AMIS-42700 ONSEMI | Alldatasheet
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© Semiconductor Components Industries, LLC, 2009 January, 2009 − Rev. 5
1 Publication Order Number:
AMIS−42700/D AMIS-42700 Dual High Speed CAN Transceiver General Description Controller area network (CAN) is a serial communication protocol, which supports distributed real −time control and multiplexing with high safety level. Typical applications of CAN−based networks can be found in automotive and industrial environments. The AMIS−42700 Dual−CAN transceiver is the interface between up to two physical bus lines and the protocol controller and will be used for serial data interchange between different electronic units at more than one bus line. It can be used for both 12 V and 24 V systems. The circuit consists of following blocks:
- Two differential line transmitters
- Two differential line receivers
- Interface to the CAN protocol handler
- Interface to expand the number of CAN busses
- Logic block including repeater function and the feedback suppression
- Thermal shutdown circuit (TSD)
- Short to battery treatment circuit Due to the wide common−mode voltage range of the receiver inputs, the AMIS −42700 is able to reach outstanding levels of electromagnetic susceptibility (EMS). Similarly, extremely low electromagnetic emission (EME) is achieved by the excellent matching of the output signals. Key Features
- Fully compatible with the ISO 11898−2 standard
- Certified “Authentication on CAN Transceiver Conformance (d1.1)”
- High speed (up to 1 Mbit/s in function of the bus topology)
- Ideally suited for 12 V and 24 V industrial and automotive
applications
- Low EME common−mode−choke is no longer required
- Differential receiver with wide common−mode range (±35 V) for high EMS
- No disturbance of the bus lines with an un−powered node
- Dominant time−out function
- Thermal protection
- Bus pins protected against transients in an automotive environment
- Short circuit proof to supply voltage and ground SOIC 20 WC SUFFIX CASE 751AQ http://onsemi.com See detailed ordering and shipping information in the package dimensions section on page 12 of this data sheet.
ORDERING INFORMATION
AMIS−42700 NC GND GND CANL2 CANH2 Text EN2 PIN CONFIGURATION
Table 1. Technical Characteristics
- The parameters V CM−peak and VCM−step guarantee low EME.
Figure 1. Block Diagram
- Dual CAN
- A CAN−bus extender
- A CAN−bus repeater
4 CANH2
Figure 2. Application Diagram CAN−bus Repeater Figure 3. Application Diagram Dual−CAN
Figure 4. Application Diagram CAN−bus Extender Table 2. Pin Out
1 NC Not connected
2 ENB2 Enable input, bus system 2; internal pull−up
3 Text Multi−system transmitter Input; internal pull−up
4 Tx0 Transmitter input; internal pull−up
5 GND Ground connection (Note 2)
6 GND Ground connection (Note 2)
7 Rx0 Receiver output
8 VREF1 Reference voltage
9 Rint Multi−system receiver output
10 ENB1 Enable input, bus system 1; internal pull−up
11 NC Not connected
12 VCC Positive supply voltage
13 CANH1 CANH transceiver I/O bus system 1
14 CANL1 CANL transceiver I/O bus system 1
15 GND Ground connection (Note 2)
16 GND Ground connection (Note 2)
17 GND Ground connection (Note 2)
18 CANL2 CANL transceiver I/O bus system 2
19 CANH2 CANH transceiver I/O bus system 2
20 NC Not connected
- In order to ensure the chip performance, all these pins need to be connected to GND on the PCB.
corresponding driving and receiving sections are provided. bus to all nodes connected to either of them. sections of all transceivers connected to the bus are passive. bus lines, it remains limited to that bus line where it occurs. system and on this bus system itself can be continued. open it serves as a single transceiver for an electronic unit. bus by the proper termination resistor. unit is described in Table 3. dominant state on both busses, pin Rint and pin Rx0. pins, dominant on Text is only transferred to Rx0. active if the transmission of a dominant bit is required. switched on and off with a controlled slope to limit EME. Table 3. Function of the Logic Unit (bold letters describe input signals)
- Dominant detected by the corresponding receiver.
- Dominant detected by the corresponding receiver.
identical to the comparator output signal. by a recessive signal on the timer output. on that bus line, on which a dominant is actively transmitted. after the dominant transmission on this line is finished.
- The counters are kept in the reset mode and stable state without current consumption
- Inputs are disabled (don’t care)
- Outputs are high impedant; only Rx0 = high−level
- Analog blocks are in power down
- Oscillator not running and in power down
- CANHx and CANLx are recessive
- VREF output high impedant for POR not released Over Temperature Detection A thermal protection circuit is integrated to prevent the transceiver from damage if the junction temperature exceeds thermal shutdown level. Because the transmitters dissipate most of the total power, the transmitters will be switched off only to reduce power dissipation and IC temperature. All other IC functions continue to operate. Fault Behavior A fault like a short circuit is limited to that bus line where it occurs; hence data interchange from the protocol IC to the other bus system is not affected. When the voltage at the bus lines is going out of the normal operating range (−12 V to +12 V), the receiver is not allowed to erroneously detect a dominant state.
AMIS−42700 http://onsemi.com Short Circuits As specified in the maximum ratings, short circuits of the bus wires CANHx and CANLx to the positive supply voltage Vbat or to ground must not destroy the transceiver. A short circuit between CANHx and CANLx must not destroy the IC as well. The dedicated comparator (L2VBAT) on CANL pin detects the short to battery and after debounce time −out switches off the affected driver only. The receiver of the affected driver has to operate normally. Faulty Supply In case of a faulty supply (missing connection of the electronic unit or the transceiver to ground, missing connection of the electronic unit to Vbat or missing connection of the transceiver to Vcc), the power supply module of the electronic unit will operate such that the transceiver is not supplied, i.e. the voltage Vcc is below the POR level. In this condition the bus connections of the transceiver must be in the POR state. If the ground line of the electronic unit is interrupted, Vbat may be applied to the Vcc pin (measured relative to the original ground potential, to which the other units on the bus are connected). Reverse Electronic Unit (ECU) Supply If the connections for ground and supply voltage of an electronic unit (ECU) (max. 50 V) which provides Vcc for the transceiver are exchanged, this transceiver has a ground potential which may be up to 50 V higher than that of the other transceivers. In this case no transceiver must be destroyed even if several of them are connected via the bus system. Any exchange among the six connections CANH1, CANH2, CANL1, CANL2, ground, and supply voltage of the electronic unit at the connector of the unit must never lead to the destruction of any transceiver of the bus system.
Electrical Characteristics
All voltages are referenced to GND. Positive currents flow into the IC. Sinking current means that the current is flowing into the pin. Sourcing current means that the current is flowing out of the pin. Absolute Maximum Ratings Stresses above those listed in Table 4 may cause permanent device failure. Exposure to absolute maximum ratings for extended periods may affect device reliability. Table 4. Absolute Maximum Ratings
- Applied transient waveforms in accordance with “ISO 7637 part 3”, test pulses 1, 2, 3a, and 3b (see Figure 5).
- Standardized human body model (HBM) ESD pulses in accordance to MIL883 method 3015. Supply pin 8 is ±2 kV.
- Static latch −up immunity: static latch−up protection level when tested according to EIA/JESD78.
- Standardized charged device model ESD pulses when tested according to EOS/ESD DS5.3 −1993.
Table 5. Thermal Characteristics Table 6. DC and Timing Characteristics (VCC = 4.75 to 5.25 V; Tjunc = −40 to +150°C; RLT = 60 W unless specified otherwise.)
- Guaranteed by design for VBAT = 36 V; measured in production for VBAT = 7 V to avoid short−2−VBAT detection
- Guaranteed by design for VBAT = 36 V; measured in production for VBAT = 7 V to avoid short−2−VBAT detection
pressure−syringe dispensing before package placement. infrared/convection heating in a conveyor type oven. between 100 and 200 seconds depending on heating method.
- Use a double−wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave.
- For packages with leads on two sides and a pitch (e):
- Larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the print−circuit board;
- Smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed−circuit board. The footprint must incorporate solder thieves at the downstream end.
- For packages with leads on four sides, the footprint must be placed at a 45° angle to the transport direction of the printed−circuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time is four seconds at 250 °C. A mildly−activated flux will eliminate the need for removal of corrosive residues in most applications. Manual Soldering Fix the component by first soldering two diagonally − opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300°C. When using a dedicated tool, all other leads can be soldered in one operation within two to five seconds between 270°C and 320°C.
Table 7. Soldering Process
- All SMD packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body
not be achieved, and as solder may stick to the heatsink (on top version).
- If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction. The package footprint must
incorporate solder thieves downstream and at the side corners. for packages with a pitch (e) equal or smaller than 0.65 mm. for packages with a pitch (e) equal to or smaller than 0.5 mm.
AMIS−42700 http://onsemi.com PACKAGE DIMENSIONS SOIC 20 W CASE 751AQ−01 ISSUE O ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5773−3850 AMIS−42700/D LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: orderlit@onsemi.com ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative