -55 ~ 125°C. ESD AEC-Q200-002 Test contact 1.0KV ( 0.5KV for 1005 only) No mechanical damage. Electrical specification shall satisfy the descriptions in electrical characteristics under the operational temperature range within -55 ~ 125°C.
Page 5 of 6 ASC_AMLPF16080G9DM1T76_V02 Jul. 2018 SOLDERING CONDITION Typical examples of soldering processes that provide reliable joints without any damage are given in Fig 2, Fig 2. Infrared soldering profile ORDERING CODE AM LPF 1608 0G9 D M1T76 Walsin Automotive device Product Code DIP : Diplexer Dimension code Per 2 digits of Length, Width, Thickness : e.g. : 1608 = Length 16, Width 08, Thickness 06 Application 0G9: 0.9 GHz Application D: GSM900 / DCS1800 Specification Design Code Minimum Ordering Quantity: 4000 pcs per reel. PACKAGING Paper Tape specifications (unit :mm) Index Ao Bo D T W Index E F Po P1 P2
Page 6 of 6 ASC_AMLPF16080G9DM1T76_V02 Jul. 2018 Reel dimensions A B C Taping Quantity:4000 pieces per 7” reel CAUTION OF HANDLING Limitation of Applications Please contact us before using our products for the applications listed below which require especially high reliability for the prevention of defects, which might directly cause damage to the third party’s life, body or property. (1) Aircraft equipment (2) Aerospace equipment (3) Undersea equipment (4) Medical equipment (5) Disaster prevention / crime prevention equipment (6) Traffic signal equipment (7) Transportation equipment (vehicles, trains, ships, etc.) (8) Applications of similar complexity and /or reliability requirements to the applications listed in the above. Storage condition (1) Products should be used in 6 months from the day of WALSIN outgoing inspection . (2) Storage environment condition. Products should be storage in the warehouse on the following conditions. Temperature : +5 to +40℃ Humidity : 30 to 70% relative humidity Don’t keep products in corrosive gases such as sulfur. Ch lorine gas or acid or it may cause oxidizat ion of electrode, resulting in poor solderability. Products should be storage on the palette for the prevention of the influence from humidity, dust and son on. Products should be storage in the warehouse without heat shock, vibration, direct sunlight and so on. Products should be storage under the airtight packaged condition. Index A B C Dimension (mm) Φ178.0 Φ60.0 Φ13.0