AMK042BJ473MC

HMK432B7225KM-T TAIYO-YUDEN | Alldatasheet

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notice_e-01 Notice for TAIYO YUDEN products Please read this notice before using the TAIYO YUDEN products. REMINDERS ■ Product information in this catalog is as of October 2011. All of the contents speciﬁed herein are subject to change wi thout notice due to technical improvements, etc. Therefore, please check for the latest information carefully be - for e practical application or usage of the Products. P lease note that Taiyo Yuden Co., Ltd. shall not be responsible for any defects in products or equipment incorpo - ra ting such products, which are caused under the conditions other than those speciﬁed in this catalog or individual sp eciﬁcation. ■ Please contact Taiyo Yuden Co., Ltd. for further details of product speciﬁcations as the individual speciﬁcation is av ailable. ■ Please conduct validation and veriﬁcation of products in actual condition of mounting and operating environment be fore commercial shipment of the equipment. All electronic components or functional modules listed in this catalog are developed, designed and intended for us e in general electronics equipment.(for AV, office automation, household, office supply, information service, te lecommunications, ( such as mobile phone or PC) etc.). Before incorporating the components or devices into any equipment in the ﬁeld such as transportation,( automotive control, train control, ship control), transportation signal, di saster prevention, medical, public information network (telephone exchange, base station) etc. which may have di rect inﬂuence to harm or injure a human body, please contact Taiyo Yuden Co., Ltd. for more detail in advance. D o not incorporate the products into any equipment in ﬁelds such as aerospace, aviation, nuclear control, subma - ri ne system, military, etc. where higher safety and reliability are especially required. I n addition, even electronic components or functional modules that are used for the general electronic equipment, if the equipment or the electric circuit require high safety or reliability function or performances, a sufﬁcient reliabil - it y evaluation check for safety shall be performed before commercial shipment and moreover, due consideration to in stall a protective circuit is strongly recommended at customer's design stage. The contents of this catalog are applicable to the products which are purchased from our sales ofﬁces or distribu - to rs (so called “TA IYO YUDEN’s ofﬁcial sales channel ”). It is only applicable to the products purchased from any of TAIYO YUDEN ’ s of ﬁcial sales channel. ■ Please note that Taiyo Yuden Co., Ltd. shall have no responsibility for any controversies or disputes that may oc - cu r in connection with a third party's intellectual property rights and other related rights arising from your usage of pr oducts in this catalog. Taiyo Yuden Co., Ltd. grants no license for such rights. Caution for export C ertain items in this catalog may require speciﬁc procedures for export according to “Fo reign Exchange and For - eign Trade Control Law ” o f Japan, “U.S. Export Administration Regulations ”, and other applicable regulations. Should you have any question or inquiry on this matter, please contact our sales staff.

4 mlcc01_e-01 ■ FEATURES ■ PART NUMBER ■ STANDARD EXTERNAL DIMENSIONS/STANDARD QUANTITY ■ APPLICATIONS ＊ This catalog contains the typical speciﬁcation only due to the limitation of space. When you consider the purchase of our products, please check our speciﬁcation. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs. ◦ Improved higher density mounting.（042 to 105 type） ◦ Mo nolithic structure provides higher reliability. ◦ A wi de range of capacitance values available in standard case sizes. ◦ Th e use of nickel as electrode material and plating processing im - pr ove the solderability and heat resistance characteristics. It also pr events migration and raises the level of reliability. ◦ Lo w equivalent series resistance(ESR) provides superior noise ab - so rption characteristics. ◦ Co mpared to tantalum or aluminum electrolytic capacitors, multilayer ce ramic capacitors offer a number of superior features, including: H igher permissible ripple current values S maller case sizes with high rated voltage I mproved reliability due to higher insulation resistance and breakdown voltage. ◦ Communication e q uipment （cellular phone, wireless applications, etc. ） ◦ Ge neral digital circuit ◦ Po wer supply bypass capacitors L iquid crystal modules L iquid crystal drive voltage lines L SI, IC, converters(both for input and output) ◦ Sm oothing capacitors D C-DC converters (for both input and output) S witching po wer supplies (secondary side) HIGH VALUE MULTILAYER CERAMIC CAPACITORS(HIGH DIELECTRIC TYPE) REFLOWWAVE Type Dimension [mm] Standard quantity [pcs] L W T e Pa per tape Em bossed tape □MK 042 □MK063 □MK105 0.2±0.02 C 0.25±0.10 20000 － 0.3±0.03 P 15000 － 0.5±0.05 V 10000 － □MK107 □MK212 0.45±0.05 K 1.25±0.10 G — 3000 □MK316 0.85±0.10 D 0.5＋0.35/－0.25 4000 — 1.25±0.10 G — 3000 1.6±0.20 L 2000 □MK325 0.85±0.10 D 1.9＋0.1/－0.2 Y ❷Series name M ❸End termination K Plated ❶Rated voltage 〔VDC〕 A 4 J 6.3 L 10 E 16 T 25 G 35 U 50 ⓫Packaging F φ178mm Taping （2m m pitch） W φ178 mm Taping mm pitch, 042 Ty pe） T φ178mm Taping （4mm pitch） Al l types P φ178mm Taping （4mm pitch, 00pcs/reel ） 1210Type Th ickness：M ⓬Internal code △ Standard △＝Blank space ❿Special code － Standard Thickness 〔mm〕 C 0.2 P 0.3 V 0.5 K 0.45 A 0.8 D 0.85 G 1.25 L 1.6 N 1.9 Y 2.0max M 2.5 ❼Nominal capacitance〔pF〕 example 473 47,000 105 1,000,000 ❽Capacitance tolerance K ±10％ M ±20％ Z ＋80 －20％ ❻Temperature characteristics code BJ B X5R B7 X7R △F F Y5V △＝Blank space ❹Dimension 42 （01005） 0.4×0.2 063 （0201） 0.6×0.3 105 （0402） 1.0×0.5 107 （0603） 1.6×0.8 316 （1206） 3.2×1.6 325 （1210） 3.2×2.5 J M K 3 1 6 △ B J 1 0 6 M L － T △ ❶ ❷ ❸ ❹ ❺ ❻ ❼ ❽ ❾ ❿ ⓫ ⓬ ❺Dimension tolerance ［mm］ Code Type L W T △ ALL Standard Standard Standard A 0.45±0.05 0.85±0.1 1.25＋0.15/－0.05 1.6±0.2 B 0.8＋0.2/－0 1.25＋0.2/－0 △＝Blank space

5mlcc01_e-01 ＊ This catalog contains the typical speciﬁcation only due to the limitation of space. When you consider the purchase of our products, please check our speciﬁcation. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs. ■ AVAILABLE CAPACITANCE RANGE Temp.char.Code Temperature characteristics Capacitance tolerance 〔％〕Applicable standard Temperature range〔℃ 〕 Ref. Temp.〔℃ 〕 Capacitance change〔％〕 BJ JIS B －25～＋85 20 ±10 ±10（K ） B7 EIA X7R －55～＋125 25 ±15 F JIS F －25～＋85 20 ＋30/－80 ＋8 0 －20 EIA Y5V －30～＋85 25 ＋22/－82

Low Proﬁle Multilayer Ceramic Capacitors Cap 〔μF〕 Type 107 212 316 325 B/X5R X7R B/X5R F/Y5V X7R B/X5R F/Y5V B/X5R 〔3-digit 〕 0.1 104 D 0.22 224 D D 0.33 334 0.47 474 D D D 0.68 684 1 105 K K K K D D D D D D D D D 2.2 225 K K D D D D D D D D D D D 3.3 335 G D 4.7 475 K K D D D D. K D.K D D D D D D D 6.8 685 G D 10 106 D D D.K D D D D D D D D D 22 226 D D D D D D D 47 476 D D Note：Letters in t he table indicate product thickness. ■■ X5R only No te：Letters in t he table indicate product thickness. ■■ X5R only Cap 〔μF〕 Type 107 212 316 325 X7R B/X5R F/Y5V X7R B/X5R F/Y5V X7R B/X5R F/Y5V X7R B/X5R F/Y5V 〔3-digit 〕 0.1 104 A G G 0.15 154 0.22 224 A A A A A A A A G G L 0.33 334 0.47 474 A A A A A A A A A A A G G G L 0.68 684 1 105 A A A A A A A A A A A A G G G G G G G L L L 2.2 225 A A A A A A A G G G G G G G G L L L L L L N 3.3 335 N N 4.7 475 A A A G G G G G G G G L L L L L L M.N N N M.N N N N 6.8 685 10 106 A A A G G G G G G G G G L L L L L L L L L L L M M.N N N M N M.N N N 22 226 A G G L L L L L M M M M.Y Y N N 47 476 G L L M M M.Y M M.N N 100 107 L L M M.Y Cap ［pF］ Type 042 063 105 X7R B/X5R X7R B/X5R X7R B/X5R F/Y5V 100 101 C C P P 150 151 C C P P 220 221 C C P P V V 330 331 C C P P V V 470 471 C C P P V V 680 681 C C P P V V 1000 102 C C P P V V 1500 152 C C P P P V V V 2200 222 C C P P P V V V 3300 332 C C P P P V V V 4700 472 C C P P P V V V 6800 682 C C P P P V V V 10000 103 C C P P P V V V V 15000 153 V V 22000 223 C P P V V V V V 33000 333 P P V V 47000 473 C P P V V V V V 68000 683 P P V 100000 104 C P P P V V V V V V V 220000 224 P P P V V V V V V V V 330000 334 P 470000 474 P V V V V 1000000 105 P V V V V V 2200000 225 V V 3300000 335 V 4700000 475 V V Note：Letters i n t he table indicate product thickness. ■■ X5R only Cap ［pF］ Type 105 B/X5R VDC 25 16 10 6.3〔3-digit〕 100 101 150 151 220 221 330 331 470 471 680 681 1000 102 1500 152 2200 222 3300 332 4700 472 6800 682 10000 103 P 15000 153 22000 223 33000 333 47000 473 68000 683 100000 104 P C 220000 224 P C 330000 334 470000 474 P P C 1000000 105 P 2200000 225 3300000 335 4700000 475
Multilayer Ceramic Capacitors

6 mlcc01_e-01 ■ REPRESENTATIVE PART NUMBERS ＊ This catalog contains the typical speciﬁcation only due to the limitation of space. When you consider the purchase of our products, please check our speciﬁcation. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.

042TYPE（01005 case size）
06 3TYPE（0201 case size）【Temperature Ch aracteristic BJ:B/X5R 】・0.2mm th ickness（C）【Temperature C h aracteristic BJ:B/X5R 】・0.3mm th ickness（P）【Temperature Ch aracteristic B7 ：X7R】・0.2mm th ickness（C） Rated voltage Part number 1 Pa rt number 2 Te mp. char. Capacitance 〔pF〕 Capacitance tolerance tanδ 〔%〕 Thickness 〔mm〕 Soldering R:Reﬂow W:Wave HALT Internal code （P/N 1） No te% Rated vo ltage 10V LMK042 BJ101□C B/ X5R* 100 ±10, ±20 5 0 .2±0.02 R 200% LMK042 BJ151□C B/ X5R* 150 ±10, ±20 5 0 .2±0.02 R 200% LMK042 BJ221□C B/ X5R* 220 ±10, ±20 5 0 .2±0.02 R 200% LMK042 BJ331□C B/ X5R* 330 ±10, ±20 5 0 .2±0.02 R 200% LMK042 BJ471□C B/ X5R* 470 ±10, ±20 5 0 .2±0.02 R 200% LMK042 BJ681□C B/ X5R* 680 ±10, ±20 5 0 .2±0.02 R 200% LMK042 BJ102□C B/ X5R* 1000 ±10, ±20 5 0 .2±0.02 R 200% LMK042 BJ152□C X5 R 1500 ±10, ±20 1 0 0.2±0.02 R 150% LMK042 BJ222□C X5 R 2200 ±10, ±20 1 0 0.2±0.02 R 150% LMK042 BJ332 □C X5 R 3300 ±10, ±20 1 0 0.2±0.02 R 150% LMK042 BJ472□C X5 R 4700 ±10, ±20 1 0 0.2±0.02 R 150% LMK042 BJ682 □C X5 R 6800 ±10, ±20 1 0 0.2±0.02 R 150% LMK042 BJ103□C X5 R 10000 ±10, ±20 1 0 0.2±0.02 R 150% 6.3V JMK042 BJ152□C B/ X5R* 1500 ±10, ±20 1 0 0.2±0.02 R 150% JMK042 BJ222□C B/ X5R* 2200 ±10, ±20 1 0 0.2±0.02 R 150% JMK042 BJ332 □C B/ X5R* 3300 ±10, ±20 1 0 0.2±0.02 R 150% JMK042 BJ472□C B/ X5R* 4700 ±10, ±20 1 0 0.2±0.02 R 150% JMK042 BJ682 □C B/ X5R* 6800 ±10, ±20 1 0 0.2±0.02 R 150% JMK042 BJ103□C B/ X5R* 10000 ±10, ±20 1 0 0.2±0.02 R 150% JMK042 BJ223□C X5 R 22000 ±10, ±20 1 0 0.2±0.02 R 150% 4V AMK042 BJ473MC X5 R 47000 ±20 10 0.2±0.02 R 150% AMK042 BJ104MC X5 R 100000 ±20 10 0.2±0.02 R 150% Capacitance tolerance code is applied to □ of part number. *1 We may provide X7S/X7R for some items according to the individual speciﬁcation. Rated voltage Part number 1 Pa rt number 2 Te mp. char. Capacitance 〔pF〕 Capacitance tolerance tanδ 〔%〕 Thickness 〔mm〕 Soldering R:Reﬂow W:Wave HALT Internal code （P/N 1） No te% Rated vo ltage 10V LMK042 B7101□C X7 R 100 ±10, ±20 5 0 .2±0.02 R 200% LMK042 B7151□C X7 R 150 ±10, ±20 5 0 .2±0.02 R 200% LMK042 B7221□C X7 R 220 ±10, ±20 5 0 .2±0.02 R 200% LMK042 B7331□C X7 R 330 ±10, ±20 5 0 .2±0.02 R 200% LMK042 B7471□C X7 R 470 ±10, ±20 5 0 .2±0.02 R 200% LMK042 B7681□C X7 R 680 ±10, ±20 5 0 .2±0.02 R 200% LMK042 B7102□C X7 R 1000 ±10, ±20 5 0 .2±0.02 R 200% Capacitance tolerance code is applied to □ of part number. Rated voltage Part number 1 Pa rt number 2 Te mp. char. Capacitance 〔pF〕 Capacitance tolerance tanδ 〔%〕 Thickness 〔mm〕 Soldering R:Reﬂow W:Wave HALT Internal code （P/N 1） No te% Rated vo ltage 25V TMK063 BJ101□P B/ X5R* 100 ±10, ±20 3 .5 0.3±0.03 R 200% TMK063 BJ151□P B/ X5R* 150 ±10, ±20 3 .5 0.3±0.03 R 200% TMK063 BJ221□P B/ X5R* 220 ±10, ±20 3 .5 0.3±0.03 R 200% TMK063 BJ331□P B/ X5R* 330 ±10, ±20 3 .5 0.3±0.03 R 200% TMK063 BJ471□P B/ X5R* 470 ±10, ±20 3 .5 0.3±0.03 R 200% TMK063 BJ681 □P B/ X5R* 680 ±10, ±20 3 .5 0.3±0.03 R 200% TMK063 BJ102□P B/ X5R* 1000 ±10, ±20 3 .5 0.3±0.03 R 200% TMK063 BJ152□P B/ X5R 1500 ±10, ±20 5 0 .3±0.03 R 200% TMK063 BJ222 □P B/ X5R 2200 ±10, ±20 5 0 .3±0.03 R 200% TMK063 BJ332 □P B/ X5R 3300 ±10, ±20 5 0 .3±0.03 R 200% TMK063 BJ472 □P B/ X5R 4700 ±10, ±20 5 0 .3±0.03 R 200% TMK063 BJ682 □P B/ X5R 6800 ±10, ±20 5 0 .3±0.03 R 200% TMK063 BJ103 □P B/ X5R 10000 ±10, ±20 5 0 .3±0.03 R 200% 16V EMK063 BJ152□P B/ X5R* 1500 ±10, ±20 5 0 .3±0.03 R 200% EMK063 BJ222 □P B/ X5R* 2200 ±10, ±20 5 0 .3±0.03 R 200% EMK063 BJ332 □P B/ X5R* 3300 ±10, ±20 5 0 .3±0.03 R 200% EMK063 BJ472□P B/ X5R* 4700 ±10, ±20 5 0 .3±0.03 R 200% EMK063 BJ682 □P B/ X5R* 6800 ±10, ±20 5 0 .3±0.03 R 200% EMK063 BJ103 □P B/ X5R* 10000 ±10, ±20 5 0 .3±0.03 R 200% EMK063 BJ104□P X5 R 100000 ±10, ±20 1 0 0.3±0.03 R 150% 10V LMK063 BJ223 □P B/ X5R 22000 ±10, ±20 7 .5 0.3±0.03 R 150% LMK063 BJ333 □P X5 R 33000 ±10, ±20 7 .5 0.3±0.03 R 150% LMK063 BJ473 □P X5 R 47000 ±10, ±20 7 .5 0.3±0.03 R 150% LMK063 BJ683 □P X5 R 68000 ±10, ±20 1 0 0.3±0.03 R 150% LMK063 BJ104□P X5 R 100000 ±10, ±20 1 0 0.3±0.03 R 150% LMK063 BJ224 □P X5 R 220000 ±10, ±20 1 0 0.3±0.03 R 150% 6.3V JMK063 BJ223 □P B/ X5R 22000 ±10, ±20 7 .5 0.3±0.03 R 200% JMK063 BJ333 □P X5 R 33000 ±10, ±20 7 .5 0.3±0.03 R 150% JMK063 BJ473 □P X5 R 47000 ±10, ±20 7.5 0.3±0.03 R 150% JMK063 BJ683 □P X5 R 68000 ±10, ±20 1 0 0.3±0.03 R 150% JMK063 BJ104□P X5 R 100000 ±10, ±20 1 0 0.3±0.03 R 150% JMK063 BJ224 □P X5 R 220000 ±10, ±20 1 0 0.3±0.03 R 150% 4V AMK063 BJ224 □P X5 R 220000 ±10, ±20 1 0 0.3±0.03 R 150% AMK063 BJ334MP X5 R 330000 ±20 10 0.3±0.03 R 150% *2 AMK063 BJ474MP X5R 470000 ±20 10 0.3±0.03 R 150% AMK063ABJ105MP X5 R 1000000 ±20 10 0.3±0.05 R 150% Capacitance tolerance code is applied to □ of part number. *1 We may provide X7R for some items according to the individual speciﬁcation. *2 The exchange of individual speciﬁcation is necessary depending on the application and circuit condition. Please contact Taiyo Y uden sales channels.

7mlcc01_e-01 ■ REPRESENTATIVE PART NUMBERS ＊ This catalog contains the typical speciﬁcation only due to the limitation of space. When you consider the purchase of our products, please check our speciﬁcation. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.

105TYPE（0402 case size）【Temperature Ch aracteristic BJ:B/X5R 】・0.5mm thickness（V） emperature C h aracteristic B7 ：X7R】・0.3mm thickness（P） Rated voltage Part number 1 Pa rt number 2 Te mp. char. Capacitance 〔pF〕 Capacitance tolerance tanδ 〔%〕 Thickness 〔mm〕 Soldering R:Reﬂow W:Wave HALT Internal code （P/N 1） No te% Rated vo ltage 25V TMK063 B7101□P X7 R 100 ±10, ±20 3 .5 0.3±0.03 R 200% TMK063 B7151□P X7 R 150 ±10, ±20 3 .5 0.3±0.03 R 200% TMK063 B7221□P X7 R 220 ±10, ±20 3 .5 0.3±0.03 R 200% TMK063 B7331□P X7 R 330 ±10, ±20 3 .5 0.3±0.03 R 200% TMK063 B7471□P X7 R 470 ±10, ±20 3 .5 0.3±0.03 R 200% TMK063 B7681□P X7 R 680 ±10, ±20 3 .5 0.3±0.03 R 200% TMK063 B7102□P X7 R 1000 ±10, ±20 3 .5 0.3±0.03 R 200% 16V EMK063 B7152□P X7 R 1500 ±10, ±20 5 0 .3±0.03 R 200% EMK063 B7222□P X7 R 2200 ±10, ±20 5 0 .3±0.03 R 200% EMK063 B7332 □P X7 R 3300 ±10, ±20 5 0 .3±0.03 R 200% EMK063 B7472□P X7 R 4700 ±10, ±20 5 0 .3±0.03 R 200% EMK063 B7682□P X7 R 6800 ±10, ±20 5 0 .3±0.03 R 200% EMK063 B7103□P X7 R 10000 ±10, ±20 5 0 .3±0.03 R 200% Capacitance tolerance code is applied to □ of part number. Rated voltage Part number 1 Pa rt number 2 Te mp. char. Capacitance 〔pF〕 Capacitance tolerance tanδ 〔%〕 Thickness 〔mm〕 Soldering R:Reﬂow W:Wave HALT Internal code （P/N 1） No te% Rated vo ltage 50V UMK105 BJ221□V B/ X5R* 220 ±10, ±20 2 .5 0.5±0.05 R 200% UMK105 BJ331□V B/ X5R* 330 ±10, ±20 2 .5 0.5±0.05 R 200% UMK105 BJ471□V B/ X5R* 470 ±10, ±20 2 .5 0.5±0.05 R 200% UMK105 BJ681□V B/ X5R* 680 ±10, ±20 2 .5 0.5±0.05 R 200% UMK105 BJ102□V B/ X5R* 1000 ±10, ±20 2 .5 0.5±0.05 R 200% UMK105 BJ152□V B/ X5R* 1500 ±10, ±20 2 .5 0.5±0.05 R 200% UMK105 BJ222□V B/ X5R* 2200 ±10, ±20 2 .5 0.5±0.05 R 200% UMK105 BJ332□V B/ X5R* 3300 ±10, ±20 2 .5 0.5±0.05 R 200% UMK105 BJ472□V B/ X5R* 4700 ±10, ±20 2 .5 0.5±0.05 R 200% UMK105 BJ682□V B/ X5R* 6800 ±10, ±20 2 .5 0.5±0.05 R 150% UMK105 BJ103□V B/ X5R* 10000 ±10, ±20 3 .5 0.5±0.05 R 200% 35V GMK105 BJ104□V B/ X5R 100000 ±10, ±20 5 0 .5±0.05 R 150% 25V TMK105 BJ153□V B/X5R* 15000 ±10, ±20 3 .5 0.5±0.05 R 200% TMK105 BJ223□V B/ X5R* 22000 ±10, ±20 3 .5 0.5±0.05 R 200% TMK105 BJ333 □V B/ X5R* 33000 ±10, ±20 3 .5 0.5±0.05 R 150% TMK105 BJ473□V B/ X5R* 47000 ±10, ±20 3 .5 0.5±0.05 R 150% TMK105 BJ104□V B/ X5R 100000 ±10, ±20 5 0 .5±0.05 R 150% TMK105 BJ105□V X5 R 1000000 ±10, ±20 1 0 0.5±0.05 R 150% 16V EMK105 BJ153□V B/ X5R* 15000 ±10, ±20 3 .5 0.5±0.05 R 200% EMK105 BJ223□V B/ X5R* 22000 ±10, ±20 3 .5 0.5±0.05 R 200% EMK105 BJ333□V B/ X5R* 33000 ±10, ±20 3 .5 0.5±0.05 R 200% EMK105 BJ473□V B/ X5R* 47000 ±10, ±20 3 .5 0.5±0.05 R 200% EMK105 BJ683 □V B/ X5R 68000 ±10, ±20 5 0 .5±0.05 R 200% EMK105 BJ104□V B/ X5R* 100000 ±10, ±20 5 0 .5±0.05 R 150% EMK105 BJ224□V B/ X5R 220000 ±10, ±20 5 0 .5±0.05 R 150% EMK105 BJ105□V X5 R 1000000 ±10, ±20 1 0 0.5±0.05 R 150% 10V LMK105 BJ104□V B/ X5R 100000 ±10, ±20 5 0 .5±0.05 R 200% LMK105 BJ224□V B/ X5R 220000 ±10, ±20 5 0.5±0.05 R 150% LMK105 BJ474□V X5 R 470000 ±10, ±20 1 0 0.5±0.05 R 150% LMK105 BJ105□V X5 R 1000000 ±10, ±20 1 0 0.5±0.05 R 150% LMK105 BJ225MV X5 R 2200000 ±20 10 0.5±0.05 R 150% 6.3V JMK105 BJ224□V B/ X5R 220000 ±10, ±20 5 0 .5±0.05 R 150% JMK105 BJ474□V X5 R 470000 ±10, ±20 1 0 0.5±0.05 R 150% JMK105 BJ105□V X5 R 1000000 ±10, ±20 1 0 0.5±0.05 R 150% JMK105 BJ225MV X5 R 2200000 ±20 10 0.5±0.05 R 150% JMK105 BJ475MV JM K105BBJ475MV X5R 4700000 ±20 10 0.5＋0.15/－0.05 R 150% D 4V AMK105 BJ335MV X5 R 3300000 ±20 10 0.5±0.05 R 150% *2 AMK105 BJ475MV AMK105ABJ475MV X5R 4700000 ±20 10 0.5±0.1 R 150% Capacitance tolerance code is applied to □ of part number. *1 We may provide X7R for some items according to the individual speciﬁcation. *2 The exchange of individual speciﬁcation is necessary depending on the application and circuit condition. Please contact Taiyo Y uden sales channels.

8 mlcc01_e-01 ■ REPRESENTATIVE PART NUMBERS ＊ This catalog contains the typical speciﬁcation only due to the limitation of space. When you consider the purchase of our products, please check our speciﬁcation. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs. 【Temperature Characteristic B7:X7R 】・0.5mm thickness（V） emperature C h aracteristic F:Y5V 】・0.5mm thickness（V） .3mm thickness（P） .2mm thickness（C） Rated voltage Part number 1 Pa rt number 2 Te mp. char. Capacitance 〔pF〕 Capacitance tolerance tanδ 〔%〕 Thickness 〔mm〕 Soldering R:Reﬂow W:Wave HALT Internal code （P/N 1） No te% Rated vo ltage 25V TMK105 BJ103□P B/ X5R 10000 ±10, ±20 5 0 .3±0.03 R 150% TMK105 BJ104□P X5 R 100000 ±10, ±20 1 0 0.3±0.03 R 150% TMK105 BJ224□P X5 R 220000 ±10, ±20 1 0 0.3±0.03 R 150% TMK105 BJ474□P X5 R 470000 ±10, ±20 1 0 0.3±0.03 R 150% 16V EMK105 BJ474□P X5 R 470000 ±10, ±20 1 0 0.3±0.03 R 150% 6.3V JMK105 BJ105□P X5 R 1000000 ±10, ±20 1 0 0.3±0.03 R 150% Rated voltage Part number 1 Pa rt number 2 Te mp. char. Capacitance 〔pF〕 Capacitance tolerance tanδ 〔%〕 Thickness 〔mm〕 Soldering R:Reﬂow W:Wave HALT Internal code （P/N 1） No te% Rated vo ltage 10V LMK105 BJ104□C X5 R 100000 ±10, ±20 1 0 0.2±0.02 R 150% 6.3V JMK105 BJ224□C X5 R 220000 ±10, ±20 1 0 0.2±0.02 R 150% JMK105 BJ474□C X5 R 470000 ±10, ±20 1 0 0.2±0.02 R 150% Capacitance tolerance code is applied to □ of part number. Rated voltage Part number 1 Pa rt number 2 Te mp. char. Capacitance 〔pF〕 Capacitance tolerance tanδ 〔%〕 Thickness 〔mm〕 Soldering R:Reﬂow W:Wave HALT Internal code （P/N 1） No te% Rated vo ltage 50V UMK105 B7221□V X7 R 220 ±10, ±20 2 .5 0.5±0.05 R 200% UMK105 B7331□V X7 R 330 ±10, ±20 2 .5 0.5±0.05 R 200% UMK105 B7471□V X7 R 470 ±10, ±20 2 .5 0.5±0.05 R 200% UMK105 B7681□V X7 R 680 ±10, ±20 2 .5 0.5±0.05 R 200% UMK105 B7102□V X7 R 1000 ±10, ±20 2 .5 0.5±0.05 R 200% UMK105 B7152□V X7 R 1500 ±10, ±20 2 .5 0.5±0.05 R 200% UMK105 B7222□V X7 R 2200 ±10, ±20 2 .5 0.5±0.05 R 200% UMK105 B7332□V X7 R 3300 ±10, ±20 2 .5 0.5±0.05 R 200% UMK105 B7472□V X7 R 4700 ±10, ±20 2 .5 0.5±0.05 R 150% UMK105 B7682□V X7 R 6800 ±10, ±20 2 .5 0.5±0.05 R 150% UMK105 B7103□V X7 R 10000 ±10, ±20 3 .5 0.5±0.05 R 150% 25V TMK105 B7152□V X7 R 1500 ±10, ±20 2 .5 0.5±0.05 R 200% TMK105 B7222□V X7 R 2200 ±10, ±20 2 .5 0.5±0.05 R 200% TMK105 B7332□V X7 R 3300 ±10, ±20 2.5 0.5±0.05 R 200% TMK105 B7472□V X7 R 4700 ±10, ±20 2 .5 0.5±0.05 R 200% TMK105 B7682□V X7 R 6800 ±10, ±20 2 .5 0.5±0.05 R 200% TMK105 B7103□V X7 R 10000 ±10, ±20 3 .5 0.5±0.05 R 200% TMK105 B7224□V X7 R 220000 ±10, ±20 1 0 0.5±0.05 R 150% R 16V EMK105 B7223□V X7 R 22000 ±10, ±20 3 .5 0.5±0.05 R 200% EMK105 B7473□V X7 R 47000 ±10, ±20 3 .5 0.5±0.05 R 200% EMK105 B7104□V X7 R 100000 ±10, ±20 5 0 .5±0.05 R 150% EMK105 B7224□V X7 R 220000 ±10, ±20 1 0 0.5±0.05 R 150% R 10V LMK105 B7223□V X7 R 22000 ±10, ±20 3 .5 0.5±0.05 R 200% LMK105 B7473□V X7 R 47000 ±10, ±20 3 .5 0.5±0.05 R 200% LMK105 B7104□V X7 R 100000 ±10, ±20 5 0 .5±0.05 R 150% LMK105 B7224□V X7 R 220000 ±10, ±20 1 0 0.5±0.05 R 150% R LMK105 B7474□V X7 R 470000 ±10, ±20 1 0 0.5±0.05 R 150% 6.3V JMK105 B7224□V X7 R 220000 ±10, ±20 5 0 .5±0.05 R 150% Capacitance tolerance code is applied to □ of part number. Rated voltage Part number 1 Pa rt number 2 Te mp. char. Capacitance 〔pF〕 Capacitance tolerance tanδ 〔%〕 Thickness 〔mm〕 Soldering R:Reﬂow W:Wave HALT Internal code （P/N 1） No te% Rated vo ltage 50V UMK105 F103ZV F/ Y5V 10000 ＋80/－20 5 0.5±0.05 R 200% 25V TMK105 F223ZV F/ Y5V 22000 ＋80/－20 5 0.5±0.05 R 200% 16V EMK105 F473ZV F/ Y5V 47000 ＋80/－20 7 0.5±0.05 R 200% EMK105 F104ZV F/ Y5V 100000 ＋80/－20 9 0.5±0.05 R 200% 10V LMK105 F224ZV F/ Y5V 220000 ＋80/－20 11 0.5±0.05 R 200% 6.3V JMK105 F474ZV F/ Y5V 470000 ＋80/－20 12.5 0.5±0.05 R 200% JMK105 F105ZV F/ Y5V 1000000 ＋80/－20 20 0.5±0.05 R 150%

9mlcc01_e-01 ■ REPRESENTATIVE PART NUMBERS ＊ This catalog contains the typical speciﬁcation only due to the limitation of space. When you consider the purchase of our products, please check our speciﬁcation. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.

107TYPE 【Temperature Ch aracteristic BJ:B/X5R 】・0.8mm thickness（A） Rated voltage Part number 1 Pa rt number 2 Te mp. char. Capacitance 〔μF〕 Capacitance tolerance 〔%〕 tanδ 〔%〕 Thickness 〔mm〕 Soldering R:Reﬂow W:Wave HALT Internal code （P/N 1） No te% Rated vo ltage 50V UMK107 BJ474□A UM K107ABJ474□A X5R 0.47 ±10, ±20 1 0 0.8＋0.15/－0.05 R 150% D UMK107 BJ105□A X5 R 1 ±10, ±20 1 0 0.8±0.1 R 150% 35V GMK107 BJ105□A B/ X5R 1 ±10, ±20 5 0 .8±0.1 R 150% 25V TMK107 BJ224□A B/ X5R 0.22 ±10, ±20 3 .5 0.8±0.1 R/W 200% TMK107 BJ474□A B/ X5R 0.47 ±10, ±20 3 .5 0.8±0.1 R 150% TMK107 BJ105□A B/ X5R 1 ±10, ±20 5 0 .8±0.1 R 150% TMK107 BJ225□A TM K107ABJ225□A X5R 2.2 ±10, ±20 1 0 0.8＋0.15/－0.05 R 150% D 16V EMK107 BJ224□A B/ X5R* EMK107 BJ474□A B/ X5R* EMK107 BJ105□A B/ X5R* 1 ±10, ±20 5 0 .8±0.1 R 150% EMK107 BJ225□A B/ X5R 2.2 ±10, ±20 1 0 0.8±0.1 R 150% EMK107 BJ475□A EM K107ABJ475□A X5R 4.7 ±10, ±20 1 0 0.8＋0.15/－0.05 R 150% D 10V LMK107 BJ224□A B/ X5R* LMK107 BJ474□A B/ X5R* LMK107 BJ105□A B/ X5R* 1 ±10, ±20 5 0 .8±0.1 R 200% LMK107 BJ225□A B/ X5R 2.2 ±10, ±20 1 0 0.8±0.1 R 150% LMK107 BJ475□A X5 R 4.7 ±10, ±20 1 0 0.8±0.1 R 150% LMK107 BJ106MA LM K107BBJ106MA X5R 10 ±20 10 0.8＋0.2/－0 R 150% D Special code：L 6.3V JMK107 BJ225□A B/ X5R 2.2 ±10, ±20 1 0 0.8±0.1 R 150% JMK107 BJ475□A X5 R 4.7 ±10, ±20 1 0 0.8±0.1 R 150% JMK107 BJ106MA JM K107ABJ106MA X5R 10 ±20 10 0.8＋0.15/－0.05 R 150% 4V AMK107 BJ106MA X5 R 10 ±20 10 0.8±0.1 R 150% AMK107 BJ226MA AM K107BBJ226MA X5R 22 ±20 10 0.8＋0.2/－0 R 150% ・0.45mm thickness（K） Rated voltage Part number 1 Pa rt number 2 Te mp. char. Capacitance 〔μF〕 Capacitance tolerance 〔%〕 tanδ 〔%〕 Thickness 〔mm〕 Soldering R:Reﬂow W:Wave HALT Internal code （P/N 1） No te% Rated vo ltage 25V TMK107 BJ105□K X5 R 1 ±10, ±20 1 0 0.45±0.05 R 150% 16V EMK107 BJ105□K X5 R 1 ±10, ±20 1 0 0.45±0.05 R 150% 10V LMK107 BJ105□K B/ X5R 1 ±10, ±20 1 0 0.45±0.05 R 150% LMK107 BJ225□K X5 R 2.2 ±10, ±20 1 0 0.45±0.05 R 150% LMK107 BJ475MK LM K107BBJ475MK X5R 4.7 ±20 10 0.45±0.05 R 150% D Special code ：L 6.3V JMK107 BJ105□K B/ X5R 1 ±10, ±20 1 0 0.45±0.05 R 150% JMK107 BJ225□K X5 R 2.2 ±10, ±20 1 0 0.45±0.05 R 150% JMK107 BJ475MK X5 R 4.7 ±20 10 0.45±0.05 R 150% Capacitance tolerance code is applied to □ of part number. *1 W e may provide X7R for some itemes according to the individual speciﬁcation. 【Temperature Characteristic B7 ：X7R】・0.8mm thickness（A） Rated voltage Part number 1 Pa rt number 2 Te mp. char. Capacitance 〔μF〕 Capacitance tolerance 〔%〕 tanδ 〔%〕 Thickness 〔mm〕 Soldering R:Reﬂow W:Wave HALT Internal code （P/N 1） No te% Rated vo ltage 50V UMK107 B7224□A X7 R 0.22 ±10, ±20 1 0 0.8±0.1 R 150% R UMK107 B7474□A X7 R 0.47 ±10, ±20 1 0 0.8±0.1 R 150% R UMK107AB7105□A X7R 1 ±10, ±20 1 0 0.8＋0.15/－0.05 R 150% 25V TMK107 B7474□A X7 R 0.47 ±10, ±20 1 0 0.8±0.1 R 150% R TMK107 B7105□A X7 R 1 ±10, ±20 1 0 0.8±0.1 R 150% 16V EMK107 B7224□A X7 R 0.22 ±10, ±20 3 .5 0.8±0.1 R/W 150% EMK107 B7474□A X7 R 0.47 ±10, ±20 3 .5 0.8±0.1 R 150% EMK107 B7105□A X7 R 1 ±10, ±20 5 0 .8±0.1 R 150% 10V LMK107 B7224□A X7 R 0.22 ±10, ±20 3 .5 0.8±0.1 R/W 200% LMK107 B7474□A X7 R 0.47 ±10, ±20 3 .5 0.8±0.1 R 200% LMK107 B7105□A X7 R 1 ±10, ±20 5 0 .8±0.1 R 150% LMK107 B7225□A X7 R 2.2 ±10, ±20 1 0 0.8±0.1 R 150% JMK107 B7474□A X7 R 0.47 ±10, ±20 3 .5 0.8±0.1 R 200% JMK107 B7105□A X7 R 1 ±10, ±20 5 0 .8±0.1 R 150% Capacitance tolerance code is applied to □ of part number.

10 mlcc01_e-01 ■ REPRESENTATIVE PART NUMBERS ＊ This catalog contains the typical speciﬁcation only due to the limitation of space. When you consider the purchase of our products, please check our speciﬁcation. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs. 【Temperature Characteristic F ：Y5V】・0.8mm thickness（A） Rated voltage Part number 1 Pa rt number 2 Te mp. char. Capacitance 〔μF〕 Capacitance tolerance 〔%〕 tanδ 〔%〕 Thickness 〔mm〕 Soldering R:Reﬂow W:Wave HALT Internal code （P/N 1） No te% Rated vo ltage 50V UMK107 F104ZA F/ Y5V 0.1 ＋80/－20 7 0.8±0.1 R/W 200% 25V TMK107 F474ZA F/ Y5V 0.47 ＋80/－20 7 0.8±0.1 R/W 200% 16V EMK107 F224ZA F/ Y5V 0.22 ＋80/－20 7 0.8±0.1 R/W 200% EMK107 F474ZA F/ Y5V 0.47 ＋80/－20 7 0.8±0.1 R/W 200% EMK107 F105ZA F/ Y5V 1 ＋80/－20 16 0.8±0.1 R 200% EMK107 F225ZA F/ Y5V 2.2 ＋80/－20 16 0.8±0.1 R 200% 10V LMK107 F105ZA F/ Y5V 1 ＋80/－20 16 0.8±0.1 R 200% LMK107 F225ZA F/ Y5V 2.2 ＋80/－20 16 0.8±0.1 R 200%

212TYPE 【Temperature Ch aracteristic BJ ：B/X5R】・1.25mm thickness（G） Rated voltage Part number 1 Pa rt number 2 Te mp. char. Capacitance 〔μF〕 Capacitance tolerance 〔%〕 tanδ 〔%〕 Thickness 〔mm〕 Soldering R:Reﬂow W:Wave HALT Internal code （P/N 1） No te% Rated vo ltage 50V UMK212 BJ104□G B/ X5R* UMK212 BJ224□G B/ X5R* UMK212 BJ474□G B/ X5R* UMK212 BJ105□G B/ X5R 1 ±10, ±20 5 1 .25±0.1 R/W 150% 25V TMK212 BJ225□G B/ X5R 2.2 ±10, ±20 5 1 .25±0.1 R 150% TMK212 BJ475□G TM K212ABJ475□G X5R 4.7 ±10, ±20 1 0 1.25＋0.15/－0.05 R 150% TMK212BBJ106MG X5R 10 ±20 10 1.25＋0.2/－0 R 150% 16V EMK212 BJ225□G B/ X5R* EMK212 BJ475□G EM K212ABJ475□G B/X5R* EMK212 BJ106□G EM K212ABJ106□G X5R 10 ±10, ±20 1 0 1.25＋0.15/－0.05 R 150% 10V LMK212 BJ225□G B/ X5R* LMK212 BJ475□G LMK212ABJ475□G B/X5R* LMK212 BJ106□G LM K212ABJ106□G X5R 10 ±10, ±20 1 0 1.25＋0.15/－0.05 R 200% LMK212 BJ226MG LM K212BBJ226MG X5R 22 ±20 10 1.25＋0.2/－0 R 150% JMK212 BJ106□G JM K212ABJ106□G X5R* JMK212 BJ226MG JM K212ABJ226MG X5R 22 ±20 10 1.25＋0.15/－0.05 R 150% JMK212 BJ476MG JM K212BBJ476MG X5R 47 ±20 10 1.25＋0.2/－0 R 150% ・0.85mm thickness（D） Rated voltage Part number 1 Pa rt number 2 Te mp. char. Capacitance 〔μF〕 Capacitance tolerance 〔%〕 tanδ 〔%〕 Thickness 〔mm〕 Soldering R:Reﬂow W:Wave HALT Internal code （P/N 1） No te% Rated vo ltage 50V UMK212 BJ105□D UM K212ABJ105□D X5R 1 ±10, ±20 1 0 0.85±0.1 R 150% D 25V TMK212 BJ474□D B/ X5R 0.47 ±10, ±20 3 .5 0.85±0.1 R 200% TMK212 BJ105□D B/ X5R 1 ±10, ±20 5 0 .85±0.1 R 200% TMK212 BJ225□D TM K212ABJ225 □D B/X5R 2.2 ±10, ±20 5 0 .85±0.1 R 150% TMK212 BJ475□D TM K212BBJ475□D X5R 4.7 ±10, ±20 1 0 0.85±0.1 R 150% D 16V EMK212 BJ105□D B/ X5R* 1 ±10, ±20 5 0 .85±0.1 R 200% EMK212 BJ225□D EM K212ABJ225 □D B/X5R* EMK212 BJ475□D B/ X5R 4.7 ±10, ±20 1 0 0.85±0.1 R 150% EMK212 BJ106□D EM K212ABJ106□D X5R 10 ±10, ±20 1 0 0.85±0.1 R 150% D 10V LMK212 BJ105□D B/ X5R* LMK212 BJ225□D B/ X5R* LMK212 BJ475□D B/ X5R 4.7 ±10, ±20 10 0.85±0.1 R 200% LMK212 BJ106□D LM K212ABJ106□D X5R 10 ±10, ±20 1 0 0.85±0.1 R 150% 6.3V JMK212 BJ475□D X5 R 4.7 ±10, ±20 1 0 0.85±0.1 R 200% JMK212 BJ106□D JM K212ABJ106□D X5R 10 ±10, ±20 1 0 0.85±0.1 R 200% JMK212 BJ226MD JM K212ABJ226MD X5R 22 ±20 10 0.85±0.1 R 150% ・0.45mm thickness（K） Rated voltage Part number 1 Pa rt number 2 Te mp. char. Capacitance 〔μF〕 Capacitance tolerance 〔%〕 tanδ 〔%〕 Thickness 〔mm〕 Soldering R:Reﬂow W:Wave HALT Internal code （P/N 1） No te% Rated vo ltage 10V LMK212 BJ475□K LM K212ABJ475□K X5R 4.7 ±10, ±20 1 0 0.45±0.05 R 150% 6.3V JMK212 BJ475□K JM K212ABJ475□K X5R 4.7 ±10, ±20 1 0 0.45±0.05 R 150% JMK212 BJ106MK JM K212ABJ106MK X5R 10 ±20 10 0.45±0.05 R 150% Capacitance tolerance code is applied to □ of part number. *1 W e may provide X7R for some itemes according to the individual speciﬁcation.

11mlcc01_e-01 ■ REPRESENTATIVE PART NUMBERS ＊ This catalog contains the typical speciﬁcation only due to the limitation of space. When you consider the purchase of our products, please check our speciﬁcation. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs. 【Temperature Characteristic B7 ：X7R】・1.25mm thickness（G） Rated voltage Part number 1 Pa rt number 2 Te mp. char. Capacitance 〔μF〕 Capacitance tolerance 〔%〕 tanδ 〔%〕 Thickness 〔mm〕 Soldering R:Reﬂow W:Wave HALT Internal code （P/N 1） No te% Rated vo ltage 50V UMK212 B7104□G X7 R 0.1 ±10, ±20 3 .5 1.25±0.1 R/W 200% UMK212 B7224□G X7 R 0.22 ±10, ±20 3 .5 1.25±0.1 R/W 150% UMK212 B7474□G X7 R 0.47 ±10, ±20 3 .5 1.25±0.1 R/W 150% UMK212 B7105□G X7 R 1 ±10, ±20 1 0 1.25±0.1 R/W 150% UMK212BB7225□G X7R 2.2 ±10, ±20 1 0 1.25＋0.2/－0 R 150% 35V GMK212 B7105□G X7 R 1 ±10, ±20 3 .5 1.25±0.1 R/W 150% 25V TMK212 B7105□G X7 R 1 ±10, ±20 3 .5 1.25±0.1 R/W 150% TMK212 B7225□G X7 R 2.2 ±10, ±20 1 0 1.25±0.1 R 150% R TMK212 B7475□G TM K212AB7475□G X7R 4.7 ±10, ±20 1 0 1.25＋0.15/－0.05 R 150% D 16V EMK212 B7105□G X7 R 1 ±10, ±20 3 .5 1.25±0.1 R/W 200% EMK212 B7225□G X7 R 2.2 ±10, ±20 1 0 1.25±0.1 R 150% EMK212 B7475□G X7 R 4.7 ±10, ±20 1 0 1.25±0.1 R 150% EMK212BB7106MG X7R 10 ±20 10 1.25＋0.2/－0 R 150% 10V LMK212 B7105□G X7 R 1 ±10, ±20 3 .5 1.25±0.1 R/W 200% LMK212 B7225□G X7 R 2.2 ±10, ±20 5 1 .25±0.1 R 200% LMK212 B7475□G X7 R 4.7 ±10, ±20 1 0 1.25±0.1 R 150% LMK212 B7106MG LM K212AB7106MG X7R 10 ±20 10 1.25＋0.15/－0.05 R 150% D 6.3V JMK212 B7106□G JM K212AB7106□G X7R 10 ±10, ±20 1 0 1.25＋0.15/－0.05 R 150%

316Type 【Temperature Ch aracteristic BJ ：B/X5R】・1.6mm thickness（L） Rated voltage Part number 1 Pa rt number 2 Te mp. char. Capacitance 〔μF〕 Capacitance tolerance 〔%〕 tanδ 〔%〕 Thickness 〔mm〕 Soldering R:Reﬂow W:Wave HALT Internal code （P/N 1） No te% Rated vo ltage 50V UMK316 BJ105□L B/ X5R* UMK316 BJ475□L X5 R 4.7 ±10, ±20 1 0 1.6±0.2 R 150% 25V TMK316 BJ225□L B/ X5R* TMK316 BJ475□L B/ X5R 4.7 ±10, ±20 5 1 .6±0.2 R 150% TMK316 BJ106□L X5 R* 10 ±10, ±20 5 1 .6±0.2 R 150% 16V EMK316 BJ225□L B/ X5R* EMK316 BJ475□L B/ X5R 4.7 ±10, ±20 5 1 .6±0.2 R 200% EMK316 BJ106□L B/ X5R* 10 ±10, ±20 5 1 .6±0.2 R 150% EMK316 BJ226ML EM K316ABJ226ML B/X5R 22 ±20 10 1.6±0.2 R 150% 10V LMK316 BJ106□L B/ X5R* 10 ±10, ±20 5 1 .6±0.2 R 200% LMK316 BJ226ML LM K316ABJ226ML B/X5R 22 ±20 10 1.6±0.2 R 150% LMK316 BJ476ML LM K316ABJ476ML X5R 47 ±20 10 1.6±0.2 R 150% 6.3V JMK316 BJ106□L B/ X5R* 10 ±10, ±20 5 1 .6±0.2 R 200% JMK316 BJ226□L JM K316ABJ226□L B/X5R 22 ±10, ±20 1 0 1.6±0.2 R 200% JMK316 BJ476ML JM K316ABJ476ML X5R 47 ±20 10 1.6±0.2 R 200% JMK316 BJ107ML JM K316ABJ107ML X5R 100 ±20 10 1.6±0.2 R 150% 4V AMK316 BJ107ML AM K316ABJ107ML X5R 100 ±20 10 1.6±0.2 R 150% Capacitance tolerance code is applied to □ of part number. *1 W e may provide X7R for some itemes according to the individual speciﬁcation. ・0.85mm thickness（D） Rated voltage Part number 1 Pa rt number 2 Te mp. char. Capacitance 〔μF〕 Capacitance tolerance 〔%〕 tanδ 〔%〕 Thickness 〔mm〕 Soldering R:Reﬂow W:Wave HALT Internal code （P/N 1） No te% Rated vo ltage 50V UMK212AB7104□D X7R 0.1 ±10, ±20 1 0 0.85±0.1 R 150% UMK212AB7224□D X7R 0.22 ±10, ±20 1 0 0.85±0.1 R 150% UMK212AB7474□D X7R 0.47 ±10, ±20 1 0 0.85±0.1 R 150% UMK212AB7105□D X7R 1 ±10, ±20 1 0 0.85±0.1 R 150% 25V TMK212AB7225 □D X7R 2.2 ±10, ±20 1 0 0.85±0.1 R 150% R 16V EMK212 B7474□D X7 R 0.47 ±10, ±20 3 .5 0.85±0.1 R/W 200% EMK212 B7105□D X7 R 1 ±10, ±20 5 0 .85±0.1 R 200% EMK212 B7225□D EM K212AB7225□D X7R 2.2 ±10, ±20 5 0 .85±0.1 R 150% 10V LMK212 B7105□D X7 R 1 ±10, ±20 3 .5 0.85±0.1 R 200% LMK212 B7225□D LM K212AB7225□D X7R 2.2 ±10, ±20 5 0 .85±0.1 R 200% LMK212 B7475□D LM K212AB7475□D X7R 4.7 ±10, ±20 1 0 0.85±0.1 R 150% R Capacitance tolerance code is applied to □ of part number. 【Temperature Characteristic F ：Y5V】・1.25mm thickness（G） Rated voltage Part number 1 Pa rt number 2 Te mp. char. Capacitance 〔μF〕 Capacitance tolerance 〔%〕 tanδ 〔%〕 Thickness 〔mm〕 Soldering R:Reﬂow W:Wave HALT Internal code （P/N 1） No te% Rated vo ltage 50V UMK212 F474ZG F/ Y5V 0.47 ＋80/－20 7 1.25±0.1 R/W 200% UMK212 F105ZG F/ Y5V 1 ＋80/－20 7 1.25±0.1 R/W 200% 16V EMK212 F225ZG F/ Y5V 2.2 ＋80/－20 7 1.25±0.1 R/W 200% 10V LMK212 F475ZG F/ Y5V 4.7 ＋80/－20 9 1.25±0.1 R 200% LMK212 F106ZG F/ Y5V 10 ＋80/－20 16 1.25±0.1 R 200% 6.3V JMK212 F106ZG F/ Y5V 10 ＋80/－20 16 1.25±0.1 R 200% ・0.85mm thickness（D） Rated voltage Part number 1 Pa rt number 2 Te mp. char. Capacitance 〔μF〕 Capacitance tolerance 〔%〕 tanδ 〔%〕 Thickness 〔mm〕 Soldering R:Reﬂow W:Wave HALT Internal code （P/N 1） No te% Rated vo ltage 50V UMK212 F224ZD F/ Y5V 0.22 ＋80/－20 7 0.85±0.1 R/W 200% 10V LMK212 F225ZD F/ Y5V 2.2 ＋80/－20 9 0.85±0.1 R 200% 6.3V JMK212 F475ZD F/ Y5V 4.7 ＋80/－20 16 0.85±0.1 R 200%

12 mlcc01_e-01 ■ REPRESENTATIVE PART NUMBERS ＊ This catalog contains the typical speciﬁcation only due to the limitation of space. When you consider the purchase of our products, please check our speciﬁcation. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs. ・0.85mm thickness（D） Rated voltage Part number 1 Pa rt number 2 Te mp. char. Capacitance 〔μF〕 Capacitance tolerance 〔%〕 tanδ 〔%〕 Thickness 〔mm〕 Soldering R:Reﬂow W:Wave HALT Internal code （P/N 1） No te% Rated vo ltage 50V UMK316 BJ105□D B/ X5R 1 ±10, ±20 3 .5 0.85±0.1 R 150% UMK316 BJ225□D B/ X5R 2.2 ±10, ±20 3 .5 0.85±0.1 R 150% UMK316 BJ475□D UM K316ABJ475□D X5R 4.7 ±10, ±20 1 0 0.85±0.1 R 150% D 25V TMK316 BJ105□D B/ X5R 1 ±10, ±20 3 .5 0.85±0.1 R 200% TMK316 BJ225□D B/ X5R 2.2 ±10, ±20 3 .5 0.85±0.1 R 150% TMK316 BJ475□D X5 R 4.7 ±10, ±20 5 0 .85±0.1 R 150% TMK316 BJ106□D TM K316ABJ106□D X5R 10 ±10, ±20 1 0 0.85±0.1 R 150% D 16V EMK316 BJ225□D B/ X5R 2.2 ±10, ±20 3 .5 0.85±0.1 R 200% EMK316 BJ475□D B/ X5R 4.7 ±10, ±20 5 0 .85±0.1 R 200% EMK316 BJ106□D X5 R 10 ±10, ±20 1 0 0.85±0.1 R 150% EMK316 BJ226MD EM K316ABJ226MD X5R 22 ±20 10 0.85±0.1 R 150% D 10V LMK316 BJ475□D B/ X5R 4.7 ±10, ±20 5 0 .85±0.1 R 200% LMK316 BJ106□D B/X5R 10 ±10, ±20 1 0 0.85±0.1 R 200% LMK316 BJ226MD LM K316ABJ226MD X5R 22 ±20 10 0.85±0.1 R 150% 6.3V JMK316 BJ106□D B/ X5R 10 ±10, ±20 1 0 0.85±0.1 R 200% JMK316 BJ226MD JM K316ABJ226MD X5R 22 ±20 10 0.85±0.1 R 150% JMK316 BJ476MD JM K316ABJ476MD X5R 47 ±20 10 0.85±0.1 R 150% Capacitance tolerance code is applied to □ of part number. 【Temperature Characteristic B7 ：X7R】・1.6mm thickness（L） Rated voltage Part number 1 Pa rt number 2 Te mp. char. Capacitance 〔μF〕 Capacitance tolerance 〔%〕 tanδ 〔%〕 Thickness 〔mm〕 Soldering R:Reﬂow W:Wave HALT Internal code （P/N 1） No te% Rated vo ltage 50V UMK316 B7224□L X7 R 0.22 ±10, ±20 2 .5 1.6±0.2 R/W 200% UMK316 B7474□L X7 R 0.47 ±10, ±20 3 .5 1.6±0.2 R/W 200% UMK316 B7105□L X7 R 1 ±10, ±20 3 .5 1.6±0.2 R 200% UMK316 B7225□L X7 R 2.2 ±10, ±20 1 0 1.6±0.2 R 150% UMK316 B7475□L UM K316AB7475□L X7R 4.7 ±10, ±20 1 0 1.6±0.2 R 150% D 25V TMK316 B7105□L X7 R 1 ±10, ±20 3 .5 1.6±0.2 R/W 200% TMK316 B7225□L X7 R 2.2 ±10, ±20 3 .5 1.6±0.2 R 200% TMK316 B7475□L TM K316AB7475□L X7R 4.7 ±10, ±20 1 0 1.6±0.2 R 200% D TMK316 B7106□L TM K316AB7106□L X7R 10 ±10, ±20 1 0 1.6±0.2 R 150% D 16V EMK316 B7225□L X7 R 2.2 ±10, ±20 3 .5 1.6±0.2 R/W 200% EMK316 B7106□L EM K316AB7106□L X7R 10 ±10, ±20 1 0 1.6±0.2 R 200% D 10V LMK316 B7225□L X7 R 2.2 ±10, ±20 3.5 1.6±0.2 R/W 200% LMK316 B7475□L X7 R 4.7 ±10, ±20 5 1 .6±0.2 R 200% LMK316 B7106□L LM K316AB7106□L X7R 10 ±10, ±20 1 0 1.6±0.2 R 200% D LMK316 B7226ML LM K316AB7226ML X7R 22 ±20 10 1.6±0.2 R 150% R 6.3V JMK316 B7106□L X7 R 10 ±10, ±20 5 1 .6±0.2 R 200% Capacitance tolerance code is applied to □ of part number. 【Temperature Characteristic F ：F/Y5V】・1.6mm thickness（L） Rated voltage Part number 1 Pa rt number 2 Te mp. char. Capacitance 〔μF〕 Capacitance tolerance 〔%〕 tanδ 〔%〕 Thickness 〔mm〕 Soldering R:Reﬂow W:Wave HALT Internal code （P/N 1） No te% Rated vo ltage 35V GMK316 F106ZL F/ Y5V 10 ＋80/－20 9 1.6±0.2 R 200% 25V TMK316 F106ZL F/ Y5V 10 ＋80/－20 9 1.6±0.2 R 200% 16V EMK316 F106ZL F/ Y5V 10 ＋80/－20 9 1.6±0.2 R 200% 10V LMK316 F226ZL F/ Y5V 22 ＋80/－20 16 1.6±0.2 R 200% ・0.85mm thickness（D） Rated voltage Part number 1 Pa rt number 2 Te mp. char. Capacitance 〔μF〕 Capacitance tolerance 〔%〕 tanδ 〔%〕 Thickness 〔mm〕 Soldering R:Reﬂow W:Wave HALT Internal code （P/N 1） No te% Rated vo ltage 50V UMK316 B7225□D X7 R 2.2 ±10, ±20 1 0 0.85±0.1 R 150% 25V TMK316AB7475□D X7R 4.7 ±10, ±20 1 0 0.85±0.1 R 150% 10V LMK316AB7106MD X7R 10 ±20 10 0.85±0.1 R 150% Capacitance tolerance code is applied to □ of part number. ・1.25mm thickness（G） Rated voltage Part number 1 Pa rt number 2 Te mp. char. Capacitance 〔μF〕 Capacitance tolerance 〔%〕 tanδ 〔%〕 Thickness 〔mm〕 Soldering R:Reﬂow W:Wave HALT Internal code （P/N 1） No te% Rated vo ltage 50V UMK316 F225ZG F/ Y5V 2.2 ＋80/－20 7 1.25±0.1 R/W 200% 35V GMK316 F475ZG F/ Y5V 4.7 ＋80/－20 7 1.25±0.1 R 200% ・0.85mm thickness（D） Rated voltage Part number 1 Pa rt number 2 Te mp. char. Capacitance 〔μF〕 Capacitance tolerance 〔%〕 tanδ 〔%〕 Thickness 〔mm〕 Soldering R:Reﬂow W:Wave HALT Internal code （P/N 1） No te% Rated vo ltage 10V LMK316 F475ZD F/ Y5V 4.7 ＋80/－20 9 0.85±0.1 R 200% 6.3V JMK316 F106ZD F/ Y5V 10 ＋80/－20 16 0.85±0.1 R 200%

13mlcc01_e-01 ■ REPRESENTATIVE PART NUMBERS ＊ This catalog contains the typical speciﬁcation only due to the limitation of space. When you consider the purchase of our products, please check our speciﬁcation. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.

325Type 【Temperature Ch aracteristic BJ ：B/X5R】・2.5mm thickness（M） Rated voltage Part number 1 Pa rt number 2 Te mp. char. Capacitance 〔μF〕 Capacitance tolerance 〔%〕 tanδ 〔%〕 Thickness 〔mm〕 Soldering R:Reﬂow W:Wave HALT Internal code （P/N 1） No te% Rated vo ltage 50V UMK325 BJ475MM X5 R 4.7 ±20 5 2.5±0.2 R 150% UMK325 BJ106MM X5 R 10 ±20 5 2.5±0.2 R 150% 25V TMK325 BJ106MM B/ X5R* 10 ±20 3.5 2.5±0.2 R 150% 16V EMK325 BJ226MM B/ X5R 22 ±20 5 2.5±0.2 R 150% EMK325 BJ476MM X5 R 47 ±20 10 2.5±0.2 R 150% 10V LMK325 BJ226MM B/ X5R 22 ±20 5 2.5±0.2 R 200% LMK325 BJ476MM X5 R 47 ±20 10 2.5±0.2 R 150% LMK325 BJ107MM LM K325ABJ107MM X5R 100 ±20 10 2.5±0.3 R 150% 6.3V JMK325 BJ476MM X5 R 47 ±20 10 2.5±0.2 R 150% JMK325 BJ107MM JM K325ABJ107MM X5R 100 ±20 10 2.5±0.3 R 150% ・1.9mm thickness（Y, N） Rated voltage Part number 1 Pa rt number 2 Te mp. char. Capacitance 〔μF〕 Capacitance tolerance 〔%〕 tanδ 〔%〕 Thickness 〔mm〕 Soldering R:Reﬂow W:Wave HALT Internal code （P/N 1） No te% Rated vo ltage 50V UMK325 BJ475MN X5 R 4.7 ±20 10 1.9±0.2 R 150% 35V GMK325 BJ225MN B/ X5R 2.2 ±20 3.5 1.9±0.2 R 200% GMK325 BJ475MN X5 R 4.7 ±20 10 1.9±0.2 R 150% GMK325 BJ106MN B/ X5R 10 ±20 5 1.9±0.2 R 150% 25V TMK325 BJ335MN B/ X5R* TMK325 BJ475MN B/ X5R* TMK325 BJ106MN B/ X5R 10 ±20 5 1.9±0.2 R 200% 16V EMK325 BJ475MN B/ X5R* EMK325 BJ106MN B/ X5R 10 ±20 3.5 1.9±0.2 R 200% EMK325 BJ476MY X5 R 47 ±20 10 1.9＋0.1/－0.2 R 150% 10V LMK325 BJ226MY B/ X5R 22 ±20 5 1.9＋0.1/－0.2 R 150% LMK325 BJ106MN B/ X5R* 10 ±20 3.5 1.9±0.2 R 200% 6.3V JMK325 BJ226MY B/X5R 22 ±20 5 1.9＋0.1/－0.2 R 200% JMK325 BJ107MY X5 R 100 ±20 10 1.9＋0.1/－0.2 R 150% JMK325 BJ476MN X5 R 47 ±20 10 1.9±0.2 R 150% ・0.85mm thickness（D） Rated voltage Part number 1 Pa rt number 2 Te mp. char. Capacitance 〔μF〕 Capacitance tolerance 〔%〕 tanδ 〔%〕 Thickness 〔mm〕 Soldering R:Reﬂow W:Wave HALT Internal code （P/N 1） No te% Rated vo ltage 25V TMK325 BJ106MD B/ X5R 10 ±20 5 0.85±0.1 R 150% 16V EMK325 BJ106MD B/ X5R 10 ±20 5 0.85±0.1 R 150% EMK325 BJ226MD B/ X5R 22 ±20 10 0.85±0.1 R 150% 10V LMK325 BJ335MD B/ X5R 3.3 ±20 3.5 0.85±0.1 R 200% LMK325 BJ475MD B/ X5R 4.7 ±20 5 0.85±0.1 R 200% LMK325 BJ106MD B/ X5R 10 ±20 5 0.85±0.1 R 150% *1 We may provide X7R for some itemes according to the individual speciﬁcation. 【Temperature Characteristic B7 ：X7R】・2.5mm thickness（M） Rated voltage Part number 1 Pa rt number 2 Te mp. char. Capacitance 〔μF〕 Capacitance tolerance 〔%〕 tanδ 〔%〕 Thickness 〔mm〕 Soldering R:Reﬂow W:Wave HALT Internal code （P/N 1） No te% Rated vo ltage 50V UMK325 B7475MM X7 R 4.7 ±20 5 2.5±0.2 R 150% UMK325AB7106MM X7R 10 ±20 10 2.5±0.3 R 150% 25V TMK325 B7226MM X7 R 22 ±20 10 2.5±0.2 R 150% R TMK325AB7106MM X7R 10 ±20% 10 2.5±0.3 R 150% 16V EMK325 B7226MM X7 R 22 ±20 10 2.5±0.2 R 150% R 10V LMK325 B7476MM X7 R 47 ±20 10 2.5±0.2 R 150% R 6.3V JMK325 B7476MM X7 R 47 ±20 10 2.5±0.2 R 200% R ・1.9mm thickness（N） Rated voltage Part number 1 Pa rt number 2 Te mp. char. Capacitance 〔μF〕 Capacitance tolerance 〔%〕 tanδ 〔%〕 Thickness 〔mm〕 Soldering R:Reﬂow W:Wave HALT Internal code （P/N 1） No te% Rated vo ltage 50V UMK325 B7475MN X7 R 4.7 ±20 10 1.9±0.2 R 150% R 25V TMK325 B7335MN X7 R 3.3 ±20 3.5 1.9±0.2 R 200% TMK325 B7475MN X7 R 4.7 ±20 3.5 1.9±0.2 R 150% TMK325 B7106MN X7 R 10 ±20 10 1.9±0.2 R 150% R 16V EMK325 B7475MN X7 R 4.7 ±20 3.5 1.9±0.2 R 200% EMK325 B7106MN X7 R 10 ±20 3.5 1.9±0.2 R 150% 10V LMK325 B7106MN X7 R 10 ±20 3.5 1.9±0.2 R 200% 【Temperature Characteristic F ：F/Y5V】・1.9mm thickness（N） Rated voltage Part number 1 Pa rt number 2 Te mp. char. Capacitance 〔μF〕 Capacitance tolerance 〔%〕 tanδ 〔%〕 Thickness 〔mm〕 Soldering R:Reﬂow W:Wave HALT Internal code （P/N 1） No te% Rated vo ltage 16V EMK325 F226ZN F/ Y5V 22 ＋80/－20 16 1.9±0.2 R 200% 10V LMK325 F226ZN F/ Y5V 22 ＋80/－20 16 1.9±0.2 R 200% 6.3V JMK325 F476ZN F/ Y5V 47 ＋80/－20 16 1.9±0.2 R 200%

14 mlcc01_e-01 ■ ELECTRICAL CHARACTERISTICS ＊ This catalog contains the typical speciﬁcation only due to the limitation of space. When you consider the purchase of our products, please check our speciﬁcation. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.

Example of Impedance ESR vs. Frequency characteristics ■Taiyo Yuden multilayer ceramic capacitor TMK107 BJ105KA AMK107BBJ226MA AMK107 BJ226MA JMK107ABJ106MA JMK107 BJ106MA TMK212BBJ106MG JMK316ABJ476ML JMK316 BJ476MLTMK316 BJ106KL JMK212ABJ226MG JMK212 BJ226MG JMK316ABJ107ML JMK316 BJ107ML EMK325 BJ476MYGMK325 BJ106MN JMK325 BJ107MY UMK212 F224ZD UMK212 F105ZG LMK212 F106ZG UMK316 F225ZG GMK316 F106ZL LMK107 F105ZA LMK107 F225ZA UMK107 F104ZA LMK316 F226ZL JMK325 F476ZN

15mlcc01_e-01 ＊ This catalog contains the typical speciﬁcation only due to the limitation of space. When you consider the purchase of our products, please check our speciﬁcation. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.

mlcc_pack-P1 mlcc_pack_e-01 ■ PACKAGING ＊ This catalog contains the typical speciﬁcation only due to the limitation of space. When you consider the purchase of our products, please check our speciﬁcation. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs. ◦Taped package ①Minimum Quantity ②Taping material ※No bottom tape for pressed carrier tape ③Representative taping dimensions ◦Paper Tape（8mm wide ） ◦Pressed carrier tape （2mm pitch）㧗0.1/−0 ◦Paper tape ◦Embossed tape Type Chip Cavity Insertion Pitch Ta pe Thickness A B F T □MK 107 □WK107 1.0 1.8 4.0±0.1 1.1max. □2K110 1.15 1.55 1.0max. □MK212 □WK212 1.65 2.4 1.1max.□4K212 □2K212 □MK316 2.0 3.6 Type Chip Cavity Insertion Pitch Ta pe Thickness A B F T □2K 096 0.72 1.02 52.0±0.05 0.6max. □MK105 □VK105 0.65 1.15 0.8max. 㧗0.1/−0 㧗0.1/−0 ◦Punched carrier tape （4mm pitch） Note：Taping size might be different depending on the size of the product. ◦Punched carrier tape （2mm pitch） hip ﬁlled Type Thickness Standard quantity [pcs] mm c ode Paper tape Em bossed ta pe □MK042 0.2 C,D — 40000 □MK063 0.3 P,T 15000 □2K096 0.3 P 100000.45 K □WK105 0.3 P □MK105

0.2 C 20000

0.3 P 15000

0.5 V, W 10 000□VK105 0.5 W □MK107 □WK107

0.45 K 4000

0.5 V — 4000

0.8 A 4000 —□2K110 0.5 V 0.6 B 0.8 A □MK212 □WK212 0.45 K 0.85 D

1.25 G — 3000

□4K212 0.85 D 4000 —□2K212 0.85 D □MK316 0.85 D 1.15 F — 30001.25 G 1.6 L 2000 □MK325 0.85 D 1.15 F 1.9 N 2.0max Y □MK432 2.5 M — 500 Unit：mm Unit：mm Unit：mm Type Chip Cavity Insertion Pitch Tape Thickness ＡＢＦＴ T1 □MK063 0.37 0.67 2.0±0.05 □WK105 0.65 1.15MK105（* C） 0.4max. 0.3max. MK105（* P） 0.45max. 0.42max. Thickness, C：0.2mm、P：0.3mm

mlcc_pack-P2mlcc_pack_e-01 ■ PACKAGING ＊ This catalog contains the typical speciﬁcation only due to the limitation of space. When you consider the purchase of our products, please check our speciﬁcation. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs. ◦Embossed tape（8mm wide） ◦Embossed tape（12mm wide） Type Chip Cavity Insertion Pitch Tape Thickness A B F K T □WK107 1.0 1.8 4.0±0.1 1.3max 0.25±0.1 □MK212 1.65 2.4 □MK325 2.8 3.6 ④Trailer and Leader Trailer 160mm min. Leader 400mm min. 100mm or more ⑤Reel size ⑥Top Tape Strength The top tape requires a peel-off force of 0.1 to 0.7N in the direction of the arrow as illustrated below. The exchange of individual speciﬁcation is necessary. Please contact Taiyo Yuden sales channels. 㧗0.1/−0 㧗0.1/−0 2.0ʶ0.1 F 36ʴ0/ʵ0.2 110ʶ0.7 12ʶ0.1 ʴ0.2/ʵ0 ʴ0/ʵ0.2 12.0ʶ0.1 8.8ʶ0.1 6.8ʶ0.1 Unit：mm ⑦Bulk Cassette 1.0ʶ0.02 4.0ʶ0.05 ̛ 2.0ʶ0.04 ◦Embossed tape（4mm wide） Type Chip Cavity Insertion Pitch Tape Thickness A B F K T A B C φ178±2.0 φ5 0min. φ13.0±0.2 D E R t W 4mm wide ta pe 1.5max. 5±1.0 8mm wide tape 2.5max. 10±1.5 12mm wide tape 2.5max. 14±1.5 Unit：mm Unit：mm Unit：mm Type Chip Cavity Insertion Pitch Tape Thickness A B F K T Unit：mm E W C R D B t A E W C R D B t A

mlcc_reli-R1 mlcc_reli_e-01 ■ RELIABILITY DATA ＊ This catalog contains the typical speciﬁcation only due to the limitation of space. When you consider the purchase of our products, please check our speciﬁcation. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs. 7. Q or Dissipation Factor Speciﬁed Value Temperatur e Compensating （Class 1 Standard C＜30 pF：Q≧400＋20C、 C≧30 pF：Q≧1000 （C：Nominal capacitance） High Frequency T ype Refer to detailed speciﬁcation High Permittivity（Class 2） Note 1 BJ, B7, C6,C7：2. 5％ max., F：7％ max. 【Test Methods and Remarks】 Hi gh Frequency Type Me asuring equipment: HP4291A Me asuring jig: HP16192A Class 1 Class 2 Standard High Frequency Type C ≦10μF C＞10μF Preconditioning None Thermal treatment （at 150℃ for 1hr） Note 2 Measuring frequency 1ＭHz±10％ 1GHz 1ｋHz±10％ 120±10Hz Measuring voltage Note 1 0.5 to 5Vrms 1±0.2Vrms 0.5±0.1Vrms Bias application None 6. Capacitance （Tolerance） Speciﬁed Value Temperatur e Compensating （Class 1 Standard C△ 0.5pF≦C≦5pF：±0.25pF 0.5pF<C≦10pF：±0.5pF C＞10pF：±5% RH 0.5pF≦C≦2pF：±0.1pF C＞2pF：±5% High Frequency Type CH RH 0.5pF≦C≦2pF：±0.1pF C＞2pF：±5% High Permittivity （Class 2） BJ, B7, C6,C7：±1 0％ or ±20％, F：－20％／＋80％【Test Methods and Remarks】 Class 1 Class 2 Standard High Frequency Type C ≦10μF C＞10μF Preconditioning None Thermal treatment （at 150℃ for 1hr） Note 2 Measuring frequency 1ＭHz±10％ 1ｋHz±10％ 120±10Hz Measuring voltage Note 1 0.5 to 5Vrms 1±0.2Vrms 0.5±0.1Vrms Bias application None 5. Insulation Resistance Speciﬁed Value Temperatur e Compensating （Class 1 Standard 10000 MΩ min.High Frequency T ype High Permittivity （Class 2） Note 1 C≦0.047μF : 10000 MΩ min. C＞0. 047μF : 50 0MΩ ・μF 【Test Methods and Remarks】 Applied voltage: Rated voltage Duration: 60±5 sec. Charge/dischar ge current: 50mA max. 4. Withstanding Voltage（Between terminals） Speciﬁed Value Temperatur e Compensating （Class 1 Standard No breakdown or damageHigh Frequency Type High Permittivity（Class 2） est Methods and Remarks】 Class 1 Class 2 Applied voltage Rated voltage ×3 Rated voltage ×2.5 Duration 1 to 5 sec. Charge/discharge current 50mA max. 3. Rated Voltage Speciﬁed Value Temperatur e Compensating （Class 1 Standard 50VDC, 25VDC, 16VDC High Frequency Type 50 VDC, 16VDC High Permittivity （Class 2） 5 0VDC, 35VDC, 25VDC, 16VDC, 10VDC, 6.3VDC, 4VDC 2. Storage Conditions Speciﬁed Value Temperatur e Compensating （Class 1 Standard －55 to ＋125℃High Fr equency Type High Permittivity （Class 2） Speciﬁcation Temperature Range BJ B －25 to ＋85℃ X5R －55 to ＋85℃ B7 X7R －55 to ＋125℃ C6 X6S －55 to ＋105℃ C7 X7S －55 to ＋125℃ F F －25 to ＋85℃ Y5V －30 to ＋85℃ 1.Operating Temperature Range Speciﬁed Value Temperatur e Compensating （Class 1 Standard －55 to ＋125℃High Fr equency Type High Permittivity （Class 2） Speciﬁcation Temperature Range BJ B －25 to ＋85℃ X5R －55 to ＋85℃ B7 X7R －55 to ＋125℃ C6 X6S －55 to ＋105℃ C7 X7S －55 to ＋125℃ F F －25 to ＋85℃ Y5V －30 to ＋85℃ Multilayer Ceramic Capacitors Super Low Distortion Multilayer Ceramic Capacitors and Medium-High Voltage Multilayer Ceramic Capacitors are noted separately.

mlcc_reli-R2mlcc_reli_e-01 ■ RELIABILITY DATA ＊ This catalog contains the typical speciﬁcation only due to the limitation of space. When you consider the purchase of our products, please check our speciﬁcation. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs. 8. Temperature Characteristic（Without voltage application） Speciﬁed Value Temperatur e Compensating （Class 1 Standard Temperature Characteristic ［ppm/℃］ Tolerance C□ ：0 CH, CJ, CK H±60 J±120 K±250 R□ ：ー220 RH S□ ：ー330 SH, SJ, SK T□ ：ー470 TJ, TK U□ ：ー750 UJ, UK SL ：＋350 to －1000 High Frequency Type High Permittivity （Class 2） Speciﬁcation Capacitance change Reference temperature Temperature Range 【Test Methods and Remarks】 Class 1 Capacitance a t 2 0℃ and 85℃ shall be measured in thermal equilibrium, and the temperature characteristic shall be calculated from the following equation. （C85－C20） × 10 Class 2 Ca pacitance a t e ach step shall be measured in thermal equilibrium, and the temperature characteristic shall be calculated from the following equation. C ：Capacitance in Step 1 or Step 3 C2 ：Capacitance in Step 2 Step B、F X5R、X7R、X6S、X7S、Y5V

1 Minimum operating temperature

2 20℃ 25℃

3 Maximum operating temperature

Deﬂection Speciﬁed Value Temperatur e Compensating （Class 1 Standard Appearance : No abnormality Capacitance change : Within ±5% or ±0.5 pF, whichever is lar ger. High Frequency Type Appearance : No abnormality Capacitance change : Within±0.5 pF High Permittivity （Class 2） Appearance : No abnormality Capacitance change : Within ±12.5%（BJ, B7, C6, C7 ）, Within ±30%（F ）【Test Methods and Remarks】 Multilayer Ceramic Capacitors Board Thickness Warp Duration 042、063 Type glass epoxy-resin substrate 0.8mm 1mm 10 sec.The other types 1.6mm Array Type Board Thickness Warp Duration 096、110、212 Type glass epoxy-resin substrate 1.6mm 1mm 10 sec. Board Warp Capacitance measurement shall be conducted with the board bent 10. Body Strength Speciﬁed Value Temperatur e Compensating （Class 1 Standard — High Frequency Type No mechanical damage. High Permittivity （Class 2） — est Methods and Remarks】 High Frequency T ype Applied force: 5N Duration: 10 sec. A A A 11. Adhesive Strength of Terminal Electrodes Speciﬁed Value Temperatur e Compensating （Class 1 Standard No terminal separation or its indication.High Frequency T ype High Permittivity （Class 2） est Methods and Remarks】 Multilayer Ceramic Capacitors A rray Ty pe Applied force Duration 042、063 Type 2N 30±5 sec.105 Type or more 5N Applied force Duration 096 Type 2N 30±5 sec.110、212 Type 5N 12. Solderability Speciﬁed Value Temperatur e Compensating （Class 1 Standard At least 95% of terminal electrode is covered by new solder.High Frequency T ype High Permittivity （Class 2） est Methods and Remarks 】 Solder type Solder temperature Duration Eutectic solder H60A or H63A 230±5℃ 4±1 sec.Lead-free solder Sn-3.0Ag －0.5Cu 245 ±3℃

mlcc_reli-R3 mlcc_reli_e-01 ■ RELIABILITY DATA ＊ This catalog contains the typical speciﬁcation only due to the limitation of space. When you consider the purchase of our products, please check our speciﬁcation. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs. 13. Resistance to Soldering Speciﬁed Value Temperatur e Compensating （Class 1 Standard Appearance: No abnormality Capacitance change: Within ±2.5% or ±0.25pF, whichever is lar ger. Q: Initial value Insulation resistance: Initial value Withstanding voltage （between terminals）: No abnormality High Fr equency Type Appearance: No abnormality Capacitance change: Within ±2.5% Q: Initial value Insulation resistance: Initial value Withstanding voltage （between terminals）: No abnormality High Permittivity （Class 2） Note 1 Appearance: No abnormality Capacitance change: Within ±7.5% （BJ, B7, C6, C7 ） Within ±20% （F ） Dissipation factor: Initial value Insulation resistance: Initial value Withstanding voltage （between terminals）: No abnormality est Methods and Remarks】 Class 1 042, 063 Type 105 Type Array（096, 110 Type） Preconditioning None Preheating 150℃, 1 to 2 min. 80 to 100℃, 2 to 5 min. 150 to 200℃, 2 to 5 min. Solder temp. 270±5℃ Duration 3±0.5 sec. Recovery 6 to 24 hrs （Standard condition ） Note 5 Class 2 042、063 Type 105, 107, 212 Type Array（096, 110,212 Type） 316, 325 Type Preconditioning Thermal treatment （at 150℃ for 1 hr） Note 2 Preheating 150℃, 1 to 2 min. 80 to 100 ℃, 2 to 5 min. 150 to 200℃, 2 to 5 min. 80 to 100℃, 5 to 10 min. 150 to 200℃, 5 to 10 min. Solder temp. 270±5℃ Duration 3±0.5 sec. Recovery 24±2 hrs （Standard condition ） Note 5 14. Temperature Cycle (Thermal Shock） Speciﬁed Value Temperatur e Compensating （Class 1 Standard Appearance: No abnormality Capacitance change: Within ±2.5% or ±0.25pF, whichever is lar ger. Q: Initial value Insulation resistance: Initial value Withstanding voltage （between terminals）: No abnormality High Fr equency Type Appearance: No abnormality Capacitance change: Within ±0.25pF Q: Initial value Insulation r esistance: Initial value Withstanding voltage （between terminals）: No abnormality High Permittivity （Class 2） Note 1 Appearance: No abnormality Capacitance change: Within ±7.5% （BJ, B7, C6, C7 ） Within ±20% （F ） Dissipation factor: Initial value Insulation resistance: Initial value Withstanding voltage （between terminals）: No abnormality est Methods and Remarks】 Class 1 Class 2 Preconditioning None Thermal treatment （at 150℃ for 1 hr） Note 2 1 cycle Step Temperature（℃） Time（min.）

1 Lowest operating temperature ＋ 0/－3 30±3

2 Normal temperature 2 to 3

3 Highest operating temperature ＋ 0/－3 30 ±3

4 Normal temperature 2 to 3

Recovery 6 to 24 hrs （Standard condition ） Note 5 24±2 hrs （Standard condition ） Note 5 15. Humidity （Steady State ） Speciﬁed Value Temperatur e Compensating （Class 1 Standard Appearance: No abnormality Capacitance change: Within ±5% or ±0.5pF, whichever is lar ger. 10≦C＜30pF： Q≧2 75＋2.5C C≧30pF： Q≧350 （C：Nominal capacitance ） Insulation resistance: 1000 MΩ min. High Frequency T ype Appearance: No abnormality Capacitance change: Within ±0.5pF , Insulation resistance: 1000 MΩ min. High Permittivity （Class 2） Note 1 Appearance: No abnormality Capacitance change: Within ±12.5%（BJ, B7, C6, C7 ） Within ±30%（F ） Dissipation factor： 5.0% max. （BJ, B7, C6, C7） 11.0% max.（F） Insulation r esistance: 50 MΩ μF or 1000 MΩ whichever is smaller. est Methods and Remarks】 Class 1 Standard High Frequency Type Preconditioning None Temperature 40±2℃ 60±2℃ Humidity 90 to 95％RH Duration 500＋24/ー0 hrs Recovery 6 to 24 hrs （Standard condition ） Note 5 Class 2 All items Preconditioning Thermal treatment （at 150℃ for 1 hr） Note 2 Temperature 40±2℃ Humidity 90 to 95％RH Duration 500＋24/ー0 hrs Recovery 24±2 hrs （Standard condition ） Note 5

mlcc_reli-R4mlcc_reli_e-01 ■ RELIABILITY DATA ＊ This catalog contains the typical speciﬁcation only due to the limitation of space. When you consider the purchase of our products, please check our speciﬁcation. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs. 16. Humidity Loading Speciﬁed Value Temperatur e Compensating （Class 1 Standard Appearance: No abnormality Capacitance change: W ithin ±7.5% or ±0.75pF, whichever is lar ger. C≧30pF：Q≧200 （C：Nominal capacitance ） Insulation resistance: 500 MΩ min. High Fr equency Type Appearance: No abnormality Capacitance change: C≦2pF：Within ±0.4 pF C＞2pF：Within ±0.75 pF （C：Nominal capacitance ） Insulation resistance: 500 MΩ min. High Permittivity （Class 2） Note 1 Appearance: No abnormality Capacitance change: Within ±12.5% （BJ, B7, C6, C7 ） Within ±30%（F ） Dissipation factor： 5.0% max. （BJ, B7, C6, C7） 11.0% max.（ Insulation resistance: 25 MΩ μF or 500 MΩ, whichever is smaller. 【Test Methods and Remarks】 Class 1 Standard High Frequency Type Preconditioning None Temperature 40±2℃ 60±2℃ Humidity 90 to 95％RH Duration 500＋24/ー0 hrs Applied voltage Rated voltage Charge/discharge current 50mA max. Recovery 6 to 24 hrs （Standard condition ） Note 5 Class 2 All items Preconditioning Voltage treatment （Rated voltage are applied for 1 hour at 40 ℃） Note 3 Temperature 40±2℃ Humidity 90 to 95％RH Duration 500＋24/ー0 hrs Applied voltage Rated voltage Charge/discharge current 50mA max. Recovery 24±2 hrs （Standard condition ） Note 5 17. High Temperature Loading Speciﬁed Value Temperatur e Compensating （Class 1 Standard Appearance: No abnormality Capacitance change: Within ±3% or ±0.3pF, whichever is lar ger. C≧30pF： Q≧350 （C：Nominal capacitance ） Insulation resistance: 1000 MΩ min. High Frequency T ype Appearance: No abnormality Capacitance change: Within ±3% or ±0.3pF , whichever is lar ger. Insulation resistance: 1000 MΩ min. High Permittivity （Class 2） Note 1 Appearance: No abnormality Capacitance change: Within ±12.5%（BJ, B7, C6, C7 ） Within ±30%（F ） Dissipation factor： 5.0% max. （BJ, B7, C6, C7 ） 11.0% max.（F ） Insulation resistance: 50 MΩ μF or 1000 MΩ, whichever is smaller. est Methods and Remarks】 Class 1 Standard High Frequency Type Preconditioning None Temperature 125±3℃ Duration 1000＋48/ー0 hrs Applied voltage Rated voltage ×2 Charge/discharge current 50mA max. Recovery 6 to 24hr （Standard condition ） Note 5 Class 2 BJ, F C6 B7, C7 Preconditioning Voltage treatment （Twice the rated voltage shall be applied for 1 hour at 85 ℃, 105℃ or 125℃） Note 3, 4 Temperature 85±2℃ 105±3℃ 125±3℃ Duration 1000＋48/ー0 hrs Applied voltage Rated voltage ×2 Note 4 Charge/discharge current 50mA max. Recovery 24±2 hrs （Standard condition ） Note 5 Note 1 The ﬁgures indicate typical speciﬁcations. Please refer to individual speciﬁcations in detail. Note 2 Thermal treatment : Initial value shall be measured after test sample is heat-treated at 150 ＋0/－10℃ for an hour and kept at room temperatur e for 24±2hours. Note 3 Voltage tr eatment : Initial value shall be measured after test sample is voltage-treated for an hour at both the temperature and voltage speciﬁed in the test conditions, and kept at room temperature for 24±2hours. Note 4 150% of rated voltage is applicable to some items. Please r efer to their speciﬁcations for further information. Note 5 Standar d condition: Temperature: 5 to 35℃, Relative humidity: 45 to 85 % RH, Air pressur e: 86 to 106kPa When there are questions concerning measurement results, in order to provide correlation data, the test shall be conducted under the following condi - tion. Temperatur e: 20±2℃, Relative humidity: 60 to 70 % RH, Air pr essure: 86 to 106kPa Unless otherwise speciﬁed, all the tests are conducted under the "standard condition".

mlcc_prec-P1 mlcc_prec_e-01 ■ PRECAUTIONS ＊ This catalog contains the typical speciﬁcation only due to the limitation of space. When you consider the purchase of our products, please check our speciﬁcation. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs. 1. Circuit Design Precautions ◆Veriﬁcation of operating environment, electrical rating and performance 1. A malfunction of equipment in ﬁelds such as medical, aer ospace, nuclear control, etc. may cause serious harm to human life or have severe social ramiﬁcations. Ther efore, any capacitors to be used in such equipment may require higher safety and reliability, and shall be clearly differentiated from them used in general pur - pose applications. ◆Operating V oltage （V eriﬁcation of Rated voltage） 1. The operating voltage for capacitors must always be their rated voltage or less. If an AC voltage is loaded on a DC voltage, the sum of the two peak voltages shall be the rated voltage or less. For a cir cuit where an AC or a pulse voltage may be used, the sum of their peak voltages shall also be the rated voltage or less. 2. Even if an applied voltage is the rated voltage or less reliability of capacitors may be deteriorated in case that either a high frequency AC voltage or a pulse voltage having rapid rise time is used in a circuit. 2. PCB Design Precautions ◆Pattern conﬁgurations （Design of Land-patter ns） When capacitors are mounted on PCBs, the amount of solder used （size of ﬁllet） c an directly affect the capacitor performance. Therefore, the following items must be carefully consider ed in the design of land patterns: ）Excessive solder applied can cause mechanical stresses which lead to chip breaking or cracking. Ther efore, please consider appropriate land-patterns for proper amount of solder. （2）When more than one component are jointly solder ed onto the same land, each component's soldering point shall be separated by solder-resist. ◆Pattern conﬁgurations（Capacitor layout on PCBs ） After capacitors are mounted on boards, they can be subjected to mechanical stresses in subsequent manufacturing processes （PCB cutting, board inspection, mounting of additional parts, assembly into the chassis, wave soldering of the boards, etc.）. For this reason, land pattern conﬁgurations and positions of capacitors shall be car efully considered to minimize str esses. Technical consider- ations ◆Patter n conﬁgurations （Design of Land-patter ns） The following diagrams and tables show some examples of r ecommended land patterns to pr event excessive solder amounts. （1）Recommended land dimensions for typical chip capacitors

Multilayer Ceramic Capacitors : Recommended land dimensions （unit: mm ） Wave-soldering Land patterns for PCBs Type 107 212 316 325 Size L 1.6 2.0 3.2 3.2 W 0.8 51.25 1.6 2.5 Solder-resist Chip capacitor L L W B C BA W LWDC Land Chip capacitor Reﬂow-soldering Type 042 063 105 107 212 316 325 432 Note：Recommended land size might be different according to the allowance of the size of the product.
LWDC: Recommended land dimensions for reﬂow-soldering（unit: mm ） Type 105 107 212 Size L 0.52 50.8 1.25 W 1.0 1.6 2.0
Array type: Recommended land dimensions for reﬂow-soldering （unit: mm） 2 circuits 4 circuits Type 096 （2 circuits）110（2 circuits）212（2 circuits）212（4 circuits） Size L 0.9 1.37 2.0 2.0 W 0.6 1.0 1.25 1.25 d 0.45 0.64 1.0 0.5 Chip capacitor a a b d c Land c d a a b （2）Examples of good and bad solder application Items Not recommended Recommended Mixed mounting of SMD and leaded components Component placement close to the chassis Hand-soldering of leaded components near mounted components Horizontal component placement Precautions on the use of Multilayer Ceramic Capacitors To next page

mlcc_prec-P2mlcc_prec_e-01 ■ PRECAUTIONS ＊ This catalog contains the typical speciﬁcation only due to the limitation of space. When you consider the purchase of our products, please check our speciﬁcation. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs. Precautions on the use of Multilayer Ceramic Capacitors 2. PCB Design Technical consider- ations ◆Pattern conﬁgurations（Capacitor layout on PCBs ） 1-1. The following is examples of good and bad capacitor layouts ; capacitors shall be located to minimize any possible mechanical stresses from board warp or de - ﬂection. Items Not recommended Recommended Deﬂection of board 1-2. The amount of mechanical stresses given will vary depending on capacitor layout. Please refer to diagram below. 1-3. When PCB is split, the amount of mechanical stress on the capacitors can vary according to the method used. The following methods are listed in order from least stressful to most stressful: push-back, slit, V-grooving, and perforation. Thus, please consider the PCB, split methods as well as chip location. 3. Mounting Precautions ◆Adjustment of mounting machine 1. When capacitors are mounted on PCB, excessive impact load shall not be imposed on them. 2.Maintenance and inspection of mounting machines shall be conducted periodically. Selection of Adhesives 1. When chips are attached on PCBs with adhesives prior to soldering, it may cause capacitor characteristics degradation unless the following factors are appro - priately checked : size of land patterns, type of adhesive, amount applied, hardening temperature and hardening period. Therefore, please contact us for further information. Technical consider- ations ◆Adjustment of mounting machine When the bottom dead center of a pick-up nozzle is too low, excessive force is imposed on capacitors and causes damages. To avoid this, the following points shall be considerable. ） The bottom dead center of the pick-up nozzle shall be adjusted to the surface level of PCB without the board deﬂection. ） The pressure of nozzle shall be adjusted between 1 and 3 N static loads. ） To reduce the amount of deﬂection of the board caused by impact of the pick-up nozzle, supporting pins or back-up pins shall be used on the other side of the PCB. The following diagrams show some typical examples of good and bad pick-up nozzle placement: Items Not recommended Recommended Single-sided mounting Double-sided mounting 2. As the alignment pin is worn out, adjustment of the nozzle height can cause chipping or cracking of capacitors because of mechanical impact on the capacitors. To avoid this, the monitoring of the width between the alignment pins in the stopped position, maintenance, check and replacement of the pin shall be conducted periodically. ◆Selection of Adhesives Some adhesives may cause IR deterioration. The different shrinkage percentage of between the adhesive and the capacitors may result in stresses on the capaci - tors and lead to cracking. Moreover, too little or too much adhesive applied to the board may adversely affect components. Therefore, the following precautions shall be noted in the application of adhesives. ）Required adhesive characteristics a. The adhesive shall be str ong enough to hold parts on the board during the mounting & solder process. b. The adhesive shall have suf ﬁcient strength at high temperatures. c. The adhesive shall have good coating and thickness consistency d. The adhesive shall be used during its pr escribed shelf life. e. The adhesive shall har den rapidly. f . The adhesive shall have corrosion resistance. g. The adhesive shall have excellent insulation characteristics. h. The adhesive shall have no emission of toxic gasses and no ef fect on the human body. ）The recommended amount of adhesives is as follows; ［Recommended condition］ Figure 212/316 case sizes as examples a 0.3mm min b 100 to 120 μm c Adhesives shall not contact land

mlcc_prec-P3 mlcc_prec_e-01 ■ PRECAUTIONS ＊ This catalog contains the typical speciﬁcation only due to the limitation of space. When you consider the purchase of our products, please check our speciﬁcation. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs. Precautions on the use of Multilayer Ceramic Capacitors 4. Soldering Precautions ◆Selection of Flux Since ﬂux may have a signiﬁcant effect on the performance of capacitors, it is necessary to verify the following conditions prior to use; ）Flux used shall be less than or equal to 0.1 wt% （in CI equivalent） of halogenated content. Flux having a strong acidity content shall not be applied. ）When shall capacitors are soldered on boar ds, the amount of ﬂux applied shall be controlled at the optimum level. （3）When water-soluble ﬂux is used, special care shall be taken to pr operly clean the boards. ◆Soldering Temperature, time, amount of solder, etc. shall be set in accordance with their recommended conditions. Sn-Zn solder paste can adversely affect MLCC reliability . Please contact us prior to usage of Sn-Zn solder. Technical consider- ations ◆Selection of Flux 1-1. When too much halogenated substance （Chlorine, etc.） content is used to activate ﬂ ux, or highly acidic ﬂ ux is used, it may lead to corrosion of terminal elec-（Chlorine, etc.） content is used to activate ﬂ ux, or highly acidic ﬂ ux is used, it may lead to corrosion of terminal elec-Chlorine, etc.） content is used to activate ﬂ ux, or highly acidic ﬂ ux is used, it may lead to corrosion of terminal elec-） content is used to activate ﬂ ux, or highly acidic ﬂ ux is used, it may lead to corrosion of terminal elec- content is used to activate ﬂux, or highly acidic ﬂux is used, it may lead to corrosion of terminal elec - trodes or degradation of insulation r esistance on the surfaces of the capacitors. 1-2. Flux is used to increase solderability in wave soldering. However if too much ﬂux is applied, a large amount of ﬂux gas may be emitted and may adversely affect the solderability. To minimize the amount of ﬂux applied, it is r ecommended to use a ﬂux-bubbling system. 1-3. Since the residue of water-soluble ﬂux is easily dissolved in moisture in the air, the residues on the surfaces of capacitors in high humidity conditions may cause a degradation of insulation resistance and reliability of the capacitors. Therefore, the cleaning methods and the capability of the machines used shall also be considered car efully when water-soluble ﬂux is used. ◆Soldering Ceramic chip capacitors are susceptible to thermal shock when exposed to rapid or concentrated heating or rapid cooling.

Ther efore, the soldering must be conducted with great care so as to prevent malfunction of the components due to excessive thermal shock.
Pr eheating : Capacitors shall be preheated sufﬁciently, and the temperature difference between the capacitors and solder shall be within 100 to 130℃.
Cooling : The temperatur e differ ence between the capacitors and cleaning process shall not be greater than 100℃. ［Reﬂow soldering］【Recommended conditions for eutectic soldering】【Recommended condition for Pb-free soldering】 Temperatureʢˆʣ 100 200 300 230ˆ Within 10 sec. 60sec. Min. 60sec. Min. Slow cooling Preheating Temperature ʢˆʣ 100 200 300Temperature ʢˆʣ 100 200 300Temperature ʢˆʣTemperature ʢˆʣ 100 200 300 Peak 260ˆ Max. Within 10sec. Heating above 230ˆ 40sec. Max. Slow cooling Preheating 150ˆ 60sec. Min. 230ʙ250ˆ Within 3sec.Preheating 120sec. Min. Slow cooling Peak 260ˆ Max. Within 10sec. Slow cooling 120sec. Min. Preheating 150ˆ 100 200 300 400 230ʙ280ˆ Within 3 sec. Preheating 60sec. Min. Slow cooling Temperature ʢˆʣ 100 200 300 400 Temperature ʢˆʣ 100 200 300 400 Peak 350ˆ Max. Within 3sec. Peak 280ˆ Max. Within 3sec. Slow cooling Slow cooling Preheating 150ˆ Min. 60sec. Min. Preheating 150ˆ Min. 60sec. Min. Caution ①The ideal condition is to have solder mass （ﬁllet） controlled to 1/2 to 1/3 of the thickness of a capacitor. Capacitor PC board TSolder ②Because excessive dwell times can adversely affect solderability, soldering duration shall be kept as close to recommended times as possible. ［Wave soldering］【Recommended conditions for eutectic soldering】【Recommended condition for Pb-free soldering】 Temperature ʢˆʣ 100 200 300Temperature ʢˆʣ 100 200 300Temperature ʢˆʣTemperature ʢˆʣ 100 200 300 Peak 260ˆ Max. Within 10sec. Heating above 230ˆ 40sec. Max. Slow cooling Preheating 150ˆ 60sec. Min. 230ʙ250ˆ Within 3sec.Preheating 120sec. Min. Slow cooling Peak 260ˆ Max. Within 10sec. Slow cooling 120sec. Min. Preheating 150ˆ 100 200 300 400 230ʙ280ˆ Within 3 sec. Preheating 60sec. Min. Slow cooling Temperature ʢˆʣ 100 200 300 400 Temperature ʢˆʣ 100 200 300 400 Peak 350ˆ Max. Within 3sec. Peak 280ˆ Max. Within 3sec. Slow cooling Slow cooling Preheating 150ˆ Min. 60sec. Min. Preheating 150ˆ Min. 60sec. Min. Temperature ʢˆʣ 100 200 300Temperature ʢˆʣ 100 200 300Temperature ʢˆʣTemperature ʢˆʣ 100 200 300 Peak 260ˆ Max. Within 10sec. Heating above 230ˆ 40sec. Max. Slow cooling Preheating 150ˆ 60sec. Min. 230ʙ250ˆ Within 3sec.Preheating 120sec. Min. Slow cooling Peak 260ˆ Max. Within 10sec. Slow cooling 120sec. Min. Preheating 150ˆ 100 200 300 400 230ʙ280ˆ Within 3 sec. Preheating 60sec. Min. Slow cooling Temperature ʢˆʣ 100 200 300 400 Temperature ʢˆʣ 100 200 300 400 Peak 350ˆ Max. Within 3sec. Peak 280ˆ Max. Within 3sec. Slow cooling Slow cooling Preheating 150ˆ Min. 60sec. Min. Preheating 150ˆ Min. 60sec. Min. Caution ①Wave soldering must not be applied to capacitors designated as for reﬂow soldering only. ［Hand soldering］【Recommended conditions for eutectic soldering】【Recommended condition for Pb-free soldering】 Temperature ʢˆʣ 100 200 300Temperature ʢˆʣ 100 200 300Temperature ʢˆʣTemperature ʢˆʣ 100 200 300 Peak 260ˆ Max. Within 10sec. Heating above 230ˆ 40sec. Max. Slow cooling Preheating 150ˆ 60sec. Min. 230ʙ250ˆ Within 3sec.Preheating 120sec. Min. Slow cooling Peak 260ˆ Max. Within 10sec. Slow cooling 120sec. Min. Preheating 150ˆ 100 200 300 400 230ʙ280ˆ Within 3 sec. Preheating 60sec. Min. Slow cooling Temperature ʢˆʣ 100 200 300 400 Temperature ʢˆʣ 100 200 300 400 Peak 350ˆ Max. Within 3sec. Peak 280ˆ Max. Within 3sec. Slow cooling Slow cooling Preheating 150ˆ Min. 60sec. Min. Preheating 150ˆ Min. 60sec. Min. Temperature ʢˆʣ 100 200 300Temperature ʢˆʣ 100 200 300Temperature ʢˆʣTemperature ʢˆʣ 100 200 300 Peak 260ˆ Max. Within 10sec. Heating above 230ˆ 40sec. Max. Slow cooling Preheating 150ˆ 60sec. Min. 230ʙ250ˆ Within 3sec.Preheating 120sec. Min. Slow cooling Peak 260ˆ Max. Within 10sec. Slow cooling 120sec. Min. Preheating 150ˆ 100 200 300 400 230ʙ280ˆ Within 3 sec. Preheating 60sec. Min. Slow cooling Temperature ʢˆʣ 100 200 300 400 Temperature ʢˆʣ 100 200 300 400 Peak 350ˆ Max. Within 3sec. Peak 280ˆ Max. Within 3sec. Slow cooling Slow cooling Preheating 150ˆ Min. 60sec. Min. Preheating 150ˆ Min. 60sec. Min. Temperature ʢˆʣ 100 200 300Temperature ʢˆʣ 100 200 300Temperature ʢˆʣTemperature ʢˆʣ 100 200 300 Peak 260ˆ Max. Within 10sec. Heating above 230ˆ 40sec. Max. Slow cooling Preheating 150ˆ 60sec. Min. 230ʙ250ˆ Within 3sec.Preheating 120sec. Min. Slow cooling Peak 260ˆ Max. Within 10sec. Slow cooling 120sec. Min. Preheating 150ˆ 100 200 300 400 230ʙ280ˆ Within 3 sec. Preheating 60sec. Min. Slow cooling Temperature ʢˆʣ 100 200 300 400 Temperature ʢˆʣ 100 200 300 400 Peak 350ˆ Max. Within 3sec. Peak 280ˆ Max. Within 3sec. Slow cooling Slow cooling Preheating 150ˆ Min. 60sec. Min. Preheating 150ˆ Min. 60sec. Min. 316type or less ⊿T≦150℃ 325type or more ⊿T≦130℃ Caution ①Use a 50W soldering iron with a maximum tip diameter of 1.0 mm. ②The soldering ir on shall not directly touch capacitors.

mlcc_prec-P4mlcc_prec_e-01 ■ PRECAUTIONS ＊ This catalog contains the typical speciﬁcation only due to the limitation of space. When you consider the purchase of our products, please check our speciﬁcation. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs. Precautions on the use of Multilayer Ceramic Capacitors 5. Cleaning Precautions ◆Cleaning conditions 1. When PCBs are cleaned after capacitors mounting, please select the appropriate cleaning solution in accordance with the intended use of the cleaning. （e.g. to remove soldering ﬂux or other materials fr om the production process.） 2. Cleaning condition shall be determined after it is veriﬁed by using actual cleaning machine that the cleaning pr ocess does not affect capacitor's characteristics. Technical consider- ations 1. The use of inappr opriate cleaning solutions can cause foreign substances such as ﬂux residue to adhere to capacitors or deteriorate their outer coating, resulting in a degradation of the capacitor's electrical properties （especially insulation r esistance）. Inappropriate cleaning conditions （insuf ﬁcient or excessive cleaning） may adversely affect the performance of the capacitors. In the case of ultrasonic cleaning, too much power output can cause excessive vibration of PCBs which may lead to the cracking of capacitors or the soldered portion, or decrease the terminal electrodes' str ength. Therefore, the following conditions shall be carefully checked; Ultrasonic output : 20 W/ℓ or less Ultrasonic frequency : 40 kHz or less Ultrasonic washing period : 5 min. or less 6. Resin coating and mold Precautions 1. With some type of resins, decomposition gas or chemical reaction vapor may remain inside the resin during the hardening period or while left under normal stor - age conditions resulting in the deterioration of the capacitor's performance. 2. When a resin's hardening temperature is higher than capacitor's operating temperature, the stresses generated by the excessive heat may lead to damage or destruction of capacitors. The use of such r esins, molding materials etc. is not recommended. 7. Handling Precautions ◆Splitting of PCB When PCBs are split after components mounting, care shall be taken so as not to give any stresses of deﬂection or twisting to the board. 2. Boar d separation shall not be done manually, but by using the appropriate devices. ◆Mechanical considerations Be car eful not to subject capacitors to excessive mechanical shocks. ）If ceramic capacitors are dropped onto a ﬂoor or a har d surface, they shall not be used. （2）Please be careful that the mounted components do not come in contact with or bump against other boards or components. Storage conditions Precautions ◆Storage To maintain the solderability of terminal electrodes and to keep packaging materials in good condition, care must be taken to control temperature and humidity in the storage area. Humidity should especially be kept as low as possible. ・Recommended conditions Ambient temperature : Below 30℃ Humidity : Below 70% RH The ambient temperature must be kept below 40℃ . Even under ideal storage conditions, solderability of capacitor is deteriorated as time passes, so capaci - tors shall be used within 6 months from the time of delivery. ・Ceramic chip capacitors shall be kept wher e no chlorine or sulfur exists in the air. The capacitance values of high dielectric constant capacitors will gradually decrease with the passage of time, ｓo car e shall be taken to design circuits . Even if capacitance value decreases as time passes, it will get back to the initial value by a heat treatment at 150 ℃ for 1hour. Technical consider- ations If capacitors are stored in a high temperature and humidity environment, it might rapidly cause poor solderability due to terminal oxidation and quality loss of taping/ packaging materials. For this reason, capacitors shall be used within 6 months from the time of delivery. If exceeding the above period, please check solderability be - fore using the capacitors. ※RCR-2335B（ Safety Application Guide for ﬁxed ceramic capacitors for use in electronic equipment）is published by JEIT A. Please check the guide r egarding pr ecautions for deﬂection test, soldering by spot heat, and so on.

Summary

Notice for TAIYO YUDEN products Please read this notice before using the TAIYO YUDEN products.

Description