AMIS-39101 ONSEMI | Alldatasheet
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© Semiconductor Components Industries, LLC, 2008 December, 2008 − Rev. 2
1 Publication Order Number:
AMIS−39101/D AMIS-39101 Octal High Side Driver with Protection General Description The AMIS−39101 is a robust high side driver IC featuring eight independent high current output drive channels along with a number of integrated fault−protection circuits. This highly integrated product is designed for controlled delivery of power to a large variety of loads in industrial applications including motors, relays and LED arrays, among others. With all driver output channels in the conducting state, each channel can source up to 350 mA of continuous current (resistive load). In cases where all output drivers are not active, higher output current per channel can be achieved provided that the thermal limits of the device are not exceeded. Furthermore, in order to minimize system cost each output driver has built −in fly −back diodes. The device withstands short−circuits to ground and supply, respectively. It is designed with an array of integrated protection features including over−temperature and over−current detection and shut down. The integrated charge pump requires only one external capacitor and provides for operation of the critical fault−protection circuitry even in case of low supply voltages. The device can be interfaced to a variety of microcontrollers via the serial interface link, in turn allowing for monitoring and controlling the state of each of the output drivers individually. In this case, at the onset of a potential hazardous situation the drivers are switched off and the diagnostic state of the drivers can be extracted via the serial interface. The device also features a power down mode for reduced power consumption and has high built −in electrostatic discharge (ESD) protection capability for robust operation. Key Features
- Eight High Side Output Drivers
- Up to 830 mA Continuous Current per Driver Pair (Resistive Load)
- Charge Pump with One External Capacitor
- Serial Interface
- Short−circuit Protection
- Diagnostic Features
- Power−down Mode
- Internal Thermal Shutdown
- 3.3 V and 5 V Microcontroller Compliant
- Excellent System ESD
- Automotive Compliant
- SO28 Package with Low R/C0113JA
- This is a Pb−Free Device* Typical Applications
- Actuator Control
- LED Drivers
- Relays and Solenoids
- Industrial Process Control
- Automotive Load Management SOIC 28 PN SUFFIX CASE 751AR http://onsemi.com *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. See detailed ordering and shipping information in the package dimensions section on page 2 of this data sheet.
ORDERING INFORMATION
AMIS−39101 http://onsemi.com Product Name Package Shipping Configuration Temperature Range AMIS39101PNPB4G PSOP 300-28 (JEDEC MS-013) Tube/Tray −40°C to 85°C AMIS39101PNPB4RG PSOP 300-28 (JEDEC MS-013) Tape & Reel −40°C to 85°C NOTE: For additional information on our Pb −Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. OUT1 OUT2 OUT3 OUT4 VS1 OUT1 VS2 OUT2 OUT3 OUT4 OUT5 OUT6 OUT7 OUT8 VS3 OUT5 VS4 OUT6 OUT7 OUT8 LOGIC Control Power on Reset Thermal shutdown Serial interface Diagnostic Oscillator Charge− pump Bandgap AMIS−39101 GND4 GND5 GND6GND3GND2 CAPA1 DIN DOUT CLK WR VDDN 7 8 15 21 22 2826 TEST2 11 4 1 6 TEST GND1PDB TEST1 Figure 1. Block Diagram
17 CAPA
Figure 2. Typical Application Diagram TEST, TEST1, and TEST2 are shorted on the PCB level. Table 1. EXTERNAL COMPONENTS
- The capacitor must be placed close to the AMIS −39101 pins on the PCB.
- Both capacitors are optional and depend on the final application and board layout.
Figure 3. Pin Description of the AMIS−39101 Table 2. PIN OUT
1 TEST1 Connect to GND
2 CLK Schmitt trigger serial interface CLK input
3 WR Schmitt trigger serial interface write enable input
4 OUT1 HS driver output
5 VS1 VS power supply
6 OUT2 HS driver output
7 GND1 Power ground and thermal dissipation path junction−to−PCB
8 GND2 Power ground and thermal dissipation path junction−to−PCB
9 OUT3 S driver output
10 VS2 VS power supply
11 OUT4 HS driver output
12 DIN Serial interface input pin (Schmitt trigger or CMOS inverter)
13 DOUT Digital three state output for serial interface
14 TEST2 Connect to GND
15 GND3 Power ground and thermal dissipation path junction−to−PCB
16 TEST Connect to GND
17 CAPA1 Charge pump capacitor pin
18 OUT5 HS driver output
19 VS3 VS power supply
20 OUT6 HS driver output
21 GND4 Power ground and thermal dissipation path junction−to−PCB
22 GND5 Power ground and thermal dissipation path junction−to−PCB
23 OUT7 HS driver output
24 VS4 VS power supply
25 OUT8 HS driver output
26 PDB Schmitt trigger power−down input
27 VDDN Digital supply
28 GND6 Power ground and thermal dissipation path junction−to−PCB
Table 3. ABSOLUTE MAXIMUM RATINGS
- The power dissipation of the chip must be limited not to exceed the maximum junction temperature Tj.
- According to HBM standard MIL −STD−883 method 3015.7.
- According to norm EOS/ESD −STM5.3.1−1999 robotic mode.
Table 4. THERMAL CHARACTERISTICS OF THE PACKAGE Table 5. THERMAL CHARACTERISTICS OF THE AMIS−39101 ON A PCB
- These values are informative only.
Figure 4. Layout Recommendation for Thermal Characteristics
the maximum operating rating for the power supply or temperature must be less than 100 hours. Table 6. OPERATING RANGES
- The power dissipation of the chip must be limited not to exceed maximum junction temperature Tj of 130 °C.
Table 7. ELECTRICAL CHARACTERISTICS
- The power dissipation of the chip must be limited not to exceed maximum junction temperature Tj.
- The cumulative operation time mentioned above may cause permanent device failure.
- Parameters for inductive loads up to 350 mH and Tambient up to 85°C
- Parameters for inductive loads up to 300 mH and Tambient up to 85°C
- Parameters for resistive loads and Tambient up to 85°C
Table 8. LOAD SPECIFIC CHARACTERISTICS application PCB (see Thermal Characteristics section). With TSD_H = 130°C and Rthja according to Table 5. oscillator has typical frequency of 4 MHz. the application according to Table 9. all drivers will be switched off (see Table 9). that the device has cooled down under the TSD trip point. Table 9. OUT DIAGNOSTICS 10.The correct diagnostic information is available after T_diagnostic_OFF time.
- All 8 diagnostic bits DIAG_x must be in the fault condition to conclude a TSD diagnostic.
Table 10. POWER LOSS always acts as a slave and it can’t initiate any transmission. characteristics are shown in Figures 6 and 7. information on the two serial data lines (DIN and DOUT). idles high between the transferred bytes. timing diagram for 8−bit communication. status. Serial interface communication is ended. pulses with dummy DIN data and ignoring the DOUT data. Table 11. DIGITAL CHARACTERISTICS
Figure 7. Timing Diagram assembly and wafer fabrication. All products are tested using a production test program. Table 13. QUALIFICATION NOTE: Each production lot will be accompanied with a Certificate of Conformance. For more information about ON Semiconductor’s products or services visit our Web site at http://www.onsemi.com.
AMIS−39101 http://onsemi.com PACKAGE DIMENSIONS SOIC 28 W CASE 751AR−01 ISSUE O ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5773−3850 AMIS−39101/D LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: orderlit@onsemi.com ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative